KR101708194B1 - 기판 코팅 방법 및 코팅 장치 - Google Patents

기판 코팅 방법 및 코팅 장치 Download PDF

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KR101708194B1
KR101708194B1 KR1020127011388A KR20127011388A KR101708194B1 KR 101708194 B1 KR101708194 B1 KR 101708194B1 KR 1020127011388 A KR1020127011388 A KR 1020127011388A KR 20127011388 A KR20127011388 A KR 20127011388A KR 101708194 B1 KR101708194 B1 KR 101708194B1
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magnet
substrate
rti
predetermined
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KR20120092619A (ko
Inventor
마르쿠스 벤더
마르쿠스 하니카
에벨린 쉐어
파비오 피랄리시
구이도 만케
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3461—Means for shaping the magnetic field, e.g. magnetic shunts

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1020127011388A 2009-10-02 2010-09-30 기판 코팅 방법 및 코팅 장치 Active KR101708194B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP09172133A EP2306489A1 (en) 2009-10-02 2009-10-02 Method for coating a substrate and coater
EP09172133.2 2009-10-02
PCT/EP2010/064574 WO2011039316A1 (en) 2009-10-02 2010-09-30 Method for coating a substrate and coater

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020157010836A Division KR101709520B1 (ko) 2009-10-02 2010-09-30 기판 코팅 방법 및 코팅 장치

Publications (2)

Publication Number Publication Date
KR20120092619A KR20120092619A (ko) 2012-08-21
KR101708194B1 true KR101708194B1 (ko) 2017-02-20

Family

ID=41725818

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020127011388A Active KR101708194B1 (ko) 2009-10-02 2010-09-30 기판 코팅 방법 및 코팅 장치
KR1020157010836A Active KR101709520B1 (ko) 2009-10-02 2010-09-30 기판 코팅 방법 및 코팅 장치

Family Applications After (1)

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KR1020157010836A Active KR101709520B1 (ko) 2009-10-02 2010-09-30 기판 코팅 방법 및 코팅 장치

Country Status (7)

Country Link
US (2) US20110079508A1 (https=)
EP (2) EP2306489A1 (https=)
JP (4) JP2013506756A (https=)
KR (2) KR101708194B1 (https=)
CN (2) CN102549706B (https=)
TW (3) TWI494969B (https=)
WO (1) WO2011039316A1 (https=)

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JP6073383B2 (ja) * 2012-03-12 2017-02-01 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ スパッタ堆積用の小型の回転可能なスパッタデバイス
JP6134815B2 (ja) * 2013-02-25 2017-05-24 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 隣接スパッタカソードを用いた装置およびその操作方法
EP2778253B1 (de) * 2013-02-26 2018-10-24 Oerlikon Surface Solutions AG, Pfäffikon Zylinderförmige Verdampfungsquelle
WO2015072046A1 (ja) * 2013-11-14 2015-05-21 株式会社Ｊｏｌｅｄ スパッタリング装置
BE1021296B1 (nl) * 2014-04-18 2015-10-23 Soleras Advanced Coatings Bvba Sputter systeem voor uniform sputteren
KR20170000267U (ko) * 2014-05-15 2017-01-18 어플라이드 머티어리얼스, 인코포레이티드 2 개의 코팅 구역들에서의 회전식 타겟 어셈블리들에 의해 기판을 코팅하기위한 장치
CN106460148B (zh) * 2014-06-23 2018-12-04 应用材料公司 在通孔或沟槽中沉积层的方法以及由此获得的产品
BE1022358B1 (nl) * 2014-07-09 2016-03-24 Soleras Advanced Coatings Bvba Sputterinrichting met bewegend doelwit
CN104694892A (zh) * 2015-03-27 2015-06-10 京东方科技集团股份有限公司 一种溅射装置
CN209227052U (zh) * 2015-04-09 2019-08-09 应用材料公司 用于在基板上进行层沉积的设备
JP2018517846A (ja) * 2015-06-05 2018-07-05 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ スパッタ堆積源、スパッタリング装置およびそれらを動作させる方法
KR20180137536A (ko) * 2016-04-21 2018-12-27 어플라이드 머티어리얼스, 인코포레이티드 기판을 코팅하기 위한 방법들 및 코터
WO2017190763A1 (en) * 2016-05-02 2017-11-09 Applied Materials, Inc. Magnetron sputtering method
JP6396367B2 (ja) * 2016-06-27 2018-09-26 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Ｐｖｄアレイ用の多方向レーストラック回転カソード
KR101760218B1 (ko) * 2016-08-30 2017-07-20 전기표 수직진동 제트천공장치 및 방법, 그리고 수직진동 제트그라우팅 장치 및 방법
CN109983150B (zh) * 2016-11-22 2022-04-26 应用材料公司 用于在基板上沉积层的设备和方法
CN107541712A (zh) * 2017-10-11 2018-01-05 广东腾胜真空技术工程有限公司 一种双端进出的玻璃镀膜设备
JP7328744B2 (ja) * 2018-07-31 2023-08-17 キヤノントッキ株式会社 成膜装置、および、電子デバイスの製造方法
US20230097276A1 (en) * 2020-03-13 2023-03-30 Evatec Ag Apparatus and process with a dc-pulsed cathode array
KR102785672B1 (ko) * 2020-07-08 2025-03-26 가부시키가이샤 아루박 성막 방법
EP4324015A1 (en) * 2021-04-16 2024-02-21 Evatec AG Sputtering apparatus for coating of 3d-objects
KR102920678B1 (ko) 2021-04-19 2026-01-29 어플라이드 머티어리얼스, 인코포레이티드 스퍼터 증착 소스, 마그네트론 스퍼터 캐소드, 및 기판 상에 재료를 증착하는 방법
JP7672921B2 (ja) * 2021-08-30 2025-05-08 株式会社アルバック 成膜方法及び成膜装置

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WO2009022184A2 (en) * 2007-08-15 2009-02-19 Gencoa Ltd Low impedance plasma
JP2009512788A (ja) * 2005-10-24 2009-03-26 ソレラス・リミテッド 固定式又は可動磁石アセンブリと組み合わせて回転式ターゲットを組み込むカソード及び応用

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WO2009022184A2 (en) * 2007-08-15 2009-02-19 Gencoa Ltd Low impedance plasma

Also Published As

Publication number Publication date
JP6104967B2 (ja) 2017-03-29
CN102549706A (zh) 2012-07-04
JP2015148014A (ja) 2015-08-20
KR20150052359A (ko) 2015-05-13
JP5993974B2 (ja) 2016-09-21
TW201539524A (zh) 2015-10-16
WO2011039316A1 (en) 2011-04-07
JP2017128813A (ja) 2017-07-27
EP2483907B1 (en) 2016-07-27
KR20120092619A (ko) 2012-08-21
JP6385487B2 (ja) 2018-09-05
TW201113927A (en) 2011-04-16
US20110079508A1 (en) 2011-04-07
JP2015158013A (ja) 2015-09-03
TW201530606A (zh) 2015-08-01
CN104766779B (zh) 2017-07-25
EP2483907A1 (en) 2012-08-08
US20120273343A1 (en) 2012-11-01
EP2306489A1 (en) 2011-04-06
CN104766779A (zh) 2015-07-08
CN102549706B (zh) 2016-03-02
JP2013506756A (ja) 2013-02-28
TWI578371B (zh) 2017-04-11
KR101709520B1 (ko) 2017-02-23
TWI494969B (zh) 2015-08-01
TWI567777B (zh) 2017-01-21

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