KR101615518B1 - Dike for Semiconductor and LCD chemical cleaning equipment - Google Patents

Dike for Semiconductor and LCD chemical cleaning equipment Download PDF

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KR101615518B1
KR101615518B1 KR1020140127334A KR20140127334A KR101615518B1 KR 101615518 B1 KR101615518 B1 KR 101615518B1 KR 1020140127334 A KR1020140127334 A KR 1020140127334A KR 20140127334 A KR20140127334 A KR 20140127334A KR 101615518 B1 KR101615518 B1 KR 101615518B1
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wall
cleaning
lcd
semiconductor
dike
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KR1020140127334A
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KR20160036113A (en
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김정수
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(주)썬패치테크노
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

본 발명은 반도체·LCD 케미컬 세정설비의 세정액으로부터의 피해를 예방하는 다이크에 관한 것으로, 특히 세정설비의 이설시에도 용이한 다이크에 관한 것이다.
이와 같은 반도체·LCD 케미컬 세정설비(200)에서 누설된 세정액의 확산을 방지하는 다이크(100)는 상기 세정설비(200)가 설치된 바닥면에 세정설비(200)에서 누설된 세정액의 확산을 방지하도록 설치된 보호벽과; 상기 보호벽의 내측에 충진되는 에폭시(50)와; 세정설비(200)를 지지하는 지지대(211,212) 및 세정설비(200)와 연결된 관(220)이 상기 에폭시(50)와 격리되도록 지지대(211,212) 및 관(220)을 각각 수용하는 홀더(71,72,80)와; 상기 홀더(71,72,80)의 내부에 충진되는 실리콘(60);를 포함하되, 상기 보호벽은 내측으로 결합돌기(13)가 형성된 외벽(11)과, 상기 결합돌기(13)에 결합되면서 외벽(11)과 간격을 두고 결합되는 내벽(12)으로 이루어지고, 상기 에폭시(50)는 보호벽의 내측면 및 상기 외벽(11)과 내벽(12) 사이에 충진되는 것을 특징으로 한다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dike for preventing damage to a semiconductor / LCD chemical cleaning facility from a cleaning liquid, and more particularly, to a dike that is easy to install even when a cleaning facility is installed.
The dike 100 for preventing the leakage of the cleaning liquid leaked from the semiconductor / LCD chemical cleaning equipment 200 prevents the cleaning liquid that has leaked from the cleaning equipment 200 from spreading on the bottom surface of the cleaning equipment 200 An installed protective wall; An epoxy 50 filled inside the protective wall; Supports 211 and 212 for supporting the cleaning facility 200 and pipes 220 connected to the cleaning facility 200 are connected to holders 71 and 72 for receiving the supports 211 and 212 and the pipe 220, 72, 80); And a silicon 60 filled in the holders 71 and 72. The protective wall includes an outer wall 11 having an inner coupling protrusion 13 formed therein and an outer wall 11 coupled to the coupling protrusion 13, And an inner wall 12 spaced apart from the outer wall 11. The epoxy 50 is filled between the inner wall of the protective wall and the outer wall 11 and the inner wall 12. [

Description

반도체·LCD 케미컬 세정설비의 다이크{Dike for Semiconductor and LCD chemical cleaning equipment}BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor / LCD chemical cleaning equipment,

본 발명은 반도체·LCD 케미컬 세정설비의 세정액으로부터의 피해를 예방하는 다이크에 관한 것으로, 특히 세정설비의 이설시에도 용이한 다이크에 관한 것이다.
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dike for preventing damage to a semiconductor / LCD chemical cleaning facility from a cleaning liquid, and more particularly, to a dike that is easy to install even when a cleaning facility is installed.

반도체 디바이스와 LCD 디바이스의 고집적화가 진행될수록 제조 공정 중에서 발생하는 오염 및 환경성 오염을 제어하는 일이 제조 수율 및 제품의 품질 관리를 위해서 필수적인 것은 당연하다.As semiconductor devices and LCD devices become more highly integrated, it is natural that the control of pollution and environmental pollution occurring in the manufacturing process is essential for the production yield and quality control of products.

