KR101596965B1 - Organic Light Emitting Display Device - Google Patents

Abstract

The present invention relates to a display panel, A thermal diffusion layer positioned on the non-display surface of the display panel; And a metal layer located on one side of the thermal diffusion layer.

Organic electroluminescence display device, metal, thermal diffusion

Description

[0001] The present invention relates to an organic light emitting display device,

The present invention relates to an organic light emitting display.

As the information technology is developed, the market of display devices, which is a connection medium between users and information, is getting larger. Accordingly, a flat panel display (FPD) such as a liquid crystal display (LCD), an organic light emitting diode (OLED), and a plasma display panel (PDP) Usage is increasing.

An organic light emitting display device belonging to a part of a flat panel display uses a self light emitting type device which emits light when an electric current flows through an organic light emitting layer positioned between two electrodes. The organic electroluminescent display device has a faster response characteristic and flexibility than the liquid crystal display device. Thus, organic electroluminescent display devices are also being used in a variety of applications in the field of consumer electronics such as television (TV) and video, and in industrial fields such as computers such as notebook computers and cellular phones.

In order to use the organic light emitting display device in various fields, EMI (Electro Magnetic Interference) condition must be satisfied. EMI is defined as "the reception of an electromagnetic signal desired by an unwanted electromagnetic signal or electromagnetic noise is disturbed ". Conventional organic light emitting display devices use a capacitor or a ferrite chip bead in a circuit formed on a flexible circuit board (PCB) to improve EMI. In the case of organic electroluminescent display devices, as the fields to be applied with other display devices are becoming wider, there is a tendency to become larger and larger. As a result, not only EMI but also heat dissipation caused by driving is emerging. This is the way to go.

SUMMARY OF THE INVENTION [0008] The present invention is directed to solve the problems of the related art described above, and it is an object of the present invention to provide an organic light emitting display in which a multi-purpose heat radiation sheet capable of simultaneously solving EMI and heat dissipation while maintaining a modular form is formed.

According to the present invention, there is provided a display panel comprising: a display panel; A thermal diffusion layer positioned on the non-display surface of the display panel; And a metal layer located on one side of the thermal diffusion layer.

According to another aspect of the present invention, there is provided a display device comprising: a display panel; A metal layer positioned on a non-display surface of the display panel; And a thermal diffusion layer disposed on one surface of the metal layer.

The metal layer may have a net shape in some areas.

The metal layer may include a frame region formed corresponding to an outer region of the display panel and a net region formed in a net shape within the frame region.

The metal layer may include a wiring portion connected to the ground wiring.

And a protective layer located on one side of the metal layer.

The protective layer may cover the metal layer and the thermal diffusion layer.

And a protective layer located on one side of the thermal diffusion layer.

The protective layer may cover the thermal diffusion layer and the metal layer.

The protective layer may comprise a porous material.

The present invention provides an organic electroluminescent display device capable of simultaneously solving EMI and heat dissipation while maintaining a modular form by attaching a multi-purpose heat-radiating sheet to a non-display surface of a display panel.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

≪ Embodiment 1 >

FIG. 1 is a plan view of an organic light emitting display according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of the region A1-A2 shown in FIG. 1, 5 is a plan view of the heat-radiating sheet shown in Fig. 5, and Fig. 8 is a schematic view of a module having a heat- Fig.

1 to 4, an organic light emitting display according to a first embodiment of the present invention includes a substrate 110a having a display area AA defined by sub-pixels SP formed in a matrix, And a sealing substrate 110b for protecting the sub-pixels SP formed on the substrate 110a from moisture or oxygen. The display panel 110 is a top emission type in which light is emitted toward the sealing substrate 110b.

The subpixels SP are formed into a passive matrix or an active matrix. When the subpixels SP are formed in the active matrix type, they may be formed of a 2T (Capacitor) structure including a switching transistor, a driving transistor, a capacitor, and an organic light emitting diode, or a structure in which transistors and capacitors are further added . Hereinafter, the structure of subpixels will be described in more detail.

As shown in FIG. 3, a buffer layer 111 is disposed on the substrate 110a. The buffer layer 111 may be formed to protect a thin film transistor formed in a subsequent process from an impurity such as an alkali ion or the like, which flows out from the substrate 110a.

