KR101570531B1 - organic light emitting display - Google Patents

Abstract

An embodiment of the present invention is a display device comprising: a first substrate including a sealing region and a display region; A display unit disposed on the first substrate and including a plurality of subpixels formed in a display region; A solid phase film layer positioned on the first substrate so as to cover both the display region and the sealing region; And an adhesive member formed on a sealing region located on the first substrate and sealing the first substrate and the second substrate.

Organic electroluminescent display, curing, sealing

Description

[0001] The present invention relates to an organic light emitting display,

The present invention relates to an organic light emitting display.

An organic electroluminescent device used in an organic electroluminescent display device is a self-luminous device in which a light emitting layer is formed between two electrodes.

The organic light emitting display device may include a top emission type, a bottom emission type, and a dual emission type depending on a direction in which light is emitted. And passive matrix and active matrix according to the driving method.

In such an organic light emitting display, when a scan signal, a data signal, a power supply, and the like are supplied to a plurality of subpixels arranged in a matrix form, the selected subpixel emits light, thereby displaying an image.

On the other hand, the organic electroluminescent display device can be easily deteriorated by various factors such as moisture, oxygen, and manufacturing conditions of the device, which are permeated from the outside. Particularly, since oxygen and moisture permeated from the outside have a serious effect on the lifetime of the device, the process of sealing the organic light emitting display is very important.

Conventionally, a sealing substrate and an adhesive member are used to seal the organic light emitting display, or a moisture absorbent or the like is inserted between the sealing substrate and the sealing substrate. However, there is a need for an alternative solution to this problem, since it is impossible to shut off the path of moisture or oxygen from the outside. In addition, in the conventional organic light emitting display device, when an impact is applied to the panel by an external pressure, a moisture absorbing agent is pressed against the device and an impact is applied thereto.

An embodiment of the present invention for solving the problems of the background art described above is an organic electroluminescent display device capable of protecting an element from moisture or oxygen penetrated from the outside to improve a lifetime of the element, Device.

According to an embodiment of the present invention, there is provided a display device comprising: a first substrate including a sealing region and a display region; A display unit disposed on the first substrate and including a plurality of subpixels formed in a display region; A solid phase film layer positioned on the first substrate so as to cover both the display region and the sealing region; And an adhesive member formed on a sealing region located on the first substrate and sealing the first substrate and the second substrate.

The solid phase film layer may be composed of a thermosetting material and a photocurable material.

The thermosetting material may be located in a region corresponding to the display region, and the photocurable material may be located in a region corresponding to the sealing region.

The first substrate may include one or more protrusions positioned within the sealing region.

And a moisture absorbing member positioned between the first substrate and the second substrate.

According to another aspect of the present invention, there is provided a display device comprising: a first substrate including a sealing region and a display region; A display unit disposed on the first substrate and including a plurality of subpixels formed in a display region; A solid phase film layer disposed on the first substrate so as to cover all of the display region and to cover a part of the sealing region; And an adhesive member formed on a sealing region located on the first substrate and sealing the first substrate and the second substrate.

The solid phase film layer is made of a thermosetting material and a photocurable material, the thermosetting material is located in a region corresponding to the display region, and the photocurable material can be located in a region corresponding to the sealing region.

The first substrate may include one or more protrusions positioned within the sealing region.

The protruding portion may be located on the outer side of the solid-phase film layer.

And a moisture absorbing member positioned between the first substrate and the second substrate.

An embodiment of the present invention provides an organic electroluminescent display device capable of protecting an element from moisture or oxygen penetrated from the outside to improve the lifetime of the element and protecting the element from external pressure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a plan view of an organic light emitting display device according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the region A1-A1 shown in FIG.

1 and 2, an organic light emitting display according to a first embodiment of the present invention includes a first substrate 110 including a sealing region SL and a display region AA, A display section 130 including a plurality of subpixels formed in a display area AA positioned on the first substrate 110 so as to cover the display area AA and the sealing area SL; And a sealing member 160 formed on the sealing region SL positioned on the first substrate 110 and sealing the first and second substrates 110 and 150, .