반도체 기판 또는 LCD 기판의 표면 오염은 제조 공정의 개시에서 완료에 이르기까지의 전 공정에 걸쳐서 발생할 수 있으며 그 오염원의 종류 또한 파티클, 유기물, 금속성 물질, 자연 산화막 등의 산화막, 손상막질 등으로 매우 다양하기 때문에 이들을 동시에 그리고 효율적으로 제거하는 것은 매우 어렵다.Surface contamination of the semiconductor substrate or LCD substrate can occur throughout the entire process from the start of the manufacturing process to the completion of the manufacturing process. The type of the contamination source is also very various due to the oxide film such as particles, organic substances, metallic substances, natural oxide films, It is very difficult to remove them simultaneously and efficiently.

현재, 가장 광범위하게 사용되고 있는 세정방법은 1970년대 미국 RCA사에서 개발한 공정으로서 APM (Ammonia hydrogen peroxide mixture) 공정, SPM (sulfuric acid hydrogen peroxide mixture) 공정 및 HPM(hydrochloric acid hydrogen peroxide mixture) 공정으로 이루어진 일련의 습식 세정공정이다. 여기서, APM 공정, SPM 공정 및 HPM 공정은 각각 파티클, 유기오염물 및 금속 오염물을 효과적으로 제거하는 공정으로서, 독립적으로 사용하거나 이들 공정을 적절하게 조합하거나 변형하여 사용한다.Currently, the most widely used cleaning method is the RCM process developed by American RCA in the 1970s. It consists of APM (ammonia hydrogen peroxide mixture) process, SPM (sulfuric acid hydrogen peroxide mixture) process and HPM (hydrochloric acid hydrogen peroxide mixture) It is a series of wet cleaning processes. Here, the APM process, the SPM process, and the HPM process are processes for effectively removing particles, organic contaminants, and metal contaminants, respectively, and these processes may be independently used or appropriately combined or modified.

그러나 이러한 세정방법에서 사용되는 세정액은 강한 산화제인 과산화수소, 불산 등을 포함하기 때문에 세정설비를 부식시키고, 종종 작업바닥으로까지 비산하여 작업환경을 저해하는 문제점이 있었다.However, since the cleaning liquid used in this cleaning method contains hydrogen peroxide or hydrofluoric acid which is a strong oxidizing agent, there is a problem that the cleaning equipment is corroded and often scattered to the floor of the work, which hinders the working environment.

이에 본 출원인은 이러한 문제점을 해결하기 위하여 등록특허공보 제10-1128298호(반도체·LCD 케미컬 세정설비의 누수 보강 방법)를 제안한 바 있다.In order to solve such a problem, the applicant of the present invention has proposed Registration No. 10-1128298 (leak-tightening method of a semiconductor / LCD chemical cleaning facility).

이러한 반도체·LCD 케미컬 세정설비의 누수 보강 방법은 세정설비를 크리닝하는 단계와; 세정설비의 바닥에 형성된 개구부를 보강하는 단계와; 세정설비에서 낙하되는 세정액을 수용하여 배출하도록 세정설비의 바닥면에 누수 보강 장치를 설치하는 단계;를 포함하며,The leakage water leaking method of the semiconductor / LCD chemical cleaning equipment includes a step of cleaning the cleaning equipment; Reinforcing an opening formed in the bottom of the cleaning facility; And installing a water leakage enhancing device on the bottom surface of the washing facility to receive and discharge the washing liquid dropped in the washing facility,

상기 누수 보강 설치 단계는,In the leaking reinforcement installation step,

상기 세정설비의 바닥면에, 상부는 개방되고 외부와는 격리된 보호벽과, 상기 보호벽의 내측 및 하부측과 간극을 갖는 보강벽과, 상기 보호벽의 내측과 보강벽을 연결하여 지지하는 연결라인을 설치하는 방호벽 설치단계와; 상기 방호벽에 수용되는 세정액을 배출하도록 하는 드레인관을 상기 방호벽에 설치하는 단계와; 상기 방호벽의 하부 및 보호벽과 보강벽의 사이에 에폭시를 충진하는 단계;를 포함하여 이루어진다.A reinforcing wall having a gap between the inside and the lower side of the protecting wall and a connecting line for connecting and supporting the inside of the protecting wall with the reinforcing wall, Installing firewalls; Installing a drain pipe on the barrier wall to discharge a cleaning liquid accommodated in the barrier wall; And filling epoxy between the lower portion of the barrier wall and the protection wall and the reinforcing wall.

