KR101654762B1 - Method of manufacturing Liquid Crystal Display Device - Google Patents

Abstract

The present invention relates to a liquid crystal display device and a method of manufacturing the same, and a liquid crystal display device according to the present invention includes a plurality of gate wirings and data wirings that are perpendicular to each other to define a plurality of pixels, and thin film transistors A non-display area formed at a periphery of the display area; a pad part formed at a lower end of the non-display area; a data link wiring extending from the data wiring and the gate wiring and formed in the pad part; And a data pad and a data pad formed at an end of the data link wiring and the gate link wiring, wherein the data pad and the gate pad are formed of a metal for a pad, A gate insulating film and a protective film which are laminated, and a gate insulating film and a protective film Includes a dummy pattern for protecting the metal for the pad.

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Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a liquid crystal display device,

The present invention relates to a liquid crystal display element and a method of manufacturing the same.

Recently, a liquid crystal display device which has been widely spotlighted as a flat panel display device has been actively researched because of its advantage that it has a large contrast ratio, is suitable for gradation display and moving picture display, and has low power consumption.

Particularly, it can be manufactured in a thin thickness and can be used not only as an ultra thin display device such as a wall-mounted TV but also as a display of a battery-operated notebook computer because the weight is light and the power consumption is considerably lower than that of a CRT cathode- And receives the spotlight as a next-generation display device.

Such a liquid crystal display device includes a liquid crystal panel and a flexible printed circuit (FPC) connected to a pad portion of the liquid crystal panel.

Here, the liquid crystal panel is divided into a display region where display is performed and a non-display region around the display region, and a pad portion in which a driver circuit is formed at the lower end of the non-display region is defined.

The liquid crystal panel further includes a TFT array substrate on which TFTs and pixel electrodes are formed in respective pixel regions defined by gate wirings and data wirings, a color filter substrate on which color filter layers and common electrodes are formed, And a voltage is applied to the electrodes to rearrange the liquid crystal molecules in the liquid crystal layer to adjust the amount of light transmitted to display an image. The TFT array substrate is formed relatively larger than the color filter substrate, and a largely formed portion is defined as a pad portion, and a driving circuit is mounted on the pad portion.

On the other hand, in the case of a small liquid crystal display device used for a mobile phone monitor or the like, the gate pad portion and the data pad portion may be collectively arranged in the pad portion formed at the lower end of the liquid crystal panel in order to minimize the size of the pad portion region, And the gate pad portion may be formed inside the liquid crystal panel.

At this time, a protective film is formed on the top of the gate pad and / or the data pad of the liquid crystal display device.

However, scratches may be formed on the protective film, which is the uppermost layer, during the process operation after the formation of the protective film, and scratches formed on the protective film may cause scratches on the protective film due to handling of the substrate, Damages can be formed, and further, a pad metal such as a gate pad and / or a data pad formed at the bottom is exposed, which further disadvantageously breaks the metal for the pad.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the problems described above and to provide a liquid crystal display device and a method of manufacturing the same that prevent disconnection of metal for a pad.

According to an aspect of the present invention, there is provided a liquid crystal display device including: a display region including a plurality of gate lines and data lines which are perpendicular to each other to define a plurality of pixels, A pad portion formed at a lower end of the non-display region; a data link wiring and a gate link wiring extending from the data wiring and the gate wiring and formed in the pad portion; A data pad and a data pad formed at the ends of the link wiring and the gate link wiring, wherein the data pad and the gate pad are formed of a metal for a pad, a gate insulating film and a protective film laminated on the pad metal, , A gate insulating film formed between the gate insulating film and the passivation film, It includes a dummy pattern.

Wherein the data metal and the semiconductor layer pattern are formed at the same time as the drain electrode and the semiconductor layer of the thin film transistor are formed and the data pad is formed on the gate insulating film and the protective film And a connection wiring through which the pad metal and the data link wiring are connected through a contact hole passing therethrough.

According to an aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device, including: forming a first metal film on a substrate, patterning the first metal film, forming a gate electrode in the thin film transistor region, Forming a gate insulating film on the substrate on which the gate electrode and the pad metal are formed; forming a gate insulating film on the substrate on which the amorphous silicon film, the amorphous silicon film, And forming a second metal film and patterning the first metal film to form a semiconductor layer, an ohmic contact layer, a source electrode, and a drain electrode in the thin film transistor region, Forming a stacked dummy pattern, forming a protective film on the substrate on which the source and drain electrodes are formed Forming a drain contact hole exposing the drain electrode by removing a protective film of a metal for the pad of the drain electrode and the data pad portion; forming a third metal film on the protective film and patterning the third metal film, And forming a pixel electrode connected to the drain electrode through the gate electrode.

