KR101553472B1 - 전자 부품용 적층 배선막 및 피복층 형성용 스퍼터링 타깃재 - Google Patents

전자 부품용 적층 배선막 및 피복층 형성용 스퍼터링 타깃재 Download PDF

Info

Publication number
KR101553472B1
KR101553472B1 KR1020140032109A KR20140032109A KR101553472B1 KR 101553472 B1 KR101553472 B1 KR 101553472B1 KR 1020140032109 A KR1020140032109 A KR 1020140032109A KR 20140032109 A KR20140032109 A KR 20140032109A KR 101553472 B1 KR101553472 B1 KR 101553472B1
Authority
KR
South Korea
Prior art keywords
coating layer
wiring film
film
laminated wiring
layer
Prior art date
Application number
KR1020140032109A
Other languages
English (en)
Korean (ko)
Other versions
KR20140116002A (ko
Inventor
히데오 무라타
Original Assignee
히타치 긴조쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히타치 긴조쿠 가부시키가이샤 filed Critical 히타치 긴조쿠 가부시키가이샤
Publication of KR20140116002A publication Critical patent/KR20140116002A/ko
Application granted granted Critical
Publication of KR101553472B1 publication Critical patent/KR101553472B1/ko

Links

Images

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
KR1020140032109A 2013-03-22 2014-03-19 전자 부품용 적층 배선막 및 피복층 형성용 스퍼터링 타깃재 KR101553472B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-059489 2013-03-22
JP2013059489 2013-03-22

Publications (2)

Publication Number Publication Date
KR20140116002A KR20140116002A (ko) 2014-10-01
KR101553472B1 true KR101553472B1 (ko) 2015-09-15

Family

ID=51552193

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140032109A KR101553472B1 (ko) 2013-03-22 2014-03-19 전자 부품용 적층 배선막 및 피복층 형성용 스퍼터링 타깃재

Country Status (4)

Country Link
JP (1) JP6361957B2 (zh)
KR (1) KR101553472B1 (zh)
CN (1) CN104064549B (zh)
TW (1) TWI498441B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6455303B2 (ja) * 2014-12-19 2019-01-23 住友金属鉱山株式会社 被覆はんだワイヤおよびその製造方法
JP6823799B2 (ja) * 2015-10-01 2021-02-03 日立金属株式会社 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材
JP6997945B2 (ja) * 2016-12-27 2022-01-18 日立金属株式会社 積層配線膜およびその製造方法ならびにＭｏ合金スパッタリングターゲット材

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005079130A (ja) 2003-08-28 2005-03-24 Hitachi Metals Ltd 薄膜配線層

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4419037B2 (ja) * 2000-11-27 2010-02-24 三菱マテリアル株式会社 ブラックマトリックス用遮光膜を形成するためのスパッタリングターゲット
JP3649238B2 (ja) * 2002-10-17 2005-05-18 旭硝子株式会社 積層体、配線付き基体、有機ｅｌ表示素子、有機ｅｌ表示素子の接続端子及びそれらの製造方法
KR100938885B1 (ko) * 2003-06-30 2010-01-27 엘지디스플레이 주식회사 액정표시장치용 어레이기판과 제조방법
JP4730662B2 (ja) * 2005-03-02 2011-07-20 日立金属株式会社 薄膜配線層
EP2277191A1 (en) * 2008-04-28 2011-01-26 H. C. Starck, Inc. Molybdenum-niobium alloys, sputtering targets containing such alloys, methods of making such targets, thin films prepared therefrom and uses thereof
JP6016083B2 (ja) * 2011-08-19 2016-10-26 日立金属株式会社 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005079130A (ja) 2003-08-28 2005-03-24 Hitachi Metals Ltd 薄膜配線層

Also Published As

Publication number Publication date
TW201437405A (zh) 2014-10-01
CN104064549B (zh) 2016-08-31
JP6361957B2 (ja) 2018-07-25
JP2014208887A (ja) 2014-11-06
CN104064549A (zh) 2014-09-24
KR20140116002A (ko) 2014-10-01
TWI498441B (zh) 2015-09-01

Similar Documents

Publication Publication Date Title
KR101358529B1 (ko) 전자부품용 적층 배선막 및 피복층 형성용 스퍼터링 타겟재
KR101613001B1 (ko) Mo 합금 스퍼터링 타깃재의 제조 방법 및 Mo 합금 스퍼터링 타깃재
TWI583801B (zh) A sputtering target for forming a wiring film for an electronic component and a coating layer material
KR20180076316A (ko) 적층 배선막 및 그 제조 방법 그리고 Mo 합금 스퍼터링 타깃재
KR101600169B1 (ko) 전자 부품용 금속 박막 및 금속 박막 형성용 Mo 합금 스퍼터링 타깃재
KR101553472B1 (ko) 전자 부품용 적층 배선막 및 피복층 형성용 스퍼터링 타깃재
TW201715054A (zh) 電子零件用積層配線膜及被覆層形成用濺鍍靶材
KR101597018B1 (ko) 금속 박막 및 금속 박막 형성용 Mo 합금 스퍼터링 타깃재
TWI493624B (zh) 電子零件用積層配線膜及被覆層形成用濺鍍靶材
KR101828085B1 (ko) Ｃｕ 전극 보호막용 ＮｉＣｕ 합금 타겟재 및 적층막
KR101337141B1 (ko) 전자부품용 적층 배선막
JP2005091543A (ja) 薄膜配線層
KR101421881B1 (ko) 전자 부품용 적층 배선막
TW201523373A (zh) 觸控面板感測器用配線膜、及觸控面板感測器

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20180816

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20190819

Year of fee payment: 5