KR101602544B1 - 투과성 영역을 포함하는 연마 패드 - Google Patents

투과성 영역을 포함하는 연마 패드 Download PDF

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Publication number
KR101602544B1
KR101602544B1 KR1020137015580A KR20137015580A KR101602544B1 KR 101602544 B1 KR101602544 B1 KR 101602544B1 KR 1020137015580 A KR1020137015580 A KR 1020137015580A KR 20137015580 A KR20137015580 A KR 20137015580A KR 101602544 B1 KR101602544 B1 KR 101602544B1
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South Korea
Prior art keywords
polishing pad
translucent insert
recess
translucent
region
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Korean (ko)
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KR20130116892A (ko
Inventor
켈리 뉴엘
아바네쉬워 프라사드
Original Assignee
캐보트 마이크로일렉트로닉스 코포레이션
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
KR1020137015580A 2010-11-18 2011-11-18 투과성 영역을 포함하는 연마 패드 Active KR101602544B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US41501510P 2010-11-18 2010-11-18
US61/415,015 2010-11-18
PCT/US2011/061312 WO2012068428A2 (en) 2010-11-18 2011-11-18 Polishing pad comprising transmissive region

Publications (2)

Publication Number Publication Date
KR20130116892A KR20130116892A (ko) 2013-10-24
KR101602544B1 true KR101602544B1 (ko) 2016-03-10

Family

ID=46084662

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137015580A Active KR101602544B1 (ko) 2010-11-18 2011-11-18 투과성 영역을 포함하는 연마 패드

Country Status (8)

Country Link
US (1) US20130237136A1 (https=)
EP (1) EP2641268A4 (https=)
JP (1) JP5918254B2 (https=)
KR (1) KR101602544B1 (https=)
CN (1) CN103222034B (https=)
MY (1) MY166716A (https=)
SG (1) SG190249A1 (https=)
WO (1) WO2012068428A2 (https=)

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KR101829542B1 (ko) * 2016-07-27 2018-02-23 신우유니온(주) 손톱용 버퍼의 제조방법

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US20130205679A1 (en) * 2012-02-14 2013-08-15 Innopad, Inc. Method of manufacturing a chemical mechanical planarization pad
US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
CN106853610B (zh) * 2015-12-08 2019-11-01 中芯国际集成电路制造(北京)有限公司 抛光垫及其监测方法和监测系统
US9925637B2 (en) * 2016-08-04 2018-03-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapered poromeric polishing pad
US11325221B2 (en) * 2017-11-16 2022-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with multipurpose composite window
US11192215B2 (en) * 2017-11-16 2021-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with pad wear indicator
US11260495B2 (en) 2018-07-27 2022-03-01 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and methods for chemical mechanical polishing
JP7317440B2 (ja) * 2019-04-15 2023-07-31 株式会社ディスコ ドレッシング工具
JP7220130B2 (ja) * 2019-07-11 2023-02-09 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
US11633830B2 (en) * 2020-06-24 2023-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with uniform window
TWI855291B (zh) * 2021-01-25 2024-09-11 美商Ｃｍｃ材料有限責任公司 用於化學機械平坦化（ｃｍｐ）墊之窗及ｃｍｐ墊
KR102593117B1 (ko) * 2021-07-02 2023-10-24 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
CN117050375A (zh) * 2023-08-28 2023-11-14 东莞鑫磊研磨工业有限公司 一种基于辐射交联技术制备树脂研磨垫的方法

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JP2001110762A (ja) * 1999-10-04 2001-04-20 Asahi Kasei Corp 研磨パッド
JP2008512006A (ja) * 2004-09-01 2008-04-17 キャボット マイクロエレクトロニクス コーポレイション 微小孔性領域を有する磨きパッド
JP2008226911A (ja) * 2007-03-08 2008-09-25 Jsr Corp 化学機械研磨用パッド、化学機械研磨用積層体パッド、および化学機械研磨方法

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US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US5888120A (en) * 1997-09-29 1999-03-30 Lsi Logic Corporation Method and apparatus for chemical mechanical polishing
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6248000B1 (en) * 1998-03-24 2001-06-19 Nikon Research Corporation Of America Polishing pad thinning to optically access a semiconductor wafer surface
US6280289B1 (en) * 1998-11-02 2001-08-28 Applied Materials, Inc. Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
US6247998B1 (en) * 1999-01-25 2001-06-19 Applied Materials, Inc. Method and apparatus for determining substrate layer thickness during chemical mechanical polishing
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KR100541545B1 (ko) * 2003-06-16 2006-01-11 삼성전자주식회사 화학기계적 연마 장비의 연마 테이블
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US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
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US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
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KR100882045B1 (ko) * 2006-02-15 2009-02-09 어플라이드 머티어리얼스, 인코포레이티드 그루브형 서브패드를 구비한 폴리싱 장치
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US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
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Publication number Priority date Publication date Assignee Title
JP2001110762A (ja) * 1999-10-04 2001-04-20 Asahi Kasei Corp 研磨パッド
JP2008512006A (ja) * 2004-09-01 2008-04-17 キャボット マイクロエレクトロニクス コーポレイション 微小孔性領域を有する磨きパッド
JP2008226911A (ja) * 2007-03-08 2008-09-25 Jsr Corp 化学機械研磨用パッド、化学機械研磨用積層体パッド、および化学機械研磨方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101829542B1 (ko) * 2016-07-27 2018-02-23 신우유니온(주) 손톱용 버퍼의 제조방법

Also Published As

Publication number Publication date
WO2012068428A3 (en) 2012-08-16
US20130237136A1 (en) 2013-09-12
JP5918254B2 (ja) 2016-05-18
MY166716A (en) 2018-07-18
EP2641268A4 (en) 2017-01-25
JP2013542863A (ja) 2013-11-28
CN103222034A (zh) 2013-07-24
CN103222034B (zh) 2016-03-09
SG190249A1 (en) 2013-06-28
KR20130116892A (ko) 2013-10-24
EP2641268A2 (en) 2013-09-25
WO2012068428A2 (en) 2012-05-24

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