KR101697812B1 - 와전류 센서 및 연마 방법 및 장치 - Google Patents

와전류 센서 및 연마 방법 및 장치 Download PDF

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Publication number
KR101697812B1
KR101697812B1 KR1020130033452A KR20130033452A KR101697812B1 KR 101697812 B1 KR101697812 B1 KR 101697812B1 KR 1020130033452 A KR1020130033452 A KR 1020130033452A KR 20130033452 A KR20130033452 A KR 20130033452A KR 101697812 B1 KR101697812 B1 KR 101697812B1
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South Korea
Prior art keywords
coil
coils
sensor
substrate
eddy current
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KR1020130033452A
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Korean (ko)
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KR20130111403A (ko
Inventor
다로오 다카하시
미츠오 다다
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가부시키가이샤 에바라 세이사꾸쇼
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
    • G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
    • G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
    • G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

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  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020130033452A 2012-03-30 2013-03-28 와전류 센서 및 연마 방법 및 장치 Active KR101697812B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012079555A JP5894833B2 (ja) 2012-03-30 2012-03-30 渦電流センサ並びに研磨方法および装置
JPJP-P-2012-079555 2012-03-30

Publications (2)

Publication Number Publication Date
KR20130111403A KR20130111403A (ko) 2013-10-10
KR101697812B1 true KR101697812B1 (ko) 2017-01-18

Family

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KR1020130033452A Active KR101697812B1 (ko) 2012-03-30 2013-03-28 와전류 센서 및 연마 방법 및 장치

Country Status (5)

Country Link
US (1) US9632061B2 (https=)
JP (1) JP5894833B2 (https=)
KR (1) KR101697812B1 (https=)
CN (1) CN103358222B (https=)
TW (1) TWI543847B (https=)

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US9316618B2 (en) * 2014-03-26 2016-04-19 Olympus Ndt, Inc. Method for monitoring the integrity of an eddy current inspection channel
JP6369548B2 (ja) * 2014-07-24 2018-08-08 株式会社村田製作所 磁気センサ
JP6399873B2 (ja) * 2014-09-17 2018-10-03 株式会社荏原製作所 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法
US20160284461A1 (en) * 2015-03-28 2016-09-29 Intel IP Corporation Tuning inductance ratio of a passive device
DE102015209589A1 (de) 2015-05-26 2016-12-01 Wacker Chemie Ag Vorrichtung zur Förderung eines Produktstroms aus Polysiliciumbruch oder Polysiliciumgranulat
TW201710029A (zh) * 2015-09-01 2017-03-16 荏原製作所股份有限公司 渦電流檢測器
JP6779633B2 (ja) * 2016-02-23 2020-11-04 株式会社荏原製作所 研磨装置
HK1224137A (zh) * 2016-10-06 2017-08-11 陳偉權 號 用電量超負荷警報的裝置
WO2018080764A1 (en) * 2016-10-28 2018-05-03 Applied Materials, Inc. Core configuration with alternating posts for in-situ electromagnetic induction monitoring system
EP3321043A3 (en) * 2016-11-10 2018-10-10 Canon Kabushiki Kaisha Method of controlling holding apparatus, holding apparatus, and robot apparatus
WO2018135463A1 (ja) * 2017-01-20 2018-07-26 日本精機株式会社 渦電流式計器
JP6817896B2 (ja) * 2017-05-26 2021-01-20 株式会社荏原製作所 基板研磨装置および基板研磨方法
US11759912B2 (en) * 2017-12-26 2023-09-19 Ebara Corporation Magnetic element and eddy current sensor using the same
JP7244250B2 (ja) * 2017-12-26 2023-03-22 株式会社荏原製作所 磁性素子、及びそれを用いた渦電流式センサ
JP7084811B2 (ja) * 2018-07-13 2022-06-15 株式会社荏原製作所 研磨装置および研磨方法
DE102018211761A1 (de) * 2018-07-16 2020-01-16 MTU Aero Engines AG Vorrichtung mit einem Untersuchungsmittel zur zerstörungsfreien Untersuchung eines Bauteils und Verfahren zum Untersuchen eines Bauteils
JP7179586B2 (ja) * 2018-11-08 2022-11-29 株式会社荏原製作所 渦電流検出装置及び研磨装置
JP7291558B2 (ja) * 2019-07-03 2023-06-15 株式会社荏原製作所 渦電流センサ
US11536693B2 (en) * 2020-04-07 2022-12-27 Fbs, Inc. Folded flat flexible cable guided wave sensor
CN118786322A (zh) * 2022-05-20 2024-10-15 华为技术有限公司 测量导电膜的厚度的装置和传感器
CN115415929B (zh) * 2022-08-30 2024-04-19 中国船舶重工集团公司第七0七研究所 一种用于球铰链球面组合研磨控制系统及使用方法
CN115464556B (zh) * 2022-09-14 2024-01-26 清华大学 一种金属膜厚测量方法和化学机械抛光设备
CN115319634B (zh) * 2022-10-14 2023-03-07 杭州众硅电子科技有限公司 一种涡流终点检测装置及方法
JP2024092231A (ja) 2022-12-26 2024-07-08 株式会社荏原製作所 渦電流センサ、研磨装置および膜厚検出方法
JP2025083039A (ja) * 2023-11-20 2025-05-30 株式会社荏原製作所 基板処理装置および基板処理方法

Citations (1)

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Publication number Priority date Publication date Assignee Title
US20110124269A1 (en) 2009-07-16 2011-05-26 Mitsuo Tada Eddy current sensor and polishing method and apparatus

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DE2410047A1 (de) * 1974-03-02 1975-09-11 Nix Steingroeve Elektro Physik Elektromagnetischer schichtdickenmesser mit umschaltbarer mess-frequenz
JP3276295B2 (ja) * 1996-10-09 2002-04-22 三菱重工業株式会社 渦電流探傷装置
JP2008032575A (ja) * 2006-07-29 2008-02-14 Nippon Hihakai Kensa Kk 渦電流測定用プローブ及びそれを用いた探傷装置
JP2009036682A (ja) * 2007-08-02 2009-02-19 Toyota Motor Corp 渦電流センサ、硬化層深さ検査装置及び硬化層深さ検査方法
JP5513795B2 (ja) 2009-07-16 2014-06-04 株式会社荏原製作所 研磨方法および装置
TWI572441B (zh) * 2008-08-05 2017-03-01 荏原製作所股份有限公司 硏磨方法及裝置
US8657644B2 (en) * 2009-07-16 2014-02-25 Ebara Corporation Eddy current sensor and polishing method and apparatus
JP5730747B2 (ja) * 2010-12-10 2015-06-10 株式会社荏原製作所 渦電流センサ並びに研磨方法および装置
JP5411084B2 (ja) * 2010-08-05 2014-02-12 株式会社東海理化電機製作所 回転角度検出装置

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
US20110124269A1 (en) 2009-07-16 2011-05-26 Mitsuo Tada Eddy current sensor and polishing method and apparatus

Also Published As

Publication number Publication date
TW201347911A (zh) 2013-12-01
KR20130111403A (ko) 2013-10-10
CN103358222A (zh) 2013-10-23
JP5894833B2 (ja) 2016-03-30
JP2013211354A (ja) 2013-10-10
TWI543847B (zh) 2016-08-01
CN103358222B (zh) 2017-03-01
US20130260645A1 (en) 2013-10-03
US9632061B2 (en) 2017-04-25

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