KR101682038B1

KR101682038B1 - Inspection device

Info

Publication number: KR101682038B1
Application number: KR1020140061744A
Authority: KR
Inventors: 케이수케 사카키바라
Original assignee: 야마하하쓰도키 가부시키가이샤
Priority date: 2013-12-27
Filing date: 2014-05-22
Publication date: 2016-12-02
Also published as: JP2015126222A; KR20150077259A; JP6285714B2

Abstract

An inspection apparatus of the present invention includes: an imaging section for imaging an image of a substrate after a reflow process at a predetermined inspection position to acquire an image; a control section for inspecting the substrate based on the sensed image; And a flux suction fan.

Description

[0001] INSPECTION DEVICE [0002]

The present invention relates to an inspection apparatus, and more particularly to an inspection apparatus for inspecting a substrate after reflowing.

Conventionally, an inspection apparatus for inspecting a substrate after reflow is known. Such an inspection apparatus is disclosed in, for example, Japanese Patent Application Laid-Open No. 1208082/1990

Japanese Unexamined Patent Application Publication No. 12-18082 discloses an inspection apparatus comprising an image pickup section for picking up an image of a substrate after a reflow process at a predetermined inspection position and a control section for inspecting the substrate based on the picked- And is disclosed in Japanese Patent Application Laid-Open Publication No. 2012-18082.

However, in the inspection apparatus described in Japanese Unexamined Patent Publication (KOKAI) No. 12-18082, the imaging unit is contaminated by the flux generated (vaporized) from the solder on the substrate due to heat when the substrate is reflowed. As a result, Is lowered.

It is an object of the present invention to provide an inspection apparatus capable of suppressing deterioration of inspection accuracy due to flux.

An inspection apparatus according to one aspect of the present invention includes: an imaging section for picking up an image of a substrate after a reflow process at a predetermined inspection position; a control section for inspecting the substrate based on the picked-up image; And a flux suction fan for sucking the generated flux.

As described above, in the inspection apparatus according to one aspect of the present invention, the flux suction fan for sucking the flux generated from the solder on the substrate is provided, so that the flux generated (vaporized) from the solder on the substrate can be positively removed Therefore, exposure of the imaging section to the vaporized flux can be suppressed. This can prevent the image pickup portion from being contaminated by the flux, so that it is possible to suppress deterioration of the inspection accuracy due to the flux. Further, space saving can be achieved in comparison with a configuration in which a cooling device for cooling the substrate is provided on the upstream side of the inspection apparatus in the transport direction of the substrate in order to suppress the generation of flux from the solder. In addition, unlike the configuration in which the case covers the imaging section in order to suppress exposure of the imaging section to the vaporized flux, it is possible to suppress heat from being applied to the imaging section.

The inspection apparatus according to one aspect preferably further comprises a first blower fan for blowing upward the first conveyor for conveying the substrate to the inspection position and the substrate conveyed to the inspection position, And a first flux suction fan disposed so as to face the first blowing fan with the substrate conveyed to the inspection position between the first blowing fan and the first blowing fan. With this configuration, the flux blown (vaporized) from the solder on the substrate can be positively fed into the first flux suction fan by the first blowing fan, so that the vaporized flux can be reliably sucked into the first flux suction fan . In addition, since the first blowing fan forms a flow of air above the substrate conveyed to the inspection position, the substrate can be cooled by the flow of the air. As a result, the amount of flux generated from the substrate can be gradually reduced.

Preferably, the inspection apparatus according to the one aspect further comprises a detection sensor for detecting that the substrate is transported to the inspection position, and the control unit operates the flux suction fan when it is determined by the detection sensor that the substrate is detected . With this configuration, since the flux suction fan can be operated only when the substrate is transported to the inspection position (the position in the vicinity of the image pickup unit), power consumption can be reduced while suppressing contamination of the image pickup unit.

In this case, it is preferable that the inspection head further includes an inspection head including an illumination unit that irradiates light when the imaging is performed by the imaging unit and the imaging unit, and the inspection head moves to a retreat position above the inspection position and away from the substrate, And the control unit is configured to move the inspection head from the retracted position to the upper position of the inspection position after imaging the substrate with the imaging unit after operating the flux suction fan when it is determined that the substrate has been transported to the inspection position. With this configuration, when the image pickup of the substrate is not performed, the inspection head is retracted to the retreat position where it is hardly exposed to the flux generated from the solder on the substrate, so that contamination of the image pickup unit can be further suppressed.

Preferably, the first conveyor is a movable conveyor movable in a direction perpendicular to the conveying direction of the substrate, at least one of the flux suction fan and the first blowing fan is disposed on the movable conveyor, In addition, the position of the movable conveyor is changed with the movement of the movable conveyor. According to this structure, at least one of the flux suction fan and the first blowing fan can be disposed at a position close to the substrate to be transported, so that the flux generated from the solder on the substrate can be efficiently removed.

The inspection apparatus according to one aspect preferably further comprises a housing provided to surround the image sensing unit and an external air suction fan installed in the housing and sucking air from the outside of the housing into the inside. With this configuration, since the inside of the housing can be made static by the external air suction fan, the flux sucked by the flux suction fan can be easily discharged to the outside of the housing.

In this case, preferably, the flux suction fan is configured to exhaust the drawn flux to the outside of the housing. With such a configuration, it is not necessary to store the sucked flux in the housing, so that the inspection apparatus can be downsized.

In the inspection apparatus according to one aspect of the present invention, preferably, the second conveyor for transporting the substrate to the substrate standby position on the upstream side of the inspection position in the transport direction of the substrate and the substrate conveyed to the substrate standby position are blown The flux suction fan further includes a second blowing fan. The flux suctioning fan includes a second flux suction fan disposed between the second blowing fan and the substrate conveyed to the substrate standby position, and arranged to face the second blowing fan. According to this configuration, even at the substrate stand-by position, the flux generated (vaporized) from the solder on the substrate by the second blowing fan can be positively fed to the second flux suction fan, so that exposure of the image pickup section to the vaporized flux . In addition, since the second blowing fan forms a flow of air above the substrate conveyed to the substrate standby position, the substrate can be cooled by the flow of the air. Thereby, the amount of flux generated from the substrate can be reduced before the substrate is transported to the inspection position.

