KR101711751B1 - Probe card - Google Patents

Probe card Download PDF

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Publication number
KR101711751B1
KR101711751B1 KR1020150133077A KR20150133077A KR101711751B1 KR 101711751 B1 KR101711751 B1 KR 101711751B1 KR 1020150133077 A KR1020150133077 A KR 1020150133077A KR 20150133077 A KR20150133077 A KR 20150133077A KR 101711751 B1 KR101711751 B1 KR 101711751B1
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KR
South Korea
Prior art keywords
capacitor
probe card
board
connecting board
present
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KR1020150133077A
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Korean (ko)
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KR20160041761A (en
Inventor
마사타카 기모토
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가부시키가이샤 니혼 마이크로닉스
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Publication of KR20160041761A publication Critical patent/KR20160041761A/en
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Publication of KR101711751B1 publication Critical patent/KR101711751B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards

Abstract

Provided is a probe card in which a capacitor is easily mounted and electrical inspection of a test object is performed with high accuracy.
The probe card 1 includes a wiring board 2, a connecting board 3 supported by the wiring board 2 on the main surface 2b of the wiring board 2, And has a probe 4. The probe card 1 also has a capacitor 10 electrically connected to at least one of the probes 4 on the side surface of the connecting board 3. The capacitor 10 removes the noise generated during the electrical inspection of the inspection object.

Description

Probe card {PROBE CARD}

The present invention relates to a probe card.

In a semiconductor device manufacturing process, a plurality of semiconductor integrated circuits fabricated in a semiconductor wafer are usually inspected whether or not they are manufactured according to specifications before being separated into semiconductor chips. That is, a semiconductor wafer in which a plurality of semiconductor integrated circuits are formed becomes an inspection object, and is subjected to, for example, electrical inspection.

For electrical inspection of a subject such as a semiconductor wafer, an electrical connection device is used to connect each semiconductor integrated circuit to the electric circuit of the inspection apparatus. As this electrical connection device, for example, a probe card having an electrical test probe connected to an electrode of a semiconductor integrated circuit is used (see, for example, Patent Document 1).

16 is a side view showing an example of a conventional probe card.

16, the conventional probe card 200 has a wiring board 212 having a generally circular planar shape and a wiring board 212 at a central portion of the main surface 212a of the wiring board 212. [ And a plurality of probes 216 attached to the connection board 214. The probes 216 are connected to the connecting board 214 via the connecting board 214,

Each of the probes 216 is fixed to each connecting portion (not shown) of a conductive path (not shown) formed on one surface 214a of the connecting board 214, which is the lower side of the drawing. The connecting board 214 is fixed to the wiring board 212 so that the surface opposite to the surface 214a on which the probes 216 are provided is opposed to the main surface 212a on the lower side of the wiring board 212. [

The wiring board 212 is made of an electrically insulating material in which a conductive path (not shown) is knitted. A plurality of tester lands (not shown) which are connected to an inspection apparatus (not shown) called a tester or the like are provided on the peripheral edge of the upper surface of the wiring board 212. Each of the probes 216 of the connecting board 214 attached to the wiring board 212 passes through the corresponding conductive path of the connecting board 214 and the corresponding conductive path in the wiring board 212, And is electrically connected to each corresponding tester land of the tester. Thus, each of the probes 216 is electrically connected to the above-described tester via the corresponding tester land of the wiring board 212.

The electrical inspection of a subject such as a semiconductor wafer is performed by using the probe card 200 illustrated in FIG. 16 described above, and the tip ends of the plurality of probes 216 are electrically connected to the electrodes To a pad (not shown). As a result, the tester and the object to be inspected are electrically connected through the probe 216, the connecting board 214, and the wiring board 212, and an electric signal for inspection is applied to the electrode pad as an electrode from the tester.

In such electrical inspection of a subject such as a semiconductor wafer, there is noise generated in the conductive path between the tester and the electrode of the object to be inspected as a factor that deteriorates the accuracy of inspection.

17 is a schematic diagram showing a connection position of a noise removing capacitor of a probe card.

17, the conductive path 221 for electrically connecting the test object 223, which is a semiconductor wafer, to a tester (not shown), the ground line 222, Can be removed by connecting a noise removing capacitor 220 between them. That is, the noise generated in the conductive path 221 is removed by passing the noise through the capacitor 220 to the ground.

To this end, Patent Document 2 discloses a probe card having a structure in which an electronic component such as a capacitor together with a probe is mounted on a lower surface of a support plate of a contact structure.

Japanese Patent Application Laid-Open No. 2014-21064 Japanese Patent Application Laid-Open No. 2010-25765

As described above, in the electrical inspection of a test object such as a semiconductor wafer, noise may be generated in the conductive path between the tester and the electrode of the test object. To remove the noise, mounting of a noise removing capacitor is effective. In order to remove the noise more efficiently, it is preferable that the noise removing capacitor is mounted in the vicinity of the object to be inspected. For example, it is preferable that the noise removing capacitor is connected to the conductive path in the vicinity of the probe of the probe card.

In the case of using the conventional probe card 200 illustrated in Fig. 16 in the electrical inspection of the inspection object, it is possible to provide a noise removing capacitor on the wiring board 212. Fig. However, in such a case, the structure of the probe card 200 in which the condenser and the probe 216 are distant from each other becomes a structure, and there is a fear that the accuracy of noise removal is lowered.

Therefore, in the case of using the conventional probe card 200 illustrated in FIG. 16, it is preferable that the noise removing capacitor is disposed at a position closer to the probe. For example, it is preferable that the noise removing capacitor is provided on the connecting board 214 do. Therefore, in the conventional probe card disclosed in Patent Document 2, it is understood that the probe attached to the semiconductor wafer and the capacitor are provided on the lower surface of the support plate of the contact structure.

However, in the case of the conventional probe card, the front and back surfaces of the connecting board on which the probes are mounted are used for forming the conductive paths for electrically connecting the probes and the wiring substrate, and it is difficult to secure a space for mounting the capacitors.

For this reason, a method of increasing the area of the connecting board and mounting the capacitor in the marginal portion of the conductive path can be used. However, if the area of the connecting board is increased, the manufacturing cost of the probe card may increase. Further, when the area of the connecting board is increased, it is difficult to maintain the flatness of the connecting board when connecting the wiring board and the connecting board.

In the electrical inspection of the semiconductor wafer, the inspection may be performed while heating the semiconductor wafer of the inspection object. In this case, for example, if the area of the connecting board is increased and a capacitor is mounted on the lower surface provided with the probes as in the above-described Patent Document 2, the capacitor may be damaged or fail due to the influence of wafer heating, The stability may be impaired.

The mounting of the capacitor may also be embodied in a connecting board.

However, in this case, there is a possibility that the capacitor is broken or broken due to the stress generated at the time of contact between the semiconductor wafer and the probe at the time of inspection. In the probe card, if the capacitor incorporated in the connecting board fails, the stability of the inspection is impaired and the connecting board itself needs to be replaced, which may increase the inspection cost.

Therefore, there is a demand for a technique of easily mounting a capacitor on a probe card and stably performing electrical inspection of a subject such as a semiconductor wafer with high accuracy. Further, there is a demand for a technique for improving the inspection efficiency of the inspection object and further improving the production efficiency of the semiconductor.

The present invention has been made in view of this point. That is, an object of the present invention is to provide a probe card which can easily mount a capacitor and conduct electrical inspection of a test object with high precision.

Other objects and advantages of the present invention will become apparent from the following description.

One aspect of the present invention is a probe card having a wiring board, a connecting board supported by the wiring board on the main surface of the wiring board, and a plurality of probes attached to the connecting board,

And a capacitor electrically connected to at least one of the probes on a side surface of the connecting board.

In one aspect of the present invention, it is preferable that the connecting board is provided with a counterboring portion on the side surface, and the capacitor is provided at a position where the counterboring portion is provided.

In one aspect of the present invention, it is preferable that the thickness of the connecting board is larger than the dimension in the thickness direction of the connecting board of the capacitor on the side surface.

In one aspect of the present invention, the connecting board has an electrode pad in the vicinity of a side face of the capacitor, at least one of a first face on the wiring board side and a second face opposite to the first face,

The capacitor is preferably electrically connected to the electrode pad using solder.

In one aspect of the present invention, the connecting board has electrode pads in the vicinity of the first surface on the wiring board side and the second surface opposite to the first surface, in the vicinity of the side surface portion with the capacitor,

Wherein the capacitor is formed by a metal connecting member which sandwiches the vicinity of the side surface of the connecting board end portion from both sides of the first surface and the second surface on one side and grips the capacitor board on the other side with the capacitor, It is preferable that they are electrically connected to each other.