The buffer layer 111 may be made of silicon oxide (SiOx), silicon nitride (SiNx), or the like. A gate electrode 112 is located on the buffer layer 111.

The gate electrode 112 is formed of a material selected from the group consisting of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper And may be formed of a single layer or a multilayer composed of any one or an alloy thereof.

A first insulating film 113 is located on the gate electrode 112. The first insulating layer 113 may be a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or a multilayer thereof, but is not limited thereto.

An active layer 114 is located on the first insulating film 113. The active layer 114 may comprise amorphous silicon or polycrystalline silicon crystallized therefrom. Although not shown here, the active layer 114 may include a channel region, a source region, and a drain region, and the source region and the drain region may be doped with P-type or N-type impurities. In addition, the active layer 114 may include an ohmic contact layer for lowering the contact resistance.

On the active layer 114, a source electrode 115a and a drain electrode 115b are located. The source electrode 115a and the drain electrode 115b may be formed of a single layer or multiple layers and may be formed of a single layer of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). Alternatively, when the source electrode 115a and the drain electrode 115b are multilayered, they may be formed of a triple layer of molybdenum / aluminum-neodymium, molybdenum / aluminum / molybdenum or molybdenum / aluminum-neodymium / molybdenum.

A second insulating film 116 is disposed on the source electrode 115a and the drain electrode 115b. The second insulating film 116 may be a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a multilayer thereof, but is not limited thereto. The second insulating film 116 may be a passivation film.

A third insulating film 117 is formed on the second insulating film 116. The third insulating film 117 may be a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a multilayer thereof, but is not limited thereto. The third insulating film 117 may be a planarizing film.

The above is a description of a totem gate type driving transistor located on the substrate 110a. Hereinafter, the organic light emitting diode positioned on the driving transistor will be described.

A first electrode 119 is located on the third insulating film 117. The first electrode 119 may be selected as an anode or a cathode. The first electrode 119 selected as the anode may be a transparent material such as indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited thereto.

On the first electrode 119, a bank layer 120 having an opening exposing a part of the first electrode 119 is positioned. The bank layer 120 may include organic materials such as benzocyclobutene (BCB) resin, acrylic resin or polyimide resin, but is not limited thereto.

The organic light emitting layer 121 is located in the opening of the bank layer 120. The organic light emitting layer 121 includes a hole injection layer 121a, a hole transport layer 121b, a light emitting layer 121c, an electron transport layer 121d and an electron injection layer 121e as shown in FIG.

The hole injection layer 121a may serve to smooth the injection of holes and may be formed of a material such as cupper phthalocyanine, PEDOT (poly (3,4) -ethylenedioxythiophene), PANI (polyaniline) and NPD (N, -N, N'-diphenyl benzidine), but the present invention is not limited thereto.

The hole transport layer 121b serves to smooth the transport of holes and may include NPD (or NPB) (N, N-dinaphthyl-N, N'-diphenyl benzidine), TPD methylphenyl-N, N'-bis- (phenyl) -benzidine), s-TAD and MTDATA (4,4 ', 4 " But the present invention is not limited thereto.

The light emitting layer 121c includes a host and a dopant. The light emitting layer 121c may include a material that emits red, green, blue, and white light, and may be formed using phosphorescent or fluorescent materials. When the light emitting layer 121c emits red light, it includes a host material containing CBP (carbazole biphenyl) or mCP (1,3-bis (carbazol-9-yl), and PIQIr (acac) (bis (1-phenylisoquinoline ) acetylacetonate iridium, PQIr acac bis (1-phenylquinoline) acetylacetonate iridium, PQIr (tris (1-phenylquinoline) iridium) and PtOEP (octaethylporphyrin platinum) (DBM) 3 (Phen) or perylene. Alternatively, when the light emitting layer 121c emits green light, the light emitting layer 121c may be formed of CBP or mCP And a phosphorescent material including a dopant material including Ir (ppy) 3 (fac tris (2-phenylpyridine) iridium), and alternatively, Alq3 (tris (8-hydroxyquinolino) aluminum) may be used as the fluorescent material But not limited thereto. When the light emitting layer 121c emits blue light, it may be made of a phosphorescent material containing a dopant material including (4,6-F2ppy) 2Irpic, including a host material including CBP or mCP Alternatively, it may be made of a fluorescent material containing any one selected from the group consisting of spiro-DPVBi, spiro-6P, distyrylbenzene (DSB), distyrylarylene (DSA), PFO- But are not limited thereto.