In this case, preferably, the control unit waits the substrate at the substrate standby position, and if the inspection time of the substrate at the inspection position is longer than the predetermined waiting time, And the operation of the blowing fan and the second flux suction fan is continued. With this configuration, it is possible to positively feed the vaporized flux to the second flux suction fan for a longer period of time by using the waiting time for inspection, and to cool the substrate conveyed to the substrate standby position.

In the inspection apparatus according to one aspect, preferably, the control section is configured to control the number of rotations of the flux suction fan based on the information of the substrate to be inspected. With such a configuration, for example, by performing control to set the number of revolutions to a high value in the case of inspecting a large substrate based on the information of the substrate size (in the case of a large amount of flux to be vaporized) Can be reliably removed. By setting the appropriate number of revolutions of the flux suction fan based on the information on the substrate in this manner, contamination of the imaging section can be suppressed more effectively.

In the configuration for controlling the number of rotations of the flux suction fan, preferably, the control unit is configured to perform control to increase or decrease the number of rotations of the flux suction fan according to the width of the direction perpendicular to the carrying direction of the substrate. With this configuration, the number of rotations of the flux suction fan can be increased or decreased in accordance with the size of the substrate, and the rotation speed can be set to an appropriate number of revolutions.

And a detection sensor for detecting that the substrate has been transported to the inspection position, preferably further comprising a substrate removal detection sensor for detecting that the substrate is transported from the inspection position to the downstream side, The operation of the flux suction fan is stopped. With such a configuration, it is possible to reduce power consumption and reduce the noise caused by the flux suction fan.

According to the present invention, as described above, it is possible to suppress deterioration of inspection accuracy due to flux.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an appearance of an inspection apparatus according to a first embodiment of the present invention; Fig.
2 is a plan view showing the inside of the inspection apparatus according to the first embodiment of the present invention.
3 is a side view showing the inside of the inspection apparatus according to the first embodiment of the present invention.
Fig. 4 is a view showing a state in which the inspection apparatus according to the first embodiment of the present invention sucks the vaporized flux. Fig.
5 is a block diagram showing a configuration of an inspection apparatus according to the first embodiment of the present invention.
6 is a flowchart for explaining an inspection process of the inspection apparatus according to the first embodiment of the present invention.
Fig. 7 is a view showing a state in which the inspection apparatus according to the second embodiment of the present invention sucks the vaporized flux. Fig.
8 is a block diagram showing a configuration of a testing apparatus according to a second embodiment of the present invention.
9 is a flowchart for explaining an inspection process of the inspection apparatus according to the second embodiment of the present invention.
10 is a flowchart showing the first waiting process (subroutine) in the inspection process shown in Fig.
11 is a flowchart showing a second waiting process (subroutine) in the inspection process shown in Fig.
12 is a flowchart showing the inspection process (subroutine) shown in Fig.
13 is a side view showing the inside of the inspection apparatus according to the third embodiment of the present invention.
Fig. 14 is a view showing a state in which the inspection apparatus according to the modification of the first embodiment of the present invention sucks the vaporized flux. Fig.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First Embodiment)

First, the structure of the inspection apparatus 100 according to the first embodiment of the present invention will be described with reference to Figs. 1 to 5. Fig.

The inspection apparatus 100 shown in Figs. 1 and 2 is an apparatus for inspecting the substrate 110 after reflow (see Fig. 2) at a predetermined inspection position. Specifically, the inspection apparatus 100 is an apparatus for performing various inspections such as whether or not the solder is correctly printed on the substrate 110, and whether the component is mounted on the substrate 110 accurately.

2, the inspection apparatus 100 includes a substrate transfer conveyor (hereinafter referred to as a conveyor) 10, an X-beam 20, a Y-beam 30, (40), and a fan unit (50) (see Fig. 3). 5, the inspection apparatus 100 includes a CPU 60, a storage unit 70, and a display unit 80 (see FIG. 1). The inspection apparatus 100 is configured to carry the substrate 110 from the opening 101 (see FIG. 1) on the X1 direction side of the housing 100a (see FIG. 1) As shown in Fig. The conveyor 10 is an example of the " first conveyor " of the present invention. The CPU 60 is an example of the " control unit " of the present invention.

2, the conveyor 10 has a function of holding the substrate 110 and transporting the substrate 110 from the opening 101 (see Fig. 1) in the X1 direction toward the X2 direction. In addition, the conveyor 10 includes a pair of rails 10a and 10b. A detection sensor 11 and a stopper 12 are provided between the pair of rails 10a and 10b. The conveyor 10 conveys the substrate 110 to the inspection position and is configured to fix the substrate 110 to the inspection position by a holding mechanism (not shown). At this inspection position, inspection of the substrate 110 is performed. The conveyor 160 is a movable conveyor in which the rail 10b can move in the Y direction. As a result, it is possible to transport the substrate 110 having a different width in the transport direction and the vertical direction (Y direction).

The detection sensor 11 has a function of detecting that the substrate 110 is transported (brought in) to the inspection position. Further, the detection sensor 11 has a function of detecting that the substrate 110 is carried (ejected) from the inspection position. Further, the detection sensor 11 is an example of the " substrate removal detection sensor " of the present invention.

The stopper 12 has a function of stopping the substrate 110 to be transported at the inspection position. When the substrate 110 is detected by the detection sensor 11 in a state in contact with the stopper 12, the stopper 12 is lowered to a height position where the stopper 12 is not in contact with the substrate 110. Further, when the substrate 110 is transported (taken out) from the inspection position, the stopper 12 ascends to a height position where it can contact the substrate 110.

The X-beam 20 is configured to movably support the inspection head 40 in the X direction. Specifically, the X-beam 20 includes an X-beam motor 21. As the X-beam motor 21 is driven, the inspection head 40 is moved along the X-beam 20. Further, the Y beam 30 is configured to support the inspection head 40 movably in the Y direction through the X beam 20. More specifically, the Y beam 30 includes a Y beam motor 31. [ The inspection head 40 is moved along the Y beam 30 through the X beam 20 by driving the Y beam motor 31. Thus, it is possible to move the inspection head 40 to a retracted position (see FIG. 2) different from the upper side of the inspection position (see FIG. 3) and the upper side of the substrate 110 arranged at the inspection position. The retracted position is a position different from the position above the substrate 110 disposed at the inspection position and is different from the position sandwiched between the pair of rails 10a and 10b of the conveyor 10. [

The inspection head 40 includes an illumination section 42 for irradiating light when imaging is performed by the imaging section 41 and the imaging section 41 as shown in Fig. In addition, the inspection head 40 includes a dome-shaped case 40a. An illuminating unit 42 and a lens unit (not shown) of the image pickup unit 41 are disposed on the inner surface side of the case 40a. The inspection head 40 performs inspection of the substrate 110 in a state in which the inspection head 40 is moved upward of the substrate 110. That is, the image pickup unit 41 is disposed above the substrate 110. [

The illumination unit 42 includes, for example, a plurality of LED light sources.

