KR101634705B1 - apparatus for treating substrate - Google Patents

Abstract

The present invention relates to a substrate processing apparatus and, more specifically, to a substrate processing apparatus, wherein a chamber structure for loading, processing, transferring, and unloading of a substrate is configured by multiple stages, the loading and the unloading of the substrate is performed on one side of the front face or the back face, it is possible to reduce the installation area, it is possible to reduce the takt time for processing the substrate, and docking with equipment for the other processing is easy. The substrate processing apparatus according to the present invention comprises: a loading chamber which receives a substrate; at least one processing chamber which is connected to the other side of the loading chamber and performs at least one process on the substrate transferred from one side to the other side; an elevating chamber which is connected to the other side of the processing chamber, receives the processed substrate, and transfers the substrate upward; a high-speed transfer chamber which is disposed on the upside of the processing chamber and transfers the substrate received from the elevating chamber, from one side to the other side, at a high speed; an unloading chamber which is disposed on the upside of the loading chamber and allows the substrate transferred from the high-speed transfer chamber to be unloaded; and transfer means which are disposed in the loading chamber, the processing chamber, the elevating chamber, the high-speed transfer chamber, the unloading chamber, and transfer the substrate, wherein the transfer means disposed in the processing chamber is disposed in a diagonal manner, and the transfer means disposed in the high-speed transfer chamber and the unloading chamber are disposed in a horizontal manner.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

The present invention relates to a substrate processing apparatus, and more particularly, to a multi-stage chamber structure for loading, performing, transferring, and unloading a substrate, and loading and unloading of the substrate is performed from one side of the front side or the rear side, The present invention relates to a substrate processing apparatus capable of reducing the area, reducing the tack time for substrate processing, and equipment for other process processing and facilitating docking.

In general, a substrate used for a flat panel display (FPD), a semiconductor wafer, an LCD, and a glass for a photomask is processed through a series of processes such as vapor deposition, etching, stripping, cleaning, and rinsing.

Korean Patent Registration No. 10-0402901 relates to a multifunctional cleaning module of a flat panel display manufacturing apparatus and a cleaning apparatus using the same. This is an integrated multifunctional cleaning module that consists of a single composite module that aggregates the individual functions of the equipment. It is a multifunctional cleaning module of the flat panel display manufacturing apparatus configured to minimize the installation area of the equipment while including all the functions of the existing equipment in a narrow area. .

However, this prior art fails to provide a layout structure capable of docking with equipment for other processing while the substrate is being loaded, processed, transferred, and unloaded continuously.

Korean Patent Publication No. 10-0402901 (2003. 10. 22, 2003, entitled " Multifunctional cleaning module of flat panel display manufacturing apparatus and cleaning apparatus using the same)

SUMMARY OF THE INVENTION The present invention has been devised to solve the problems of the prior art as described above, and it is an object of the present invention to provide a multi-stage chamber structure for loading, performing, transporting and unloading a substrate, It is an object of the present invention to provide a substrate processing apparatus capable of reducing the installation area, reducing the tack time for substrate processing, facilitating equipment for other process processing, and facilitating docking.

In addition, the present invention allows the substrate to be processed to be transferred in a state of being inclined at a predetermined angle in the process chamber, and to transfer the processed substrates horizontally in the high-speed transfer chamber at a high speed, And it is an object of the present invention to provide a substrate processing apparatus capable of improving the efficiency of processing and enabling rapid substrate transfer.

In addition, the present invention can improve the drying effect by minimizing the cleaning liquid present in the drying chamber by disposing the air knife in the drying chamber adjacent to the partition separating the cleaning chamber and the drying chamber, And to provide a substrate processing apparatus capable of minimizing the amount of deflection and the occurrence of deformation by arranging the substrates in parallel and vertically adjacent to the partition.

According to an aspect of the present invention, there is provided a substrate processing apparatus comprising: a loading chamber for receiving a substrate; At least one process chamber connected to the other side of the loading chamber to perform at least one process on a substrate transferred from one side to the other side; An elevating chamber connected to the other side of the process chamber for transferring the processed substrate to the upper side; A high speed transfer chamber disposed above the process chamber for transferring the substrate transferred from the elevating chamber at a high speed in one direction from the other side; An unloading chamber disposed above the loading chamber for unloading the substrate transferred from the rapid transfer chamber; And transport means disposed in the loading chamber, the process chamber, the elevating chamber, the high-speed transfer chamber, and the unloading chamber for transporting the substrate, wherein the transport means disposed in the process chamber is inclined And the transfer means disposed in the interior of the rapid transfer chamber and the unloading chamber are arranged in a horizontal state.

Here, the process chamber includes an AP processing chamber having one side connected to the other side of the loading chamber to perform a plasma processing process on the surface of the substrate to be transferred, at least one cleaning unit connected to the other side of the AP processing chamber, A cleaning chamber connected to the other side of the cleaning chamber for performing a cleaning process on the substrate to be transferred, a drying chamber for performing a drying process using an air knife on the substrate transferred after the cleaning process is performed, And a control unit.

Here, the substrate is characterized in that the plasma treatment process and the cleaning process by the at least one cleaning unit are simultaneously performed.

In the loading chamber, a substrate holding means for holding a substrate to be drawn in by using a support pin and then lowering the substrate is mounted on a conveying means which is held in a horizontal state in the loading chamber, And a first tilting means for tilting the means at the same slope as the transfer means disposed in the process chamber.

In the elevating chamber, elevating means for elevating and lowering the conveying means disposed in the elevating chamber, and conveying means disposed in the elevating chamber when receiving the substrate from the processing chamber, The elevating chamber is maintained at the same slope as the conveying means disposed inside the process chamber and the slope of the conveying means disposed inside the elevating chamber is changed during the ascending by the elevating means to reach the other side of the high- And a second tilting means for operating the conveying means disposed inside the elevating chamber to operate in a horizontal state.

The conveying means disposed in the unloading chamber may include a pair of support plates disposed on both sides so as to face each other, a plurality of shafts rotatably mounted at both ends of the support plate and spaced apart from each other, An up-down shaft disposed between the plurality of shafts and spaced apart from each other, and a roller (55) coupled with the shaft at a predetermined distance from the up-down shaft, wherein the up-down shaft is moved up and down by a shaft vertical driver, And an opening is formed in the support plate so that one end of the up and down shaft is exposed in the lateral direction.

In addition, a partition is provided to separate and block the cleaning chamber and the drying chamber, and the partition has a through hole through which the substrate can be transported in the direction of the drying chamber from the cleaning chamber by the transporting means And the air knife is disposed in the drying chamber adjacent to the partition so that the air knife is disposed one above and below the substrate conveyed by the conveying means so that air can flow in the direction of the cleaning chamber through the through hole And air is sprayed.

형상을 가지고, 상기 일측면이 상기 칸막이에 평행하게 인접 배치되며, 상기 일측면의 하단을 통하여 상기 공기가 분사되는 것을 특징으로 한다.Here, the air knife has a cross section in which one side is formed of a vertical plane and the other side is formed of a vertical plane and an inclined plane

Wherein the one side surface is disposed adjacent to and parallel to the partition, and the air is injected through the bottom surface of the one side surface.

