KR101719383B1 - 기판 처리 장치, 기판 처리 방법 및 그 기판 처리 방법을 실행시키기 위한 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체 - Google Patents

기판 처리 장치, 기판 처리 방법 및 그 기판 처리 방법을 실행시키기 위한 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체 Download PDF

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KR101719383B1
KR101719383B1 KR1020120001901A KR20120001901A KR101719383B1 KR 101719383 B1 KR101719383 B1 KR 101719383B1 KR 1020120001901 A KR1020120001901 A KR 1020120001901A KR 20120001901 A KR20120001901 A KR 20120001901A KR 101719383 B1 KR101719383 B1 KR 101719383B1
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substrate
unit
section
processing
inspecting
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KR20120114146A (ko
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신이치 세키
히로시 도미타
노부타카 후쿠나가
도시후미 소하라
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020120001901A 2011-04-06 2012-01-06 기판 처리 장치, 기판 처리 방법 및 그 기판 처리 방법을 실행시키기 위한 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체 Active KR101719383B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-084827 2011-04-06
JP2011084827A JP5575691B2 (ja) 2011-04-06 2011-04-06 基板処理装置、基板処理方法及びその基板処理方法を実行させるためのプログラムを記録した記録媒体

Related Child Applications (1)

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KR1020170029938A Division KR20170031122A (ko) 2011-04-06 2017-03-09 기판 처리 장치, 기판 처리 방법 및 그 기판 처리 방법을 실행시키기 위한 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체

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Publication Number Publication Date
KR20120114146A KR20120114146A (ko) 2012-10-16
KR101719383B1 true KR101719383B1 (ko) 2017-03-23

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KR1020120001901A Active KR101719383B1 (ko) 2011-04-06 2012-01-06 기판 처리 장치, 기판 처리 방법 및 그 기판 처리 방법을 실행시키기 위한 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체
KR1020170029938A Ceased KR20170031122A (ko) 2011-04-06 2017-03-09 기판 처리 장치, 기판 처리 방법 및 그 기판 처리 방법을 실행시키기 위한 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체

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KR1020170029938A Ceased KR20170031122A (ko) 2011-04-06 2017-03-09 기판 처리 장치, 기판 처리 방법 및 그 기판 처리 방법을 실행시키기 위한 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체

Country Status (4)

Country Link
US (1) US8774491B2 (enExample)
JP (1) JP5575691B2 (enExample)
KR (2) KR101719383B1 (enExample)
TW (1) TWI528414B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5626122B2 (ja) * 2011-05-30 2014-11-19 東京エレクトロン株式会社 基板検査装置、基板検査方法及び記憶媒体
JP6308958B2 (ja) * 2015-02-25 2018-04-11 東京エレクトロン株式会社 基板処理装置、基板処理方法、プログラム及びコンピュータ記憶媒体
CN106292204A (zh) * 2015-05-28 2017-01-04 沈阳芯源微电子设备有限公司 一种匀胶显影装置
JP7261052B2 (ja) * 2019-03-26 2023-04-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置およびその搬送制御方法
TW202518178A (zh) 2023-07-13 2025-05-01 日商東京威力科創股份有限公司 周邊曝光裝置、及周邊曝光方法
US20250085215A1 (en) * 2023-09-07 2025-03-13 Taiwan Semiconductor Manufacturing Co., Ltd. Inspection system with multiwavelength light source and method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003209154A (ja) * 2002-01-11 2003-07-25 Tokyo Electron Ltd 基板処理装置および基板処理方法
JP2007266074A (ja) 2006-03-27 2007-10-11 Toshiba Corp 半導体装置の製造方法及び液浸リソグラフィーシステム
JP2009216515A (ja) 2008-03-10 2009-09-24 Tokyo Electron Ltd 欠陥検査方法、プログラム及びコンピュータ記憶媒体
JP2011066049A (ja) * 2009-09-15 2011-03-31 Sokudo Co Ltd 基板処理装置、基板処理システムおよび検査周辺露光装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004274068A (ja) * 1999-10-19 2004-09-30 Tokyo Electron Ltd 基板処理装置
JP3589406B2 (ja) * 1999-10-25 2004-11-17 東京エレクトロン株式会社 基板処理システム
JP4585649B2 (ja) * 2000-05-19 2010-11-24 キヤノン株式会社 露光装置およびデバイス製造方法
JP4014031B2 (ja) * 2002-06-05 2007-11-28 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP4202220B2 (ja) * 2003-09-22 2008-12-24 大日本スクリーン製造株式会社 検査装置、基板処理装置および基板処理方法
CN1947267A (zh) * 2004-04-21 2007-04-11 松下电器产业株式会社 发光元件驱动用半导体芯片、发光装置以及照明装置
JP2007240519A (ja) * 2006-02-08 2007-09-20 Tokyo Electron Ltd 欠陥検査方法、欠陥検査装置及びコンピュータプログラム
JP2009017156A (ja) * 2007-07-04 2009-01-22 Omron Corp 撮像装置、並びに、監視装置および方法
JP2009032898A (ja) * 2007-07-27 2009-02-12 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
JP4918438B2 (ja) * 2007-08-31 2012-04-18 オリンパスメディカルシステムズ株式会社 被検体内情報取得システム
US20100074515A1 (en) * 2008-02-05 2010-03-25 Kla-Tencor Corporation Defect Detection and Response
JP4983724B2 (ja) * 2008-05-27 2012-07-25 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法並びに記憶媒体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003209154A (ja) * 2002-01-11 2003-07-25 Tokyo Electron Ltd 基板処理装置および基板処理方法
JP2007266074A (ja) 2006-03-27 2007-10-11 Toshiba Corp 半導体装置の製造方法及び液浸リソグラフィーシステム
JP2009216515A (ja) 2008-03-10 2009-09-24 Tokyo Electron Ltd 欠陥検査方法、プログラム及びコンピュータ記憶媒体
JP2011066049A (ja) * 2009-09-15 2011-03-31 Sokudo Co Ltd 基板処理装置、基板処理システムおよび検査周辺露光装置

Also Published As

Publication number Publication date
TWI528414B (zh) 2016-04-01
US20120257813A1 (en) 2012-10-11
KR20120114146A (ko) 2012-10-16
JP2012222086A (ja) 2012-11-12
JP5575691B2 (ja) 2014-08-20
TW201250776A (en) 2012-12-16
US8774491B2 (en) 2014-07-08
KR20170031122A (ko) 2017-03-20

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