KR101570530B1 - Flexible Printed Circuit Board and Organic Light Emitting Display using the same - Google Patents

Abstract

An embodiment of the present invention is a display panel comprising: a display panel; A pad portion located on the outer periphery of the display panel; And a flexible circuit board attached to the pad portion and including a base film, a first film layer positioned on one side of the base film, and a second film layer positioned on the other side of the base film, A first body portion defined at a spaced-apart position from the bonding portion, a first bending portion defined between the bonding portion and the first body portion, and a second bending portion defined between the bonding portion and the first bending portion, Wherein the second film layer has a second dummy portion defined in a region opposite to the bonding portion and having an area wider than an area of the bonding portion and a second dummy portion defined in an area opposite to the first body portion, 2 body portion and a second bending portion defined in a region opposite to the first bending portion.

Organic electroluminescent display, flexible circuit board, bending

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board and an organic light emitting display using the same,

An embodiment of the present invention relates to a flexible circuit board and an organic light emitting display using the same.

An organic electroluminescent device used in an organic electroluminescent display device is a self-luminous device in which a light emitting layer is formed between two electrodes located on a substrate.

In addition, the organic light emitting display device may include a top emission type, a bottom emission type, or a dual emission type depending on a direction in which light is emitted. It is divided into a passive matrix and an active matrix depending on the driving method.

In an organic light emitting display, when a scan signal, a data signal, or the like is supplied to a plurality of subpixels arranged in a matrix on a panel, the selected subpixel emits light, thereby displaying an image.

The scan signal, the data signal, and the like are supplied by a drive device electrically connected to the panel. The driving device may include a scan driver for supplying a scan signal and a data driver for supplying a data signal. The driving unit can generate a scan signal and a data signal in response to various signals supplied from an external circuit board, and supply the scan signal and the data signal to the panel. The panel and the external circuit board may be connected by a flexible circuit board, and the scan driver and the data driver may be located on the flexible circuit board or the panel.

Meanwhile, in a conventional process for manufacturing an organic light emitting display, a TAB (Tape Automated Bonding) process is performed to connect the panel and the flexible circuit board. The flexible circuit board is attached to the panel and bent to the back side of the panel. In this process, when the flexible circuit board is bent to the rear surface of the panel, cracks are generated in the flexible circuit board's bending portion, and bonding of the flexible circuit board is broken. Such a problem poses a problem in signal transmission between the panel and the external circuit board, causing poor lighting of the panel, and thus an improvement thereof is required.

In order to solve the problems of the background art described above, an embodiment of the present invention can solve the problem that a bending portion of a flexible circuit board is cracked or a bonding portion of a flexible circuit board is torn when the flexible circuit board is bent to the back surface of the panel And an organic light emitting display using the flexible circuit substrate.

According to an embodiment of the present invention, there is provided a display panel comprising: a display panel; A pad portion located on the outer periphery of the display panel; And a flexible circuit board attached to the pad portion and including a base film, a first film layer positioned on one side of the base film, and a second film layer positioned on the other side of the base film, A first body portion defined at a spaced-apart position from the bonding portion, a first bending portion defined between the bonding portion and the first body portion, and a second bending portion defined between the bonding portion and the first bending portion, Wherein the second film layer has a second dummy portion defined in a region opposite to the bonding portion and having an area wider than an area of the bonding portion and a second dummy portion defined in an area opposite to the first body portion, 2 body portion and a second bending portion defined in a region opposite to the first bending portion.

The area of the second dummy portion may be larger than the area of the bonding portion, and may be equal to or narrower than the sum of the area of the bonding portion and the area of the first dummy portion.

The first film layer includes a first conductive layer positioned on the bonding portion, the first dummy portion, and the first body portion, and a second conductive layer positioned on the first conductive layer and separated from the first dummy portion and the first body portion, An adhesive layer, and a first protective layer disposed on the first adhesive layer.

The second film layer includes a second conductive layer positioned in the second body portion, a second adhesive layer separated from the second dummy portion and the second body portion, and a second protective layer positioned on the second adhesive layer, .

The first film layer may include an organic ink layer formed on the first bending portion and located on the first conductive layer.