Here, the air knife is coupled to the bracket at both ends in the longitudinal direction, and one of the upper air knife and the lower air knife is vertically and vertically coupled so that the gap between the upper air knife and the lower air knife .

Here, the bracket is formed with a see-through window for confirming an interval between the upper air knife and the lower air knife.

According to the present invention, there is provided a substrate processing apparatus including a plurality of chamber structures for loading, performing, transferring, and unloading a substrate, It is possible to reduce the installation area, reduce the tack time for substrate processing, and facilitate the docking and other equipment for the processing of the substrate.

In addition, since the substrate to be processed is transferred in a state in which the substrate to be processed is inclined at a predetermined angle from the inside of the process chamber, and the processed substrate is transported at a high speed in a horizontal state inside the high speed transfer chamber, There is an advantage that the efficiency of the process can be improved and the substrate can be transferred quickly.

Further, since the air knife is disposed in the drying chamber adjacent to the partition separating the cleaning chamber and the drying chamber, the cleaning liquid present in the drying chamber can be minimized to improve the drying effect, and the air knife By arranging them parallel to each other adjacent to the partition, they are advantageous in that the amount of deflection and the occurrence of deformation can be minimized.

1 is a front view of a substrate processing apparatus according to an embodiment of the present invention.
Fig. 2 is a front view schematically showing Fig. 1. Fig.
3 to 6 are side views of a loading chamber constituting a substrate processing apparatus according to an embodiment of the present invention.
7 is a side view of a process chamber and a high-speed transfer chamber constituting a substrate processing apparatus according to an embodiment of the present invention.
8 to 10 are side views of an elevating chamber constituting a substrate processing apparatus according to an embodiment of the present invention.
11 is a rear view of an unloading chamber constituting a substrate processing apparatus according to an embodiment of the present invention.
12 is a plan view of an unloading chamber constituting a substrate processing apparatus according to an embodiment of the present invention.
FIG. 13 and FIG. 14 are rear views showing the operation of the transfer means disposed inside the unloading chamber constituting the substrate processing apparatus according to the embodiment of the present invention. FIG.
15 is a front view showing the interior of a cleaning chamber and a drying chamber constituting a substrate processing apparatus according to an embodiment of the present invention.
16 is a plan view showing the inside of a cleaning chamber and a drying chamber constituting a substrate processing apparatus according to an embodiment of the present invention.
17 to 19 are partial perspective views of the square portion shown in Fig. 16 as viewed from various angles.
FIG. 20 is a perspective view cut in the direction AA 'in FIG. 16 and viewed in the direction of the arrow.
Fig. 21 is a perspective view showing a partition of Fig. 20; Fig.
22 is a partial perspective view of one side of a partition in a cleaning chamber constituting a substrate processing apparatus according to an embodiment of the present invention.
23 is a perspective view of an air knife constituting the substrate processing apparatus according to the embodiment of the present invention.
24 is a schematic cross-sectional view of the air knife shown in Fig.
25 is a transparent perspective view of the air knife shown in Fig.
26 is a front view and a perspective view of the air knife constituting the substrate processing apparatus according to the embodiment of the present invention coupled to the bracket.
27 is a perspective view seen from both sides of the air knife coupled to the bracket shown in Fig.
28 is a schematic view of a tip of an air knife through a sight window formed in the bracket shown in Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a substrate processing apparatus according to the present invention having the above-described problems, solutions and effects will be described in detail with reference to the accompanying drawings.

The sizes and shapes of the components shown in the drawings may be exaggerated for clarity and convenience. In addition, terms defined in consideration of the configuration and operation of the present invention may be changed according to the intention or custom of the user, the operator.

FIG. 1 is a front view of a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic front view of a substrate processing apparatus according to an embodiment of the present invention.

1 and 2, a substrate processing apparatus 100 according to an embodiment of the present invention includes a loading chamber 3 as a space for loading a substrate, a processing chamber 5 as a space for performing a process on the substrate, 10, 30), an elevating chamber 40 which is a space for transferring the processed substrate upward, a high-speed transfer chamber 45 which is a space for transferring the processed substrate at a high speed in the horizontal direction, A loading chamber 60 and transfer means 50 disposed inside each of the chambers for transferring the substrate.

The loading chamber 3 and the process chambers 5, 10 and 30 are arranged in a first layer and the unloading chamber 60 and the high-speed transfer chamber 45 are respectively connected to the loading chamber 3 and the process chamber 5 10 and 30 and the elevating chamber 40 are disposed on the first and second floors and the elevating chambers 40 and 40 are disposed on the first and second floors, And is disposed on the other side.

The conveying direction of the substrate is conveyed in the direction of the arrow shown by the dotted line in Fig. That is, the process is performed while passing through the process chambers 5, 10 and 30 after being introduced into the loading chamber 3 of the first layer and is transferred to the two layers through the elevating chamber 40, Is delivered at a high speed in the chamber 45 and arrives at the unloading chamber 60 and is drawn out through the robot arm. The substrate drawn out by the robot arm is transferred to the substrate processing apparatus of the present invention and other process equipment docked.

The loading chamber 3 receives a substrate from the outside. In particular, a robot arm disposed adjacent to the loading chamber 3 transfers the substrate into the loading chamber 3. The substrate processing apparatus according to the present invention has a two-layer structure as shown in Figs. 1 and 2, and is arranged long from left to right. Therefore, in order to minimize the installation area and easily handle the docking with other equipment, the robot arm is not disposed adjacent to the left side (one side) of the loading chamber 3 but the front side Or on the rear surface.

At least one of the process chambers is connected to the other side of the loading chamber 3 in order. Specifically, the at least one process chamber (5, 10, 30) is connected to the other side of the loading chamber (3) so as to move from one side (left side in FIGS. 1 and 2) At least one or more steps are carried out in sequence with respect to the substrate to be transferred.

The substrate having been processed through the process chambers 5, 10 and 30 is transferred to the elevating chamber 40 and then raised upward. Specifically, the elevating chamber 40 is connected to the other side of the process chambers 5, 10 and 30 to receive the processed substrate and transfer it to the upper side. When the process chambers 5, 10 and 30 are constituted in plural, the elevating chamber 40 is connected to the other side of the process chamber disposed at the rightmost position.

The lower side of the elevating chamber 40 is connected to the other side of the process chamber and the upper side is connected to the other side of the high-speed transfer chamber 45. Therefore, the substrate transferred upward by the elevating chamber 40 is transferred to the interior of the high-speed transfer chamber 45, and is transferred in one direction from the other direction, that is, Lt; / RTI >

Specifically, the high-speed transfer chamber 45 is disposed on the upper side of the process chamber, and transfers the substrate transferred from the elevating chamber 40 at a high speed in one direction from the other side. Since the substrate conveyed in the high-speed transfer chamber 45 is not a transfer for receiving the process but a transfer for drawing out the deposit through the unloading chamber 60 to the outside, the conveyance speed within the process chamber It is transported faster.