Here, in the first embodiment, the fan unit 50 includes external air suction fans 51a to 51c, a blowing fan 52, and flux suction fans 53a and 53b. The blowing fan 52 is an example of the "first blowing fan" of the present invention. The flux suction fan 53a is an example of the "first flux suction fan" of the present invention. Further, in Fig. 3, arrows with oblique lines show the flow of air, and black arrows show the flow of vaporization flux.

As shown in Fig. 3, the external air suction fans 51a to 51c have a function of sucking air from the outside of the housing 100a to the inside, thereby making it possible to constantly pressurize the inside of the housing 100a. The external air suction fan 51a is provided on the upper surface of the housing 100a. Each of the external air suction fans 51b and 51c is installed below the side surface of the housing 100a and sucks air through an inferior chamber (not shown) below the base 1. [ This air enters the lower chamber 3 above the base 1 through the opening 1a provided in the base 1. Further, the external air suction fans 51a to 51c are provided with replaceable filters 55, respectively. The filter 55 installed in the external air suction fans 51a to 51c has a function of suppressing dust or the like from intruding from the outside of the housing 100a into the inside.

The blowing fan 52 has a function of blowing the flux generated from the substrate 110 toward the flux suction fan 53a along the upper side of the substrate 110 by blowing toward the substrate 110 conveyed to the inspection position have. That is, the flux suction fan 53a is configured to suck the flux in the direction along the surface of the substrate 110 from the suction unit disposed between the image pickup unit 41 and the substrate 110 in the vertical direction. At this time, the blowing fan 52 is installed on the rail 10b of the conveyor 10 as shown in Figs. The blowing fan 52 is disposed so as to face the flux suction fan 53a. In addition, the air blowing fan 52 is movable in the Y direction together with the rail 10b of the conveyor 10. Concretely, the blowing fan 52 and the flux suction fan 53a are disposed so as to face each other in the direction (Y direction) perpendicular to the conveying direction of the substrate 110. [ The blowing fan 52 and the flux suction fan 53a are arranged parallel to the rails 10b and 10a, respectively. In other words, the blowing fan 52 (flux suction fan 53a) is arranged on the rail 10b (10a) so that the direction of blowing (suction) is perpendicular to the rails 10b (10a)).

The flux suction fans 53a and 53b have a function of sucking the flux generated from the solder on the substrate 110. [ The flux suction fans 53a and 53b are connected to each other through a duct 54. [

The flux suction fan 53a is installed on the rail 10a of the conveyor 10. The flux suction fan 53a is disposed so as to face the blowing fan 52 so as to sandwich the substrate 110 conveyed to the inspection position between the blowing fan 52 and the blowing fan 52. [ A replaceable filter 55 is provided on the substrate 110 side (Y1 direction side) of the flux suction fan 53a. The filter 55 installed in the flux suction fan 53a has a function of suppressing the flux sucked by the flux suction fan 53a from being exhausted directly to the outside of the housing 100a. That is, the flux sucked by the flux suction fan 53a and not captured (adsorbed) by the filter 55 is exhausted to the outside of the housing 100a together with the air.

The flux suction fan 53b is provided on the side surface of the housing 100a. The flux suction fan 53b is configured to be attracted by the flux suction fan 53a to discharge the flux fed through the duct 54 to the outside of the housing 100a.

The CPU 60 is configured to control the entire inspection apparatus 100 as shown in Fig. The CPU 60 also inspects the substrate 110 based on the image picked up by the image pickup unit 41. [ The CPU 60 controls the fan unit 50 (the external air suction fans 51a to 51c, the blowing fan 52, the flux suction fans 53a and 53b) until the substrate 110 is brought into the inspection apparatus 100, 53b) are stopped. The CPU 60 is configured to operate the fan unit 50 when it is determined by the detection sensor 11 that the substrate 110 is detected. The CPU 60 is configured to control the number of rotations of the fan unit 50 based on information (for example, size information and the like) of the substrate 110 to be inspected. Specifically, the CPU 60 controls to increase or decrease the number of rotations of the fan unit 50 in accordance with the size of the width of the substrate 110 in the Y direction (the size of the interval between the rails 10a and 10b of the conveyor 10) . More specifically, the CPU 60 sets the number of rotations of the fan unit 50 to be proportional to the width of the substrate 110 in the Y direction.

The storage unit 70 is configured to store data relating to inspection and the like.

The display unit 80 is configured to display inspection results and the like.

Next, the inspection process of the inspection apparatus 100 will be described with reference to Figs. 2 to 4 and 6. Fig. This checking process is performed by the CPU 60. [

First, in step S1, the CPU 60 raises the stopper 12 from the lowered position, and then conveys the substrate 110 to the inspection position.

Next, in step S2, the CPU 60 determines whether or not the substrate 110 has been transported to the inspection position. Specifically, the CPU 60 determines that the substrate 110 has been transported to the inspection position based on the detection of the substrate 110 by the detection sensor 11. The CPU 60 repeats this determination until the substrate 110 is transported to the inspection position, and when the substrate 110 is transported to the inspection position, the CPU 60 performs the processing in step S3.

Next, in step S3, the CPU 60 turns on the power supply of the fan unit 50. Then, Specifically, the CPU 60 turns on the external air suction fans 51a to 51c, the blowing fan 52, and the flux suction fans 53a and 53b. As a result, the blowing (suction and exhaust) by the fan unit 50 is started. In step S3, the CPU 60 controls the external air suction fans 51a to 51c based on information on the size of the substrate 110 (the substrate 110 to be inspected in the inspection apparatus 100) The air blowing fan 52, and the flux suction fans 53a and 53b at a predetermined number of revolutions.

Next, in step S4, the CPU 60 moves the inspection head 40 to the inspection position. Specifically, the inspection head 40 is moved from the retracted position (see FIG. 2) to the inspection position (see FIG. 3).