In another aspect, an embodiment of the present invention includes a flexible circuit board including a base film, a first film layer positioned on one side of the base film, and a second film layer positioned on the other side of the base film, The first film layer includes a bonding portion defined to be attached to the pad portion of the display panel, a first body portion defined at a position spaced apart from the bonding portion, a first banding portion defined between the bonding portion and the first body portion, And a first dummy portion defined between the bonding portion and the first bending portion, wherein the second film layer has a second dummy portion defined in a region opposite to the bonding portion and having an area wider than an area of the bonding portion, And a second bending portion defined in a region opposite to the first bending portion.

The area of the second dummy portion may be larger than the area of the bonding portion, and may be equal to or narrower than the sum of the area of the bonding portion and the area of the first dummy portion.

The first film layer includes a first conductive layer positioned on the bonding portion, the first dummy portion, and the first body portion, and a second conductive layer positioned on the first conductive layer and separated from the first dummy portion and the first body portion, An adhesive layer, and a first protective layer disposed on the first adhesive layer.

The second film layer includes a second conductive layer positioned in the second body portion, a second adhesive layer separated from the second dummy portion and the second body portion, and a second protective layer positioned on the second adhesive layer, .

The first film layer may include an organic ink layer formed on the first bending portion and located on the first conductive layer.

An embodiment of the present invention provides a flexible circuit board capable of solving the problem of cracking in the bending portion of the flexible circuit board or boding of the bonding portion of the flexible circuit board when the flexible circuit board is bent to the back surface of the panel, There is an effect of providing a display device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a side view of an organic light emitting display according to an embodiment of the present invention.

1, an organic light emitting display according to an exemplary embodiment of the present invention includes a display panel 110, a driving unit 160 for supplying a driving signal to the display panel 110, And a flexible circuit board 170 attached to the pad unit 165. The pad unit 165 may include a flexible printed circuit board (PCB)

The display panel 110 may include a first substrate 110a in which a plurality of sub pixels are formed in a matrix form and a second substrate 110b that protects sub pixels formed in the first substrate 110a from outside air.

The driving device 160 may include a scan driver connected to scan lines of sub pixels formed in the display panel 110 to supply scan signals and a data driver connected to the data lines of the sub pixels to supply data signals . The scan driver and the data driver may be separately located outside the display panel 110 or the display panel 110.

The pad unit 165 may be connected to the wirings located on the display panel 110 and may be connected to an external circuit board such as the flexible circuit board 170 or the like to the outside of the display panel 110 Can be located.

The flexible circuit board 170 is attached to the pad unit 165 so that various signals supplied from the external circuit board can be supplied to the driving apparatus 160 and the display panel 110. A power supply unit for supplying power to the display panel 110 and the driving unit 160 may be disposed on the flexible circuit board 170.

The circuit configuration of subpixels formed on the display panel 110 will be described below.

2 is a circuit diagram of a sub-pixel formed on the display panel shown in FIG.

As shown in FIG. 2, the sub-pixel may include a switching transistor SWTFT having a gate connected to the scan line Scan and one end connected to the data line Data. The subpixel may include a driving transistor DRTFT having a gate connected to the other end of the switching transistor SWTFT and one end connected to the second power supply line VSS. In addition, the sub-pixel may include a capacitor CST connected between the gate of the driving transistor DRTFT and the second power source line VSS. The subpixel may include an organic light emitting diode (OLED) having an anode connected to the first power supply line VDD and a cathode connected to the other end of the driving transistor DRTFT.

2, the sub-pixel includes a switching transistor SWTFT, a driving transistor DRTFT, a capacitor CST and an organic light emitting diode OLED. The switching transistor SWTFT and the driving transistor DRTFT ) Is N-type, but the present invention is not limited thereto.

Here, the data line Data is connected to the data driver and the scan line Scan is connected to the scan driver. Accordingly, when a data signal, a scan signal, or the like is supplied from the data driver and the scan driver, the subpixel is supplied with the current supplied to the first power supply line VDD through the second power supply line VSS, (OLED) emits light to display an image.

Hereinafter, a cross-sectional view of a subpixel formed based on the circuit configuration of the subpixel will be described.

3 is a cross-sectional exemplary view of a subpixel.