The substrate transferred by the high-speed transfer chamber 45 is transferred to the unloading chamber 60, and the substrate inside the unloading chamber 60 is withdrawn by the adjacent robot arm. The drawn-out substrate is transferred to other processing equipment docked to the substrate processing apparatus of the present invention.

Specifically, the unloading chamber 60 is disposed above the loading chamber 3 so that the substrate transferred from the rapid transfer chamber 45 is unloaded by the robot arm. And the robot arm transfers the unloaded substrate to another process equipment docked to the substrate processing apparatus of the present invention.

As described above, the substrate is transported along the direction of the arrow shown by the dotted line in Fig. The transfer of the substrate is carried out by transfer means (not shown) disposed in the loading chamber 3, the process chambers 5, 10 and 30, the elevating chamber 40, the high-speed transfer chamber 45 and the unloading chamber 60 50).

2, the transfer means 50 disposed inside the process chambers 5, 10 and 30 are arranged in a tilted state, and the high-speed transfer chamber 45 and the unloading chamber (not shown) 60 are disposed horizontally.

In the process chambers 5, 10, and 30, a substrate processing process using an etching solution, a cleaning liquid, or the like can be performed. In this case, the process liquid flows down in one direction on the substrate, The efficiency can be increased. Accordingly, the transfer means (50) disposed inside the process chamber is arranged in an inclined state so that the substrate can be transferred in a tilted state.

The transfer means 50 disposed inside the rapid transfer chamber 45 and the unloading chamber 60 can be rapidly unloaded by transferring a substrate that has already been processed in the process chamber at a high speed Therefore, it is preferable to arrange in a horizontal state so as to enable high-speed feeding and facilitate unloading.

The conveying means 50 disposed in the loading chamber 3 is configured to convey the substrate in a tilted state after the substrate is drawn in a horizontal state, The transfer means 40 disposed inside the transfer means 40 is horizontally changed in a process of being transferred after being transferred in a tilted state so that the substrate can be maintained in a horizontal state on the transfer means 50. The substrate which is raised by the conveying means 50 disposed inside the elevating chamber 40 and is in a horizontal state is conveyed at a high speed by the conveying means 50 disposed inside the high speed conveying chamber 45 Is transferred to the unloading chamber (60).

The process chamber may be continuously processed with various processes. Specifically, the process chamber includes an AP processing chamber 5 having one side surface connected to the other side of the loading chamber 3 to perform plasma processing on the surface of the substrate to be transferred, A cleaning chamber 10 connected to the other side of the cleaning chamber 10 for performing a cleaning process on the substrate to be transferred using at least one cleaning unit and a cleaning process connected to the other side of the cleaning chamber 10, And a drying chamber 30 for performing a drying process using an air knife with respect to the substrate.

A plasma surface processor (denoted by reference numeral 5a in FIG. 7) is provided in the AP processing chamber 5 to perform a plasma process on the surface of the substrate transferred by the transfer means 50. FIG. The plasma surface processor 5a processes the surface of the substrate which proceeds in one direction by plasma, for example, atmospheric pressure plasma (AP).

Since the organic matter on the surface of the substrate is chemically and physically stable, it is generally not easy to remove. When the plasma treatment is performed, the stable organic state can be physically and chemically unstable by the ionization energy of the plasma. As a result, the cleaning effect using the liquid in the subsequent wet cleaning can be maximized.

The substrate subjected to the plasma surface treatment in the AP processing chamber 5 is subjected to at least one cleaning process by various cleaning units provided in the cleaning chamber 10. It is preferable that a partition or an air curtain is provided between the plurality of cleaning units.

In the inside of the cleaning chamber 10, at least one of a cleaning process using a roll brush, a cleaning process using a water jet, a cleaning process using an air flow, and a cleaning process using a spray is preferably performed, A cleaning process may be further added.

A drying chamber 30 is connected to an end of the cleaning chamber 10, that is, the other side thereof. The drying chamber 30 removes the cleaning liquid remaining on the substrate. An air knife is provided in the drying chamber 10 to dry the substrate while pushing the cleaning liquid on the substrate to be transferred into the cleaning chamber 10.

The substrate transferred within the process chamber may be subjected to a plurality of processes at the same time. Specifically, the substrate is simultaneously subjected to a plasma processing process in the AP processing chamber 5 and a cleaning process performed by at least one cleaning unit in the cleaning chamber 10.

That is, the substrate may be simultaneously subjected to the plasma treatment process and the cleaning process by the roll brush, and the plasma treatment process, the cleaning process by the roll brush, and the cleaning process by the water jet may be simultaneously performed.

In the latter case, the rear portion of the substrate is subjected to the plasma treatment process, the middle portion thereof is subjected to a cleaning process by a roll brush, and the front portion thereof may be subjected to a cleaning process by a water jet. As a result, the length of each process processing space of the substrate processing apparatus according to the present invention is shortened in order to reduce the installation area, whereby the substrate is transferred over a plurality of process processing spaces.

As described above, the transfer means (50) disposed inside the process chamber is disposed at a predetermined angle to be inclined so that the substrate can be transferred in a tilted state. Therefore, the cleaning liquid supplied on the substrate transferred to the inside of the process chamber flows down to one side without remaining on the upper surface. As a result, the surface of the substrate is not contaminated and the cleaning effect is increased.

FIGS. 3 to 6 are side views showing the operation of the conveying means 50 disposed inside the loading chamber 3. That is, it is a side view in the direction of B-B 'shown in FIG.

The transfer means 50 disposed in the loading chamber 3 may be maintained in a horizontal state or may be maintained in a state of being tilted at the same slope as the transfer means disposed in the process chamber. In detail, the transfer means 50 disposed inside the loading chamber 3 maintains a horizontal state when the substrate is loaded. When the loaded substrate is transferred, the transfer means 50, which is disposed inside the process chamber, And the tilted state is maintained.

In order to achieve this, the loading chamber 3 is provided with a conveying means (not shown) which holds the substrate 1 drawn in by using the support pins 111 and then descends to keep the inside of the loading chamber 3 in a horizontal state And a conveying means (50) on which the substrate (1) is placed is tilted at the same slope as the conveying means (50) disposed inside the process chamber (10) A tilting means (not shown) is provided.

The conveying means 50 includes a pair of support plates 51 disposed to face each other, a shaft 53 having both ends rotatably engaged with the support plate 51, And a roller 55 which is engaged with the roller.

The substrate seating means 110 includes a driving unit 117 for generating an up-down driving force, a driving rod 115 for moving up and down according to a driving force of the driving unit 117, And a support pin 111 vertically coupled to the plate 113 and the up-down plate 113 and spaced apart at regular intervals.