In one aspect of the present invention, it is preferable to have a band-shaped member provided around the side surface of the connecting board and fixing the capacitor to the side surface of the connecting board.

In one aspect of the present invention, it is preferable to have a cover which is provided around the side surface of the connecting board and covers the capacitor.

According to one aspect of the present invention, there is provided a supporting member provided around a side surface of the connecting board and provided with a belt-like member for fixing the capacitor to the side surface of the connecting board and for supporting the belt-like member with the wiring board .

According to one aspect of the present invention, there is provided a probe card in which a capacitor is easily mounted and electrical inspection of a test object is performed with high accuracy.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view schematically showing a configuration of an example of a probe card according to a first embodiment of the present invention. Fig.
2 is a schematic cross-sectional view of a portion of a probe card in the vicinity of a capacitor according to the first embodiment of the present invention.
3 is a schematic cross-sectional view of another example of a probe card according to the first embodiment of the present invention in the vicinity of a capacitor.
4 is a cross-sectional view schematically showing a configuration of an example of a probe card according to a second embodiment of the present invention.
5 is a side view schematically showing a main part of a connection board of an example of a probe card according to a second embodiment of the present invention.
6 is a plan view schematically showing a main part of a connection board of an example of a probe card according to a second embodiment of the present invention.
7 is a schematic cross-sectional view of a portion of a probe card in the vicinity of a capacitor according to the second embodiment of the present invention.
8 is a cross-sectional view schematically showing a configuration of an example of a probe card according to a third embodiment of the present invention.
9 is a plan view schematically showing a connection board of a probe card which is an example of a third embodiment of the present invention.
10 is a plan view schematically showing a band-shaped member to which a capacitor is attached.
11 is a schematic cross-sectional view of another example of the probe card according to the third embodiment of the present invention in the vicinity of the capacitor.
12 is a cross-sectional view schematically showing the structure of an example of a probe card according to a fourth embodiment of the present invention.
13 is a plan view schematically showing a connecting board and a supporting member of a probe card which is an example of the fourth embodiment of the present invention.
Fig. 14 is a cross-sectional view schematically showing a configuration of an example of a probe card according to a fifth embodiment of the present invention.
15 is a schematic cross-sectional view of a portion of a probe card according to a fifth embodiment of the present invention in the vicinity of a capacitor.
16 is a side view showing an example of a conventional probe card.
17 is a schematic diagram showing a connection position of a noise removing capacitor of a probe card.

The probe card of the embodiment of the present invention is used for electrical inspection of an object to be inspected such as a semiconductor wafer in which a plurality of semiconductor integrated circuits are built.

The probe card of the embodiment of the present invention can be configured by arranging, for example, a plurality of probes on a connector plate in the same manner as the conventional probe card 200 shown in Fig. 16, for example. Further, the probe card of the embodiment of the present invention is provided on the prober, and the position of the needle tip of the probe is adjusted. Thereafter, the probe card contacts the needle tip of the probe on each of a plurality of electrode pads, which are electrodes on the semiconductor wafer, and realizes the electrical connection of the semiconductor integrated circuit formed in the semiconductor wafer.

Electrical inspection of a semiconductor wafer can be performed by passing an electric signal for inspection from a tester to the electrode (electrode pad) through a conductive path provided on a connection board or a wiring board.

In such electrical inspection of a semiconductor wafer, there is a noise generated in the conductive path for applying the inspection electric signal as described above as a factor for lowering inspection accuracy. In order to eliminate such noise, it is effective to mount the capacitor on the probe card. The probe card of the embodiment of the present invention can easily mount a capacitor for noise removal and can stably conduct electrical inspection of a subject such as a semiconductor wafer with high precision.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a probe card according to the present invention will be described with reference to the drawings. In the drawings, elements common to those in the drawings are denoted by the same reference numerals, and redundant description is omitted.

Embodiment 1

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view schematically showing a configuration of an example of a probe card according to a first embodiment of the present invention. Fig.

The probe card 1 shown in Fig. 1 is an example of the probe card according to the first embodiment of the present invention. For example, the probe card 1 shown in Fig. 1 includes a circular wiring board 2 as a whole, And a plurality of probes 4 attached to the connection board 3. The probes 4 are mounted on the connecting board 3 and are supported by the wiring board 2 on the surface 2b on the lower side of the drawing. The probe card 1 also has a capacitor 10 that is electrically connected to at least one of the probes 4 on the connection board 3. [ A reinforcing plate 5 for reinforcing the central portion of the wiring board 2 is provided on the other surface 2a (the upper surface of Fig. 1) facing the surface 2b of the wiring board 2 Is installed. The reinforcing plate 5 is fixed to the surface 2a of the wiring board 2 by fasteners such as bolts, for example, not shown.

A plurality of tester lands 6 which are connected to a tester (not shown) for electrical inspection of semiconductor wafers to be inspected are arranged at the edge of the surface 2a of the wiring board 2. [ A connection portion (not shown) corresponding to each tester land 6 is arranged at the center of the other surface 2b of the wiring board 2. [ The connecting portions are connected to the corresponding tester lands 6 via conductive paths (not shown) provided on the wiring board 2. [

The connecting board 3 is composed of, for example, a wiring board similar to a multilayer wiring board. Here, a surface on the side of the wiring board 2, which is the upper side in Fig. 1, of the main surface of the connecting board 3 is referred to as a first surface 3a, And the second surface 3b. In the connecting board 3, a connection pad 7 for each probe 4 is provided on the second surface 3b (a surface which is the lower side of Fig. 1), and on the first surface 3a, (Not shown) provided corresponding to the connecting portion 7 and arranged opposite to the connecting portion of the wiring board 2 are arranged. The connection pads 7 of the probes 4 and the connection portions corresponding to the connection pads 7 are connected to each other through conductive paths (not shown) of the connection substrate 3.

The connecting board 3 is formed so that the first surface 3a is connected to the wiring board 2 so that the connecting portion provided on the first surface 3a is connected to the corresponding connecting portion provided on the surface 2b of the wiring board 2. [ And is disposed opposite to the surface 2b. The connecting board 3 has a structure in which a bolt member (not shown) disposed through the reinforcing plate 5 and the wiring board 2 has an anchor portion (not shown) provided on the first surface 3a, So as to be supported on the surface 2b of the wiring board 2 at a predetermined position.

Each probe 4 illustrated in Fig. 1 is a so-called vertical probe composed of a metal wire such as a tungsten wire or a metal wire such as a nickel alloy made of MEMS. As shown in Fig. 1, for example, the probe 4 comprises a curved portion between a pair of rectilinear portions and a rectilinear portion linearly aligned at both ends. One linear portion of the probe 4 is disposed through a holding plate 8 such as a ceramic plate.

It is possible to insert and pass one linear portion of the probe 4 in correspondence to the arrangement pitch of the probes 4 in the holding plate 8 and further corresponding to the arrangement pitch of the connection pads 7 of the connecting substrate 3 (Not shown) extending in the plate thickness direction of the holding plate 8 is formed. Each of the probes 4 has a tip end of one linear portion thereof extending from one surface of the holding plate 8 (the surface on the upper side in Fig. 1) to the connecting substrate 3 To the corresponding connection pads 7 of the corresponding connection pads 7.

The distal end of the straight portion of the probe 4 protruding from one surface of the holding plate 8 is coupled to the corresponding connection pad 7 of the connecting board 3 using, for example, soldering. The distal end of one linear portion of the probe 4 protrudes from one surface of the holding plate 8 opposed to the second surface 3b of the connecting substrate 3 and the connecting end to the connecting pad 7 do.

The holding plate 8 is held on the second surface 3b of the connecting substrate 3 so as to be able to receive the outer edge of the holding plate 8, for example, And is supported at a predetermined position on the connecting board 3 by an annular holding member 9 having an annular shape.

The probe card 1 as an example of the first embodiment of the present invention has a capacitor 10 that is electrically connected to at least one of the probes 4 on the connecting board 3 as described above. More specifically, as shown in Fig. 1, the probe card 1 has a capacitor 10 on the side of the connecting board 3, that is, the side connecting the first face 3a and the second face 3b, Respectively. One or a plurality of the capacitors (10) are mounted on the side surface of the connecting board (3). It is preferable that the capacitor 10 is electrically connected to at least one of the probes 4 and if it is one, the capacitor 10 is electrically connected to all the probes 4. It is preferable that each of the probes 4 is electrically connected to at least one of the capacitors 10 when there are a plurality of the capacitors 10.