Next, in step S5, the CPU 60 controls each section of the inspection apparatus 100 to start inspection. 4, when the CPU 60 determines that the substrate 110 has been transported to the inspection position, the CPU 60 operates the fan device 50 The inspection head 40 is moved from the retracted position to the upper side of the inspection position. Then, the CPU 60 images the substrate 110 on the imaging unit 41 and performs inspection.

Next, in step S6, the CPU 60 determines whether or not the inspection is completed. The CPU 60 repeats this determination until the inspection is completed, and when the inspection is completed, the CPU 60 advances the processing to step S7.

Next, in step S7, the CPU 60 lowers the stopper 12 from the raised position, and then transfers the substrate 110 from the inspection position.

Next, in step S8, the CPU 60 determines whether or not the substrate 110 is carried (ejected) from the inspection position. Specifically, the CPU 60 determines that the substrate 110 has been transported from the inspection position based on the detection sensor 11 changing from the state in which the substrate 110 is detected to the state in which the substrate 110 is not detected. That is, the detection sensor 11 also functions as a substrate carry-out detection sensor that detects that the substrate 110 is carried out from the inspection position to the downstream side. The CPU 60 repeats this determination until the substrate 110 is transported from the inspection position, and advances the processing to step S9 when the substrate 110 is transported from the inspection position.

Next, in step S9, the CPU 60 turns off the power of the fan unit 50. [ Specifically, after the stopper 12 is lifted from the lowered position, the CPU 60 turns off the external air suction fans 51a to 51c, the blowing fan 52, and the flux suction fans 53a and 53b . As a result, the blowing (suction and exhaust) by the fan unit 50 is stopped.

Next, in step S10, the CPU 60 moves (retracts) the inspection head 40 to the retreat position. Thereafter, the CPU 60 ends the inspection process.

In the first embodiment, the following effects can be obtained.

In the first embodiment, as described above, flux suction fans 53a and 53b for sucking the flux generated from the solder on the substrate 110 are provided. As a result, the flux generated (vaporized) from the solder on the substrate 110 can be positively removed, and exposure of the image pickup unit 41 to the vaporized flux can be suppressed. As a result, since the imaging unit 41 can be prevented from being contaminated by the flux, deterioration of the inspection accuracy due to the flux can be suppressed. In order to suppress the generation of flux from the solder on the substrate 110, a cooling device for cooling the substrate 110 is provided on the upstream side of the inspection apparatus 100 in the transport direction of the substrate 110 It is possible to save space. It is also possible to suppress heat from being applied to the image pickup unit 41 as compared with a configuration in which the image pickup unit 41 is covered by the case in order to suppress exposure of the image pickup unit 41 to vaporized flux.

In the first embodiment, as described above, a flux suction fan 53a disposed so as to face the blowing fan 52 is sandwiched between the blowing fan 52 and the substrate 110 conveyed to the inspection position. Install it. As a result, the flux blown (vaporized) from the solder on the substrate 110 can be positively fed to the flux suction fan 53a by the blowing fan 52, so that the vaporized flux is supplied to the flux suction fan 53a It can be surely sucked. Since the airflow is formed above the substrate 110 conveyed to the inspection position by the blowing fan 52, the substrate 110 can be cooled by the flow of the air. Thus, the amount of flux generated from the substrate 110 can be gradually reduced.

In the first embodiment, as described above, the CPU 60 is configured to operate the flux suction fans 53a and 53b when the detection sensor 11 determines that the substrate 110 is detected. This makes it possible to operate the flux suction fans 53a and 53b only when the substrate 110 is transported to the inspection position (near the imaging unit 41), thereby suppressing contamination of the imaging unit 41 The power saving can be achieved.

Further, in the first embodiment, as described above, the inspection head 40 is configured to be movable in the retreat position different from the upper side of the inspection position and the upper side of the substrate 110. When the CPU 60 determines that the substrate 110 has been transported to the inspection position, the flux suction fans 53a and 53b are operated, the inspection head 40 is moved from the retracted position to the upper side of the inspection position, The image pickup unit 41 is configured to pick up the image of the substrate 110. [ The inspection head 40 is retracted to the retreat position where the substrate 110 is not easily exposed to the flux generated from the solder on the substrate 110 so that the imaging unit 41 is contaminated Can be suppressed.

As described above, in the first embodiment, the conveyor 10 movable in the vertical direction with respect to the conveying direction of the substrate 110 is provided, and the blowing fan 52 disposed in the conveyor 10 is placed on the movable conveyor So that the arrangement position is changed with the movement. This makes it possible to dispose the blowing fan 52 at a position close to the substrate 110 to be transported, so that the flux generated from the solder on the substrate 110 can be efficiently removed.

In the first embodiment, as described above, external air suction fans 51a to 51c which are provided in the housing 100a and suck air from the outside of the housing 100a are provided. This allows the inside of the housing 100a to be a positive pressure by the external air suction fans 51a to 51c so that the flux sucked by the flux suction fans 53a and 53b can be easily transferred to the outside of the housing 100a Can be discharged.

Further, in the first embodiment, as described above, the flux sucked by the flux suction fans 53a and 53b is exhausted to the outside of the housing 100a. As a result, it is not necessary to store the flux sucked in the housing 100a, thereby making it possible to miniaturize the inspection apparatus 100. [

In the first embodiment, as described above, the CPU 60 is configured to control the number of rotations of the flux suction fan 53b based on the information of the board 100 to be inspected. Thereby, by performing control to set the number of revolutions to a high value in the case of inspecting the large substrate 110 (the amount of flux to be vaporized is large) based on the information of the dimension of the substrate 110, for example, The flux generated from the substrate 110 can be reliably removed. By setting the appropriate number of rotations of the flux suction fan based on the information of the substrate 110 in this manner, contamination of the imaging unit 41 can be suppressed more effectively.

In the first embodiment, as described above, the CPU 60 controls to increase or decrease the number of rotations of the flux suction fans 53a and 53b according to the size of the width in the direction perpendicular to the carrying direction of the substrate 110 . Thereby, the number of rotations of the flux suction fans 53a and 53b can be increased or decreased according to the size of the substrate 110, and can be set to an appropriate number of rotations.

In the first embodiment, as described above, when the CPU 60 determines that the substrate 110 has been taken out to the downstream side from the inspection position by the detection sensor 11, the flux suction fans 53a and 53b are stopped . As a result, it is possible to reduce the power consumption and reduce the noise caused by the flux suction fans 53a and 53b.