Also, the first tilting means may be constructed by adopting any one of various structures that can be tilted. For example, a first hinge engaging portion (not shown) for rotatably coupling a central portion of the conveying means 50 and a cylinder (not shown) connected to the lower portion of the conveying means 50 to move up and down And the like. Accordingly, when the cylinder is moved up and down, the conveying means 50 can be tilted about a central portion which is rotatably coupled by the first hinge engaging portion.

3 shows a process in which the transfer means 50 disposed in the loading chamber 3 is in a horizontal state and the robot arm RA draws the substrate in a state where the support pins 111 are lifted. Then, when the robot arm RA exits, the substrate 1 is held by the support pins 111 (see FIG. 4).

5, the support pin 111 is lowered so that the substrate 1 is brought into contact with the roller 55 of the conveying means 50 to be seated. Then, before transferring the substrate 1, as shown in FIG. 6, the transfer means 50 includes transfer means disposed in the process chamber by the first tilting means (not shown) And is tilted so as to have the same inclination. Subsequently, the substrate 1 is transferred to the process chamber in accordance with the driving of the transfer means.

7 is a side view in the direction of C-C 'shown in FIG. That is, it is a side view showing the interior of the AP processing chamber 5 and the high-speed transfer chamber 45.

7, the conveying means 50 arranged inside the AP processing chamber 5 is disposed in a tilted state, and the conveying means 50 disposed inside the high-speed conveying chamber 45, Are arranged in a horizontal state. The inclination of the conveying means 50 disposed inside the AP processing chamber 5 is the same as the inclination of the conveying means disposed inside the cleaning chamber 10 and the drying chamber 30. [

The substrate is transported in a tilted state by the transporting means 50 disposed inside the AP processing chamber 5 and is subjected to the plasma surface treatment by the plasma surface treatment apparatus 5a. Then, the substrate 1 is transferred into the cleaning chamber 10, is subjected to a cleaning process by various cleaning units, and is transferred into the drying chamber 30 to be subjected to a drying process.

The substrate 1 subjected to the drying process in the drying chamber 30 is transferred to the conveying means 50 disposed inside the elevating chamber 40. The conveying means 50 disposed inside the elevating chamber 40 may include a conveying means 50 disposed inside the drying chamber 30 in the course of receiving the substrate from the drying chamber 30, The same inclination is maintained. Then, the conveying means (50) disposed inside the elevating chamber (40) is shifted upward in a horizontal direction. As a result, when the conveying means 50 disposed inside the elevating chamber 40 is elevated to the same position as the conveying means disposed inside the high-speed conveying chamber 45, The conveying means 50 disposed inside and the substrate 1 placed thereon are in a horizontal state.

8 to 10, the elevating chamber 40 is provided therein with conveying means 50 (see FIG. 8) disposed inside the elevating chamber 40, as shown in FIGS. 8 to 10, Elevating means for elevating and lowering the elevating chamber 40 and a conveying means 50 disposed inside the elevating chamber 40 when the substrate 1 is transferred from the processing chamber to the processing chambers 5, (50) arranged inside the elevating chamber (40) and maintaining the inclination of the conveying means (50) arranged inside the elevating chamber (40) in the process of ascending by the elevating means And a second tilting means for moving the conveying means 50 disposed in the elevating chamber 40 to a horizontal state when the elevating chamber reaches the other side of the high-speed transfer chamber 45.

The elevating means (not shown) may be configured in various ways as long as the support frame 43 supporting the conveying means 50 can move up and down. The second tilting means includes a second hinge engaging portion 41 vertically coupled to the supporting frame 43 and having an upper end rotatably coupled to a central portion of the conveying means 50, And an elevating cylinder (42) vertically coupled to the conveying means (43) and having an upper end connected to a lower side of the conveying means (50) to move up and down.

Accordingly, the conveying means 50 disposed inside the elevating chamber 40 can be moved upward by elevating the support frame 43 by the elevating means (not shown) And can be switched to a horizontal state by driving the elevating cylinder 42. [

Figure 8 shows a state in which the transfer means 50 disposed within the elevating chamber 40 maintains the same slope as the transfer chamber disposed within the process chamber for transfer of the substrate from the process chamber. 9 shows a state in which the conveying means 50 is inclined before being brought into a horizontal state, and FIG. 10 shows a state in which the conveying means 50 is rotated in a high-speed Is positioned at the same height as the transfer chamber 45 and shows a state of being switched to a horizontal state.

When the conveying means disposed in the elevating chamber 40 is positioned at the same height as the high-speed conveying chamber 45 in a horizontal state, the conveying means is driven, so that the substrate is conveyed in the high-speed conveying chamber 45 And is delivered into the unloading chamber 60. [ Then, the robot arm RA unloads the substrate, which is seated in the transfer chamber disposed inside the unloading chamber 60. Then,

The robot arm RA is not disposed adjacent to the side surfaces of the loading chamber 3 and the unloading chamber 60 but is disposed on the front surface or the rear surface. Therefore, the robot arm RA draws the substrate through the front surface or the rear surface of the loading chamber 3, and draws the substrate through the front surface or the rear surface of the unloading chamber 60.

The support pins 111 of the substrate seating means 110 are lifted up to receive the substrate at the inside of the loading chamber 3 so that the robot arm RA is moved upward So that the substrate can be seated on the support pins 111 and can be removed.

On the other hand, the support pin of the substrate seating means is not provided in the unloading chamber 60. Therefore, the robot arm RA can not unload the substrate through the front surface or the rear surface of the unloading chamber 60 due to interference of the support plate 51.

Therefore, in the present invention, the structure of the conveying means 50 disposed inside the unloading chamber 60 is changed, and the shaft vertical driver 65 is provided on the lower side. 11 to 14, the conveying means 50 disposed inside the unloading chamber 60 includes a pair of support plates 51 disposed to face each other on both sides, A plurality of shafts 53 rotatably mounted on the plate 51 so as to be rotatable and spaced apart from each other, an up-down shaft 53b disposed between the plurality of shafts 53 and spaced apart from each other, And a roller 55 which is coupled to the up-down shaft 53b at a predetermined interval.

The up-down shaft 53b is moved up and down by the shaft vertical driver 65 and is opened to the support plate 51 so that one end of the up-down shaft 53b can be laterally exposed. (51a) is formed.

Unlike the conveying means disposed in the loading chamber 3, the conveying means 50 disposed inside the unloading chamber 60 has an opening 51a formed in the support plate 51, (Up-down shaft exposed in the lateral direction by the opening portion) is arranged not to be mounted on the support plate 51 but to be able to be up-down by the shaft vertical driver 65.

12, when the up-down shaft 53b is lowered by the shaft vertical driver 65, the robot arm RA is moved in the horizontal direction through the opening 51a, 1) to support the substrate and unload the substrate.

13 shows a state in which the up-down shaft 53b constituting the conveying means disposed inside the unloading chamber 60 is raised. In this state, the substrate can not be unloaded. Fig. 14 shows a state in which the up-down shaft 53b is lowered by the shaft vertical driver 65. Fig. In this state, since the robot arm RA can be horizontally inserted through the opening 51a, the substrate can be unloaded.