As the capacitor 10, for example, a stacked chip type capacitor in which a conductive layer forming a substrate and a dielectric layer are alternately stacked, and electrodes are attached to both ends of the capacitor, is exemplified. As the capacity of the capacitor 10, it is preferable to select a capacitance of, for example, 0.01 μF to 100 μF. The size of the capacitor 10 is preferably set such that the capacitor 10 is mounted on either the first surface 3a or the second surface 3b of the connecting board 3 when the capacitor 10 is mounted on the side surface of the connecting board 3, It is preferable that the size is such that a part thereof does not protrude.

Therefore, it is preferable that the thickness of the connecting board 3 is larger than the dimension in the thickness direction of the connecting board 3 in the capacitor 10 arranged on the side, and is preferably within a range of 1 mm to 10 mm Do.

Next, a more specific structural example of the portion where the capacitor 10 is mounted on the probe card 1 will be described, and a mounting method of the capacitor 10 will be described in more detail.

In the probe card 1 which is an example of the first embodiment of the present invention, at least one of the first surface 3a and the second surface 3b of the connecting board 3 is located near the side of the capacitor 10 An electrode pad can be provided. That is, in the probe card 1, at least one of the first surface 3a and the second surface 3b of the connecting board 3 can be provided with an electrode pad at the end of the side surface where the capacitor 10 is provided have. It is also possible to provide the electrode pads in the vicinities of the side surfaces of the capacitor 10 on both sides of the first surface 3a and the second surface 3b of the connecting board 3 as described later, for example. The capacitor 10 is electrically connected to the electrode pad using solder or the like on the side surface of the connecting board 3. [

2 is a schematic cross-sectional view of a portion of a probe card in the vicinity of a capacitor according to the first embodiment of the present invention.

Fig. 2 shows an example of a method of mounting the capacitor 10 in the probe card 1, which is an example of the first embodiment of the present invention.

2, the connecting board 3 of the probe card 1 has a first surface 3a to be a wiring board side and a second surface 3b facing the first surface 3a, And electrode pads 11 and 12 on both sides of the side surface 3b of the capacitor 10 in the vicinity of the side surface portion where the capacitor 10 is disposed. That is, the electrode pads 11 and 12 are provided with the electrode pads 11 on the first surface 3a of the connecting substrate 3 and the electrode pads 12 on the second surface 3b.

Either the electrode pad 11 or the electrode pad 12 is electrically connected to a conductive path (not shown) for electrically connecting a semiconductor wafer (not shown), which is an object to be inspected, to a tester And the other is electrically connected to a ground wiring (not shown).

Therefore, in the case of a stacked chip capacitor having a rectangular parallelepiped shape, the capacitor 10 is electrically connected to the electrode pad 11 of the connection substrate 3 by providing the electrode 10a provided on one side of the opposing face, The electrode 10b can be electrically connected to the electrode pad 12 of the connection substrate 3. [ As a result, in the probe card 1, which is an example of the first embodiment of the present invention, the capacitor 10 can be connected between the conductive path for electrically connecting the semiconductor wafer to the tester and the ground wiring, The connection of the capacitor for removing noise becomes possible.

At this time, in the probe card 1, which is an example of the first embodiment of the present invention, the electrical connection between the electrode pads 11, 12 of the connecting board 3 and the electrodes 10a, 10b of the capacitor 10, Solder can be used. That is, as shown in Fig. 2, between the electrode pads 11, 12 of the connecting board 3 and the electrodes 10a, 10b of the capacitor 10, bridging solder layers 13, 14 The above-described electrical connection can be realized.

In the probe card 1 with the capacitor 10 mounted as described above, the noise generated in the conductive path for electrically connecting the semiconductor wafer to the tester is transmitted through the capacitor 10 provided on the side surface of the connection board 3, And can be removed from the ground at a position closer to the ground (4).

That is, in the probe card 1, which is an example of the first embodiment of the present invention, the mounting position of the capacitor 10 can be set on the connecting board 3 close to the probe 4, It can be removed well.

At this time, the method of mounting the capacitors in the probe card of the first embodiment of the present invention is not limited to the method using the bristle type solder layers 13 and 14 shown in Fig. Various other methods capable of mounting the capacitor on the side surface of the connecting board are possible.

For example, as another example of the probe card of the first embodiment of the present invention, a metal-made connecting member can be used to mount a noise removing capacitor on a side surface of a connecting board.

3 is a schematic cross-sectional view of another example of a probe card according to the first embodiment of the present invention in the vicinity of a capacitor.

The probe card 20 as another example of the first embodiment of the present invention is schematically shown in Fig. 3 in the vicinity of the capacitor 10 of the connection substrate 3, but the capacitor 10 on the side of the connection substrate 3 And has the same structure as that of the probe card 1 shown in Fig. Therefore, the same components as those of the probe card 1 shown in FIG. 1 and the like described above are denoted by the same reference numerals, and redundant description is appropriately omitted.

3, in the probe card 20, which is another example of the first embodiment of the present invention, the first surface 3a of the connecting board 3 and the second surface 3b of the connecting board 3, On both sides of the surface 3b, electrode pads 11 and 12 are provided in the vicinity of a side portion where the capacitor 10 is present. That is, in the probe card 1, the electrode pads 11 and 12 are formed on both sides of the first surface 3a and the second surface 3b of the connecting board 3, Can be installed. The capacitor 10 is electrically connected between the electrode pads 11 and 12 by solder and a metallic connection member 15 on the side surface of the connection substrate 3. [

That is, the connection board 3 of the probe card 20 is electrically connected to the first surface 3a on the wiring board 2 side and the second surface 3b opposite to the first surface 3a, The electrode pad 11 is provided on the first surface 3a of the connecting substrate 3 and the electrode pad 11 is provided on the second surface 3b, An electrode pad 12 is provided.

One of the electrode pad 11 and the electrode pad 12 is electrically connected to a conductive path (not shown) electrically connected to a tester (not shown) of a semiconductor wafer (not shown) And the other is electrically connected to a ground wiring (not shown).

In the probe card 20 of the first embodiment of the present invention, the electrical connection between the electrode pads 11 and 12 of the connecting board 3 and the electrodes 10a and 10b of the capacitor 10 is made by metal connection Member 15 can be used. The connecting member 15 is a socket-shaped metal member that is inserted and held by an electronic component such as a condenser, and is electrically connected while being fixed to a desired mounting portion. 3, the vicinity of the side where the capacitor 10 at the end of the connecting board 3 is disposed on one side of the connecting member 15 is referred to as a first side 3a and a side of the second side 3b It is inserted from both sides. In other words, the connecting member 15 sandwiches the end of the connecting board 3 on the side where the capacitor 10 is disposed from both sides of the first surface 3a and the second surface 3b. The connecting member 15 is electrically connected by the solder layers 17 and 18 provided between the electrode pads 11 and 12 on one side and grips the capacitor on the other side. As a result, the connecting member 15 can realize the electrical connection between the electrode pads 11 and 12 of the connecting board 3 and the electrodes 10a and 10b of the capacitor 10.

The probe card 20 in which the capacitor 10 is mounted as described above can exhibit the same effect as the connection method of the capacitor described with reference to Fig. That is to say, the noise generated in the conductive path for electrically connecting the semiconductor wafer to the tester is removed and propagated to the ground at a position closer to the probe 4 through the capacitor 10 provided on the side surface of the connecting board 3 .

Therefore, in the probe card 20, which is another example of the first embodiment of the present invention, the mounting position of the capacitor 10 is set on the connecting board 3 close to the probe 4, similarly to the probe card 1 described above And the noise generated in the conductive path can be efficiently removed.

As described above, the probe card (1, 20) of the first embodiment and the other example of the first embodiment of the present invention having the above configuration can efficiently remove the noise generated in the conductive path by the capacitor (10) The capacitor 10 is provided on the side surface of the connecting substrate 3 and it is not necessary to increase the area of the connecting substrate 3 in order to provide the capacitor 10. Therefore, the increase in the manufacturing cost of the probe card 1 is suppressed. Since the area of the connecting board 3 does not need to be particularly large, it is easy to maintain the flatness of the connecting board 3 when the wiring board 2 and the connecting board 3 are connected.