그러나 등록특허공보 제10-1128298호는 세정설비를 지지하기 위한 지지대에도 에폭시를 충진함으로써 세정설비의 이설에 어려움이 있었다.
However, JP-A-10-1128298 has difficulty in replacing the cleaning equipment by filling epoxy in the support for supporting the cleaning equipment.

등록특허공보 제10-112898호(공고일자: 2012.03.23.)Patent Registration No. 10-112898 (Publication date: March 23, 2012)

본 발명은 반도체·LCD 케미컬 세정설비의 세정액으로부터의 피해를 예방하고 더불어 세정설비의 이설시에도 용이성을 갖도록 하는 다이크의 제공을 목적으로 한다.An object of the present invention is to provide a dyestuff which prevents damage to a semiconductor / LCD chemical cleaning facility from a cleaning liquid and facilitates installation of a cleaning facility.

본 발명의 목적은 이상에서 언급한 목적으로 제한되지 않으며, 언급되지 않은 또 다른 목적들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.
The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

상기와 같은 본 발명의 목적은 The object of the present invention as described above

반도체·LCD 케미컬 세정설비(200)에서 누설된 세정액의 확산을 방지하는 다이크(100)에 있어서,A dike (100) for preventing diffusion of a cleaning liquid leaked from a semiconductor / LCD chemical cleaning equipment (200)

상기 세정설비(200)가 설치된 바닥면에 세정설비(200)에서 누설된 세정액의 확산을 방지하도록 설치된 보호벽과;A protection wall installed to prevent diffusion of the cleaning liquid leaked from the cleaning facility 200 to the bottom surface of the cleaning facility 200;

상기 보호벽의 내측에 충진되는 에폭시(50);를 포함하며, And an epoxy (50) filled inside the protective wall,

상기 보호벽은 내측으로 결합돌기(13)가 형성된 외벽(11)과, 상기 결합돌기(13)에 결합되면서 외벽(11)과 간격을 두고 결합되는 내벽(12)으로 이루어지고,The protective wall comprises an outer wall 11 formed with an inner coupling protrusion 13 and an inner wall 12 coupled to the outer wall 11 while being coupled to the coupling protrusion 13,

상기 에폭시(50)는 보호벽의 내측면 및 상기 외벽(11)과 내벽(12) 사이에 충진되는 것을 특징으로 하며,Characterized in that the epoxy (50) is filled between the inner surface of the protective wall and the outer wall (11) and the inner wall (12)

특히 세정설비(200)를 지지하는 지지대(211,212) 및 세정설비(200)와 연결된 관(220)이 상기 에폭시(50)와 격리되도록 지지대(211,212) 및 관(220)을 각각 수용하는 홀더(71,72,80)와;In particular, supports (211, 212) for supporting the cleaning equipment (200) and a holder (220) for holding the supports (211, 212) and the pipe (220) , 72, 80);

상기 홀더(71,72,80)의 내부에 충진되는 실리콘(60);Silicon (60) filled in the holders (71, 72, 80);

을 더 포함하여 이루어지는 것을 특징으로 하는 반도체·LCD 케미컬 세정설비의 다이크에 의해 달성된다.
And a dike of a semiconductor / LCD chemical cleaning facility.

본 발명에 의하면, According to the present invention,

본 발명에 의하면, 세정액에 의한 피해(작업환경 저해, 세정설비 부식 등)가 예방된다. 또한, 세정설비의 지지대 및 관의 분리가 용이하기 때문에 결국 세정설비의 이설이 용이하다.
According to the present invention, damage caused by the cleaning liquid (inhibition of the working environment, corrosion of the cleaning equipment, and the like) is prevented. In addition, since the supporting stand and the pipe of the washing equipment can be easily separated, it is easy to install the washing equipment.

도 1은 본 발명에 따른 다이크를 나타낸 측면도,
도 2는 도 1의 A부분 확대도,
도 3은 도 1의 B부분 확대도,
도 4는 도 1의 C-C 단면도,
도 5는 본 발명에 따른 보호벽의 조립관계도.1 is a side view showing a dike according to the present invention,
Fig. 2 is an enlarged view of a portion A in Fig. 1,
3 is an enlarged view of a portion B in Fig. 1,
4 is a cross-sectional view taken along line CC of Fig. 1,
Fig. 5 is an assembling view of a protection wall according to the present invention; Fig.