Next, the connection structure of the cleaning chamber 10 and the drying chamber 30 and the air knife disposed inside the drying chamber will be described.

FIG. 15 is a front view showing the inside of a cleaning chamber and a drying chamber which constitute the substrate processing apparatus according to the embodiment of the present invention, and FIG. 16 is a plan view.

15 and 16, a partition 70 is provided to separate and block the cleaning chamber 10 and the drying chamber 30, And a through hole (denoted by reference numeral 71 in FIG. 20 and FIG. 22) through which it can be transported in the direction of the drying chamber 30 from the cleaning chamber 10 by the conveying means 50. The air knife 90 is disposed in the drying chamber 30 adjacent to the partition 70 so that the air knife 90 is disposed one above and below the substrate 1 conveyed by the conveying means 50, Air is blown through the through holes 71 so that air can flow in the direction of the cleaning chamber 10. [

The cleaning chamber 10 corresponds to a space for performing a cleaning process on the substrate 1 to be transferred using deionized water or the like. The cleaning chamber 10 may be one process related to cleaning, but a plurality of processes may be performed. For example, at least one of the cleaning processes may be performed in the cleaning chamber (not shown) during the organic cleaning through the plasma surface treatment, the cleaning using the roll brush, the cleaning using the inherent shower through the water jet, 10).

The substrate 1 subjected to the cleaning process in the cleaning chamber 10 is transferred to the drying chamber 30 by the transfer means 30 and is subjected to a drying process. Accordingly, the drying chamber 30 is connected to the cleaning chamber 10. Specifically, the drying chamber 30 is connected to the cleaning chamber 10 and spatially separated by the partition 70.

The substrate 1 is transferred to the inside 30a of the drying chamber 30 to be dried after being subjected to a cleaning process while being transferred from the inside 10a of the cleaning chamber 10 in the direction of the arrows of FIGS. The process can be performed. To this end, a conveying means 50 is disposed in the interior 10a of the cleaning chamber and the interior 30a of the process chamber to transfer the substrate 1 in the direction of the arrow.

That is, the conveying means 50 is disposed in the inside of the cleaning chamber 10 and the inside of the drying chamber 30 so as to move the substrate 1 from the cleaning chamber 10 toward the drying chamber 30 . Through the transfer, the substrate 1 can be continuously subjected to a cleaning process and a drying process.

The transfer means 50 may be variously configured as long as it can transfer the substrate 1 in one direction. The conveying means 50 applied in the present invention is exemplified by a roller conveyor capable of conveying the substrate through continuous rotation of the rollers.

The cleaning chamber 10 and the drying chamber 30 are maintained in a spatially separated state. To this end, the partition 70 is disposed between the cleaning chamber 10 and the drying chamber 30 to block and separate the space. The partition 70 is installed to separate and block the cleaning chamber 10 and the drying chamber 30 so that the substrate 1 is transferred from the cleaning chamber 10 to the drying chamber 30 by the transfer means 50. [ (Shown in FIG. 20 and FIG. 22) through which the toner can be transported and transported in the direction of the transport path 30.

That is, the partition 70 is provided to spatially separate the interior 10a of the cleaning chamber 10 and the interior 30a of the drying chamber 30, A through hole 71 is formed so that the substrate 1 can be transferred from the inside 10a of the cleaning chamber 10 to the inside 30a of the drying chamber 30. [

The substrate 1 transferred into the drying chamber 30 is dried by the air knife 90. However, the air knife 90 in the present invention is not disposed at the center of the drying chamber 30, but is arranged close to the partition 70.

More specifically, the air knife 90 is disposed in the drying chamber 30 adjacent to the partition 70, one above and below the substrate 1 conveyed by the conveying means 50, Air is blown through the through holes 71 so that air can flow in the direction of the cleaning chamber 10. [

As described above, since the air knife 90 is disposed in the inside 30a of the drying chamber 30 in the vicinity of the partition 70 to blow air toward the through hole 71, The cleaning liquid remaining on the substrate 1 hardly enters the drying chamber 30 and is mostly flushed into the cleaning chamber. As a result, the drying effect in the drying chamber 30 increases.

The air knife 90 is disposed on the upper side and the lower side of the substrate 1 conveyed by the conveying means 50. 17, 19, and 26) and the lower air knife (indicated by 90 "in Figs. 17, 19, and 26) being).

The air injected from the upper air knife 90 'flows into the cleaning chamber 10 through the through holes 71 along the upper surface of the substrate 1 to remove the cleaning liquid adhering to the upper surface of the substrate And is pushed toward the cleaning chamber. The air injected from the lower air knife 90 "flows into the cleaning chamber 10 through the through hole 71 along the lower surface of the substrate 1, The cleaning liquid is pushed toward the cleaning chamber.

23 is a perspective view of the air knife constituting the substrate processing apparatus according to the embodiment of the present invention, Fig. 24 is a schematic sectional view of the air knife shown in Fig. 23, Fig. 25 is a cross- It is a perspective view.

형상을 가진다. 즉, 상기 에어 나이프(90)의 일측면(도 27에서 도면부호 90a로 표기됨)은 수직한 면으로만 형성되고, 타측면(90b)은 수직면(90b')과 경사면(90b")으로 형성된다.As shown in Figs. 23 to 25, the air knife 90 has a cross-

Shape. That is, one side (denoted by 90a in FIG. 27) of the air knife 90 is formed only on a vertical plane, and the other side 90b is formed by a vertical plane 90b 'and an inclined plane 90b' do.

형상을 가진다. Specifically, the air knife 90 has a cross section in which one side surface 90a is formed as a vertical surface and the other side surface 90b is composed of a vertical surface 90b 'and an inclined surface 90b'

Shape.

The air knife 90 having the above-described cross-sectional shape is disposed such that the one side face 90a is adjacent to the partition 70 in parallel and the air is injected through the lower end of the one side face 90a. That is, the air knife 90 injects air through the lower end of the one side surface 90a or the lower end of the inclined surface 90b "constituting the other side surface 90b.

Since the air knife 90 is disposed in parallel to the partition 70, the load of the air knife 90 is generated in a vertical direction. Therefore, the lower end (tip) of the air knife 90 is not bent or deformed. The lower end portion of the air knife 90 is disposed adjacent to the through hole 71 and the air blown from the air knife 90 is jetted in a diagonal direction from the lower end portion of the air knife 90. [ So that it can flow in the direction of the cleaning chamber 10 through the passage hole 71. [

24, the air knife 90 includes a body 91 having a shape similar to that of the air knife as a whole, and a vertical cover (not shown) covering a vertical surface constituting the other side of the body 91 A first inclined lid 95 covering the inclined surface constituting the other side surface of the body 91 and a second inclined lid 97 covering the other side surface of the first inclined lid 95, do. The vertical lid 93 is attached with an air inlet 98 for introducing air supplied from the outside at a predetermined pressure into the inner space of the body 91.

