KR101698532B1 - 메모리 소자 - Google Patents
메모리 소자 Download PDFInfo
- Publication number
- KR101698532B1 KR101698532B1 KR1020150045174A KR20150045174A KR101698532B1 KR 101698532 B1 KR101698532 B1 KR 101698532B1 KR 1020150045174 A KR1020150045174 A KR 1020150045174A KR 20150045174 A KR20150045174 A KR 20150045174A KR 101698532 B1 KR101698532 B1 KR 101698532B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- magnetic
- magnetization
- free
- tunnel junction
- Prior art date
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- 230000005291 magnetic effect Effects 0.000 claims abstract description 122
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 300
- 230000005415 magnetization Effects 0.000 claims description 58
- 239000000463 material Substances 0.000 claims description 36
- 229910019236 CoFeB Inorganic materials 0.000 claims description 17
- 230000004888 barrier function Effects 0.000 claims description 15
- 239000002131 composite material Substances 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 9
- 238000009792 diffusion process Methods 0.000 claims description 9
- 239000002356 single layer Substances 0.000 claims description 8
- 229910052715 tantalum Inorganic materials 0.000 claims description 7
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 7
- 238000000926 separation method Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 description 27
- 239000002184 metal Substances 0.000 description 27
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 20
- 229910045601 alloy Inorganic materials 0.000 description 15
- 239000000956 alloy Substances 0.000 description 15
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 13
- 239000013078 crystal Substances 0.000 description 10
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 8
- 229910052697 platinum Inorganic materials 0.000 description 8
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 7
- 239000000395 magnesium oxide Substances 0.000 description 7
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 239000003302 ferromagnetic material Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 229910052707 ruthenium Inorganic materials 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 239000010948 rhodium Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 229910052762 osmium Inorganic materials 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 2
- 229910052702 rhenium Inorganic materials 0.000 description 2
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910021302 Co50Pt50 Inorganic materials 0.000 description 1
- 229910019222 CoCrPt Inorganic materials 0.000 description 1
- 229910003321 CoFe Inorganic materials 0.000 description 1
- 229910018979 CoPt Inorganic materials 0.000 description 1
- 229910000684 Cobalt-chrome Inorganic materials 0.000 description 1
- 229910015368 Fe50Pd50 Inorganic materials 0.000 description 1
- 229910015366 Fe50Pt50 Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- -1 Pt or Pd Chemical class 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000004770 chalcogenides Chemical class 0.000 description 1
- 239000010952 cobalt-chrome Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H01L43/02—
-
- H01L43/08—
-
- H01L43/10—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Magnetic active materials
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- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/KR2016/001137 WO2016148395A1 (ko) | 2015-03-18 | 2016-02-02 | 메모리 소자 |
CN201680016463.4A CN107710433B (zh) | 2015-03-18 | 2016-02-02 | 存储器件 |
US15/707,491 US10580964B2 (en) | 2015-03-18 | 2017-09-18 | Memory device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150037234 | 2015-03-18 | ||
KR20150037234 | 2015-03-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20160112890A KR20160112890A (ko) | 2016-09-28 |
KR101698532B1 true KR101698532B1 (ko) | 2017-01-20 |
Family
ID=57101932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150045174A KR101698532B1 (ko) | 2015-03-18 | 2015-03-31 | 메모리 소자 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101698532B1 (zh) |
CN (1) | CN107710433B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101897916B1 (ko) | 2017-06-20 | 2018-10-31 | 고려대학교 산학협력단 | 이지-콘 상태의 자성층을 구비한 자기터널 접합 소자 |
CN112635655A (zh) * | 2019-10-08 | 2021-04-09 | 上海磁宇信息科技有限公司 | 一种磁性隧道结覆盖层及其制作工艺 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012089858A (ja) | 2011-11-28 | 2012-05-10 | Toshiba Corp | 磁気抵抗効果素子、磁気メモリ、磁気抵抗効果ヘッド、および磁気記録再生装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8120126B2 (en) * | 2009-03-02 | 2012-02-21 | Qualcomm Incorporated | Magnetic tunnel junction device and fabrication |
KR101195041B1 (ko) * | 2011-05-12 | 2012-10-31 | 고려대학교 산학협력단 | 자기 공명 세차 현상을 이용한 스핀전달토크 자기 메모리 소자 |
CN102709467A (zh) * | 2012-06-04 | 2012-10-03 | 清华大学 | 一种高灵敏度的CoFeB基磁隧道结 |
KR101446338B1 (ko) * | 2012-07-17 | 2014-10-01 | 삼성전자주식회사 | 자기 소자 및 그 제조 방법 |
KR20140025165A (ko) * | 2012-08-21 | 2014-03-04 | 삼성전자주식회사 | 자기 메모리 소자의 제조 방법 |
KR102153559B1 (ko) * | 2013-08-02 | 2020-09-08 | 삼성전자주식회사 | 수직 자기터널접합을 구비하는 자기 기억 소자 |
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2015
- 2015-03-31 KR KR1020150045174A patent/KR101698532B1/ko active IP Right Grant
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2016
- 2016-02-02 CN CN201680016463.4A patent/CN107710433B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012089858A (ja) | 2011-11-28 | 2012-05-10 | Toshiba Corp | 磁気抵抗効果素子、磁気メモリ、磁気抵抗効果ヘッド、および磁気記録再生装置 |
Also Published As
Publication number | Publication date |
---|---|
CN107710433A (zh) | 2018-02-16 |
KR20160112890A (ko) | 2016-09-28 |
CN107710433B (zh) | 2020-08-04 |
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