As described above, in the electrical inspection of the semiconductor wafer of the object to be inspected, the probe is sometimes inspected while heating the semiconductor wafer. In the probe card 1 or 20, the condenser 10 is provided on the side surface of the connection board 3 The wafer 10 is hardly affected by wafer heating, and the capacitor 10 can be prevented from being destroyed or broken due to the heating of the wafer, thereby facilitating maintenance of the inspection stability. Unlike the case where the capacitor 10 is embedded in the connection board 3 in the probe cards 1 and 20, the capacitor 10 can be easily broken or broken, It is possible to suppress an increase in the inspection cost due to, for example,

Further, the probe card 1, 20 of the first embodiment and the other example of the first embodiment of the present invention are used for electrical inspection of a test object such as a semiconductor wafer. That is, as shown in FIG. 1 and the like, the tip ends of the probes 4 held by the holding plate 8 on the side opposite to the side of the connection pad 7 are used as probe tips, The semiconductor wafer is positioned so as to be connected to the electrode of the semiconductor wafer to be inspected. At this time, when relative displacements in the direction of approaching each other are given between the probe cards 1 and 20 and the semiconductor wafer, the curved portion of the central portion of each probe 4 is elastically deformed, Allowing elastic displacement along the straight portion of the tip side to the needle tip. The elastic displacement of the needle tip is such that the needle ends of all the probes 4 are electrically connected to the electrodes of the corresponding semiconductor wafer reliably regardless of the deviation due to the manufacturing error of the height positions of the needle tips of the probes 4 Lt; / RTI > Thereby, the electrodes of the semiconductor wafer are electrically connected to the tester through the corresponding probes 4 and the tester lands 6 electrically connected thereto for electrical inspection of the semiconductor wafers.

Thereafter, electrical inspection of the semiconductor wafer to be inspected is performed by applying an inspection electric signal to an electrode (electrode pad) of the semiconductor wafer by a tester.

In the electrical inspection of the semiconductor wafer to be inspected, as described above, noise generated in the conductive path for applying the inspection electric signal is a cause for lowering the inspection accuracy. However, the probe cards 1 and 20 of the first embodiment and the other example of the first embodiment of the present invention have the capacitor 10 mounted on the side of the connecting board close to the probe 4, which is effective for removing the noise. Therefore, the probe card 1, 20 of the first embodiment and the other example of the first embodiment of the present invention can easily mount the capacitor 10 for noise elimination and can perform electrical inspection of a subject such as a semiconductor wafer with high accuracy and stability .

Embodiment 2 Fig.

In the probe card according to the first embodiment of the present invention described above, processing of a separate step is performed on the side surface of the connecting board 3 supported on the wiring board 2, for example, as in the probe card 1, The capacitor 10 is not provided. On the contrary, in the probe card according to the second embodiment of the present invention, like the probe card 1, the condenser is disposed on the side surface of the connecting board supported on the wiring board at the main surface of the wiring board, A counterboring portion is provided at a mounting position of a side capacitor, and the above-mentioned capacitor is provided at a position where the counterboring portion is provided. By providing the counterboring portion on the side surface of the connecting board, the positioning of the capacitor can be easily performed even in the case of the curved surface of the circumference which is difficult to arrange the capacitor, the positioning work for arranging the capacitor becomes easy, It becomes easy. In addition, it is easy to fix the capacitor to the side surface of the connecting board, and a probe card of higher reliability can be provided.

Hereinafter, a probe card according to a second embodiment of the present invention will be described with reference to the drawings, but the same elements as those of the probe card of the first embodiment of the present invention, Explanations should be omitted appropriately.

4 is a cross-sectional view schematically showing an example of the structure of a probe card according to a second embodiment of the present invention.

The probe card 21 shown in Fig. 4 is an example of a probe card according to the second embodiment of the present invention. For example, the probe card 21 shown in Fig. A connecting substrate 23 supported by the wiring substrate 2 on the lower surface 2b of the connecting substrate 2b and a plurality of probes 4 attached to the connecting substrate 23. [ A reinforcing plate 5 for reinforcing the central portion of the wiring board 2 is provided on the other surface 2a (the upper surface of Fig. 1) opposite to the surface 2b of the wiring board 2 Is installed.

The probe card 21 in the probe card 21 which is an example of the second embodiment of the present invention includes the probe card 1 as an example of the first embodiment of the present invention described above, . The probe card 21 has a plurality of tester lands 6 on the edge portion of the surface 2a of the wiring board 2 and also has a holding plate 8 supported on a predetermined portion of the connecting board 23 A holding member 9 and the like, which are the same as those of the probe card 1 described above.

5 is a side view schematically showing a main part of a connection board of an example of a probe card according to a second embodiment of the present invention.

6 is a plan view schematically showing a main part of a connection board of an example of a probe card according to a second embodiment of the present invention.

As shown in Fig. 5 and Fig. 6, the probe card 21, which is an example of the second embodiment of the present invention shown in Fig. 4, is provided with a counterboring portion 37 on the side surface of the connecting board 23. A capacitor 10 electrically connected to at least one of the probes 4 shown in Fig. 4 may be provided at a position where the counterboring portion 37 is located.

More specifically, as shown in Figs. 5 and 6, the probe card 21 shown in Fig. 4 has a first surface 23a on the side of the wiring board 2 of the connecting board 23, And a counter boring portion 37 on the side connecting the second surface 23b. The probe card 21 has a capacitor 10 at a position where the counterboring portion 37 on the side surface of the connecting board 23 is located. One or more of the capacitors 10 are mounted as shown in the side view of the connecting board 23. The capacitor 10 is electrically connected to at least one of the probes 4 in Fig. It is preferable that the capacitor 10 is electrically connected to all the probes 4 when the capacitor 10 is one. It is preferable that each of the probes 4 is electrically connected to at least one of the capacitors 10 when there are a plurality of the capacitors 10.

As the capacitor 10, there can be enumerated a stacked chip type capacitor in which a conductive layer forming an electrode plate and a dielectric layer are alternately stacked and electrodes are attached to both ends of the capacitor 10 in the form of a rectangular parallelepiped. As the capacity of the capacitor 10, it is preferable to select a capacitance of, for example, 0.01 μF to 100 μF. 4 and 5, when the capacitor 10 is mounted on the side surface of the connecting board 23, the first surface 23a of the connecting board 23, It is preferable that the first surface 23a and the second surface 23b have a size such that a part thereof does not protrude.

Therefore, it is preferable that the thickness of the connecting board 23 is larger than that of the connecting board 23 in the thickness direction of the capacitor 10 disposed on the side surface, and is preferably in the range of 1 mm to 10 mm .

Next, a more specific structural example of the portion where the capacitor 10 is mounted in the probe card 21 will be described, and a mounting method of the capacitor 10 will be described in more detail.

7 is a schematic cross-sectional view of a portion of a probe card in the vicinity of a capacitor according to the second embodiment of the present invention.

6 and 7, the connection board 23 of the probe card 21 has a first surface 23a on the upper side and a second surface 23b opposite to the first surface 23a Electrode pads 31 and 32 are provided in the vicinity of the counter boring portion 37 where the capacitor 10 is disposed. That is, the electrode pads 31 and 32 are provided with the electrode pads 31 on the first surface 23a of the connecting substrate 23 and the electrode pads 32 on the second surface 23b.

Either one of the electrode pad 31 and the electrode pad 32 is electrically connected to a conductive path (not shown) for electrically connecting a semiconductor wafer (not shown) to be inspected to a tester , And the other is electrically connected to a ground wiring (not shown).

Therefore, in the case of a stacked chip capacitor having a rectangular parallelepiped shape, the capacitor 10 is electrically connected to the electrode pad 31 of the connection substrate 23 on one side of the opposing face of the rectangular parallelepiped, The electrode 10b provided on the connection substrate 23 can be electrically connected to the electrode pad 32 of the connection substrate 23. [ As a result, in the probe card according to the second embodiment of the present invention, the capacitor 10 can be connected between the conductive path for electrically connecting the semiconductor wafer to the tester and the ground wiring, and the noise elimination described with reference to Fig. It is possible to connect the capacitor to the capacitor.

At this time, in the probe card 21 which is an example of the second embodiment of the present invention, the electrical connection between the electrode pad 31 of the connecting board 23 and the electrode 10a of the capacitor 10 is performed by soldering . Similarly, electrical connection between the electrode pad 32 of the connecting board 23 and the electrode 10b of the capacitor 10 can be performed by using solder. 7, a bridge-shaped solder layer 33 using solder is formed between the electrode pad 31 of the connecting board 23 and the electrode 10a of the capacitor 10, Can be realized. Similarly, electrical connection can be realized by forming a bridge-shaped solder layer 34 using solder between the electrode pad 32 of the connecting board 23 and the electrode 10b of the capacitor 10.

As described above, in the probe card 21, the capacitor 10 is mounted at a position where the counterboring portion 37 is provided on the side surface of the connecting board 23, and the noise generated in the conductive path for electrically connecting the semiconductor wafer to the tester And can be removed from the vicinity of the probe 4 through the capacitor 10 provided on the side surface of the connecting board 23 to the ground.