As the material of the first substrate 110 and the second substrate 150, glass, metal, ceramic or plastic (polycarbonate resin, acrylic resin, vinyl chloride resin, polyethylene terephthalate resin, polyimide resin, Epoxy resin, silicone resin, fluorine resin, etc.).

The display unit 130 may be formed on the display area AA located on the first substrate 110 and may include a plurality of subpixels arranged in a matrix form.

The solid film layer 140 may be made of a thermosetting material and a photocurable material and is positioned on the first substrate 110 so as to cover both the display area AA and the sealing area SL.

The adhesive member 160 may be made of a photo-curable material to seal the first substrate 110 and the second substrate 150.

A moisture absorbing member 170 may be disposed between the first substrate 110 and the second substrate 150. The moisture absorption member 170 may be located on the inner surface of the second substrate 150 facing the display unit 130 or on the solid film layer 140. The moisture absorbing member 170 may use one of a film form, a liquid form or a powder form.

Hereinafter, an example of a subpixel will be shown and described.

3 is a cross-sectional exemplary view of a subpixel.

As shown in FIG. 3, the buffer layer 111 may be positioned on the first substrate 110. The buffer layer 111 may be formed to protect a thin film transistor formed in a subsequent process from an impurity such as an alkali ion or the like that flows out from the first substrate 110. The buffer layer 111 may be made of silicon oxide (SiOx), silicon nitride (SiNx), or the like.

A gate 112 may be located on the buffer layer 111. The gate 112 is formed of any one selected from the group consisting of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper Or an alloy thereof. The gate 112 may be formed of a material selected from the group consisting of Mo, Al, Cr, Au, Ti, Ni, And may be a multilayer composed of any one selected or an alloy thereof. Also, the gate 112 may be a double layer of molybdenum / aluminum-neodymium or molybdenum / aluminum.

The first insulating layer 113 may be located on the gate 112. The first insulating layer 113 may be silicon oxide (SiOx), silicon nitride (SiNx), or a multilayer thereof, but is not limited thereto.

The active layer 114 may be located on the first insulating layer 113. The active layer 114 may comprise amorphous silicon or polycrystalline silicon crystallized therefrom. Although not shown here, the active layer 114 may include a channel region, a source region, and a drain region, and the source region and the drain region may be doped with P-type or N-type impurities. In addition, the active layer 114 may include an ohmic contact layer for lowering the contact resistance.

On the active layer 114, the source 115a and the drain 115b may be positioned. The source 115a and the drain 115b may be formed of a single layer or multiple layers and may be formed of a single layer of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). When the source 115a and the drain 115b are multilayered, they may be formed of a triple layer of molybdenum / aluminum-neodymium, molybdenum / aluminum / molybdenum, or molybdenum / aluminum-neodymium / molybdenum.

The second insulating film 116a may be located on the source 115a and the drain 115b. The second insulating layer 116a may be silicon oxide (SiOx), silicon nitride (SiNx), or a multilayer thereof, but is not limited thereto.

One of the source 115a and the drain 115b is located on the second insulating film 116a and may be connected to a shield metal 118 for preventing interference between the source 115a and the drain 115b.

A third insulating layer 116b may be formed on the second insulating layer 116a to increase the flatness. The third insulating film 116b may include an organic material such as polyimide.

In the above description, the transistor formed on the first substrate 110 is of the Bam gate type. However, the transistor formed on the first substrate 110 can be formed not only as a totem gate type but also as a top gate type.

A lower electrode 117 connected to the source 115a or the drain 115b may be positioned on the third insulating film 116b of the transistor. The lower electrode 117 may be selected as an anode or a cathode. When the lower electrode 117 is selected as the anode, the anode may be formed of any one of ITO (Indium Tin Oxide), IZO (Indium Tin Zinc Oxide), ITZO (Indium Tin Zinc Oxide), and AZO (Zno doped Al2O3) But are not limited thereto.