The air knife 90 constructed as described above is disposed between the inclined surface constituting the other side surface of the body 91 and one side surface of the first inclined lid 95 and between the other surface of the first inclined lid 95 and the side surface of the first inclined lid 95, 2 air is sprayed in an oblique direction through one side of the inclined cover 97 (between the contact surfaces of the first inclined cover and the second inclined cover).

The structure of the air knife 90 will be described in more detail with reference to FIG. The upper air knife 90 'and the lower air knife 90' have the same structure, but different from the arrangement direction.

As shown in FIG. 25, the body 91 has a first air distribution space (not shown) formed along the longitudinal direction of the air knife 90 and corresponding to a space capable of distributing the introduced air horizontally 91a are formed. A first air distribution slit portion 91b is formed to distribute the air downward through the lower portion of the first air distribution space portion 91a.

A second air distribution space 95a corresponding to a space for distributing the air flowing through the first air distribution slit 91b in the horizontal direction is formed in the lower portion of the body 91 . The second air distribution space 95a is opened through an inclined surface constituting the other side of the body 91 but is closed by one side of the first inclined lid 95.

A first air injection slit part 91c is formed on an inclined surface constituting the other side surface of the body 91 below the second air distribution space part 95a. The first air injection slit portion 91c is closed by one side of the first inclined lid 95. Accordingly, the air distributed in the second air distribution space portion 95a is injected through the tip of the air knife in the oblique direction through the first air injection slit portion 91c.

The first inclined lid 95 is in surface contact with the inclined surface portion constituting the other side surface of the body so that the second air distribution space portion 95a can be closed, And a second air distribution slit portion 95b through which the air existing in the second air distribution slit portion 95a can be introduced into the inner space. A third air distribution space 97a corresponding to a space capable of distributing the air flowing through the second air distribution slit part 95b in the horizontal direction is formed inside the first inclined lid 95 do.

A second air injection slit part 95c is formed on the other side of the first inclined cover 95 below the third air distribution space part 97a. The second air injection slit portion 95c is closed by one side of the second inclined lid 97. Accordingly, the air distributed in the third air distribution space portion 97a is injected through the tip portion of the air knife in an oblique direction through the second air injection slit portion 95c.

As a result, the air introduced through the air inlet portion 98 is injected in an oblique direction through the tip of the air knife 90 through two paths (indicated by red solid lines), as shown in Fig. 25 . Specifically, the first path is such that the air introduced through the air inlet 98 passes through the first air distribution space 91a, the first air distribution slit 91b, the second air distribution space 95a, And the second path is a path through which the air introduced through the air inflow portion 98 flows into the first air distribution space portion 91a and the first air distribution slit portion 91b Through the second air distribution space portion 95a, the second air distribution slit portion 95b, the third air distribution space portion 97a, and the second air injection slit portion 95c.

The air knife 90 having the above structure is composed of the upper air knife 90 'and the lower air knife 90' 'as described above. And the air knife is disposed one on the upper side and one on the lower side.

The air knife 90 composed of the upper air knife 90 'and the lower air knife 90' is coupled to the bracket 80 at both ends in the longitudinal direction, as shown in FIGS. 26 and 27.

When the substrate 1 passes between the upper air knife 90 'and the lower air knife 90' ', the upper air knife ejects air to the upper surface of the substrate, The gap g between the upper air knife 90 'and the lower air knife 90' needs to be adjusted as shown in FIG.

The air knife 90 according to the present invention is configured such that both longitudinal ends thereof are coupled to the bracket 80 so that any one of the upper air knife 90 'and the lower air knife 90' So that the gap g between the upper air knife 90 'and the lower air knife 90' is adjusted.

The bracket 80 is composed of a height adjusting bracket 81 and a fixing bracket 83. Both ends of the air knife 90 are coupled to the height adjusting bracket 81. One of the upper air knife 90 'and the lower air knife 90' is coupled to the height adjusting bracket 81 so as to be adjustable in height.

26 shows a state in which the lower air knife 90 "of the upper air knife 90 'and the lower air knife 90" is fixed to the height adjusting bracket 81 and only the upper air knife 90' And the height adjustment bracket 81 is vertically adjustably coupled to the height adjustment bracket 81. Therefore, the height adjusting bracket 81 has a height adjusting portion 81a at a portion where both side ends of the upper air knife are coupled.

Therefore, when the height g of the upper air knife 90 'is adjusted so that the gap g between the upper air knife 90' and the lower air knife 90 ' And the gap g between the upper air knife 90 'and the lower air knife 90' is set.

The air knife 90 having both ends connected to the height adjusting bracket 81 is disposed in the drying chamber 30 adjacent to the partition 70 by the fixing bracket 83. [ 26, the fixing bracket 83 is fixedly coupled to the height adjustment bracket 81 and is coupled to the structure in the drying chamber 30 by a coupling member.

The upper and lower air knife assembled brackets 80 having the spacing adjusted therein are inserted into a structure in the drying chamber 30 so that the substrate 1 can pass through the center between the upper air knife and the lower air knife Receiving plate 51).

Meanwhile, as described above, the gap g between the upper air knife 90 'and the lower air knife 90' 'needs to be adjusted as necessary, and the substrate is moved between the upper air knife 90 and the lower air knife 90' It is necessary to connect the bracket 80 to the support plate 51 so that the upper air knife 90 'and the lower air knife 90' The substrate 1 is normally moved between the upper air knife 90 'and the lower air knife 90' in the course of transporting the substrate in the direction of the arrow as shown in FIG. 27 It is necessary to confirm whether it passes.

26 to 28, a see-through window 85 is formed in the bracket 80 so that the upper air knife 90 'and the lower air knife 90' can be distinguished from each other. , The viewing window 85 is formed on the fixing bracket 83 so that the upper air knife 90 'and the lower air knife 90' can be seen.

28, in setting the gap g between the upper air knife 90 'and the lower air knife 90' ', the tip of the upper air knife 90' The space between the tips of the lower air knife 90 "can be confirmed through the transparent window 85 formed in the bracket 80. [

Since the space between the upper air knife 90 'and the lower air knife 90' 'can be checked through the viewing window 85, the substrate can be positioned between the upper air knife and the lower air knife 90' The bracket can be coupled to the support plate 51 so as to pass through the center of the support plate 51. [

The air knife 90 having the above-described arrangement structure and structural features is disposed adjacent to the partition 70. Hereinafter, the arrangement of the conveying means 50, the partition 70 and the air knife 90 will be described in detail with reference to FIGS. 15 to 22.

FIGS. 17 to 19 are partial perspective views of the squares shown in FIG. 16 from various angles, FIG. 20 is a perspective view cut in the direction AA 'in FIG. 16 and viewed in the direction of arrows, FIG. 22 is a partial perspective view of one side of a partition in a cleaning chamber of a substrate processing apparatus according to an embodiment of the present invention. FIG.

16, the conveying means 50 includes a pair of support plates 51 arranged to face the both sides of the cleaning chamber 10 and the drying chamber 30, and the support plate 51 A shaft 53 to which both ends are rotatably mounted, and a roller 55 which is separated from the shaft 53 by a predetermined distance.