That is, in the probe card 21 according to the second embodiment of the present invention, the mounting position of the capacitor 10 can be set on the connecting board 23 close to the probe 4, and noise generated in the conductive path can be efficiently removed can do.

The capacitor 10 is provided on the side surface of the connection board 23 of the probe card 21 so that it is not necessary to increase the area of the connection board 23 in order to install the capacitor 10. Therefore, the increase in the manufacturing cost of the probe card 21 is suppressed. Since the area of the connecting board 23 does not need to be particularly large, it is easy to maintain the flatness of the connecting board 23 when the wiring board 2 and the connecting board 23 are connected.

As described above, in the electrical inspection of the semiconductor wafer of the object to be inspected, the inspection is carried out while heating the semiconductor wafer. In the probe card 21, the condenser 10 is provided on the side surface of the connection board 23 It is difficult to be affected by wafer heating, and it is possible to suppress destruction or failure of the capacitor 10 by heating the wafer, and it is easy to maintain the stability of the inspection. Unlike the case in which the capacitor 10 is embedded in the connection board 23 in the probe card 21, even if the capacitor 10 is destroyed or fails, the probe card 21 can be easily replaced, It is possible to suppress the increase of the inspection cost by the inspection.

The probe card 21 according to the second embodiment of the present invention having the above configuration is used for electrical inspection of a test object such as a semiconductor wafer. In other words, as shown in FIG. 4 and the like, the probe card 21 has a tip end opposite to the connection pad 7 side of each probe 4 held by the holding plate 8 as a needle tip, Positioning is performed with respect to the semiconductor wafer so as to be connected to the electrode of the chain semiconductor wafer. At this time, when a relative displacement in a direction approaching each other is given between the probe card 21 and the semiconductor wafer, the curved portion of the central portion of each probe 4 is elastically deformed by the elastic deformation of the needle 4, Elastic displacement along the linear portion on the tip side is permitted. The elastic displacement of the needle tip is such that the needle ends of all the probes 4 are electrically connected to the electrodes of the corresponding semiconductor wafer reliably regardless of the deviation due to the manufacturing error of the height position of the needle tips of the probes 4 Lt; / RTI > Thereby, the electrodes of the semiconductor wafer are electrically connected to the tester through the corresponding probes 4 and the tester lands 6 electrically connected thereto for electrical inspection of the semiconductor wafers.

Electrical inspection of a semiconductor wafer to be inspected is performed by applying an inspection electric signal to an electrode (electrode pad) of a semiconductor wafer by a tester.

In the electrical inspection of the semiconductor wafer to be inspected, as described above, noise generated in the conductive path for applying the inspection electric signal is a cause for lowering the inspection accuracy. However, the probe card 21 according to the second embodiment of the present invention has a capacitor 10 mounted on the side surface of the connecting substrate close to the probe 4, which is effective for removing the noise. Therefore, the probe card 21 in the example of the second embodiment of the present invention can easily mount the capacitor 10 for noise removal, and can stably conduct electrical inspection of a subject such as a semiconductor wafer with high precision .

Embodiment 3:

In the probe card according to the first embodiment of the present invention described above, the capacitor 10 is provided on the side surface of the connection board 3 supported on the wiring board 2, for example, as in the probe card 1 as an example , And the capacitor 10 is fixed to the side surface of the connecting board 3 by using the solder layers 13 and 14. [ On the contrary, in the probe card according to the third embodiment of the present invention, like the probe card 1, a capacitor is provided on the side surface of the connecting board, but also a band-shaped member is provided on the side surface of the connecting board. The strip-shaped member protects the capacitor on the side surface of the connecting board and more firmly fixes the capacitor on the side surface of the connecting board. In the probe card according to the third embodiment of the present invention, by having such a strip-like member, it is possible to prevent the capacitor from being peeled off from the probe card during the inspection or the like and damaging the inspection object.

Hereinafter, a probe card according to a third embodiment of the present invention will be described with reference to the drawings, but the same elements as those of the probe card of the first embodiment of the present invention, The description to be made is omitted as appropriate.

8 is a cross-sectional view schematically showing a configuration of an example of a probe card according to a third embodiment of the present invention.

The probe card 41 shown in Fig. 8 is an example of the probe card according to the third embodiment of the present invention. The probe card 41 includes a wiring board 2 which is entirely circular and a wiring board 2 on the lower surface 2b of the wiring board 2 And a plurality of probes 4 attached to the connection substrate 3. The probes 4 are connected to the connection substrate 3 via the connecting substrate 3, A reinforcing plate 5 for reinforcing the central portion of the wiring board 2 is provided on the surface 2b of the wiring board 2 and the other surface 2a (the upper surface of Fig. 8) Is installed. The probe card 41 also has a capacitor 10 electrically connected to at least one of the probes 4 on the side surface of the connecting board 3. [ The probe card 41 is disposed on the side surface of the connection board 3 and covers at least a part of the capacitors 10 provided on the side surface thereof from the surface and the capacitor 10 is connected to the side surface of the connection board 3 Like member 47 for strongly adhering it.

The wiring board 2, the connecting board 3, the probes 4, the condenser 10 and the reinforcing plate 5 in the probe card 41, which is an example of the third embodiment of the present invention in Fig. 8, Is the same as the probe card 1, which is an example of the first embodiment of the present invention in Fig. The probe card 41 has a plurality of tester lands 6 on the edge portion of the surface 2a of the wiring board 2 and a holding plate 8 supported by a predetermined portion of the connecting board 3 A holding member 9 and the like, which are the same as those of the probe card 1 described above.

9 is a plan view schematically showing a connection board of a probe card which is an example of a third embodiment of the present invention.

9 shows a connection board 3 of a probe card 41 which is an example of the third embodiment of the present invention, a capacitor 10 provided on the side surface of the connection board 3, and a band- 47). At this time, the solder layer connecting between the capacitor 10 and the electrode pad 11 provided on the connecting board 3 is not shown for the sake of convenience.

The band member 47 provided on the side surface of the connecting board 3 is a strip-like member made of an insulating material and is provided on the side of the connecting board 3 on which the capacitor 10 is provided, And the capacitor 10 is firmly fixed on the side surface of the connection board 3. [ The strip-shaped member 47 is preferably made of an insulating material, and it is preferable that the strip-shaped member 47 is made of a resin material having both insulation and heat resistance, such as polyimide.

The probe card 41 which is an example of the third embodiment of the present invention includes the band member 47 so that the capacitor 10 is more firmly fixed on the side surface of the connection board 3 and the capacitor 10 Can be prevented from peeling off from the probe card 41 and damaging the object to be inspected.

As a method of installing the strip-shaped member 47 in the probe card 41 which is an example of the third embodiment of the present invention, for example, the probe card 1, which is an example of the first embodiment of the present invention, And the band member 47 is wound on the side surface of the connecting board 3 in a state where the capacitor 10 is disposed and the diameter of the band member 47 is reduced. That is, the probe card 1, which is an example of the first embodiment of the present invention described above, is used and the belt-like member 47 is provided around the side surface of the connecting board 3, It is possible to provide the probe card 41 as an example.

In the probe card according to the third embodiment of the present invention, another method may be employed as a method of providing a band-like member for fixing the capacitor to the side surface of the connecting board.

For example, as another example of the probe card according to the third embodiment of the present invention, a capacitor having a capacitor attached to a strip-shaped member is prepared, and the capacitor is wound on the side surface of the connection board to mount the capacitor on the side surface of the connection board .

10 is a plan view schematically showing a belt-like member to which a capacitor is attached.

Like the band member 47 of the probe card 41 described above, the band-shaped member 57 shown in Fig. 10 is preferably made of an insulating material. For example, it is preferable that the band- Is preferably used. It is preferable that the capacitor 10 be attached to the belt-like member 57 by adhering the capacitor 10 to a predetermined position using, for example, an adhesive. At this time, as the capacitor 10, a stacked chip-type capacitor having a rectangular parallelepiped shape in which electrodes 10a and 10b are attached at both ends by alternately overlapping the conductive layer forming the electrode plate and the dielectric layer can be used.

11 is a schematic cross-sectional view of another example of the probe card according to the third embodiment of the present invention in the vicinity of the capacitor.

The probe card 51 which is another example of the third embodiment of the present invention is schematically shown in Fig. 11 in the vicinity of the capacitor 10 of the connecting board 53, 10, the probe card 41 shown in Fig. 8 and the probe card 1 shown in Fig. 1 have the same structure. Therefore, the components common to the probe card 41 and the like in Fig. 8 described above are denoted by the same reference numerals and redundant explanations are appropriately omitted.

