KR101565099B1 - 타겟의 광자 융발을 위한 방법 및 장치 - Google Patents

타겟의 광자 융발을 위한 방법 및 장치 Download PDF

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Publication number
KR101565099B1
KR101565099B1 KR1020097016607A KR20097016607A KR101565099B1 KR 101565099 B1 KR101565099 B1 KR 101565099B1 KR 1020097016607 A KR1020097016607 A KR 1020097016607A KR 20097016607 A KR20097016607 A KR 20097016607A KR 101565099 B1 KR101565099 B1 KR 101565099B1
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South Korea
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present
radiation
target
coating
scanner
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KR1020097016607A
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Korean (ko)
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KR20090116740A (ko
Inventor
자리 루트
베사 밀리마키
레이조 라팔라이넨
라세 풀리
주하 마키탈로
삼포 일라탈로
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피코데온 리미티드 오와이
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Priority claimed from FI20070158A external-priority patent/FI20070158L/fi
Application filed by 피코데온 리미티드 오와이 filed Critical 피코데온 리미티드 오와이
Publication of KR20090116740A publication Critical patent/KR20090116740A/ko
Application granted granted Critical
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Assigned to 펄스데온 오와이 reassignment 펄스데온 오와이 권리의 전부이전등록 Assignors: 피코데온 리미티드 오와이
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multi-focusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32321—Discharge generated by other radiation
    • H01J37/32339—Discharge generated by other radiation using electromagnetic radiation

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Physical Vapour Deposition (AREA)
  • X-Ray Techniques (AREA)
  • Coating By Spraying Or Casting (AREA)
KR1020097016607A 2007-02-23 2008-02-22 타겟의 광자 융발을 위한 방법 및 장치 Active KR101565099B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20070158A FI20070158L (fi) 2006-02-23 2007-02-23 Järjestely
FI20070158 2007-02-23

Publications (2)

Publication Number Publication Date
KR20090116740A KR20090116740A (ko) 2009-11-11
KR101565099B1 true KR101565099B1 (ko) 2015-11-03

Family

ID=39636924

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097016607A Active KR101565099B1 (ko) 2007-02-23 2008-02-22 타겟의 광자 융발을 위한 방법 및 장치

Country Status (8)

Country Link
US (1) US8828506B2 (https=)
EP (1) EP2137336B1 (https=)
JP (1) JP5666138B2 (https=)
KR (1) KR101565099B1 (https=)
DK (1) DK2137336T3 (https=)
IL (1) IL199623A0 (https=)
IN (1) IN2009KN02420A (https=)
WO (1) WO2008102062A2 (https=)

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PT1793187E (pt) * 2004-09-21 2012-03-05 Joan Vives Iglesias Processo e máquina destinados à sinterização e/ou secagem de materiais em pó utilizando uma radiação infravermelha
US20100221489A1 (en) * 2006-02-23 2010-09-02 Picodeon Ltd Oy Coating on a glass substrate and a coated glass product
WO2007096476A2 (en) * 2006-02-23 2007-08-30 Picodeon Ltd Oy Coating on a medical substrate and a coated medical product
FI20070889A7 (fi) * 2007-11-21 2009-05-22 Picodeon Ltd Oy Pinnankäsittelymenetelmä
ATE537277T1 (de) * 2008-08-25 2011-12-15 Solmates Bv Verfahren zur abscheidung eines materials
US9283638B2 (en) * 2011-11-25 2016-03-15 Rofin-Baasel Lasertech Gmbh & Co. Kg Device for forming longitudinally spaced grooves or slits into a material web with a focused laser beam
US10835313B2 (en) * 2014-01-30 2020-11-17 Medlumics S.L. Radiofrequency ablation catheter with optical tissue evaluation
FI126769B (en) 2014-12-23 2017-05-15 Picodeon Ltd Oy Lighthouse type scanner with rotating mirror and annular focus
CN107111225B (zh) 2014-12-23 2021-07-27 普利司通美国轮胎运营有限责任公司 聚合物产品的增材制造方法
ITRM20150111A1 (it) * 2015-03-16 2016-09-16 Lorusso Alessio Sistema di movimentazione meccatronica per una macchina per la prototipazione rapida
DE102015004163B4 (de) * 2015-04-01 2017-03-23 Primes Gmbh Vorrichtung und Verfahren zur Bestimmung von Eigenschaften eines Laserstrahls
US11049702B2 (en) 2015-04-27 2021-06-29 Advanced Energy Industries, Inc. Rate enhanced pulsed DC sputtering system
US9812305B2 (en) 2015-04-27 2017-11-07 Advanced Energy Industries, Inc. Rate enhanced pulsed DC sputtering system
US10522300B2 (en) 2015-05-26 2019-12-31 National Research Council Of Canada Metallic surface with karstified relief, forming same, and high surface area metallic electrochemical interface
US10373811B2 (en) * 2015-07-24 2019-08-06 Aes Global Holdings, Pte. Ltd Systems and methods for single magnetron sputtering
US11097531B2 (en) 2015-12-17 2021-08-24 Bridgestone Americas Tire Operations, Llc Additive manufacturing cartridges and processes for producing cured polymeric products by additive manufacturing
US11453161B2 (en) 2016-10-27 2022-09-27 Bridgestone Americas Tire Operations, Llc Processes for producing cured polymeric products by additive manufacturing
KR101906854B1 (ko) * 2017-07-25 2018-10-11 한전원자력연료 주식회사 이동형 핵연료 집합체 구조 변형 측정장비
EP3540090A1 (en) * 2018-03-12 2019-09-18 Solmates B.V. Method for pulsed laser deposition
DE102018003675A1 (de) * 2018-05-04 2019-11-07 Siltectra Gmbh Verfahren zum Abtrennen von Festkörperschichten von Kompositstrukturen aus SiC und einer metallischen Beschichtung oder elektrischen Bauteilen
EP3587620A1 (en) * 2018-06-28 2020-01-01 Solmates B.V. Device for pulsed laser deposition and a substrate with a substrate surface for reduction of particles on the substrate
DE202019005592U1 (de) * 2019-01-22 2021-02-08 Hegla Gmbh & Co. Kg Vorrichtung zum Bearbeiten und zum Trennen einer Verbundsicherheitsglastafel
US20220186360A1 (en) * 2019-03-05 2022-06-16 Xefco Pty Ltd Improved vapour deposition system, method and moisture control device
US12099217B2 (en) * 2020-09-23 2024-09-24 Innoviz Technologies Ltd. Ultra-light optical element
WO2022161605A1 (en) * 2021-01-27 2022-08-04 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Thermal laser evaporation system
US12104885B2 (en) * 2022-03-29 2024-10-01 United States Of America As Represented By The Secretary Of The Navy Laser induced plasma targets for use as an electromagnetic testbed