The electron transporting layer 121d serves to smooth the transport of electrons and may be made of any one or more selected from the group consisting of Alq3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq and SAlq But are not limited thereto.

The electron injecting layer 121 e may function to facilitate the injection of electrons and may include but not be limited to Alq 3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, LiF, spiro-PBD, BAlq or SAlq . The embodiment of the present invention is not limited to FIG. 4, and at least one of the hole injection layer 121a, the hole transport layer 121b, the electron transport layer 121d, and the electron injection layer 121e may be omitted.

A second electrode 122 is located on the organic light emitting layer 121. The second electrode 122 may be selected as a cathode or an anode. The second electrode 122 selected as the cathode may be aluminum (Al) or the like, but is not limited thereto.

The substrate 110a and the sealing substrate 110b constituting the display panel 110 are integrally sealed by the adhesive member 140 formed in the non-display area NA located outside the display area AA. However, the sealing substrate 110b may be sealed by a multi-protective film composed of an organic, inorganic, or organic composite material. The organic light emitting display includes a pad portion 160 formed on an outer periphery of a substrate 110a so as to receive various signals or power from the outside and a driving unit 150 composed of a single chip, ) Are driven. Although the driving device 150 includes the data driving unit and the scan driving unit, the driving unit 150 may be divided into the non-display area NA in the case of the scan driving unit.

A heat radiation sheet 170 including an adhesive layer 171, a thermal diffusion layer 173, a metal layer 175 and a protective layer 177 is attached to the non-display surface of the display panel 110. The heat-radiating sheet 170 may be formed on one surface of the substrate 110a, which is a non-display surface of the display panel 110, by any one of coating, vapor deposition, and laminating, but is not limited thereto.

The adhesive layer 171 may be formed of a double-sided adhesive, an adhesive tape, an isotropic or anisotropic conductive adhesive, or the like, but is not limited thereto. The thermal diffusion layer 173 may be formed of a carbon-based or polymer composite material such as graphite, but is not limited thereto. The metal layer 175 may be formed of a material that is formed by plating, thermal vapor deposition, or sputtering with at least one of copper, platinum, rhodium, aluminum, iron, cobalt, nickel, zinc, ruthenium, palladium, tin, tungsten, But the present invention is not limited thereto. The protective layer 177 may be formed of a resin, an inorganic material, or a porous material, but is not limited thereto.

In the case of the protective layer 177, the metal layer 175 and the thermal diffusion layer 173, which are formed to cover the metal layer 175 and the thermal diffusion layer 173, And the adhesive layer 171. Meanwhile, when the protective layer 177 is formed of a porous material, the groove H is formed as shown in FIG. 5, so that the heat releasing function from the metal layer 175 can be enhanced.

In the case of the metal layer 175, as shown in Figs. 6 and 7, some regions are formed in a net shape. The metal layer 175 may include a frame region 175a formed to correspond to an outer region of the display panel 110 and a net region 175b formed in a net shape within the frame region 175a. The metal layer 175 may include a wiring portion 176 extending from the frame region 175a or the mesh region 175b and connected to the ground wiring as shown in Fig.

Referring to FIG. 8, a schematic side view of the module to which the heat-radiating sheet 170 described above is attached is shown. In the embodiment of FIG. 8, the wiring portion 176 included in the heat radiation sheet 170 is connected to the ground wiring of the external substrate 190 by way of example. The wiring portion 176 included in the heat radiation sheet 170 is connected to the ground wiring of the display panel 110 or the ground wiring of the flexible circuit board 180 connecting between the display panel 110 and the external substrate 190 Lt; / RTI >

The heat dissipation sheet 170 described above can diffuse and emit heat generated in the display panel 110 by the thermal diffusion layer 173 and the metal layer 175 and can shield EMI (Electro Magnetic Interference) .

≪ Embodiment 2 >

FIG. 9 is a cross-sectional view of an organic light emitting display device according to a second embodiment of the present invention, and FIG. 10 is a cross-sectional view of a heat dissipation sheet.