The pair of support plates 51 are arranged long in the conveying direction of the substrate 1 and the shaft 53 is rotatably mounted at both ends on the pair of support plates 51, (Not shown). The roller 55 is held in contact with the substrate 1 and feeds the substrate 1 in the direction of the arrow as the shaft 53 rotates.

The substrate 1 is transported in the direction of the arrow while being supported by the roller 55, but must be transported straight in the direction of the arrow. Therefore, guide rollers 57 are provided on both sides of the substrate 1 at predetermined intervals. 16 to 18, the guide roller 57 is mounted on the inner surface of the support plate 51 and is in contact with the side end of the substrate 1, And guided so as to be transported straight in the direction of the arrow.

The guide roller 57 should be able to correspond to the thickness and the size of the substrate 1. The guide roller 57 can move in the vertical direction (the height direction of the support plate 51) and the horizontal direction (the direction perpendicular to the inner side surface of the support plate 51) It is preferable to be bonded to the side surface.

Since the partition 70 and the air knife 90 are arranged in a diagonal direction rather than in a direction orthogonal to the conveying direction of the substrate 1, As shown in Figs. 16 to 18, further comprises auxiliary means, that is, an auxiliary shaft 53a and an auxiliary roller 55a.

15 to 19, since the partition 70 and the air knife 90 are arranged in a diagonal direction, not perpendicular to the conveying direction of the substrate 1, the partition 70 Both ends of the shaft 53 can not be mounted on the pair of support plates 51 in the region where the air knife 90 and the air knife 90 are disposed. That is, both ends of the shaft 53 can not be mounted on the pair of support plates 51 because interference occurs with the partition 70 and the air knife 90 disposed in the oblique direction.

Therefore, in the area where the partition 70 and the air knife 90 are disposed, the auxiliary shaft 53a is installed to allow the substrate 1 to be stably transported. It is a matter of course that the roller 55 is engaged with the auxiliary shaft 53a. One end of the auxiliary shaft 53a is rotatably mounted on the support plate 51 and the other end is rotatably mounted on the auxiliary shaft support 21 (see Figs. 18, 20 and 21) .

The auxiliary shaft support 21 is installed on the seating plate 20 on which the partition 70 is seated. Therefore, the auxiliary shaft 53a on which the other end is mounted on the auxiliary shaft supporter 21 is shorter than the shaft 53.

16 to 18, the conveying unit 50 may further include a conveying unit for conveying the substrate 1 in a region where the partition 70 and the air knife 90 are arranged in the oblique direction And further comprises an auxiliary roller 55a for stably advancing it.

The auxiliary roller 55a is formed on an auxiliary roller support 23 provided on the seating plate 20 to reinforce the substrate transfer by the roller coupled to the auxiliary shaft support 21. [ As a result, the substrate transfer in the region where the partition 70 and the air knife 90 are arranged in the diagonal direction is formed is formed on the auxiliary roller 53a and on the auxiliary roller support 23 By the auxiliary roller 55a.

As shown in Figs. 15 to 19, the partition 70 is disposed in an oblique direction with respect to the substrate transfer direction, and is seated on the seating plate 20 as shown in Figs. 20 and 21, Respectively.

The partition 70 is configured such that an upper partition 70a and a lower partition 70b are detachably coupled. The partition 70 formed by combining the upper partition 70a and the lower partition 70b includes a through hole 71 through which the substrate 1 can be transferred.

An upper partition spacer 70a 'is formed at both lower ends of the upper partition 70a and a lower partition spacer 70b' is formed at both upper ends of the lower partition 70b to be coupled to the upper partition spacer 70a ' . The partition 70 may include the through hole 71 by coupling the upper partition spacer 70a 'and the lower partition spacer 70b'.

It is a matter of course that the through hole 71 formed in the partition 70 is formed to have a size allowing the substrate 1 to pass therethrough. The cleaning liquid on the substrate 1 transferred to the drying chamber 30 in the cleaning chamber 10 through the through holes 71 passes through the air holes 90 ).

Therefore, it is preferable to prevent the cleaning liquid flowing along the wall of the partition 70 from falling on the substrate 1 during the passage of the substrate 1 through the through hole 71. Therefore, a cleaning liquid fall preventing prong 73 is formed on the wall surface of the partition 70 forming the inside 10a of the cleaning chamber 10 above the through hole 71. [

The cleaning liquid dropping prevention pin 73 is formed on the upper side of the through hole 71 to prevent the cleaning liquid flowing along the wall surface of the partition 70 from falling on the substrate 1 passing through the through hole 71 . The cleaning liquid flowing along the wall surface of the partition 70 moves leftward and rightward on the cleaning liquid dropping prevention tumbler 73 and drops to both sides of the through hole 71.

On the other hand, both side ends of the partition 70 contact the side wall of the chamber forming the cleaning chamber 10 and the drying chamber 30. Therefore, it is necessary to maintain airtightness between the side end of the partition 70 and the side wall of the chamber. That is, in order to prevent the cleaning liquid in the cleaning chamber 10 or the mist of mist from flowing into the drying chamber 30 through the fine gap between the side of the partition 70 and the side wall of the chamber, It is necessary to maintain airtightness between the side wall of the partition 70 and the side wall of the chamber.

22, a sealing member 75, which is a soft plate, is disposed between the wall side portion of the partition 70 forming the inside 10a of the cleaning chamber 10 and the inside side 10b of the cleaning chamber 10, Lt; / RTI > That is, the sealing material 75 is adhered to the wall side portion of the partition and then folded and attached to the inner surface 10b of the cleaning chamber. It is preferable that an overhang 77 is padded on the sealing material 75 for strong attachment of the sealing material 75.

Meanwhile, as described above, the partition 70 is seated and supported on the seating plate 20. Since the partition 70 is arranged in the diagonal direction, the seating plate 20 is also arranged in the oblique direction. An auxiliary shaft support 21 on which the auxiliary shaft 53a is formed and an auxiliary roller support 23 on which the auxiliary roller 55a is formed are formed on the seating plate 20 as described above do.

The air knife 90 is disposed on the upper side and the lower side of the substrate 1 which is disposed in the drying chamber 30 adjacent to the partition 70 and is transported by the transporting means 50, Air is blown to the cleaning chamber (10) through the opening (71).

15 to 19, the air knife 90 is disposed in a diagonal direction other than a direction orthogonal to the feeding direction of the substrate 1. Therefore, the partition 70 is also disposed in the oblique direction adjacent to the air knife 90.

The air knife 90 is disposed in a diagonal direction other than a direction orthogonal to the feeding direction of the substrate 1 in order to push out the cleaning liquid on the substrate 1 by pushing the cleaning liquid in an oblique direction by air injection. When the air knife 90 pushes the cleaning liquid in an oblique direction, the cleaning liquid on the substrate is removed by being pushed to one side of the substrate, thereby improving the drying efficiency.