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JP2004188437A (ja) 2002-12-09 2004-07-08 Fuji Photo Film Co Ltd 微細傾斜面の加工方法
JP2005097698A (ja) 2003-09-26 2005-04-14 Kansai Electric Power Co Inc:The 酸化物薄膜の形成方法
JP2005262284A (ja) 2004-03-19 2005-09-29 Toppan Printing Co Ltd 超短パルスレーザーによる材料加工方法
WO2006011608A1 (ja) 2004-07-30 2006-02-02 Mitsuboshi Diamond Industrial Co., Ltd. 基板の垂直クラック形成方法および垂直クラック形成装置

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US4987007A (en) * 1988-04-18 1991-01-22 Board Of Regents, The University Of Texas System Method and apparatus for producing a layer of material from a laser ion source
JP3336682B2 (ja) * 1992-07-02 2002-10-21 住友電気工業株式会社 硬質炭素膜
JP3255469B2 (ja) * 1992-11-30 2002-02-12 三菱電機株式会社 レーザ薄膜形成装置
JPH0855821A (ja) * 1994-08-16 1996-02-27 Nec Corp 薄膜形成装置および薄膜形成方法
US6063455A (en) 1995-10-09 2000-05-16 Institute For Advanced Engineering Apparatus for manufacturing diamond film having a large area and method thereof
AUPO912797A0 (en) * 1997-09-11 1997-10-02 Australian National University, The Ultrafast laser deposition method
AU6431199A (en) 1998-10-12 2000-05-01 Regents Of The University Of California, The Laser deposition of thin films
JP4436162B2 (ja) * 2004-03-16 2010-03-24 株式会社リコー レーザ加工装置
US20100181706A1 (en) 2005-07-13 2010-07-22 Jari Ruuttu Radiation Arrangement
FI20060178A7 (fi) 2006-02-23 2007-08-24 Picodeon Ltd Oy Pinnoitusmenetelmä

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2004188437A (ja) 2002-12-09 2004-07-08 Fuji Photo Film Co Ltd 微細傾斜面の加工方法
JP2005097698A (ja) 2003-09-26 2005-04-14 Kansai Electric Power Co Inc:The 酸化物薄膜の形成方法
JP2005262284A (ja) 2004-03-19 2005-09-29 Toppan Printing Co Ltd 超短パルスレーザーによる材料加工方法
WO2006011608A1 (ja) 2004-07-30 2006-02-02 Mitsuboshi Diamond Industrial Co., Ltd. 基板の垂直クラック形成方法および垂直クラック形成装置

Also Published As

Publication number Publication date
JP5666138B2 (ja) 2015-02-12
WO2008102062A2 (en) 2008-08-28
IN2009KN02420A (https=) 2015-08-07
EP2137336A2 (en) 2009-12-30
WO2008102062A3 (en) 2009-03-12
US8828506B2 (en) 2014-09-09
IL199623A0 (en) 2010-04-15
JP2010519051A (ja) 2010-06-03
EP2137336B1 (en) 2014-04-02
DK2137336T3 (da) 2014-07-07
KR20090116740A (ko) 2009-11-11
US20100196624A1 (en) 2010-08-05

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