Step S3 may be performed after step S1 and step S2 may be performed after step S3 and step S4 may be performed after step S2. Thereby, before the substrate 110 reaches the inspection position, the power of the fan unit is turned on to increase the number of rotations of the flux suction fan 53b. When the substrate 110 reaches the inspection position, The number of revolutions that can be removed.

(Second Embodiment)

Hereinafter, the configuration of the inspection apparatus 200 according to the second embodiment of the present invention will be described with reference to Figs. 7 and 8. Fig.

In the second embodiment, unlike the first embodiment in which the standby position of the substrate 110 is not provided upstream (in the X1 direction) in the conveying direction of the inspection position, the standby position of the substrate 110 The inspection apparatus 200 will be described. In the following description, the members denoted by the same reference numerals as those in the first embodiment are the same as those in the first embodiment, and a description thereof will be omitted.

Here, in the second embodiment, as shown in Fig. 7, a first conveyor 210 and a second conveyor 215 that hold the substrate 110 and convey it from the X1 direction to the X2 direction are provided. The first conveyor 210 is provided on the downstream side (X2 direction side) of the second conveyor 215 in the conveying direction (X2 direction) of the substrate 110. [ In addition, the first conveyor 210 includes a pair of rails 210a and 210b. In addition, the second conveyor 215 includes a pair of rails 215a and 215b. Also, the first conveyor 210 (the second conveyor 215) is a movable conveyor capable of moving in the Y direction in the rails 210b and 215b). The inspection apparatus 200 also includes a second conveyor CPU 260 (see FIG. 8). The driving of the second conveyor 215 is controlled by the second conveyor CPU 260.

Between the pair of rails 210a and 210b of the first conveyor 210, a detection sensor 11c and a stopper 12c are provided. The first conveyor 210 is configured to transport the substrate 110 to the inspection position and fix the substrate 110 to the inspection position by a holding mechanism (not shown). The detection sensor 11c is an example of the " substrate removal detection sensor " of the present invention.

The detection sensors 11a and 11b and the stoppers 12a and 12b are formed between the pair of rails 215a and 215b of the second conveyor 215. [ Specifically, the detection sensor 11a, the stopper 12a, the detection sensor 11b, and the stopper 12b are provided sequentially from the upstream side (X1 direction side) of the substrate 110 in the transport direction. The second conveyor 215 is moved from a first substrate standby position (hereinafter referred to as a first standby position), which is a position upstream of the substrate 110 in the transport direction, to a second substrate standby position And the substrate 110 is transported toward the substrate 110. The detection sensor 11a detects that the substrate is transported to the first standby position, and the detection sensor 11b is configured to detect that the substrate is transported to the second standby position. The detection sensors 11a to 11c and the stoppers 12a to 12c have the same configuration as the detection sensor 11 and the stopper 12 of the first embodiment, respectively, and thus the detailed description thereof will be omitted. The second substrate standby position is an example of the " substrate standby position " of the present invention.

Here, in the second embodiment, in addition to the external air suction fans 51a to 51c (see FIG. 3), the air blowing fan 52, and the flux suction fans 53a and 53b, the fan unit 250 includes the air blowing fans 252a and 252b, and flux suction fans 253a, 253b. The blowing fan 252b is an example of the "second blowing fan" of the present invention. The flux suction fan 253b is an example of the "second flux suction fan" of the present invention.

The blowing fan 252a (blowing fan 252b) blows the flux generated from the substrate 110 to the flux suction fan 253a by blowing toward the substrate 110 conveyed to the first standby position (second standby position) (The flux suction fan 253b). The blowing fans 252a and 252b are both installed on the rails 215b of the second conveyor 215. [ The blowing fans 252a and 252b are disposed so as to face each other (opposite) to the flux suction fans 253a and 253b, respectively. Further, the blowing fans 252a and 252b are movable in the Y direction together with the rails 215b of the second conveyor 215.

The flux suction fans 253a and 253b have a function of sucking the flux generated from the solder on the substrate 110. [ The flux suction fans 253a and 253b and the flux suction fan 53a are both connected to the flux suction fan 53b through a common duct 254. [

The flux suction fans 253a and 253b are installed on the rails 215a of the second conveyor 215. The flux suction fan 253a is disposed so as to face the blowing fan 252a so as to sandwich the substrate 110 conveyed to the first standby position between the flux suction fan 253a and the blowing fan 252a. The flux suction fan 253b is disposed so as to face the blowing fan 252b so as to sandwich the substrate 110 conveyed to the second standby position between the blowing fan 252b and the blowing fan 252b. Further, a replaceable filter 55 is provided on the substrate 110 side (Y1 direction side) of the flux suction fans 253a and 253b.

The flux suction fan 53b is configured to be attracted by the flux suction fan 53a and the flux suction fans 253a and 253b to discharge the flux fed through the duct 254 to the outside of the housing 100a.

Next, the inspection process of the inspection apparatus 200 will be described with reference to Figs. 7 and 9. Fig. This inspection process is performed by the CPU 60 and the second conveyor CPU 260. [

First, in step S100, the CPU 60 and the second conveyor CPU 260 perform the first waiting process. Specifically, the second conveyor CPU 260 returns the substrate 110 to the first standby position (see FIG. 7). Then, the CPU 60 operates the blowing fan 252a and the flux suction fan 253a. In addition, the second conveyor CPU 260 waits the substrate 110 in the first standby position for a predetermined period of time, and then conveys the substrate 110 from the first standby position. The details (subroutine) of step S100 will be described later in detail.

Next, in step S200, the CPU 60 and the second conveyor CPU 260 perform the second waiting process. Specifically, the second conveyor CPU 260 returns the substrate 110 to the second standby position (see FIG. 7). Then, the CPU 60 operates the blowing fan 252b and the flux suction fan 253b. Further, the second conveyor CPU 260 waits the substrate 110 in the second standby position for a predetermined time, and then conveys the substrate 110 from the second standby position. Details of the step (S200) (subroutine) will be described later in detail.

Next, in step S300, the CPU 60 performs inspection processing. Specifically, the CPU 60 returns the substrate 110 to the inspection position (see FIG. 7). Then, the CPU 60 operates the blowing fan 52 and the flux suction fan 53. When the inspection of the substrate 110 is completed, the CPU 60 carries the substrate 110 from the inspection position. Details (subroutine) of step S300 will be described later in detail.