As shown in FIG. 3, the buffer layer 111 may be positioned on the first substrate 110a. The buffer layer 111 may be formed to protect a thin film transistor formed in a subsequent process from an impurity such as alkali ions or the like, which is emitted from the first substrate 110a. The buffer layer 111 may be made of silicon oxide (SiOx), silicon nitride (SiNx), or the like.

A gate 112 may be located on the buffer layer 111. The gate 112 is formed of any one selected from the group consisting of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper Or an alloy thereof. The gate 112 may be formed of a material selected from the group consisting of Mo, Al, Cr, Au, Ti, Ni, And may be a multilayer composed of any one selected or an alloy thereof. Also, the gate 112 may be a double layer of molybdenum / aluminum-neodymium or molybdenum / aluminum.

The first insulating layer 113 may be located on the gate 112. The first insulating layer 113 may be silicon oxide (SiOx), silicon nitride (SiNx), or a multilayer thereof, but is not limited thereto.

The active layer 114 may be located on the first insulating layer 113. The active layer 114 may comprise amorphous silicon or polycrystalline silicon crystallized therefrom. Although not shown here, the active layer 114 may include a channel region, a source region, and a drain region, and the source region and the drain region may be doped with P-type or N-type impurities. In addition, the active layer 114 may include an ohmic contact layer for lowering the contact resistance.

On the active layer 114, the source 115a and the drain 115b may be positioned. The source 115a and the drain 115b may be formed of a single layer or multiple layers and may be formed of a single layer such as molybdenum (Mo), aluminum (Al), chromium (Cr) And may be made of any one selected from the group consisting of gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) When the source 115a and the drain 115b are multilayered, they may be formed of a triple layer of molybdenum / aluminum-neodymium, molybdenum / aluminum / molybdenum, or molybdenum / aluminum-neodymium / molybdenum.

The second insulating film 116a may be located on the source 115a and the drain 115b. The second insulating layer 116a may be silicon oxide (SiOx), silicon nitride (SiNx), or a multilayer thereof, but is not limited thereto.

One of the source 115a and the drain 115b is located on the second insulating film 116a and may be connected to a shield metal 118 for preventing interference between the source 115a and the drain 115b.

A third insulating layer 116b may be formed on the second insulating layer 116a to increase the flatness. The third insulating film 116b may include an organic material such as polyimide.

In the above description, the transistor formed on the first substrate 110a is a Bam gate type transistor. However, the transistor formed on the first substrate 110a may be formed not only as a totem gate type but also as a top gate type.

A lower electrode 117 connected to the source 115a or the drain 115b may be positioned on the third insulating film 116b of the transistor. The lower electrode 117 can be selected as an anode or a cathode. When the lower electrode 117 is selected as the anode, the anode may be formed of any one of ITO (Indium Tin Oxide), IZO (Indium Tin Zinc Oxide), ITZO (Indium Tin Zinc Oxide), and AZO (Zno doped Al2O3) But are not limited thereto.

On the lower electrode 117, a bank layer 119 having an opening exposing a part of the lower electrode 117 may be positioned. The bank layer 119 may include an organic material such as a benzocyclobutene (BCB) resin, an acrylic resin, or a polyimide resin.

The organic light emitting layer 121 may be positioned on the lower electrode 117. The organic light emitting layer 121 may be formed to emit light of any one of red, green, and blue depending on subpixels.

The upper electrode 122 may be located on the organic light emitting layer 121. The upper electrode 122 may be selected as a cathode or an anode. When the cathode is selected, the material of the cathode may be any one of aluminum (Al), aluminum alloy (Al alloy), and aluminum nitride (AlNd), but is not limited thereto.

The cross-sectional structure of the subpixel shown in FIG. 3 is only intended to illustrate an example of the embodiment, but the present invention is not limited thereto.

Hereinafter, an organic light emitting diode (OLED) including the organic light emitting layer 121 will be described in more detail with reference to FIG. However, an example will be described in which the lower electrode 117 is selected as the anode and the upper electrode 122 is selected as the cathode.

4 is a view showing an example of a hierarchical structure of an organic light emitting diode.

4, the organic light emitting diode includes a lower electrode 117, a hole injecting layer 121a, a hole transporting layer 121b, a light emitting layer 121c, an electron transporting layer 121d, , An electron injection layer (121e), and an upper electrode (122).