A step of forming a data pad contact hole exposing the metal pad of the data pad portion is simultaneously performed in a process of forming a drain contact hole exposing the drain electrode, A step of forming a connection electrode for connecting to the metal pad of the data pad portion is performed at the same time.

According to the liquid crystal display device and the method of manufacturing the same according to the present invention, a dummy pattern is formed under the protective film, so that even if scratches are generated on the protective film, only the gate insulating film is positioned below the protective film, The probability that the metal pad is exposed is reduced, and furthermore, disconnection of the pad metal can be prevented.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of a liquid crystal display according to the present invention.

1, the liquid crystal display of the present invention mainly includes a liquid crystal panel 100, an FPC (Flexible Printed Circuit) 140 connected to the pad portion 114 of the liquid crystal panel 100, and the FPC 140 And a system (not shown) connected to the system.

Here, the liquid crystal panel 100 is divided into a display region 112 in which display is performed and a non-display region 116 in the periphery thereof, and a driving circuit 180 is formed in a lower end of the non-display region 116 A pad portion 114 is defined.

The liquid crystal panel 100 includes a lower thin film transistor substrate 110 on which a thin film transistor array is formed and a color filter substrate 120 on which the color filter array is formed to face the thin film transistor substrate 110 and the thin film transistor substrate 110, And a liquid crystal layer (not shown) filled between the color filter substrates 120.

The thin film transistor substrate 110 and the color filter substrate 120 of the liquid crystal panel 100 are relatively larger than the color filter substrate 120. In this case, Is defined as a pad portion (114).

A plurality of gate lines 102 and a data line 104 are formed in the display region 112 to define a pixel region perpendicularly to each other and a pixel electrode 105 is formed in the pixel region. A thin film transistor (TFT) is formed in an intersecting region of the gate wiring 102 and the data wiring 104. At this time, the thin film transistor TFT has a gate electrode protruding from the gate wiring 102, a source electrode protruding from the data wiring 104, a drain electrode spaced apart from the source electrode, and a source electrode protruding from the gate electrode to the source / (Not shown) formed thereon.

A driving circuit 180 for applying a signal to the gate wiring 102 and the data wiring 104 is formed in the pad portion 114. The driving circuit 180 includes a display region 112, The gate wiring line 131 is connected to the plurality of gate wirings 102 and the data wirings 104 in the non-display region 116 through the gate link wirings 131 and the data link wirings 132, And the data link wiring 132 are formed with gate pads and data pads.

On the other hand, in the case of a small liquid crystal display device used for a mobile phone monitor or the like, the gate pad portion and the data pad portion may be collectively arranged in the pad portion formed at the lower end of the liquid crystal panel in order to minimize the size of the pad portion region, The liquid crystal display device according to the embodiment of the present invention may have a structure in which only the data pad portion is formed in the pad portion formed at the lower end of the liquid crystal panel, Part is formed inside the liquid crystal panel. At this time, the data pad portion is formed in the same structure as the gate pad portion, and the connection electrode 24b is further provided to connect to the data wiring 104 and the data link wiring 132.

2, the gate pad portion and the data pad portion according to the present invention include a pad metal 12b formed on a substrate 10 and a gate insulating film 13 and a protective film 12b formed on the pad metal 12b, A dummy pattern 30 is formed between the gate insulating film 13 and the passivation film 20 to protect the pad metal 12b.

The gate pad portion and the data pad portion have the same structure and the data pad portion includes the metal pad 12b exposed through the gate insulating film 13 and the contact hole 22b penetrating the protective film 20, And a connection electrode 24b connected to the data line wiring line 104 and the data link wiring line 132, respectively.

The dummy pattern 30 is formed by stacking a data metal 18c and semiconductor patterns 14b and 16c formed simultaneously with the formation of the drain electrode and the semiconductor layer of the thin film transistor, ) Pattern.

By forming the dummy pattern 30 under the protection film 20, even if scratches are generated on the protection film, only the gate insulation film is positioned under the protection film, And the gate insulating film are located, the probability of exposing the pad metal is reduced, and furthermore, disconnection of the pad metal can be prevented.

A method for manufacturing such a liquid crystal display device will be described in detail with reference to the drawings.

3A and 4A to 3F and 4F are process flow diagrams illustrating a method of manufacturing a liquid crystal display device according to the present invention.

FIGS. 3A to 3F show cross sections of a thin film transistor (TFT) region to which four masks are applied, and FIGS. 4A to 4F show cross sections of a data pad region to which four masks are applied.

First, as shown in FIGS. 3A and 4A, a first metal film is deposited on a substrate 10, and then patterned through photolithography using a first mask (not shown) to form a gate electrode 12a in the thin film transistor region, And the metal pad 12b is formed in the gate pad portion and the data pad portion region.