Next, the first waiting process (subroutine) shown in Fig. 9 will be described with reference to Figs. 7 and 10. Fig. The second conveyor CPU 260 controls the driving of the second conveyor 215, and the CPU 60 performs other controls.

First, in step S101, the second conveyor CPU 260 raises the stopper 12a from the lowered position, and then conveys the substrate 110 to the first standby position (see FIG. 7).

Next, in step S102, the CPU 60 determines whether or not the substrate 110 is transported to the first standby position. Specifically, the CPU 60 determines that the substrate 110 is transported to the first standby position based on the detection of the substrate 110 by the detection sensor 11a. The CPU 60 repeats this determination until the substrate 110 is transported to the first standby position, and advances the processing to step S103 when the substrate 110 is transported to the first standby position.

Next, in step S103, the CPU 60 turns on the power of the fan disposed at the first standby position. Specifically, the CPU 60 turns on the power of the external air suction fans 51a to 51c, the blowing fan 252a, and the flux suction fans 253a and 53b to start blowing (suction and exhaust) do. When the second and subsequent substrates 110 are transported to the first standby position, when the processing in step S100 is performed, the power sources of the external air suction fans 51a to 51c and the flux suction fan 53b are already on State, and the CPU 60 turns on the power of the blowing fan 252a and the flux suction fan 253a.

Next, in step S104, the CPU 60 determines whether or not a predetermined time has passed since the substrate 110 was transported to the first standby position. The CPU 60 repeats this determination until a predetermined time elapses after the substrate 110 is transported to the first standby position and when a predetermined time has elapsed after the substrate 110 is transported to the first standby position, The process proceeds to step S105. That is, the predetermined time is the time for the substrate 110 to wait at the first standby position, and is set by the user (user) in advance.

Next, in step S105, the CPU 60 determines whether or not the substrate 110 exists in the second standby position. That is, the CPU 60 determines whether or not the substrate 110 has been transported from the second standby position. Specifically, the CPU 60 determines that the substrate 110 is transported from the second standby position based on the fact that the substrate 110 is not detected by the detection sensor 11b. The CPU 60 repeats this determination until the substrate 110 is transported from the second standby position, and advances the processing to step S106 when the substrate 110 is transported from the second standby position.

Next, in step S106, the second conveyor CPU 260 lowers the stopper 12a from the raised position, and then conveys the substrate 110 from the first standby position.

Next, in step S107, the CPU 60 determines whether or not the substrate 110 is transported from the first standby position. Specifically, the CPU 60 determines that the substrate 110 has been transported from the first standby position based on the fact that the substrate 110 is not detected by the detection sensor 11a. The CPU 60 repeats this determination until the substrate 110 is transported from the first standby position and advances the processing to step S108 when the substrate 110 is transported from the first standby position.

Next, in step S108, the CPU 60 turns off the power of the fan disposed in the first standby position. Specifically, the CPU 60 turns off the power of the blowing fan 252a and the flux suction fan 253a.

Next, in step S109, the CPU 60 determines whether or not the next substrate 110 is present. Specifically, the CPU 60 determines whether or not there is a substrate 110 to be brought into the inspection apparatus 200 next time. Next, when it is determined that there is a substrate 110 to be brought into the inspection apparatus 200, the process returns to step S101. On the other hand, if it is determined that there is no substrate 110 to be brought into the inspection apparatus 200 next, the first waiting process (subroutine) is terminated.

Next, the second waiting process (subroutine) shown in Fig. 9 will be described with reference to Figs. 7 and 11. Fig. The processing of step S201, step S202, step S204, step S206, and step S207 in the second waiting process are the same as those in step S101 and step Substantially the same processing as that in steps S102, S104, S106, and S107 is performed in the second standby position. Therefore, detailed description of the processes of step S201, step S202, step S204, step S206, and step S207 will be omitted.

In step S201, the CPU 60 raises the stopper 12b from the lowered position, and then conveys the substrate 110 to the second standby position. When the CPU 60 determines that the substrate 110 is transferred to the second standby position in step S202, the CPU 60 sets the power source of the fan disposed in the second standby position in step S203 And blowing (suction and exhaust) is started. Specifically, the CPU 60 turns on the power of the blowing fan 252b and the flux suction fan 253b.

Next, in step S2O4, the CPU 60 determines whether or not a predetermined time has elapsed since the substrate 110 was transported to the second standby position. The CPU 60 repeats this determination until a predetermined time elapses after the substrate 110 is transported to the second standby position and when a predetermined time has elapsed after the substrate 110 is transported to the second standby position, The process proceeds to step S205.

Next, in step S205, the CPU 60 determines whether or not the substrate 110 is present at the inspection position. That is, the CPU 60 determines whether or not the substrate 110 has been transported from the inspection position. Specifically, the CPU 60 determines that the substrate 110 has been transported from the inspection position based on the fact that the substrate 110 is not detected by the detection sensor 11c. The CPU 60 repeats this determination until the substrate 110 is conveyed from the inspection position, and advances the processing to step S206 when the substrate 110 is conveyed from the inspection position.

By the processes of steps S204 and S205, the CPU 60 determines the waiting time of the substrate 110 at the inspection position to be longer than the preset waiting time for waiting the substrate 110 in the second standby position Control is performed so that the operation of the blowing fan 252b and the flux suction fan 253b is continued by waiting the substrate 110 in the second standby position even after the lapse of the waiting time. If the inspection time is less than or equal to the waiting time (when the inspection is finished when the predetermined time has elapsed), the CPU 60 sets the waiting time set in advance in the process of steps S204 and S205, 110) to the second standby position, and then proceeds to step S206. In step S206, the CPU 60 moves the substrate 110 from the second standby position after lowering the stopper 12b from the raised position.

If the CPU 60 determines that the substrate 110 has been transported from the second standby position in step S207, the CPU 60 determines in step S208 whether the power of the fan disposed in the second standby position Off. Specifically, the CPU 60 turns off the power of the blowing fan 252b and the flux suction fan 253b.

Next, in step S209, the CPU 60 determines whether or not the next substrate 110 is present. If there is a substrate 110 to be brought into the second standby position next, the CPU 60 returns the process to step S201. On the other hand, if it is determined that there is no substrate 110 to be brought into the second standby position, the second waiting process (subroutine) ends.

