KR101634419B1 - 액체 도포 장치, 액체 도포 방법 및 나노임프린트 시스템 - Google Patents

액체 도포 장치, 액체 도포 방법 및 나노임프린트 시스템 Download PDF

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Publication number
KR101634419B1
KR101634419B1 KR1020127034408A KR20127034408A KR101634419B1 KR 101634419 B1 KR101634419 B1 KR 101634419B1 KR 1020127034408 A KR1020127034408 A KR 1020127034408A KR 20127034408 A KR20127034408 A KR 20127034408A KR 101634419 B1 KR101634419 B1 KR 101634419B1
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KR
South Korea
Prior art keywords
liquid
droplet ejection
nozzles
substrate
piezoelectric elements
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Expired - Fee Related
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KR1020127034408A
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English (en)
Korean (ko)
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KR20130113969A (ko
Inventor
겐이치 고다마
다다시 오마츠
사토시 와카마츠
구니히코 고다마
Original Assignee
후지필름 가부시키가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/002—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles
    • B05C5/004—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles the work consisting of separate rectangular flat articles, e.g. flat sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1044—Apparatus or installations for supplying liquid or other fluent material to several applying apparatus or several dispensing outlets, e.g. to several extrusion nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B05D1/265—Extrusion coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1020127034408A 2010-06-30 2011-06-28 액체 도포 장치, 액체 도포 방법 및 나노임프린트 시스템 Expired - Fee Related KR101634419B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010150365A JP5489887B2 (ja) 2010-06-30 2010-06-30 液体塗布装置及び液体塗布方法並びにナノインプリントシステム
JPJP-P-2010-150365 2010-06-30
PCT/JP2011/065242 WO2012002556A1 (en) 2010-06-30 2011-06-28 Liquid application device, liquid application method, and nanoimprint system

Publications (2)

Publication Number Publication Date
KR20130113969A KR20130113969A (ko) 2013-10-16
KR101634419B1 true KR101634419B1 (ko) 2016-06-28

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KR1020127034408A Expired - Fee Related KR101634419B1 (ko) 2010-06-30 2011-06-28 액체 도포 장치, 액체 도포 방법 및 나노임프린트 시스템

Country Status (5)

Country Link
US (1) US8894187B2 (enExample)
JP (1) JP5489887B2 (enExample)
KR (1) KR101634419B1 (enExample)
TW (1) TWI594895B (enExample)
WO (1) WO2012002556A1 (enExample)

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KR102152817B1 (ko) * 2012-12-11 2020-09-08 다이요 잉키 세이조 가부시키가이샤 광경화성 수지 조성물, 솔더 레지스트 및 프린트 배선판
CN105210459B (zh) * 2013-03-13 2018-12-07 麦克罗尼克迈达塔有限责任公司 用于喷射小滴的方法和装置
JP6329425B2 (ja) 2014-05-02 2018-05-23 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6661334B2 (ja) * 2015-02-03 2020-03-11 キヤノン株式会社 装置、および物品の製造方法
CN105842982B (zh) * 2015-02-03 2019-11-08 佳能株式会社 压印装置以及物品的制造方法
JP6552392B2 (ja) * 2015-11-30 2019-07-31 キヤノン株式会社 インプリント装置、計測方法、インプリント方法、および物品の製造方法
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JP6563984B2 (ja) * 2017-08-09 2019-08-21 マイクロニック アーベーＭｙｃｒｏｎｉｃ Ａｂ 液滴噴射方法及び液滴噴射装置
US11927883B2 (en) * 2018-03-30 2024-03-12 Canon Kabushiki Kaisha Method and apparatus to reduce variation of physical attribute of droplets using performance characteristic of dispensers
JP6968505B2 (ja) * 2018-05-17 2021-11-17 住友重機械工業株式会社 インク塗布装置及びインク塗布方法
KR102178872B1 (ko) * 2018-10-31 2020-11-13 세메스 주식회사 다이 또는 기판의 본딩 장치, 본딩 방법, 액적 토출 헤드 구동 장치 및 방법
EP3898007A1 (en) * 2018-12-21 2021-10-27 Mycronic Ab Method for controlling an ejector, and related system
JP2020127922A (ja) 2019-02-08 2020-08-27 キオクシア株式会社 液体吐出部材、液体吐出装置および半導体装置の製造方法
JP7441037B2 (ja) * 2019-12-13 2024-02-29 キヤノン株式会社 インプリント装置、情報処理装置、インプリント方法及び物品の製造方法
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KR102474000B1 (ko) * 2022-03-07 2022-12-05 주식회사피에스디이 나노 임프린팅을 위한 디스펜서 및 그 제조 방법

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Also Published As

Publication number Publication date
WO2012002556A1 (en) 2012-01-05
TWI594895B (zh) 2017-08-11
US8894187B2 (en) 2014-11-25
JP5489887B2 (ja) 2014-05-14
JP2012011310A (ja) 2012-01-19
KR20130113969A (ko) 2013-10-16
US20130113863A1 (en) 2013-05-09
TW201208888A (en) 2012-03-01

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