The hole injection layer 121a may serve to smooth the injection of holes and may be formed of a material such as cupper phthalocyanine, PEDOT (poly (3,4) -ethylenedioxythiophene), PANI (polyaniline) and NPD (N, -N, N'-diphenyl benzidine), but the present invention is not limited thereto.

The hole transport layer 121b plays a role of facilitating the transport of holes and includes a hole transporting material such as NPD (N, N-dinaphthyl-N, N'-diphenyl benzidine), TPD (N, N'- , N'-bis- (phenyl) -benzidine), s-TAD and MTDATA (4,4 ', 4 "-tris (N-3-methylphenyl-N-phenylamino) But is not limited thereto.

The light emitting layer 121c may include a material that emits red, green, blue, and white light, and may be formed using phosphorescent or fluorescent materials.

When the light emitting layer 121c is red, it includes a host material including CBP (carbazole biphenyl) or mCP (1,3-bis (carbazol-9-yl)), and PIQIr (acac) (bis (1-phenylisoquinoline) acetylacetonate wherein the dopant comprises at least one selected from the group consisting of iridium, iridium, PQIr (acac) (bis (1-phenylquinoline) acetylacetonate iridium), PQIr (tris (1-phenylquinoline) iridium) and PtOEP (octaethylporphyrin platinum) Or PBD: Eu (DBM) 3 (Phen) or Perylene. However, the present invention is not limited thereto.

When the light emitting layer 121c is green, it may be made of a phosphorescent material including a dopant material including a host material including CBP or mCP and containing Ir (ppy) 3 (fac tris (2-phenylpyridine) iridium) Alternatively, it may be made of a fluorescent material including Alq3 (tris (8-hydroxyquinolino) aluminum), but is not limited thereto.

When the light emitting layer 121c is blue, it may include a host material including CBP or mCP, and may include a phosphorescent material including a dopant material including (4,6-F2ppy) 2Irpic. Alternatively, the fluorescent material may include any one selected from the group consisting of spiro-DPVBi, spiro-6P, distyrylbenzene (DSB), distyrylarylene (DSA), PFO polymer, and PPV polymer. It is not limited.

The electron transporting layer 121d serves to smooth the transport of electrons and may be made of any one or more selected from the group consisting of Alq3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq and SAlq But are not limited thereto.

The electron injection layer 121 e may be used to facilitate the injection of electrons and may include Alq 3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq or SAlq.

Here, the embodiment of the present invention is not limited to FIG. 4, and at least one of the hole injection layer 121a, the hole transport layer 121b, the electron transport layer 121d, and the electron injection layer 121e may be omitted .

Hereinafter, the flexible circuit board 170 will be described in more detail.

5 is a partial cross-sectional view of a flexible circuit board according to an embodiment of the present invention.

5, the flexible circuit board 170 is attached to a pad portion 165 formed on a display panel 110 and includes a base film 171, a first film 171 disposed on one side of the base film 171, A layer 172 and a second film layer 173 located on the other side of the base film 171. [

The first film layer 172 includes a bonding part TP defined to be attached to the pad part 165, a first body part FP1 defined at a position spaced apart from the bonding part TP, A first bending portion BP1 defined between the first body portion FP1 and the first body portion FP1 and a first dummy portion DP1 defined between the bonding portion TP and the first bending portion BP1. have. The first film layer 172 includes a bonding portion TP, a first dummy portion DP1 and a first conductive layer 172b located on the first body portion FP1 and a second conductive layer 172b on the first conductive layer 172b. A first adhesive layer 172d located on the first dummy part DP1 and the first body part FP1 and a first protective layer 172e located on the first adhesive layer 172d . The first film layer 172 may include a first metal layer 172a positioned between the first conductive layer 172b and one side of the base film 171. [ Here, the first bending portion BP1 is an example in which the first adhesive layer 172d and the first protective layer 172e are removed.