Next, the inspection process (subroutine) shown in Fig. 9 will be described with reference to Figs. 7 and 12. Fig. In the inspection process shown in Fig. 9, the process with the process number in the inspection process of the first embodiment is the same process as that of the first embodiment, and the description thereof will be omitted.

In step S1, the CPU 60 raises the stopper 12c from the lowered position, and then conveys the substrate 110 to the inspection position. At this time, the CPU 60 moves the inspection head 40 from the retreat position to the inspection position and arranges (rectifies) the inspection head 40 at the inspection position until the inspection process is completed. In the second embodiment, it is possible to absorb the flux at the first standby position and the second standby position. This ensures that the inspection head 40 is not moved alternately above the retreat position and the inspection position every time the substrate 110 is transported and the inspection head 40 is rectified above the inspection position, It is possible to perform inspection while suppressing contamination by the flux 40 (the imaging section 41 and the illumination section 42).

If it is determined in step S2 that the substrate 110 has been transported to the inspection position, the CPU 60 turns on the fan disposed in the inspection position in step S301. Specifically, the CPU 60 turns on the power of the blowing fan 52 and the flux suction fan 53a.

When the substrate 110 whose inspection has been completed by the processes of steps S5 to S8 is returned from the inspection position, the CPU 60, at step S302, turns off the power of the fan disposed at the inspection position . Specifically, the CPU 60 turns off the power of the blowing fan 52 and the flux suction fan 53a.

Next, in step S303, the CPU 60 determines whether or not the next substrate 110 is present. If there is a substrate 110 to be brought into the inspection position next time, the CPU 60 returns the processing to step S1. On the other hand, if it is determined that there is no substrate 110 to be brought into the inspection position next, the process proceeds to step S304.

Next, in step S304, the CPU 60 stops all the fans. Specifically, the CPU 60 turns off the power of the external air suction fans 51a to 51c and the flux suction fan 53b. Thereafter, the CPU 60 ends the inspection process (subroutine). By the above-described steps (S100) to (S300), the substrate 110 is inspected.

In the second embodiment, the following effects can be obtained.

In the second embodiment, as described above, flux suction fans 53a, 53b, 253a, and 253b for sucking the flux generated from the solder on the substrate 110 are provided. As a result, the flux generated (vaporized) from the solder on the substrate 110 can be positively removed, and exposure of the imaging unit 41 to the vaporized flux can be suppressed. As a result, since the imaging unit 41 can be prevented from being contaminated by the flux, deterioration of the inspection accuracy due to the flux can be suppressed. In order to suppress the generation of flux from the solder on the substrate 110, a cooling device for cooling the substrate 110 is provided on the upstream side of the inspection apparatus 100 in the transport direction of the substrate 110 It is possible to save space. It is also possible to suppress heat from being applied to the image pickup unit 41 in comparison with a configuration in which the image pickup unit 41 is covered by the case in order to suppress exposure of the image pickup unit 41 to vaporized flux.

In the second embodiment, as described above, the substrate 110 conveyed to the first standby position is sandwiched between the fan 252b and the flux suction fan 253b disposed so as to face the blowing fan 252b ). This makes it possible to actively feed the flux generated (vaporized) from the solder on the substrate 110 to the flux suction fan 253b by the blowing fan 252b even in the first standby position, The exposure of the imaging section 41 can be further suppressed. Since the airflow is formed above the substrate 110 conveyed to the first standby position by the blowing fan 252b, the substrate 110 can be cooled by the flow of the air. As a result, the amount of flux generated from the substrate 110 can be reduced before the substrate 110 is transported to the inspection position.

When the inspection time of the substrate 110 at the inspection position is longer than the predetermined waiting time for waiting the substrate 110 in the first waiting position as described above in the second embodiment, The second conveyor CPU 260 is configured to wait the substrate 110 in the first standby position and the CPU 60 is configured to continue the operation of the blowing fan 252b and the flux suction fan 253b. As a result, it is possible to positively feed the flux that has been vaporized for a longer time to the flux suction fan 253b by utilizing the inspection waiting time, and at the same time, the substrate 110 conveyed to the first standby position can be cooled.

In the second embodiment, as described above, in the first standby position, when the CPU 60 determines that the substrate 110 has been taken out from the first standby position to the downstream side by the detection sensor 11a, And stops the fan 252a and the flux suction fan 253a. This makes it possible to reduce the power consumption and reduce the noise caused by the air blowing fan 252a and the flux suction fan 253a.

Similarly, the CPU 60 stops the blowing fan 252b and the flux suction fan 253b when it is determined by the detection sensor 11b that the substrate 110 has been taken out from the second standby position to the downstream side, The air blowing fan 52 and the flux suction fan 53a are stopped when it is determined by the sensor 11c that the substrate 110 has been taken out to the downstream side from the inspection position. This makes it possible to save power and reduce the noise caused by the fan.

(Third Embodiment)

Hereinafter, the configuration of the inspection apparatus 300 according to the third embodiment of the present invention will be described with reference to FIG.

The third embodiment differs from the first embodiment in that the external air suction fan 51a is provided on the upper surface of the housing 100a and the external air suction fan 51a is mounted on the side of the housing 100a, ). In the following description, the members denoted by the same reference numerals as those in the first embodiment are the same as those in the first embodiment, and a description thereof will be omitted.

Here, in the third embodiment, the external air suction fan 51a is formed on the side surface of the housing 100a in the Y1 direction as shown in Fig. Concretely, the external air suction fan 51a is disposed so as to face the blowing fan 52 (opposite). The external air suction fan 51a and the blowing fan 52 are connected to each other through a duct 310. [ As a result, air can be efficiently directed to the upper side of the substrate 110 and the flux suction fan 53a.

In the third embodiment, the following effects can be obtained.

In the third embodiment, as described above, flux suction fans 53a and 53b for sucking flux generated from the solder on the substrate 110 are provided. As a result, the flux generated (vaporized) from the solder on the substrate 110 can be positively removed, and exposure of the image pickup unit 41 to the vaporized flux can be suppressed. As a result, since the imaging unit 41 can be prevented from being contaminated by the flux, deterioration of the inspection accuracy due to the flux can be suppressed. In order to suppress the generation of flux from the solder on the substrate 110, a cooling device for cooling the substrate 110 is provided on the upstream side of the inspection apparatus 100 in the transport direction of the substrate 110 It is possible to save space. It is also possible to suppress heat from being applied to the image pickup unit 41 in comparison with a configuration in which the image pickup unit 41 is covered by the case in order to suppress exposure of the image pickup unit 41 to vaporized flux.