본 발명은 반도체·LCD 케미컬 세정설비(200)에서 누설된 세정액의 확산을 방지하는 다이크(100)에 있어서, 상기 세정설비(200)가 설치된 바닥면에 세정설비(200)에서 누설된 세정액의 확산을 방지하도록 설치된 보호벽과; 상기 보호벽의 내측에 충진되는 에폭시(50);를 포함하며, 상기 보호벽은 내측으로 결합돌기(13)가 형성된 외벽(11)과, 상기 결합돌기(13)에 결합되면서 외벽(11)과 간격을 두고 결합되는 내벽(12)으로 이루어지고, 상기 에폭시(50)는 보호벽의 내측면 및 상기 외벽(11)과 내벽(12) 사이에 충진되는 것을 특징으로 하는 반도체·LCD 케미컬 세정설비의 다이크에 관한 것이다.A dike (100) for preventing diffusion of a cleaning liquid leaked from a semiconductor / LCD chemical cleaning facility (200), characterized in that a diffusion of a cleaning liquid leaked from a cleaning facility (200) A protection wall installed to prevent the electric power from flowing out; The protective wall includes an outer wall 11 having an inner coupling protrusion 13 formed thereon and an outer wall 11 coupled to the coupling protrusion 13 so as to be spaced apart from the outer wall 11 Characterized in that the epoxy (50) is filled between the inner wall of the protective wall and the outer wall (11) and the inner wall (12). will be.

이와 같은 다이크(100)는 세정설비(200)를 지지하는 지지대(211,212) 및 세정설비(200)와 연결된 관(220)이 상기 에폭시(50)와 격리되도록 지지대(211,212) 및 관(220)을 각각 수용하는 홀더(71,72,80)와; 상기 홀더(71,72,80)의 내부에 충진되는 실리콘(60);을 더 포함하는 것이 바람직하다.Such a dike 100 is constructed such that the supports 211 and 212 for supporting the cleaning equipment 200 and the tubes 220 connected to the cleaning equipment 200 are supported by the supports 211 and 212 and the tube 220 so as to be separated from the epoxy 50 A holder (71, 72, 80) for accommodating the holder (71, 72, 80); And silicon (60) filled in the holders (71, 72, 80).

또한, 상기 세정설비(200)의 하부측에는 세정설비(200)에서 누설된 또는 비산된 세정액을 보호벽의 내측으로 유도하는 안내벽(90)이 더 포함될 수 있다.
In addition, the lower portion of the cleaning facility 200 may further include a guide wall 90 for guiding the cleaning liquid leaked or scattered in the cleaning facility 200 to the inside of the protection wall.

이하, 본 발명의 양호한 실시예를 도시한 첨부 도면들을 참조하여 상세히 설명한다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

다이크(100)는 세정설비(200)에서 세정액이 누설될 경우에 세정액이 퍼져나가 주변이 오염되는 것을 방지하고, 누설된 세정액을 저장 및 안전한 곳으로 배출하는 역할을 한다.The dike 100 prevents the cleaning liquid from spreading and polluting the periphery when the cleaning liquid is leaked from the cleaning facility 200, and discharges the leaked cleaning liquid to a safe place.

또한, 본 발명에 따른 다이크(100)는 세정설비(200)의 이설을 고려하여 세정설비(200)의 지지대(211,212) 및 관(220)의 분리가 용이하도록 구성되었다.The dike 100 according to the present invention is configured to facilitate separation of the supports 211 and 212 and the tube 220 of the cleaning facility 200 considering the installation of the cleaning facility 200.

이를 위한 본 발명에 따른 다이크(100)는 보호벽과, 에폭시(50)와, 홀더(71,72,80)와, 실리콘(60)과 안내벽(90)을 포함하여 구성된다.A dike 100 according to the present invention for this purpose comprises a protective wall, an epoxy 50, holders 71, 72, 80, a silicon 60 and a guide wall 90.

