KR101584471B1 - 마이크로일렉트로닉 다이용 패키지, 패키지를 구비한 마이크로일렉트로닉 조립체, 마이크로일렉트로닉 시스템, 및 마이크로일렉트로닉 패키지의 다이 응력 감소 방법 - Google Patents

마이크로일렉트로닉 다이용 패키지, 패키지를 구비한 마이크로일렉트로닉 조립체, 마이크로일렉트로닉 시스템, 및 마이크로일렉트로닉 패키지의 다이 응력 감소 방법 Download PDF

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KR101584471B1
KR101584471B1 KR1020147016245A KR20147016245A KR101584471B1 KR 101584471 B1 KR101584471 B1 KR 101584471B1 KR 1020147016245 A KR1020147016245 A KR 1020147016245A KR 20147016245 A KR20147016245 A KR 20147016245A KR 101584471 B1 KR101584471 B1 KR 101584471B1
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substrate
contact
heat spreader
microelectronic
package
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KR20140094612A (ko
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데벤드라 말릭
스린드하르 나라시만
매튜 제이 마누샤로우
토마스 에이 보이드
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인텔 코포레이션
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
KR1020147016245A 2011-12-16 2011-12-16 마이크로일렉트로닉 다이용 패키지, 패키지를 구비한 마이크로일렉트로닉 조립체, 마이크로일렉트로닉 시스템, 및 마이크로일렉트로닉 패키지의 다이 응력 감소 방법 Active KR101584471B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2011/065512 WO2013089780A1 (en) 2011-12-16 2011-12-16 Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package

Publications (2)

Publication Number Publication Date
KR20140094612A KR20140094612A (ko) 2014-07-30
KR101584471B1 true KR101584471B1 (ko) 2016-01-22

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KR1020147016245A Active KR101584471B1 (ko) 2011-12-16 2011-12-16 마이크로일렉트로닉 다이용 패키지, 패키지를 구비한 마이크로일렉트로닉 조립체, 마이크로일렉트로닉 시스템, 및 마이크로일렉트로닉 패키지의 다이 응력 감소 방법

Country Status (5)

Country Link
US (1) US9478476B2 (https=)
KR (1) KR101584471B1 (https=)
CN (1) CN103999215B (https=)
IN (1) IN2014CN03370A (https=)
WO (1) WO2013089780A1 (https=)

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US8728872B2 (en) * 2011-08-18 2014-05-20 DY 4 Systems, Inc. Manufacturing process and heat dissipating device for forming interface for electronic component
US9478476B2 (en) 2011-12-16 2016-10-25 Intel Corporation Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package
KR101983142B1 (ko) * 2013-06-28 2019-08-28 삼성전기주식회사 반도체 패키지
FR3012670A1 (fr) * 2013-10-30 2015-05-01 St Microelectronics Grenoble 2 Systeme electronique comprenant des dispositifs electroniques empiles munis de puces de circuits integres
KR20150072846A (ko) * 2013-12-20 2015-06-30 삼성전기주식회사 반도체 패키지 모듈
US9892990B1 (en) * 2014-07-24 2018-02-13 Amkor Technology, Inc. Semiconductor package lid thermal interface material standoffs
WO2016099572A1 (en) * 2014-12-20 2016-06-23 Intel Corporation Solder contacts for socket assemblies
JP2016225413A (ja) * 2015-05-28 2016-12-28 株式会社ジェイテクト 半導体モジュール
KR102647213B1 (ko) 2016-12-31 2024-03-15 인텔 코포레이션 전자 디바이스 패키지
US9899305B1 (en) * 2017-04-28 2018-02-20 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor package structure
US10424527B2 (en) * 2017-11-14 2019-09-24 International Business Machines Corporation Electronic package with tapered pedestal
US11282762B2 (en) 2019-02-08 2022-03-22 Marvell Asia Pte, Ltd. Heat sink design for flip chip ball grid array
US11195779B2 (en) * 2019-08-09 2021-12-07 Raytheon Company Electronic module for motherboard
US11948855B1 (en) 2019-09-27 2024-04-02 Rockwell Collins, Inc. Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader
US11158596B2 (en) 2020-03-20 2021-10-26 Advanced Semiconductor Engineering, Inc. Semiconductor device package comprising power module and passive elements
JP7528557B2 (ja) * 2020-06-19 2024-08-06 日本電気株式会社 量子デバイス及びその製造方法
US12183650B2 (en) 2020-12-22 2024-12-31 Intel Corporation Heat extraction path from a laser die using a highly conductive thermal interface material in an optical transceiver
US12061371B2 (en) 2020-12-22 2024-08-13 Intel Corporation Patch on interposer architecture for low cost optical co-packaging
US20220291462A1 (en) * 2021-03-11 2022-09-15 Intel Corporation Method to couple light using integrated heat spreader
US12500134B2 (en) * 2021-07-09 2025-12-16 Taiwan Semiconductor Manufacturing Company Limited Package assembly including a package lid having a step region and method of making the same
US12362245B2 (en) * 2021-07-15 2025-07-15 Taiwan Semiconductor Manufacturing Company Limited Package assembly including a package lid having an inner foot and methods of making the same
CN114823549B (zh) * 2022-06-27 2022-11-11 北京升宇科技有限公司 一种纵向场效应晶体管vdmos芯片的封装结构及封装方法
US20250096071A1 (en) * 2023-09-15 2025-03-20 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit cooling systems and methods
CN118335763B (zh) * 2024-06-12 2024-10-25 甬矽电子(宁波)股份有限公司 传感器封装结构和传感器封装制作方法

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US20040190259A1 (en) * 2003-03-31 2004-09-30 Nick Labanok Integrated heat spreader with downset edge, and method of making same
US20100044856A1 (en) * 2008-08-19 2010-02-25 International Business Machines Corporation Electronic package with a thermal interposer and method of manufacturing the same

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US6229216B1 (en) * 1999-01-11 2001-05-08 Intel Corporation Silicon interposer and multi-chip-module (MCM) with through substrate vias
US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
US7462506B2 (en) * 2006-06-15 2008-12-09 International Business Machines Corporation Carbon dioxide gettering method for a chip module assembly
US7429792B2 (en) 2006-06-29 2008-09-30 Hynix Semiconductor Inc. Stack package with vertically formed heat sink
US9478476B2 (en) 2011-12-16 2016-10-25 Intel Corporation Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package

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Publication number Priority date Publication date Assignee Title
US20040190259A1 (en) * 2003-03-31 2004-09-30 Nick Labanok Integrated heat spreader with downset edge, and method of making same
US20100044856A1 (en) * 2008-08-19 2010-02-25 International Business Machines Corporation Electronic package with a thermal interposer and method of manufacturing the same

Also Published As

Publication number Publication date
US9478476B2 (en) 2016-10-25
US20130270691A1 (en) 2013-10-17
IN2014CN03370A (https=) 2015-07-03
CN103999215B (zh) 2017-06-13
KR20140094612A (ko) 2014-07-30
WO2013089780A1 (en) 2013-06-20
CN103999215A (zh) 2014-08-20

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