It is also to be understood that the embodiments disclosed herein are illustrative and non-restrictive in all respects. The scope of the present invention is defined by the appended claims rather than by the description of the embodiments, and includes all modifications within the meaning and range equivalent to the claims.

For example, although the external air suction fan, the blowing fan (the first blowing fan, the second blowing fan), and the flux suction fan are provided in the first and second embodiments, the present invention is not limited thereto. In the present invention, if at least a flux suction fan is provided, another fan may not be installed.

In the first embodiment, an example is described in which the external air suction fan, the blowing fan (first blowing fan), and the flux suction fan are turned on based on the substrate being transported to the inspection position. However, Is not limited to this. In the present invention, the external air suction fan, the first blowing fan, and the flux suction fan may be always turned on.

In the first to third embodiments, the inspection head is moved to the retreat position. However, the present invention is not limited to this. In the present invention, it is not necessary to move the inspection head to the retreat position.

In the second embodiment, two substrate waiting positions (the first waiting position and the second waiting position) are provided, but the present invention is not limited to this. In the present invention, one or more substrate standby positions may be formed.

In the first to third embodiments, the flux suction fan is provided on the rail of the conveyor. However, the present invention is not limited to this. In the present invention, as shown in Fig. 14, a flux suction fan may be formed on the rail of the conveyor through a guide plate 500 for guiding air to the front (conveyor side, Y1 direction side) of the flux suction fan. As a result, the flux generated from the solder on the substrate can be efficiently sucked into the flux suction fan. The guide plate 500 may be provided on both sides of the flux suction fan in the X direction, for example, as shown in Fig. 14, or on the upper and lower sides of the flux suction fan.

In the first to third embodiments, the present invention is applied to an inspection apparatus for picking up a substrate using light irradiated by a lighting unit, but the present invention is not limited to this. The present invention may be applied to an inspection apparatus which mounts an X-ray source and picks up an image of the substrate by using X-rays. The present invention may also be applied to a hybrid type inspection apparatus capable of picking up a substrate using light and X-rays irradiated by the illumination unit.

In the first and third embodiments, the number of rotations of the fan unit 50 is controlled based on the substrate size. In the second embodiment, the number of rotations of the fan unit 250 is set to The present invention is not limited to this. In the present invention, the number of rotations of the fan unit may be controlled based on information other than the size of the substrate (information such as the amount of solder applied to the substrate).

In the first to third embodiments, the conveyor is configured so that the rail in the Y1 direction is movable, and the air blowing fan is provided on the rail in the Y1 direction. However, the present invention is not limited to this. In the present invention, the conveyor may be constituted so that the rail on the Y2 direction side is movable, and the flux suction fan may be provided on the rail on the Y2 direction side.

In the first to third embodiments, a flow-driven flow for sequentially performing the processing of the control unit according to the processing flow has been described for convenience of explanation. However, for example, (Event driven type) processing in which the processing is performed in the event driven type. In this case, it may be a complete event driving type, or may be a combination of event driving and flow driving.

Claims

An image pickup unit disposed above the substrate and configured to pick up an image of the substrate after the reflow process at a predetermined inspection position,
A control unit for inspecting the substrate based on the sensed image,
And a flux suction fan for sucking flux generated from the solder on the substrate,
Wherein the flux suction fan is configured to suck the flux in a direction along the surface of the substrate from a suction unit disposed between the image pickup unit and the substrate in the vertical direction.

The method according to claim 1,
A first conveyor for conveying the substrate to the inspection position,
Further comprising: a first blowing fan for blowing upward the substrate conveyed to the inspection position,
Wherein the flux suction fan comprises a first flux suction fan arranged so as to face the first blowing fan with the substrate conveyed to the inspection position between the first blowing fan and the flux suction fan.

3. The method according to claim 1 or 2,
Wherein the substrate further comprises a detection sensor for detecting that the substrate has been transported to the inspection position,
Wherein the controller is configured to operate the flux suction fan when it is determined by the detection sensor that the substrate has been detected.

The method of claim 3,
Further comprising: an inspection head including an imaging section and an illumination section for irradiating light when imaging is performed by the imaging section,
Wherein the inspection head is configured to be movable to a retreat position different from the upper side of the inspection position and the upper side of the substrate,
Wherein the controller moves the inspection head from the retracted position to a position above the inspection position after operating the flux suction fan when the substrate is determined to have been transported to the inspection position, And the inspection device is provided with an inspection device.

3. The method of claim 2,
Wherein the first conveyor is a movable conveyor movable in a direction perpendicular to the conveying direction of the substrate,
Wherein at least one of the flux suction fan and the first blowing fan is disposed on the movable conveyor and the arrangement position is changed with the movement of the movable conveyor.

The method according to any one of claims 1, 2, and 5,
A housing provided so as to surround the imaging unit,
Further comprising an external air suction fan installed in the housing and sucking air from the outside of the housing to the inside thereof.

The method according to claim 6,
Wherein the flux suction fan is configured to discharge the flux aspirated to the outside of the housing.

6. The method according to claim 2 or 5,
A second conveyor for conveying the substrate to a substrate standby position on the upstream side of the inspection position in the conveying direction of the substrate,
Further comprising: a second blowing fan for blowing upward toward the substrate conveyed to the substrate standby position,
Wherein the flux suction fan includes a second flux suction fan disposed so as to face the second blowing fan with the substrate conveyed to the substrate standby position between the substrate and the second blowing fan .

9. The method of claim 8,
Wherein when the inspection time of the substrate at the inspection position is longer than a predetermined waiting time for waiting the substrate at the substrate standby position, the control unit waits the substrate at the substrate standby position after the waiting time elapses, The second fan blowing fan, and the second flux suction fan.

The method according to any one of claims 1, 2, and 5,
Wherein the controller is configured to control the number of rotations of the flux suction fan based on information of the substrate to be inspected.

11. The method of claim 10,
Wherein the control unit is configured to perform control to increase or decrease the number of rotations of the flux suction fan according to a width of a width in a direction perpendicular to the carrying direction of the substrate.

The method of claim 3,
Further comprising a substrate carry-out detection sensor for detecting that the substrate is transported from the inspection position to the downstream side,
Wherein the control unit is configured to stop the operation of the flux suction fan when it is determined that the substrate is taken out by the substrate carry-out detection sensor.