보호벽은 세정설비(200)가 설치된 바닥면에 세정설비(200)에서 누설된 세정액의 확산을 방지하도록 설치된 구성으로서, 도 5와 같은 조립 방식으로 도 4와 같이 설치될 수 있다. 즉, 보호벽은 내측으로 결합돌기(13,23,33,43)가 형성된 외벽(11,21,31,41)과, 상기 결합돌기(13,23,33,43)에 결합되면서 외벽(11,21,31,41)과 간격을 두고 결합되는 내벽(12,22,32,42)으로 이루어지고, 내벽(12)은 홀(12a)이 형성되어 있어 이 홀(12a)이 결합돌기(13)에 끼워짐으로써 조립된다. 이때 내벽(12)은 외벽(11)과 간격을 갖게 되며, 이 간격 사이에 에폭시(50)가 충진되어 외벽(11)과 내벽(12)이 강화된다. 한편, 외벽(11,21,31,41)은 도 4와 같이 분리형일 수 있고, 또는 도시하지는 않았지만 일체형일 수도 있다.The protection wall is installed to prevent diffusion of the cleaning liquid leaked from the cleaning facility 200 on the bottom surface provided with the cleaning facility 200, and may be installed as shown in FIG. 4 in an assembling manner as shown in FIG. That is, the protective wall has outer walls 11, 21, 31 and 41 formed with coupling projections 13, 23, 33 and 43 inwardly and outer walls 11, The inner wall 12 is formed with a hole 12a and the hole 12a is formed by the engaging projection 13, As shown in Fig. At this time, the inner wall 12 is spaced apart from the outer wall 11, and the outer wall 11 and the inner wall 12 are strengthened by filling the gap 50 with the gap. On the other hand, the outer walls 11, 21, 31, and 41 may be separate types as shown in FIG. 4, or may be integrally formed though not shown.

에폭시(50)는 상기와 같이 내벽(12)과 외벽(11) 사이에도 충진되지만, 보호벽의 내측 바닥면에도 충진되어 세정설비(200)에서 누설된 세정액이 낙하하더라도 바닥의 부식을 방지한다. 그리고 에폭시(50)는 도 1에 도시한 바와 같이 홀더(71,72,80)의 상단 보다 낮게 충진된다.The epoxy 50 is also filled between the inner wall 12 and the outer wall 11 as described above. However, the epoxy 50 is also filled on the inner bottom surface of the protection wall to prevent corrosion of the bottom even if the cleaning liquid leaked from the cleaning facility 200 falls. The epoxy 50 is filled lower than the upper ends of the holders 71, 72 and 80 as shown in Fig.

홀더(71,72,80)는 세정설비(200)를 지지하는 지지대(211,212) 및 세정설비(200)와 연결된 관(220)이 상기 에폭시(50)와 격리되도록 지지대(211,212) 및 관(220)을 각각 수용하는 구성이다. 그리고 홀더(71,72,80)의 내부에는 실리콘(60)이 충진되는데 이와 같이 구성하는 이유는 재질의 특성상 에폭시(50)에 비해 실리콘(60)이 세정설비(200) 이설시 분리하기 용이하기 때문이다.The holders 71, 72 and 80 are connected to the support bases 211 and 212 for supporting the cleaning device 200 and the support pipes 211 and 212 and the pipe 220 for isolating the pipe 220 connected to the cleaning device 200 from the epoxy 50 Respectively. Silicone 60 is filled in the holders 71, 72, and 80. The reason why the silicone 60 is filled in the holders 71, 72, and 80 is that the silicone 60 is easier to separate when the cleaning apparatus 200 is installed, Because.

한편, 세정설비(200)의 하부측에는 세정설비(200)에서 누설된 또는 비산된 세정액을 보호벽의 내측으로 유도하는 안내벽(90)이 설치되는데 이는 세정설비(200)의 세정액이 보호벽 밖으로 비산되는 것을 방지한다.
On the lower side of the cleaning facility 200, a guide wall 90 for guiding the cleaning liquid leaked or scattered from the cleaning facility 200 to the inside of the protective wall is installed. This is because the cleaning liquid of the cleaning facility 200 is scattered outside the protection wall ≪ / RTI >

이상 본 발명이 양호한 실시예와 관련하여 설명되었으나, 본 발명의 기술 분야에 속하는 자들은 본 발명의 본질적인 특성에서 벗어나지 않는 범위 내에 다양한 변경 및 수정을 용이하게 실시할 수 있을 것이다. 그러므로 개시된 실시예는 한정적인 관점이 아니라 설명적인 관점에서 고려되어야 하고, 본 발명의 진정한 범위는 전술한 설명이 아니라 특허청구범위에 나타나 있으며, 그와 동등한 범위 내에 있는 모든 차이점은 본 발명에 포함된 것으로 해석되어야 할 것이다.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications, and variations will readily occur to those skilled in the art without departing from the spirit and scope of the invention. Therefore, it should be understood that the disclosed embodiments are to be considered in an illustrative rather than a restrictive sense, and that the true scope of the invention is indicated by the appended claims rather than by the foregoing description, and all differences within the scope of equivalents thereof, .