The second film layer 173 includes a second dummy portion DP2 defined in a region opposite to the bonding portion TP and having an area larger than that of the bonding portion TP and a second dummy portion DP2 opposite to the first body portion FP1 And a second bending portion BP2 defined in a region opposite to the first bending portion BP1. The second film layer 173 includes a second conductive layer 173b disposed on the second body portion FP2 and a second conductive layer 173b disposed on the second dummy portion DP2 and the second body portion FP2, An adhesive layer 173d, and a second protective layer 173e positioned on the second adhesive layer 173d. The second film layer 173 may include a second metal layer 173a positioned between the other surface of the base film 171 and the second conductive layer 173b. Here, the second bending portion BP2 is an example in which the second conductive layer 173b, the second adhesive layer 173d, and the second passivation layer 173e are removed.

Meanwhile, the first film layer 172 may include an organic ink layer 175 positioned on the first conductive layer 172b formed on the first banding portion BP1. The organic ink layer 175 can be advantageous in bending by explaining another variation of the bending portions BP1 and BP2 when the flexible circuit board 170 is bent. And the first film layer 172 may include a plating layer 172c positioned on the first conductive layer 172b formed on the bonding portion TP. The plated layer 172c can protect the first conductive layer 172b exposed on the surface and can provide an advantage such as an improvement in adhesion strength when bonding to the pad part 165. [

The flexible circuit board 170 described above is attached to the pad portion 165 formed on the display panel 110 through the first conductive layer 172b located in the bonding portion TP. The flexible circuit board 170 and the pad unit 165 are electrically connected by a TAB (Tape Automated Bonding) process in the process of manufacturing the organic light emitting display device.

The flexible circuit board 170 attached to the display panel 110 by the tap bonding is bent to the back surface of the display panel 110. At this time, the bent region of the flexible circuit board 170 is the bending portions BP1 and BP2 located in the region adjacent to the bonding portion TP.

6 is a view for comparing a conventional flexible circuit board and a flexible circuit board according to an embodiment of the present invention.

6A illustrates a problem that an area ER1 in which the bonding portion is torn when the display panel 110 and the conventional flexible circuit board 170 are bonded to each other by tap bonding and bent to the back surface of the display panel 110 FIG.

6B shows a region ER2 where cracks are generated in the bonding portion when the display panel 110 and the conventional flexible circuit board 170 are tap-bonded and bent to the back surface of the display panel 110, Fig. 2 is a diagram for explaining a problem in which the above-

6 (c) is a cross-sectional view of the flexible printed circuit board 170 according to the embodiment of the present invention when the display panel 110 and the flexible circuit board 170 according to the embodiment of the present invention are bent and bent to the back surface of the display panel 110, b) is not shown in FIG.

The reason why the flexible circuit board 170 according to the embodiment of the present invention does not cause the problem as shown in FIG. 6 (a) or 6 (b) is that the second This is because the area of the dummy portion DP2 is wide. When the flexible circuit board 170 is bent to the back surface of the display panel 110, the receiving force does not act on the bending portions BP1 and BP2 but acts on both of the bending portions BP1 and BP2. Here, the second dummy portion DP2 having an area larger than that of the bonding portion TP may serve to disperse, absorb, or buffer the force acting on the region adjacent to the banding portions BP1 and BP2 . 6 (a) or 6 (b) does not occur even if the flexible circuit board 170 is bent to the back surface of the display panel 110 after the tap bonding, the signal transmission between the panel and the external circuit board The problems such as the lighting failure of the panel caused by the panel are solved.

7 is a partial cross-sectional view of a flexible circuit board according to another embodiment of the present invention.

The flexible circuit board 170 shown in Fig. 7 is similar to that described with reference to Fig. The area of the second dummy portion DP2 included in the second film layer 173 is formed to occupy the same area as the sum of the area of the bonding portion TP and the area of the first dummy portion DP1 . The area of the second dummy portion DP2 included in the second film layer 173 of the flexible circuit board 170 is wider than the area of the bonding portion TP and the area of the bonding portion TP is larger than the area of the bonding portion TP, (DP1) of the light-emitting layer. However, in some cases, the area of the second dummy portion DP2 may be formed to include the second bending portion BP2 region.