The probe card 51 which is another example of the third embodiment of the present invention is provided with a connecting board 53 corresponding to the connecting board 3 of the probe card 11 shown in Fig. Like member (57) having the adhesive layer (10) attached thereto. Hereinafter, the structure of the main part of the connection board 53 of the probe card 51 will be described in more detail.

That is, the probe card 51 is provided with a counter boring (not shown) for arranging the capacitor 10 on the side connecting the first surface 53a on the upper side of the drawing and the second surface 53b on the lower side of the drawing, (59) is provided.

11, in the probe card 51, which is another example of the third embodiment of the present invention, a counter 51 is provided on both sides of the first surface 53a and the second surface 53b of the connecting board 53, Electrode pads 61 and 62 are provided in the vicinity of the boring portion 59.

Therefore, the connection board 53 of the probe card 51 is provided with the counterboring portion 59 on the side portion where the capacitor 10 is disposed, and the counterboring portion 59 on the first surface 3a of the connection board 53 An electrode pad 61 is provided in the vicinity of the counterbore 59 and an electrode pad 62 is provided in the vicinity of the counterboring portion 59 of the second surface 53b.

Either one of the electrode pad 61 and the electrode pad 62 is electrically connected to a conductive path (not shown) for electrically connecting a semiconductor wafer (not shown) to be inspected to a tester , And the other is electrically connected to a ground wiring (not shown).

As shown in Fig. 11, the electrode pad 61 is provided with a bonding portion 63 formed of solder, and the electrode pad 62 is formed with a bonding portion 64 similarly formed of solder.

The probe card 51 is provided with the capacitor 10 by using the belt-like member 57 to which the above-described capacitor 10 is attached at a position where the counterboring portion 59 is located.

More specifically, for example, a belt-like member 57 to which the capacitor 10 is attached is used at the predetermined position, and the belt-like member 57 is connected to the side surface of the connecting board 53 together with the capacitor 10 And the capacitor 10 is disposed at a position where the counterboring portion 59 on the side surface of the connecting board 53 is located. Thereafter, the belt-like member 57 is tightened so that the diameter of the belt-like member 57 provided on the side surface of the connecting board 53 becomes small. Each capacitor 10 is suppressed to a portion where the counterboring portion 59 is formed on the side surface of the connecting board 53 so that the electrode 10a of the capacitor 10 is electrically connected to the junction portion 63 provided on the electrode pad 61 So that the electrode 10b of the capacitor 10 is pressed against the bonding portion 64 provided on the electrode pad 62. [

As a result, in the probe card 51 which is another example of the third embodiment of the present invention, between the electrode pad 61 of the connecting board 53 and the electrode 10a of the capacitor 10, The electrical connection between the pad 62 and the electrode 10b of the capacitor 10 can be realized.

The probe card 41 and 51 according to the third embodiment of the present invention in which the capacitor 10 is mounted as described above and other examples can exhibit the same effect as the connection method of the capacitor described with reference to Fig. That is, the noise generated in the conductive path for electrically connecting the semiconductor wafer to the tester is propagated to the ground through the capacitor 10 provided on the side surface of the connecting board 43, 53 at a position closer to the probe 4 Can be removed.

Therefore, in the probe cards 41 and 51, the placement positions of the capacitors 10 can be set on the connecting boards 3 and 53 close to the probes 4 in the same manner as the probe card 1 described above, It is possible to efficiently remove the noise generated in the display device.

Further, the probe card 41, 51 of the third embodiment of the present invention having the above-described configuration and the other examples are used for electrical inspection of a test object such as a semiconductor wafer. That is, as shown in FIG. 8 and the like, the tip ends of the probes 4, which are held by the holding plate 8, on the side opposite to the side of the connection pad 7 are used as probe tips, Positioning is performed with respect to the semiconductor wafer so as to be connected to the electrode of the semiconductor wafer to be inspected. At this time, when a relative displacement in the direction of approaching each other is given between the probe cards 1 and 20 and the semiconductor wafer, the curved portion of the central portion of each probe 4 is elastically deformed, Allowing elastic displacement along the straight line portion at the tip end. The elastic displacement of the needle tip is such that the needle ends of all the probes 4 are electrically connected to the electrodes of the corresponding semiconductor wafer reliably regardless of the deviation due to the manufacturing error of the height positions of the needle tips of the probes 4 Lt; / RTI > Thereby, the electrodes of the semiconductor wafer are electrically connected to the tester via the corresponding probes 4 and the tester lands 6 electrically connected to the probes 4 for electrical inspection of the semiconductor wafers.

Thereafter, electrical inspection of the semiconductor wafer to be inspected is performed by applying an inspection electric signal to an electrode (electrode pad) of the semiconductor wafer by a tester.

In the electrical inspection of semiconductor wafers to be inspected, as described above, noise generated in the conductive path for applying the inspection electric signal is a cause for lowering inspection accuracy. However, the probing cards 41, 51 of the third embodiment and the other example of the third embodiment of the present invention have the capacitor 10 mounted on the side of the connecting board close to the probe 4 and effective for removing the noise. Further, the capacitor mounted on the side surface is strongly adhered to the side surface, and the fear of peeling-off is reduced. Therefore, the probe card 41, 51 of the third embodiment and the other example of the present invention can easily and stably mount the capacitor 10 for noise elimination, and perform electrical inspection of the inspection object such as a semiconductor wafer with high precision It can be carried out stably.

Embodiment 4.

The probe card of the third embodiment of the present invention described above has a band-shaped member which is provided with a capacitor on the side surface of the connecting substrate and which is provided around the side surface of the connecting substrate and fixes the capacitor to the side surface of the connecting substrate. On the other hand, the probe card of the fourth embodiment of the present invention also has a supporting member provided to support the strip-shaped member with the wiring board. In the probe card according to the fourth embodiment of the present invention, it is possible to prevent the strip-like member from dropping from the probe card at the time of examination or the like by having such a support member. As a result, in the probe card according to the fourth embodiment of the present invention, the capacitor provided on the side surface of the connecting board can be mounted with high stability, and electrical inspection of the inspection object such as a semiconductor wafer can be stably performed with high accuracy.

Hereinafter, the probe card according to the fourth embodiment of the present invention will be described with reference to the drawings, but the same elements as those of the probe card according to the third embodiment of the present invention shown in Fig. 8 and the like described above are denoted by the same reference numerals, The description to be made is omitted as appropriate.

12 is a cross-sectional view schematically showing the structure of an example of a probe card according to a fourth embodiment of the present invention.

The probe card 61 shown in Fig. 12 is an example of the probe card according to the fourth embodiment of the present invention. The probe card 61 includes a wiring board 2 which is entirely circular and a wiring board 2 on the lower surface 2b of the wiring board 2 And a plurality of probes 4 attached to the connection substrate 3. The probes 4 are connected to the connection substrate 3 via the connecting substrate 3, A reinforcement plate 5 for reinforcing the central portion of the wiring board 2 is provided on the other surface 2a (the upper surface of Fig. 12) opposite to the surface 2b of the wiring board 2 have. The probe card 61 also has a capacitor 10 electrically connected to at least one of the probes 4 on the side surface of the connecting board 3. [ The probe card 61 is disposed around the side surface of the connecting board 3 and covers at least a part of the capacitors 10 provided on the side surfaces thereof so that the capacitor 10 is strongly fixed to the side surface of the connecting board 3 Like member (47). The probe card 61 also has a support member 71 which is provided to support the strip-shaped member 47 on the wiring board 2.

In the probe card 61 which is an example of the fourth embodiment of the present invention shown in Fig. 12, the wiring board 2, the connecting board 3, the probe 4, the capacitor 10, the reinforcing plate 5, The shape member 47 is the same as the probe card 41 which is an example of the third embodiment of the present invention shown in Fig. The probe card 61 has a plurality of tester lands 6 on the edge portion of the surface 2a of the wiring board 2 and a holding plate 8 supported by a predetermined portion of the connecting board 3 A holding member 9 and the like, which are the same as those of the probe card 41 described above.

13 is a plan view schematically showing a connecting board and a supporting member of a probe card which is an example of the fourth embodiment of the present invention.

13 shows a connection board 43 of a probe card 61 which is an example of the fourth embodiment of the present invention, a capacitor 10 provided on the side surface of the connection board 43, and a belt- 47 and a support member 71 provided to support the strip-shaped member 47 on the wiring board 2. [0050] As shown in Fig. At this time, the solder connecting between the capacitor 10 and the electrode pad 11 provided on the connecting board 3 is not shown for the sake of convenience.