100: 다이크
200: 세정설비
11,21,31,41: 외벽
12,22,32,42: 내벽
13,23,33,43: 결합돌기
50: 에폭시
60: 실리콘
71,72,80: 홀더
90: 안내벽100: Dyke
200: Cleaning equipment
11, 21, 31, 41:
12, 22, 32, 42:
13, 23, 33,
50: Epoxy
60: Silicone
71, 72, 80: Holder
90: guide wall

Claims (3)

반도체·LCD 케미컬 세정설비(200)에서 누설된 세정액의 확산을 방지하는 다이크(100)에 있어서,
상기 세정설비(200)가 설치된 바닥면에 세정설비(200)에서 누설된 세정액의 확산을 방지하도록 설치된 보호벽과;
상기 보호벽의 내측에 충진되는 에폭시(50)와;
상기 보호벽은 내측으로 결합돌기(13)가 형성된 외벽(11)과, 상기 결합돌기(13)에 결합되면서 외벽(11)과 간격을 두고 결합되는 내벽(12)으로 이루어지고,
상기 에폭시(50)는 보호벽의 내측면 및 상기 외벽(11)과 내벽(12) 사이에 충진되는 것을 포함하며;
상기 세정설비(200)를 지지하는 지지대(211,212) 및 세정설비(200)와 연결된 관(220)이 상기 에폭시(50)와 격리되도록 지지대(211,212) 및 관(220)을 각각 수용하는 홀더(71,72,80)와;
상기 홀더(71,72,80)의 내부에 충진되는 실리콘(60);
을 더 포함하는 것을 특징으로 하는 반도체·LCD 케미컬 세정설비의 다이크.
A dike (100) for preventing diffusion of a cleaning liquid leaked from a semiconductor / LCD chemical cleaning equipment (200)
A protection wall installed to prevent diffusion of the cleaning liquid leaked from the cleaning facility 200 to the bottom surface of the cleaning facility 200;
An epoxy 50 filled inside the protective wall;
The protective wall comprises an outer wall 11 formed with an inner coupling protrusion 13 and an inner wall 12 coupled to the outer wall 11 while being coupled to the coupling protrusion 13,
The epoxy 50 being filled between the inner side of the protective wall and the outer wall 11 and the inner wall 12;
A support table 211 for supporting the cleaning apparatus 200 and a tube 220 connected to the cleaning apparatus 200 are connected to a holder 71 for receiving the supports 211 and 212 and the tube 220 so as to be separated from the epoxy 50 , 72, 80);
Silicon (60) filled in the holders (71, 72, 80);
Further comprising: a dichroic layer of a semiconductor / LCD chemical cleaning facility.
제 1항에 있어서,
상기 세정설비(200)의 하부측에는 세정설비(200)에서 누설된 또는 비산된 세정액을 보호벽의 내측으로 유도하는 안내벽(90);
을 더 포함하여 이루어지는 것을 특징으로 하는 반도체·LCD 케미컬 세정설비의 다이크.The method according to claim 1,
At the lower side of the cleaning facility 200, a guide wall 90 for guiding the cleaning fluid leaked or scattered in the cleaning facility 200 to the inside of the protection wall;
Wherein the dies of the semiconductor / LCD chemical cleaning equipment further comprise: 삭제delete
KR1020140127334A 2014-09-24 2014-09-24 Dike for Semiconductor and LCD chemical cleaning equipment KR101615518B1 (en)

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KR102077429B1 (en) * 2019-09-02 2020-02-13 김정수 Dike for manufacturing and processing of Semiconductor·LCD
KR102128486B1 (en) * 2019-01-07 2020-07-01 (주)코맷 Chemical material leak blocking tray for electronic componet processing equipment, and installment method of chemical material leak blocking tray for electronic componet processing equipment

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US11062919B2 (en) 2019-09-02 2021-07-13 Jung Soo Kim Dike for semiconductor/LCD manufacturing and processing equipment

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