On the lower electrode 117, a bank layer 119 having an opening exposing a part of the lower electrode 117 may be positioned. The bank layer 119 may include an organic material such as a benzocyclobutene (BCB) resin, an acrylic resin, or a polyimide resin.

The organic light emitting layer 121 may be positioned on the lower electrode 117. The organic light emitting layer 121 may be formed to emit light of any one of red, green, and blue depending on subpixels.

The upper electrode 122 may be located on the organic light emitting layer 121. The upper electrode 122 may be selected as a cathode or an anode. When the cathode is selected, the material of the cathode may be any one of aluminum (Al), aluminum alloy (Al alloy), and aluminum nitride (AlNd), but is not limited thereto.

The cross-sectional structure of the subpixel shown in FIG. 3 is only intended to illustrate an example of the embodiment, but the present invention is not limited thereto.

Hereinafter, an organic light emitting diode (OLED) including the organic light emitting layer 121 will be described in more detail with reference to FIG. However, an example will be described in which the lower electrode 117 is selected as the anode and the upper electrode 122 is selected as the cathode.

4 is a view showing an example of a hierarchical structure of an organic light emitting diode.

4, the organic light emitting diode includes a lower electrode 117, a hole injecting layer 121a, a hole transporting layer 121b, a light emitting layer 121c, an electron transporting layer 121d, , An electron injection layer (121e), and an upper electrode (122).

The hole injection layer 121a may serve to smooth the injection of holes and may be formed of a material such as cupper phthalocyanine, PEDOT (poly (3,4) -ethylenedioxythiophene), PANI (polyaniline) and NPD (N, -N, N'-diphenyl benzidine), but the present invention is not limited thereto.

The hole transport layer 121b plays a role of facilitating the transport of holes and includes a hole transporting material such as NPD (N, N-dinaphthyl-N, N'-diphenyl benzidine), TPD (N, N'- , N'-bis- (phenyl) -benzidine), s-TAD and MTDATA (4,4 ', 4 "-tris (N-3-methylphenyl-N-phenylamino) But is not limited thereto.

The light emitting layer 121c may include a material that emits red, green, blue, and white light, and may be formed using phosphorescent or fluorescent materials.

When the light-emitting layer 121c is red, it contains a host material including CBP (carbazole biphenyl) or mCP (1,3-bis (carbazol-9-yl) wherein the dopant comprises at least one selected from the group consisting of iridium, iridium, PQIr (acac) (bis (1-phenylquinoline) acetylacetonate iridium), PQIr (tris (1-phenylquinoline) iridium) and PtOEP (octaethylporphyrin platinum) Or PBD: Eu (DBM) 3 (Phen) or Perylene. However, the present invention is not limited thereto.

When the light emitting layer 121c is green, it may be made of a phosphorescent material including a dopant material including a host material including CBP or mCP and containing Ir (ppy) 3 (fac tris (2-phenylpyridine) iridium) Alternatively, it may be made of a fluorescent material including Alq3 (tris (8-hydroxyquinolino) aluminum), but is not limited thereto.

When the light emitting layer 121c is blue, it may include a host material including CBP or mCP, and may include a phosphorescent material including a dopant material including (4,6-F2ppy) 2Irpic. Alternatively, the fluorescent material may include any one selected from the group consisting of spiro-DPVBi, spiro-6P, distyrylbenzene (DSB), distyrylarylene (DSA), PFO polymer, and PPV polymer. It is not limited.

The electron transporting layer 121d serves to smooth the transport of electrons and may be made of any one or more selected from the group consisting of Alq3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq and SAlq But is not limited thereto.

The electron injection layer 121 e may be used to facilitate the injection of electrons and may include Alq 3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq or SAlq.

Here, the embodiment of the present invention is not limited to FIG. 4, and at least one of the hole injection layer 121a, the hole transport layer 121b, the electron transport layer 121d, and the electron injection layer 121e may be omitted .