17 and 18, the air knife 90 is composed of an upper air knife 90 'and a lower air knife 90 ", and both side ends thereof are coupled to the bracket 80 The air knife 90 is coupled to the height adjusting bracket 81 in such a manner that the opposite ends of the air knife 90 are adjusted in height and fixed to the height adjusting bracket 81, 83 to the support plate 51.

Since the air knife 90 is disposed in an oblique direction, the fixing bracket 83 is coupled to the height adjusting bracket 81 at an angle. The fixing bracket 83 is mounted on the support plate 51 and fixed thereto. 19, a see-through window 85 is formed in the fixed bracket 83 so that the upper air knife 90 'and the lower air knife 90' can be identified.

As described above, the air knife 90 is disposed in an oblique direction and ejects air so that the cleaning liquid on the substrate 1 passing through the through hole 71 can be pushed to one side of the substrate 1. [ Accordingly, the amount of the cleaning liquid remaining on the substrate 1 passing through the through hole 71 into the drying chamber 30 is reduced, thereby improving the drying efficiency.

Meanwhile, the substrate 1 is conveyed by the conveying means 50 in an inclined state in order to improve the cleaning efficiency in the cleaning chamber 10 and improve the drying efficiency in the drying chamber 30. Therefore, the conveying means 50 is formed to be tilted to one side as shown in FIG. That is, by configuring one end of the shaft to be mounted higher than the other end, the substrate 1 fed by the feeding means can be fed in a tilted state to one side.

Therefore, the cleaning liquid on the substrate 1 flows down to one side in the cleaning process and is pushed down to one side in the drying process by the air knife 90, so that the cleaning liquid remaining on the substrate 1 is minimized . As a result, cleaning and drying efficiency can be improved.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. Accordingly, the true scope of the present invention should be determined by the following claims.

g: distance between upper air knife and lower air knife RA:
1: substrate 3: loading chamber
5: AP processing chamber 5a: plasma surface processor
10: cleaning chamber 10a: inside of cleaning chamber
10b: inner surface of the cleaning chamber 20:
21: auxiliary shaft support 23: auxiliary roller support
30: drying chamber 30a: inside of drying chamber
40: elevating chamber 41: second hinge coupling part
42: lift cylinder 43: support frame
45: high-speed transfer chamber 50: conveying means
51: support plate 51a:
53: shaft 53a: auxiliary shaft
53b: up-down shaft 55: roller
55a: Auxiliary roller 57: Guide roller
60: unloading chamber 65: shaft vertical driver
70: partition 70a: upper partition
70a ': upper partition spacer 70b: lower partition
70b ': Lower partition spacer 71: Through hole
73: cleaning liquid drop-off preventing surface 75: sealing material
77: Paddle 80: Bracket
81: height adjusting bracket 81a: height adjusting portion
83: Fixing bracket 85:
90: Air knife 90 ': Upper air knife
90 ": lower side air knife 90a: one side of the air knife
90b: other side 90b 'of the air knife: vertical side of the other side
90b ": inclined surface of the other side 91: body
91a: first air distribution space part 91b: first air distribution slit part
91c: first air injection slit part 93: vertical cover
95: first inclined cover 95a: second air distribution space
95b: second air distribution slit part 95c: second air injection slit part
97: second inclined cover 97a: third air distribution space
98: air inlet 110: substrate seating means
111: Support pin 113: Up-down plate
115: driving rod 117:
200: substrate processing apparatus

Claims (10)

In the substrate processing apparatus,
A loading chamber for receiving the substrate; At least one process chamber connected to the other side of the loading chamber to perform at least one process on a substrate transferred from one side to the other side; An elevating chamber connected to the other side of the process chamber for transferring the processed substrate to the upper side; A high speed transfer chamber disposed above the process chamber for transferring the substrate transferred from the elevating chamber at a high speed in one direction from the other side; An unloading chamber disposed above the loading chamber for unloading the substrate transferred from the rapid transfer chamber; And transporting means disposed in the loading chamber, the processing chamber, the elevating chamber, the high-speed transporting chamber, and the unloading chamber for transporting the substrate,
A substrate holding means for holding a substrate to be drawn in by using a support pin in the loading chamber and then lowering the substrate to be placed in a conveying means held in a horizontal state in the loading chamber; And a first tilting means for tilting at the same slope as the conveying means disposed in the process chamber,
Wherein the transfer means disposed in the process chamber is disposed in an inclined state and the transfer means disposed in the interior of the rapid transfer chamber and the unloading chamber are disposed in a horizontal state.
The method according to claim 1,
Wherein the processing chamber includes: an AP processing chamber having one side connected to the other side of the loading chamber to perform a plasma processing process on a surface of the substrate to be transferred; at least one cleaning unit connected to the other side of the AP processing chamber And a drying chamber connected to the other side of the cleaning chamber for performing a drying process using an air knife on the substrate to be transferred after the cleaning process is performed Wherein the substrate processing apparatus further comprises:
The method of claim 2,
Wherein the substrate is simultaneously subjected to the plasma treatment process and the cleaning process by the at least one cleaning unit.
delete The method according to claim 1,
Elevating means for elevating and lowering the conveying means disposed in the elevating chamber inside the elevating chamber and conveying means disposed in the elevating chamber for receiving the substrate from the processing chamber, Wherein the elevating means moves the elevating means in the elevating direction to the other side of the high-speed transfer chamber by changing the inclination of the conveying means disposed in the elevating chamber during the elevation of the elevating means, And a second tilting means for operating the conveying means disposed inside the chamber to be in a horizontal state.
The method according to claim 1,
The conveying means disposed in the unloading chamber includes a pair of support plates disposed to face each other on both sides, a plurality of shafts rotatably mounted at both ends of the support plate and spaced apart from each other, An up-down shaft disposed between the shafts and spaced apart from each other, and a roller (55) coupled with the shaft at a predetermined distance from the up-down shaft,
Wherein the up-down shaft is raised and lowered by a shaft vertical driver, and an opening is formed in the support plate so that one end of the up-down shaft is exposed in the lateral direction. The method of claim 2,
And a partition for separating and blocking the cleaning chamber and the drying chamber, wherein the partition has a through hole through which the substrate can be transported in the direction of the drying chamber from the cleaning chamber by the transporting means,
The air knife is disposed in the drying chamber adjacent to the partition so that the air knife is disposed on the upper and lower sides of the substrate conveyed by the conveying means so as to allow air to flow in the direction of the cleaning chamber through the through- Wherein the substrate processing apparatus further comprises:
The method of claim 7,
The air knife has a cross section in which one side is composed of a vertical plane and the other side is composed of a vertical plane and an inclined plane

Wherein the one side is disposed adjacent to and parallel to the partition, and the air is injected through the bottom of the one side.
The method of claim 8,
The upper and lower air knives are vertically coupled to each other so that the gap between the upper air knife and the lower air knife is adjusted And the substrate processing apparatus.
The method of claim 9,
Wherein the bracket is formed with a see-through window for confirming an interval between the upper air knife and the lower air knife.

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