KR101678352B1 - 첩부 장치 - Google Patents

첩부 장치 Download PDF

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Publication number
KR101678352B1
KR101678352B1 KR1020167019018A KR20167019018A KR101678352B1 KR 101678352 B1 KR101678352 B1 KR 101678352B1 KR 1020167019018 A KR1020167019018 A KR 1020167019018A KR 20167019018 A KR20167019018 A KR 20167019018A KR 101678352 B1 KR101678352 B1 KR 101678352B1
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KR
South Korea
Prior art keywords
plate
plate member
laminate
support
substrate
Prior art date
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Active
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KR1020167019018A
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English (en)
Korean (ko)
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KR20160088946A (ko
Inventor
준이치 가츠라가와
요시히로 이나오
시게루 가토
Original Assignee
도오꾜오까고오교 가부시끼가이샤
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Publication of KR20160088946A publication Critical patent/KR20160088946A/ko
Application granted granted Critical
Publication of KR101678352B1 publication Critical patent/KR101678352B1/ko
Assigned to 아이메카테크 가부시키가이샤 reassignment 아이메카테크 가부시키가이샤 권리의 전부이전등록 Assignors: 도오꾜오까고오교 가부시끼가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H01L21/6835—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • H01L21/67092—
    • H01L21/67288—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020167019018A 2012-06-20 2013-05-07 첩부 장치 Active KR101678352B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012139213A JP5977592B2 (ja) 2012-06-20 2012-06-20 貼付装置
JPJP-P-2012-139213 2012-06-20
PCT/JP2013/062816 WO2013190926A1 (ja) 2012-06-20 2013-05-07 貼付装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020157000444A Division KR20150031435A (ko) 2012-06-20 2013-05-07 첩부 장치

Publications (2)

Publication Number Publication Date
KR20160088946A KR20160088946A (ko) 2016-07-26
KR101678352B1 true KR101678352B1 (ko) 2016-11-21

Family

ID=49768532

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020167019018A Active KR101678352B1 (ko) 2012-06-20 2013-05-07 첩부 장치
KR1020157000444A Ceased KR20150031435A (ko) 2012-06-20 2013-05-07 첩부 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020157000444A Ceased KR20150031435A (ko) 2012-06-20 2013-05-07 첩부 장치

Country Status (5)

Country Link
US (1) US9548232B2 (https=)
JP (1) JP5977592B2 (https=)
KR (2) KR101678352B1 (https=)
TW (1) TWI505939B (https=)
WO (1) WO2013190926A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6855399B2 (ja) * 2018-01-26 2021-04-07 株式会社スギノマシン ノズルの振れの測定方法及びその装置
JP7355709B2 (ja) * 2020-05-29 2023-10-03 株式会社 日立パワーデバイス 接合治具および半導体装置の製造方法
IT202100018458A1 (it) * 2021-07-13 2023-01-13 Amx Automatrix S R L Pressa di sinterizzazione

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002323694A (ja) 2001-04-24 2002-11-08 Hitachi Industries Co Ltd 基板貼り合わせ方法及び貼り合わせ装置
JP2004268113A (ja) 2003-03-11 2004-09-30 Fujitsu Ltd 基板貼合せ装置及び基板貼合せ方法
JP2004349612A (ja) 2003-05-26 2004-12-09 Kyocera Corp 静電チャック