As shown in FIGS. 3B and 4B, on the substrate 10 on which the gate electrode 12a and the data pad 12b are formed, an insulating material is deposited on the entire surface of the substrate 10 to form a gate insulating film 13. FIG.

3C and 4C, on the gate insulating film 13, an amorphous silicon film, an impurity amorphous silicon film, a second metal film, and then a second mask (not shown) The semiconductor layer 14a, the ohmic contact layer 16a, the source electrode 18a and the drain electrode 18b are formed in the thin film transistor region and the semiconductor pattern 14a is formed in the gate pad portion and the data pad region, (14b, 16c) and a metal for data (18c) formed of a second metal film are stacked.

3D and 4D, the protective film 20 is entirely deposited on the substrate 10 on which the source and drain electrodes 18a and 18b are formed.

3E and 4E, a part of the protective film 20 on the drain electrode 18b and the metal pad 12b of the data pad portion is selectively etched through a third mask (not shown) A part of the drain electrode 18b and a drain contact hole 22a and a data pad contact hole 22b in which the pad metal 12b of the data pad portion is exposed are formed.

Then, as shown in FIGS. 3F and 4F, a transparent electrode material is deposited on the passivation layer 20 and then patterned through a fourth mask (not shown) to form the pixel electrode 24a and the connection electrode 24b And the pixel electrode 24a is connected to the drain electrode 18b through the drain contact hole 22a so that the connection electrode 24b is connected to the data pad 12b through the data pad contact hole 22b, So that the present process is completed.

By forming the dummy pattern 30 under the protection film 20, even if scratches are generated on the protection film, only the gate insulation film is positioned under the protection film, And the gate insulating film are located, the probability of exposing the pad metal is reduced, and furthermore, disconnection of the pad metal can be prevented.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

1 is a plan view of a liquid crystal display according to the present invention;

Fig. 2 is a cross-

FIGS. 2A and 3A to 2F and 3F are flow charts showing a method of manufacturing a liquid crystal display device according to the present invention.

Claims (7)

A display region including a plurality of gate wirings and data lines which are perpendicular to each other to define a plurality of pixels and thin film transistors provided in the respective pixels; a non-display region formed in a peripheral portion of the display region; And a data pad disposed at an end of the data link wiring. The liquid crystal display device according to claim 1, The data pad Metal for pads, A gate insulating film and a protective film stacked on the metal pad, And a dummy pattern disposed between the gate insulating film and the protective film, And first and second connection electrodes connected to the pad metal through contact holes passing through the gate insulation film and the protection film on one side and the other side of the data pad, Wherein the dummy pattern is a floating pattern in which metal and semiconductor layer patterns for data are stacked and disposed between the first and second connection electrodes. The method according to claim 1, A gate line extending from the gate line and disposed in the pad portion; and a gate pad disposed at an end of the gate line line, The gate pad Metal for pads, A gate insulating film and a protective film stacked on the metal pad, And a dummy pattern disposed between the gate insulating film and the protective film, Wherein the dummy pattern is a floating pattern in which metal and semiconductor layer patterns for data are stacked. The semiconductor memory device according to any one of claims 1 and 2, wherein the data metal and semiconductor layer pattern Wherein the gate electrode is disposed on the same layer as the drain electrode and the semiconductor layer of the thin film transistor. delete Forming a first metal film on the substrate and patterning the first metal film to form a gate electrode in the thin film transistor region and forming a pad metal in the gate pad portion and the data pad portion region; Forming a gate insulating film on the substrate on which the gate electrode and the pad metal are formed, An amorphous silicon film, an impurity amorphous silicon film, and a second metal film are formed on the substrate having the gate insulating film formed thereon and then patterned to form a semiconductor layer, an ohmic contact layer, a source electrode, and a drain electrode in the thin film transistor region Forming a floating dummy pattern by stacking a semiconductor pattern and a data metal on the gate pad portion and the data pad portion region, Forming a protective film on the substrate having the source and drain electrodes formed thereon, Forming a drain contact hole exposing the drain electrode by removing a protection film on the metal pad for the drain electrode and the data pad portion; forming a data pad contact hole for exposing the metal pad on one side and the other side of the data pad portion, ; Forming a third metal film on the protective film and patterning the metal film to form a pixel electrode connected to the drain electrode through the drain contact hole; And forming a connection electrode connected to the metal pad of the data pad portion through the data pad contact hole with the dummy pattern interposed between the data pad and the other side of the data pad. 6. The method of claim 5, And forming a data pad contact hole exposing a metal pad of the data pad portion in a process of forming a drain contact hole exposing the drain electrode. 6. The method of claim 5, Wherein the step of forming the connection electrode is simultaneously performed in the step of forming the pixel electrode.

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