As described above, according to the embodiment of the present invention, there is provided a flexible circuit board capable of solving the problem of cracking in the bending portion of the flexible circuit board or boding of the bonding portion of the flexible circuit board when the flexible circuit board is bent to the rear surface of the panel, There is an effect of providing a display device. As a result, problems such as lighting failure of the panel due to signal transmission between the panel and the external circuit board are solved.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. In addition, the scope of the present invention is indicated by the following claims rather than the detailed description. Also, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

1 is a side view of an organic light emitting display device according to an embodiment of the present invention;

FIG. 2 is a diagram illustrating an example of a circuit configuration of a subpixel formed in the display panel shown in FIG. 1; FIG.

3 is a cross-sectional exemplary view of a subpixel.

Fig. 4 is an example of a hierarchical structure of an organic light emitting diode. Fig.

5 is a partial cross-sectional view of a flexible circuit board according to an embodiment of the present invention.

6 is a view for comparing a conventional flexible circuit board and a flexible circuit board according to an embodiment of the present invention.

7 is a partial cross-sectional view of a flexible circuit board according to another embodiment of the present invention.

DESCRIPTION OF THE REFERENCE NUMERALS

110: display panel 160: driving device

165: pad part 170: flexible circuit board

171: base film 172: first film layer

173: second film layer TP: bonding part

DP1: first dummy portion DP2: second dummy portion

BP1: first bending part BP2: second bending part

FP1: first body part FP2: second body part

Claims (10)

Display panel; A pad portion located at an outer periphery of the display panel; And And a flexible circuit board attached to the pad portion and including a base film, a first film layer positioned on one side of the base film, and a second film layer positioned on the other side of the base film, Wherein the first film layer includes a bonding portion defined to be attached to the pad portion, a first body portion defined at a position spaced apart from the bonding portion, and a second band portion defined between the bonding portion and the first body portion, And a first dummy portion defined between the bonding portion and the first bending portion, Wherein the second film layer is defined in a region opposite to the bonding portion and has a larger area than an area of the bonding portion, a second body portion defined in a region opposite to the first body portion, And a second bending portion defined in a region opposite to the first bending portion. The method according to claim 1, The area of the second dummy portion Wherein the first dummy area is wider than an area of the bonding part and is equal to or smaller than a sum of an area of the bonding part and an area of the first dummy part. The method according to claim 1, Wherein the first film layer comprises: A first conductive layer positioned on the bonding portion, the first dummy portion, and the first body portion; and a second conductive layer disposed on the first conductive layer and separated from the first dummy portion and the first body portion, An adhesive layer, and a first protective layer disposed on the first adhesive layer. The method according to claim 1, Wherein the second film layer comprises: A second adhesive layer positioned on the second dummy portion and the second body portion and a second protective layer disposed on the second adhesive layer; Organic electroluminescence display device. The method of claim 3, Wherein the first film layer comprises: And an organic ink layer formed on the first bending portion and positioned on the first conductive layer. A flexible circuit board comprising: a base film; a first film layer located on one side of the base film; and a second film layer located on the other side of the base film, Wherein the first film layer includes a bonding portion defined to be attached to a pad portion of a display panel, a first body portion defined at a position spaced apart from the bonding portion, and a second body portion defined between the bonding portion and the first body portion A first bending portion and a first dummy portion defined between the bonding portion and the first bending portion, Wherein the second film layer is defined in a region opposite to the bonding portion and has a larger area than an area of the bonding portion, a second body portion defined in a region opposite to the first body portion, And a second bending portion defined in an area opposite to the first bending portion. The method according to claim 6, The area of the second dummy portion Wherein the first dummy portion is wider than an area of the bonding portion and is equal to or narrower than a sum of an area of the bonding portion and an area of the first dummy portion. The method according to claim 6, Wherein the first film layer comprises: A first conductive layer positioned on the bonding portion, the first dummy portion, and the first body portion; and a second conductive layer disposed on the first conductive layer and separated from the first dummy portion and the first body portion, An adhesive layer; and a first protective layer disposed on the first adhesive layer. The method according to claim 6, Wherein the second film layer comprises: A second adhesive layer positioned on the second dummy portion and the second body portion and a second protective layer disposed on the second adhesive layer; Flexible circuit board. 9. The method of claim 8, Wherein the first film layer comprises: And an organic ink layer formed on the first bending portion and positioned on the first conductive layer.

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