9 and 10, an organic light emitting display according to a second exemplary embodiment of the present invention includes a substrate 110a having a display area AA defined by sub-pixels formed in the form of a matrix, And a sealing substrate 110b for protecting the sub-pixels formed on the substrate 110 from moisture or oxygen. The display panel 110 is a bottom emission type emitting light toward the substrate 110a. The substrate 110a and the sealing substrate 110b constituting the display panel 110 are integrally sealed by the adhesive member 140 formed in the non-display area NA located outside the display area AA.

A heat radiation sheet 170 including an adhesive layer 171, a metal layer 175, a thermal diffusion layer 173, and a protective layer 177 is attached to the non-display surface of the display panel 110. The heat-radiating sheet 170 may be formed on one surface of the sealing substrate 110b, which is a non-display surface of the display panel 110, by any one of coating, vapor deposition, and laminating, but is not limited thereto.

In the case of the protective layer 177, the thermal diffusion layer 173, the metal layer 175, and the thermal diffusion layer 173, which are formed to cover the thermal diffusion layer 173 and the metal layer 175, And the adhesive layer 171. On the other hand, when the protective layer 177 is formed of a porous material, the groove H is formed as shown in FIG. 10, so that the heat releasing function from the thermal diffusion layer 173 can be enhanced.

In the case of the metal layer 175, as shown in Figs. 6 and 7 of the first embodiment, some regions are formed in a net shape. The metal layer 175 may include a frame region 175a formed to correspond to an outer region of the display panel 110 and a net region 175b formed in a net shape within the frame region 175a. The metal layer 175 may include a wiring portion 176 extending from the frame region 175a or the mesh region 175b and connected to the ground wiring as shown in Fig. The wiring portion 176 can be connected to the ground wiring of the flexible circuit board 180, the ground wiring of the display panel 110, or the ground wiring of the external substrate 190, as described in Fig. 8 of the first embodiment.

The heat dissipation sheet 170 described above can diffuse and emit heat generated in the display panel 110 by the thermal diffusion layer 173 and the metal layer 175 and shield the EMI by the metal layer 175. [

While the present invention has been described in detail, it is clearly understood that the same is by way of illustration and illustration only and is not to be construed as limiting the present invention.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. In addition, the scope of the present invention is indicated by the following claims rather than the detailed description. Also, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

1 is a plan view of an organic light emitting display device according to a first embodiment of the present invention.

2 is a sectional view of the region A1-A2 shown in Fig.

3 is a cross-sectional exemplary view of the subpixel shown in FIG.

4 is a hierarchical view of an organic light emitting layer.

5 is a sectional view of a heat-radiating sheet.

Figs. 6 and 7 are plan views of the heat-radiating sheet shown in Fig. 5; Fig.

8 is a side view schematically showing a module to which a heat-radiating sheet is attached.

9 is a sectional view of an organic light emitting display device according to a second embodiment of the present invention.

10 is a sectional view of a heat-radiating sheet.

DESCRIPTION OF THE REFERENCE NUMERALS

110: display panel 170: heat radiation sheet

171: adhesive layer 173: thermal diffusion layer

175: metal layer 177: protective layer

Claims (10)

Display panel; A thermal diffusion layer positioned on the entire one surface of the substrate which is the non-display surface of the display panel; And And a metal layer disposed on one surface of the thermal diffusion layer. Display panel; A metal layer disposed on the entire one surface of the sealing substrate which is the non-display surface of the display panel; And And a thermal diffusion layer located on one side of the metal layer. 3. The method according to claim 1 or 2, The metal layer may include, And the organic electroluminescent display device according to any one of claims 1 to 5, 3. The method according to claim 1 or 2, The metal layer may include, A frame region formed corresponding to an outer area of the display panel, And a net region formed in a net shape in the frame region. 3. The method according to claim 1 or 2, The metal layer may include, And a wiring portion connected to the ground wiring. The method according to claim 1, And a protective layer disposed on one surface of the metal layer. The method according to claim 6, The protective layer may be formed, And the metal layer and the thermal diffusion layer. 3. The method of claim 2, And a protective layer disposed on one surface of the thermal diffusion layer. 9. The method of claim 8, The protective layer may be formed, Wherein the thermal diffusion layer covers the thermal diffusion layer and the metal layer. 9. The method according to claim 6 or 8, The protective layer may be formed, An organic electroluminescent display device comprising a porous material.

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