KR101624038B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

Info

Publication number
KR101624038B1
KR101624038B1 KR1020140108213A KR20140108213A KR101624038B1 KR 101624038 B1 KR101624038 B1 KR 101624038B1 KR 1020140108213 A KR1020140108213 A KR 1020140108213A KR 20140108213 A KR20140108213 A KR 20140108213A KR 101624038 B1 KR101624038 B1 KR 101624038B1
Authority
KR
South Korea
Prior art keywords
substrate
volatile solvent
cleaning liquid
magnetic field
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020140108213A
Other languages
English (en)
Korean (ko)
Other versions
KR20150037509A (ko
Inventor
유지 나가시마
준 마츠시타
유키 사이토
고노스케 하야시
구니히로 미야자키
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20150037509A publication Critical patent/KR20150037509A/ko
Application granted granted Critical
Publication of KR101624038B1 publication Critical patent/KR101624038B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0071—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mixers With Rotating Receptacles And Mixers With Vibration Mechanisms (AREA)
  • Drying Of Solid Materials (AREA)
  • Extraction Or Liquid Replacement (AREA)
KR1020140108213A 2013-09-30 2014-08-20 기판 처리 장치 및 기판 처리 방법 Expired - Fee Related KR101624038B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013205126 2013-09-30
JPJP-P-2013-205126 2013-09-30
JP2014139197A JP6426924B2 (ja) 2013-09-30 2014-07-04 基板処理装置及び基板処理方法
JPJP-P-2014-139197 2014-07-04

Publications (2)

Publication Number Publication Date
KR20150037509A KR20150037509A (ko) 2015-04-08
KR101624038B1 true KR101624038B1 (ko) 2016-05-24

Family

ID=51730317

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140108213A Expired - Fee Related KR101624038B1 (ko) 2013-09-30 2014-08-20 기판 처리 장치 및 기판 처리 방법

Country Status (6)

Country Link
US (1) US20150090298A1 (https=)
EP (1) EP2854165A1 (https=)
JP (1) JP6426924B2 (https=)
KR (1) KR101624038B1 (https=)
CN (1) CN104517875A (https=)
TW (1) TW201523724A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6543534B2 (ja) 2015-08-26 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6588819B2 (ja) 2015-12-24 2019-10-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7045867B2 (ja) * 2018-01-26 2022-04-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP7064339B2 (ja) * 2018-01-31 2022-05-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI702373B (zh) * 2019-03-22 2020-08-21 由田新技股份有限公司 翻面式多軸機械手臂裝置及其光學檢測設備
GB201905138D0 (en) 2019-04-11 2019-05-29 Spts Technologies Ltd Apparatus and method for processing a substrate
CN111842283A (zh) * 2020-06-29 2020-10-30 北京信和洁能新能源技术服务有限公司 具有内置水箱的离子瀑空气净化机的自动清洗系统及方法
JP7453874B2 (ja) * 2020-07-30 2024-03-21 芝浦メカトロニクス株式会社 基板処理方法、および基板処理装置
JP7072623B1 (ja) * 2020-11-11 2022-05-20 芝浦機械株式会社 抽出乾燥装置
JP2024145228A (ja) * 2023-03-31 2024-10-15 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004107426A1 (ja) * 2003-05-27 2004-12-09 Personal Creation Ltd. 磁石を備えた基板の処理装置及び処理方法
US20080190454A1 (en) 2007-02-09 2008-08-14 Atsuro Eitoku Substrate treatment method and substrate treatment apparatus

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003205273A (ja) * 2002-01-16 2003-07-22 Mgchemical Kk 洗浄及び乾燥方法
JP2008034779A (ja) 2006-06-27 2008-02-14 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP5448536B2 (ja) * 2009-04-08 2014-03-19 東京エレクトロン株式会社 レジスト塗布現像装置およびレジスト塗布現像方法、並びにレジスト膜処理装置およびレジスト膜処理方法
JP2011135009A (ja) * 2009-12-25 2011-07-07 Tokyo Electron Ltd 基板乾燥装置及び基板乾燥方法
JP2012200679A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd 基板洗浄装置及び基板洗浄方法
US8715518B2 (en) * 2011-10-12 2014-05-06 Intermolecular, Inc. Gas barrier with vent ring for protecting a surface region from liquid

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004107426A1 (ja) * 2003-05-27 2004-12-09 Personal Creation Ltd. 磁石を備えた基板の処理装置及び処理方法
US20080190454A1 (en) 2007-02-09 2008-08-14 Atsuro Eitoku Substrate treatment method and substrate treatment apparatus

Also Published As

Publication number Publication date
EP2854165A1 (en) 2015-04-01
CN104517875A (zh) 2015-04-15
TW201523724A (zh) 2015-06-16
JP2015092537A (ja) 2015-05-14
JP6426924B2 (ja) 2018-11-21
KR20150037509A (ko) 2015-04-08
US20150090298A1 (en) 2015-04-02

Similar Documents

Publication Publication Date Title
KR101624038B1 (ko) 기판 처리 장치 및 기판 처리 방법
KR101971303B1 (ko) 기판 처리 장치 및 기판 처리 방법
KR101688689B1 (ko) 기판 처리 장치 및 기판 처리 방법
KR101602554B1 (ko) 기판 처리 장치 및 기판 처리 방법
KR20150037543A (ko) 기판 처리 장치 및 기판 처리 방법
JP5043406B2 (ja) 基板乾燥方法および基板乾燥装置
JP6276924B2 (ja) 基板処理装置
KR101634428B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP6585243B2 (ja) 基板処理装置及び基板処理方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20190519

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20190519

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000