The support member 71 shown in Figs. 12 and 13 is preferably a bolt-shaped member. Further, for example, in the head portion thereof, a portion protruding to the side of the band-shaped member 47 in a state of being attached to the wiring board 2 is formed. The support member 71 has, for example, such a structure as described above, so that the belt member 47 can be supported from the lower side of the figure by using the head portion as shown in Fig.

The probe card 61 is provided with a support member 71 having such a structure through the wiring board 2 and the reinforcing plate 5 and the tip of the supporting member 71 is connected to the side of the reinforcing plate 5 on the side of the half- Like member 47 provided on the side surface of the connecting board 3 can be supported from the lower side of the figure by being screwed to the anchor portion 72 provided on the surface of the connecting board 3 (upper side in the drawing). As a result, the probe card 61 can support the strip-shaped member 47 with the wiring board 2 by using the support member 71. Adjustment of the height position of the support member 71 can be adjusted by adjusting the degree of screw engagement between the tip of the support member 71 and the anchor portion 72. [

The supporting member 71 of the probe card 61 can be made of an insulating material such as resin. 13, the probe card 61 can arrange the support member 71 in the vicinity of the condenser 10, and the condenser 10, together with the band-shaped member 47, As shown in Fig.

Further, the support member 71 can be constructed using a metal material of higher strength. In this case, it is preferable that the support member 71 of the probe card 61 is disposed in the vicinity of the band-shaped member 47 spaced apart from the capacitor 10, and is arranged to support the band-shaped member 47. The probe card 61 can prevent the thermal stress received by the capacitor 10 from being applied to the wiring board 2 and the reinforcing plate 5 because the metal member is excellent in thermal conductivity and the support member 71 is made of a metal material. . That is, when wafer heating is performed in the electrical inspection of the semiconductor wafer of the object to be inspected, the probe card 61 applies the thermal stress received by the condenser 10 to the wiring board 2 and the reinforcing plate 5) side, so that the life of the capacitor 10 can be prolonged.

The probe card 61, which is an example of the fourth embodiment of the present invention described above, is mounted on the side surface of the connecting board 3 with the capacitor 10, and can exhibit the same effect as the connection method of the capacitor described with reference to Fig. 17 . That is to say, noise generated in the conductive path for electrically connecting the semiconductor wafer to the tester can be prevented from being transmitted to the ground at a position closer to the probe 4 through the capacitor 10 provided on the side surface of the connecting board 3 have.

Therefore, in the probe card 61, the mounting position of the capacitor 10 can be made on the connecting board 3 close to the probe 4, like the above-described probe card 1, etc., It can be efficiently removed.

The probe card 61, which is an example of the fourth embodiment of the present invention having the above configuration, is used for electrical inspection of a subject such as a semiconductor wafer. That is, as shown in Fig. 12 and the like, the tip of the probe card 61 held on the holding plate 8 on the side opposite to the side of the connection pad 7 is a needle tip, Positioning is performed with respect to the semiconductor wafer so as to be connected to the electrode of the chain semiconductor wafer. At this time, when a relative displacement in a direction approaching each other is given between the probe card 61 and the semiconductor wafer, the curved portion of the central portion of each probe 4 is elastically deformed by the elastic deformation, Elastic displacement along the linear portion on the tip side is permitted. The elastic displacement of the needle tip is such that the needle ends of all the probes 4 are electrically connected to the electrodes of the corresponding semiconductor wafer reliably regardless of the deviation due to the manufacturing error of the height positions of the needle tips of the probes 4 Lt; / RTI > Thereby, the electrodes of the semiconductor wafer are electrically connected to the tester through the corresponding probes 4 and the tester lands 6 electrically connected thereto for electrical inspection of the semiconductor wafers.

Thereafter, electrical inspection of the semiconductor wafer to be inspected is performed by applying an inspection electric signal to an electrode (electrode pad) of the semiconductor wafer by a tester.

In the electrical inspection of the semiconductor wafer to be inspected, as described above, noise generated in the conductive path for applying the inspection electric signal is a cause for lowering the inspection accuracy. However, the probe card 61, which is an example of the fourth embodiment of the present invention, has a capacitor 10 mounted on the side surface of the connecting substrate close to the probe 4, which is effective for removing the noise. Further, the capacitor 10 mounted on the side surface is strongly fixed to the side surface of the connecting board 3 by the belt-like member 47 and the supporting member 71, thereby reducing the risk of falling off. Therefore, the probe card 61, which is an example of the fourth embodiment of the present invention, can easily and stably mount the capacitor 10 for noise elimination, and can perform electrical inspection of a subject such as a semiconductor wafer with high accuracy and stability . ≪ / RTI >

Embodiment 5:

In the probe card according to the first embodiment of the present invention described above, the capacitor 10 is provided on the side surface of the connection board 3 supported on the wiring board 2, for example, as in the probe card 1 as an example , And the capacitor 10 is fixed to the side surface of the connecting board 3 by using the solder layers 13 and 14. [ On the other hand, in the probe card according to the fifth embodiment of the present invention, like the probe card 1, a capacitor is provided on the side surface of the connecting board, and a cover is provided on the side surface of the connecting board. The cover covers and protects the capacitor on the side surface of the connection board, and can also fix the capacitor on the side surface of the connection board. In the probe card according to the fifth embodiment of the present invention, by providing such a cover, it is possible to prevent the capacitor from peeling off from the probe card and damaging the object to be inspected.

Hereinafter, a probe card according to a fifth embodiment of the present invention will be described with reference to the drawings. However, the same reference numerals are used for components common to those of the probe card of the first embodiment of the present invention, Explanations should be omitted appropriately.

Fig. 14 is a cross-sectional view schematically showing a configuration of an example of a probe card according to a fifth embodiment of the present invention.

The probe card 81 shown in Fig. 14 is an example of the probe card according to the fifth embodiment of the present invention. The probe card 81 is formed of a wiring board 2 having a circular shape as a whole and a wiring board 2 on the lower surface 2b of the wiring board 2 And a plurality of probes 4 attached to the connection substrate 3. The probes 4 are connected to the connection substrate 3 via the connecting substrate 3, A reinforcing plate 5 for reinforcing the central portion of the wiring board 2 is provided on the surface 2b of the wiring board 2 and the other surface 2a (the upper surface of Fig. 14) Is installed. The probe card 81 has a capacitor 10 electrically connected to at least one of the probes 4 on the side surface of the connecting board 3. [ The probe card 81 has a cover 82 which is provided around the side surface of the connecting board 3 and covers the capacitor 10 provided on the side surface of the connecting board 3 from the surface. The cover 82 can be fixed to the side surface of the connecting board 3 by protecting the capacitor 10 as described above.

In the probe card 81 which is an example of the fifth embodiment of the present invention shown in Fig. 14, the wiring board 2, the connecting board 3, the probes 4, the condenser 10 and the reinforcing plate 5 Which is one example of the first embodiment of the present invention in Fig. 1 described above. The probe card 81 has a plurality of tester lands 6 on the edge portion of the surface 2a of the wiring board 2 and a holding plate 8 supported by a predetermined portion of the connecting board 3 A holding member 9 and the like, which are the same as those of the probe card 1 described above.

15 is a schematic cross-sectional view of a portion of a probe card according to a fifth embodiment of the present invention in the vicinity of a capacitor.

15, in the probe card 81 according to the example of the fifth embodiment of the present invention, the first surface 3a of the connecting board 3 is formed in the same manner as the probe card 1 of Fig. Electrode pads 11 and 12 are provided in the vicinity of the side portion where the capacitor 10 is present on both sides of the first surface 3b and the second surface 3b. The capacitor 10 is electrically connected to the electrode pads 11 and 12 by the solder layers 13 and 14 on the side surface of the connecting board 3. [

Either the electrode pad 11 or the electrode pad 12 is electrically connected to a conductive path (not shown) for electrically connecting a semiconductor wafer (not shown) to be inspected to a tester , And the other is electrically connected to a ground wiring (not shown). As a result, in the probe card 81, which is an example of the fifth embodiment of the present invention, the capacitor 10 can be connected between the conductive path for electrically connecting the semiconductor wafer to the tester and the ground wiring, , It becomes possible to connect the capacitor for removing noise.

15, a probe card 81 of an example of the fifth embodiment of the present invention is a probe card 81 which is provided around a side surface of a connecting board 3 and is provided with a capacitor 10 ) From the surface thereof.