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3165453B2 (ja) 1991-01-31 2001-05-14 富士通株式会社 プラズマディスプレイパネルの製造方法
JPH07335512A (ja) 1994-06-08 1995-12-22 Canon Inc 接合方法および接合装置および接合物
JPH09316399A (ja) * 1996-05-28 1997-12-09 Canon Inc 基板貼合せ装置及び基板貼合せ方法
JP2980073B2 (ja) 1997-08-29 1999-11-22 日本電気株式会社 熱圧着装置及びその制御方法
US6081414A (en) 1998-05-01 2000-06-27 Applied Materials, Inc. Apparatus for improved biasing and retaining of a workpiece in a workpiece processing system
JP2002192394A (ja) 2000-12-28 2002-07-10 Mitsubishi Gas Chem Co Inc 無機基板のプレス加工法およびプレス装置
JP2003241157A (ja) * 2002-02-21 2003-08-27 Shibaura Mechatronics Corp 基板貼り合わせ装置、基板貼り合わせ方法、及び液晶表示パネルの製造装置、並びに製造方法
JP2003347360A (ja) * 2002-05-31 2003-12-05 Sumitomo Electric Ind Ltd ボンディングステージ
KR100511854B1 (ko) 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
JP4513329B2 (ja) * 2004-01-16 2010-07-28 東京エレクトロン株式会社 処理装置
US20060000802A1 (en) * 2004-06-30 2006-01-05 Ajay Kumar Method and apparatus for photomask plasma etching
JP4480660B2 (ja) * 2005-10-27 2010-06-16 Ｎｅｃエンジニアリング株式会社 基板貼り合わせ装置
CN101847574B (zh) * 2006-01-31 2012-11-07 东京毅力科创株式会社 基板处理装置和暴露于等离子体的部件
KR20080002323A (ko) 2006-06-30 2008-01-04 엘지.필립스 엘시디 주식회사 합착 스테이지와 그 제어 장치 및 방법
JP5160802B2 (ja) 2007-03-27 2013-03-13 東京エレクトロン株式会社 プラズマ処理装置
TWI493609B (zh) 2007-10-23 2015-07-21 半導體能源研究所股份有限公司 半導體基板、顯示面板及顯示裝置的製造方法
KR100961871B1 (ko) 2008-04-02 2010-06-09 에이피시스템 주식회사 기판 접합 장치
WO2010019430A2 (en) 2008-08-12 2010-02-18 Applied Materials, Inc. Electrostatic chuck assembly
JP5482282B2 (ja) * 2009-03-03 2014-05-07 東京エレクトロン株式会社 載置台構造及び成膜装置
WO2010101191A1 (ja) 2009-03-03 2010-09-10 東京エレクトロン株式会社 載置台構造、成膜装置、及び、原料回収方法
KR101522633B1 (ko) 2009-04-08 2015-05-22 주식회사 원익아이피에스 진공처리장치
FR2961630B1 (fr) 2010-06-22 2013-03-29 Soitec Silicon On Insulator Technologies Appareil de fabrication de dispositifs semi-conducteurs
KR101145756B1 (ko) 2010-07-30 2012-05-16 이지스코 주식회사 고무 점착식 척킹기구 및 이를 이용한 기판 합착장치
JP5379171B2 (ja) * 2010-08-23 2013-12-25 東京エレクトロン株式会社 接合システム、基板処理システム、接合方法、プログラム及びコンピュータ記憶媒体
WO2012166265A2 (en) * 2011-05-31 2012-12-06 Applied Materials, Inc. Apparatus and methods for dry etch with edge, side and back protection
TWI585028B (zh) * 2013-01-30 2017-06-01 斯克林集團公司 剝離裝置及剝離方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002323694A (ja) 2001-04-24 2002-11-08 Hitachi Industries Co Ltd 基板貼り合わせ方法及び貼り合わせ装置
JP2004268113A (ja) 2003-03-11 2004-09-30 Fujitsu Ltd 基板貼合せ装置及び基板貼合せ方法
JP2004349612A (ja) 2003-05-26 2004-12-09 Kyocera Corp 静電チャック

Also Published As

Publication number Publication date
JP5977592B2 (ja) 2016-08-24
US20150325463A1 (en) 2015-11-12
WO2013190926A1 (ja) 2013-12-27
KR20150031435A (ko) 2015-03-24
KR20160088946A (ko) 2016-07-26
US9548232B2 (en) 2017-01-17
TW201404598A (zh) 2014-02-01
TWI505939B (zh) 2015-11-01
JP2014003245A (ja) 2014-01-09

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