Hereinafter, the solid film layer will be described.

5 is a plan view of a solid film layer.

Referring to FIG. 5, the solid film layer 140 may be made of a thermosetting material and a photocurable material. The thermosetting material may be located in a region corresponding to the display region AA and the photocurable material may be located in a region corresponding to the sealing region SL. Thus, the solid film layer 140 includes a first solid film layer 140a region formed of a thermosetting material and a second solid film layer 140b formed of a photocurable material. Here, it is advantageous that the thickness of the solid film layer 140 is in the range of 10 mu m to 20 mu m so that the total thickness including the adhesive member 160 formed in the sealing region SL does not exceed 50 mu m.

Since the solid film layer 140 is made of a thermosetting material and a photocurable material, when the first substrate 110 and the second substrate 150 are sealed, the region of the first solid film layer 140a is thermally cured And the second solid film layer 140b can be photo-cured.

By using the solid phase film layer 140 having such a structure, it is possible to narrow the moisture permeation path in which moisture or oxygen permeates from the outside, thereby protecting the element from the outside air. Even if the first substrate 110 or the second substrate 150 is impacted by external pressure, since the solid film layer 140 can protect the display unit 130, the contact of the moisture absorption member 170, It is possible to prevent a problem that a display failure occurs due to the presence of the liquid crystal.

Hereinafter, a method of forming the solid phase film layer 140 on the first substrate 110 will be described.

6 is a view showing a method of forming a solid phase film layer on a mother substrate.

Referring to Fig. 6, a mother substrate MS in which cells including a plurality of display portions are arranged is shown. A pad portion 180 electrically connected to a display portion included in the cell is located in a cell disposed on the mother substrate MS. A solid film layer 140 is formed on the mother substrate MS one by one so as to cover the display portion of each cell. When the solid phase film layer 140 is formed on the mother substrate MS in this manner, the solid phase film layer 140 is easily aligned. Further, the mother substrate MS can be cut along the scribing line SC, and the sealing process can be performed, thereby facilitating the operation.

Hereinafter, various embodiments of the present invention will be described.

7 is a partial cross-sectional view of an organic light emitting display according to a second embodiment of the present invention.

7, the organic light emitting display according to the second exemplary embodiment of the present invention includes a first substrate 210 including a sealing region SL and a display region AA, A plurality of sub-pixels formed on the first substrate 210 so as to cover both the display area AA and the sealing area SL; A film layer 240 and an adhesive member 260 formed on the sealing region SL positioned on the first substrate 210 and sealing the first substrate 210 and the second substrate 250 have.

The first substrate 210 may include one or more protrusions 220 located within the sealing region SL.

The organic light emitting display device according to the second embodiment of the present invention can narrow the moisture permeation path and effectively protect the device from the outside air. In the structure of the second embodiment, a moisture absorbing member 270 may be formed between the first substrate 210 and the second substrate 250 to absorb moisture or oxygen.

8 is a partial cross-sectional view of an organic light emitting display according to a third embodiment of the present invention.

8, the organic light emitting display according to the third exemplary embodiment of the present invention includes a first substrate 310 including a sealing region SL and a display region AA, A display section 330 including a plurality of subpixels formed in a display area AA positioned on the first substrate 310 so as to cover the display area AA and a part of the sealing area SL, An adhesive member 360 formed on the sealing region SL positioned on the first substrate 310 and sealing the first substrate 310 and the second substrate 350, . ≪ / RTI >

The third embodiment of the present invention differs from the first and second embodiments in that a solid film layer 340 covers the display area AA and covers a part of the sealing area SL, As shown in FIG.

The organic light emitting display device according to the third embodiment of the present invention can narrow the moisture permeation path and effectively protect the device from the outside air. In the structure of the third embodiment, a moisture absorbing member 370 may be formed between the first substrate 310 and the second substrate 350 to absorb moisture or oxygen.

9 is a partial cross-sectional view of an organic light emitting display according to a fourth embodiment of the present invention.