The cover 82 provided on the side surface of the connecting board 3 is made of an insulating material and is provided so as to cover the side surface of the connecting board 3. [ 15, the cover 82 has a ring shape in cross section and can cover the end portion near the side surface of the connecting board 3 together with the capacitor 10 . More specifically, the cover 82 in the shape of a "U" in cross section covers the capacitor 10 disposed on the side surface of the connecting board 3 at the central portion of the back portion, And extends to the electrode pad 11 and the electrode pad 12 of the connecting board 3, respectively. The cover 82 having such a structure can protect the capacitor 10 on the side surface of the connecting board 3 and fix the capacitor 10 to the side surface of the connecting board 3 with high stability.

As described above, the cover 82 is preferably made of an insulating material, and more preferably made of a material capable of attaching / detaching the cover 82 itself. Specifically, it is preferable to use a material having both insulation and heat resistance, such as polyimide and heat-resistant silicone rubber.

The probe card 81 which is an example of the third embodiment of the present invention is provided with the cover 82 so that the capacitor 10 is protected and fixed on the side surface of the connecting board 3 and the capacitor 10 It is possible to prevent the object to be peeled off from the probe cover 81 and being damaged.

In the probe card according to the fifth embodiment of the present invention, the shape of the cover for covering the capacitor on the side surface of the connecting board is not limited to the cross-sectional shape of the cross section like the cover 82 shown in Fig. For example, it is possible to make the bent portion formed above and below the rear portion of the center portion to have a shorter sectional shape so as to cover only the electrode 10a and the electrode 10b of the capacitor 10. It is also possible that the bent portion extending to the side of the connecting board 3 with respect to the rear portion of the central portion is provided at any of the upper and lower portions of the rear portion thereof and has a single bent portion. In addition, it is also possible to make the cross-sectional shape of only the rear portion as the central portion, that is, the cross-section to be rectangular, without providing a bent portion.

As described above, the probe card 81, which is an example of the fifth embodiment of the present invention, is mounted on the side surface of the connecting board 3 and has the same configuration as the capacitor connecting method described with reference to Fig. 17 Effect can be shown. That is, the noise generated in the conductive path for electrically connecting the semiconductor wafer to the tester can be removed from the ground at a position closer to the probe 4 via the capacitor 10 provided on the side surface of the connecting board 3 .

Therefore, in the probe card 81, the mounting position of the capacitor 10 can be made on the connecting board 3 close to the probe 4, like the probe card 1 described above, and noise generated in the conductive path can be efficiently It can be removed well.

The probe card 81, which is an example of the fifth embodiment of the present invention having the above configuration, is used for electrical inspection of a test object such as a semiconductor wafer. In other words, as shown in FIG. 14 and the like, the probe card 81 has a tip end opposite to the connection pad 7 side of each probe 4 held by the holding plate 8 as a needle tip, Positioning is performed with respect to the semiconductor wafer so as to be connected to the electrode of the chain semiconductor wafer. When the probe card 81 and the semiconductor wafer are relatively displaced in a direction approaching each other, the curved portion of the central portion of each probe 4 is elastically deformed by the elastic deformation, Elastic displacement along the linear portion on the tip side is permitted. The elastic displacement of the needle tip is such that the needle ends of all the probes 4 are electrically connected to the electrodes of the corresponding semiconductor wafer reliably regardless of the deviation due to the manufacturing error of the height positions of the needle tips of the probes 4 Lt; / RTI > Thereby, the electrodes of the semiconductor wafer are electrically connected to the tester through the corresponding probes 4 and the tester lands 6 electrically connected thereto for electrical inspection of the semiconductor wafers.

Thereafter, electrical inspection of the semiconductor wafer to be inspected is performed by applying an inspection electric signal to the electrode (electrode pad) of the semiconductor wafer by a tester.

In the electrical inspection of the semiconductor wafer to be inspected, as described above, noise generated in the conductive path for applying the inspection electric signal is a cause for lowering the inspection accuracy. However, the probe card 81, which is an example of the fifth embodiment of the present invention, has a capacitor 10 mounted on the side surface of the connecting board close to the probe 4, which is effective for removing the noise. Further, the capacitor 10 mounted on the side surface is protected by the cover 82 at the side surface of the connecting board 3 and is fixed, thereby reducing the risk of falling off. Therefore, the probe card 81, which is an example of the fifth embodiment of the present invention, can easily and stably mount the capacitor 10 for noise elimination, and can perform electrical inspection of a subject such as a semiconductor wafer with high accuracy and stability . ≪ / RTI >

The probe card according to the fifth embodiment of the present invention is similar to the probe card 81 shown in Fig. 1 except that the probe card 1, which is an example of the first embodiment of the present invention shown in Fig. 1, The cover 82 may have the same structure as that of the cover 82, but may have another structure.

For example, the probe card according to the fifth embodiment of the present invention is the same as the probe card 20, which is another example of the first embodiment of the present invention shown in Fig. 3, in which the cover 82 covering the capacitor 10 is provided A structure similar to the structure in which the cover 82 covering the condenser 10 is provided for the probe card 21 which is an example of the second embodiment of the present invention in Fig. The probe card 51 which is the same as the probe card 41 in which the cover 82 covering the capacitor 10 is provided for the probe card 41 and another example of the third embodiment of the present invention in Fig. It is also possible to use the same structure as that provided with the cover 82 covering the base 10.

Although the present invention has been described above, the present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit of the present invention.

(Industrial availability)

According to the probe card of the present invention, it is possible to inspect an object under the optimum condition in which noises are removed, and to perform accurate inspection of the object.

Further, the probe card of the present invention can be used for inspection of semiconductor wafers for use in consumer electronic devices such as liquid crystal TVs and liquid crystal display devices of portable electronic devices, which are strongly required to improve the efficiency of the inspection process, and furthermore, It is especially valid.

1, 20, 21, 41, 51, 61, 81, 200: probe card
2, 212: wiring board 2a, 2b, 214a: face
3, 23, 53, 214: connecting board 3a, 23a, 53a:
3b, 23b, 53b: second surface 4, 216: probe
5: reinforced plate 6: tester land
7: connection pad 8: retaining plate
9: holding member 10, 220: capacitor
10a and 10b: electrodes
11, 12, 31, 32, 61, 62: electrode pads
13, 14, 17, 18, 33, 34: solder layer 15: connecting member
37, 59: counter boring section 47, 57:
63, 64: joining portion 71: supporting member
72: anchor portion 82: cover
212a: main surface 221:
222: ground wiring 223:

Claims (13)

A probe card having a wiring board, a connecting board supported by the wiring board on the main surface of the wiring board, and a plurality of probes attached to the connecting board,
A first surface of the connecting board connected to the wiring board and a capacitor electrically connected to at least one of the probes on a side of the first surface opposed to the first surface and connecting a second surface on which the plurality of probes are attached, Having a probe card. The method according to claim 1,
Wherein the connecting board has a counterboring portion provided on the side surface, and the capacitor has a position in which the counterboring portion is located. 3. The method according to claim 1 or 2,
Wherein the thickness of the connecting board is larger than the dimension of the connecting board on the side surface in the thickness direction of the connecting board. 3. The method according to claim 1 or 2,
Wherein the connection board has an electrode pad at an end of at least one of a first surface on the wiring board side and a second surface opposite to the first surface,
Wherein the capacitor is electrically connected to the electrode pad using solder. 3. The method according to claim 1 or 2,
The connecting board has electrode pads on both sides of the first surface on the side of the wiring board and the second surface opposite to the first surface,
The capacitor is electrically connected between the electrode pad and the electrode pad by a metal connecting member which sandwiches the end portion of the connecting board from both sides of the first surface and the second surface on one side and sandwiches and grips the capacitor on the other side. A probe card to be connected. 3. The method according to claim 1 or 2,
And a belt-like member which is provided around the side surface of the connecting board and fixes the capacitor to the side surface of the connecting board. 5. The method of claim 4,
And a belt-like member which is provided around the side surface of the connecting board and fixes the capacitor to the side surface of the connecting board. 3. The method according to claim 1 or 2,
And a cover provided around the side surface of the connecting board and covering the capacitor. 5. The method of claim 4,
And a cover provided around the side surface of the connecting board and covering the capacitor. The method according to claim 6,
And a support member provided to support the strip-shaped member with the wiring board. 3. The method according to claim 1 or 2,
Wherein the capacitor is a chip-type capacitor. 5. The method of claim 4,
Wherein the capacitor is a chip-type capacitor. 6. The method of claim 5,
Wherein the capacitor is a chip-type capacitor.
KR1020150133077A 2014-10-08 2015-09-21 Probe card KR101711751B1 (en)

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JP2016075636A (en) 2016-05-12
JP6466128B2 (en) 2019-02-06
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KR20160041761A (en) 2016-04-18
TW201625961A (en) 2016-07-16
CN105510649B (en) 2018-12-25

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