9, an organic light emitting display according to a fourth exemplary embodiment of the present invention includes a first substrate 410 including a sealing region SL and a display region AA, A display section 430 including a plurality of sub pixels formed in a display area AA positioned on the first substrate 410 so as to cover the display area AA and a part of the sealing area SL, And a sealing member 460 formed on the sealing region SL positioned on the first substrate 410 and sealing the first substrate 410 and the second substrate 450 .

The fourth embodiment of the present invention differs from the first and second embodiments in that a solid film layer 440 covers the entire display area AA and covers a part of the sealing area SL, As shown in FIG. And one or more protrusions 420 positioned on the first substrate 410 to be positioned within the sealing region SL. Here, the protrusion 420 may be located outside the solid-phase film layer 440.

The organic light emitting display device according to the fourth embodiment of the present invention can narrow the moisture permeation path and effectively protect the device from the outside air. Also in the structure of the fourth embodiment, a moisture absorbing member 470 may be formed between the first substrate 410 and the second substrate 450 to absorb moisture or oxygen.

As described above, the embodiment of the present invention provides an organic electroluminescent display device capable of protecting the device from moisture or oxygen penetrated from the outside, thereby improving the lifetime of the device and protecting the device from external pressure. Further, in the embodiment of the present invention, it is possible to design the internal cavity to be minimized, so that the processing cost of the sealing substrate can be reduced and slimness can be achieved.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. In addition, the scope of the present invention is indicated by the following claims rather than the detailed description. Also, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

1 is a plan view of an organic light emitting display device according to a first embodiment of the present invention.

2 is a sectional view of the region A1-A1 shown in Fig.

3 is a cross-sectional exemplary view of a subpixel.

Fig. 4 is an example of a hierarchical structure of an organic light emitting diode. Fig.

5 is a plan view of a solid film layer;

6 is a view showing a method of forming a solid phase film layer on a mother substrate.

7 is a partial cross-sectional view of an organic light emitting display according to a second embodiment of the present invention.

8 is a partial cross-sectional view of an organic light emitting display device according to a third embodiment of the present invention.

9 is a partial cross-sectional view of an organic light emitting display according to a fourth embodiment of the present invention.

DESCRIPTION OF THE REFERENCE NUMERALS

110, 210, 310, 410: a first substrate 130, 230,

140, 240, 340, 440: solid phase film layers 150, 250, 350, 450:

160, 260, 360, and 460: Adhesive members 170, 270,

Claims (10)

A first substrate including a sealing region and a display region; A display unit located on the first substrate and including a plurality of sub-pixels formed in the display region; A solid phase film layer disposed on the first substrate so as to cover both the display region and the sealing region; And And an adhesive member formed in the sealing region located on the first substrate and sealing the first substrate and the second substrate, Wherein the solid phase film layer is made of a thermosetting material and a photocurable material, The thermosetting material is located in a region corresponding to the display region, Wherein the photocurable material is located in a region corresponding to the sealing region. delete delete The method according to claim 1, Wherein the first substrate comprises: And one or more protrusions positioned within the sealing region. The method according to claim 1, And a moisture absorption member positioned between the first substrate and the second substrate. A first substrate including a sealing region and a display region; A display unit located on the first substrate and including a plurality of sub-pixels formed in the display region; A solid phase film layer covering all of the display area and located on the first substrate so as to cover a part of the sealing area; And And an adhesive member formed in the sealing region located on the first substrate and sealing the first substrate and the second substrate. The method according to claim 6, Wherein the solid phase film layer comprises: A thermosetting material and a photocurable material, The thermosetting material is located in a region corresponding to the display region, Wherein the photocurable material is located in a region corresponding to the sealing region. 8. The method of claim 7, Wherein the first substrate comprises: And one or more protrusions positioned within the sealing region. 9. The method of claim 8, The projection Wherein the organic layer is located outside the solid-state film layer. The method according to claim 6, And a moisture absorption member positioned between the first substrate and the second substrate.

Images