JP6361957B2 - 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材 - Google Patents

電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材 Download PDF

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Publication number
JP6361957B2
JP6361957B2 JP2014050030A JP2014050030A JP6361957B2 JP 6361957 B2 JP6361957 B2 JP 6361957B2 JP 2014050030 A JP2014050030 A JP 2014050030A JP 2014050030 A JP2014050030 A JP 2014050030A JP 6361957 B2 JP6361957 B2 JP 6361957B2
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Japan
Prior art keywords
coating layer
wiring film
layer
film
main conductive
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JP2014050030A
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Japanese (ja)
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JP2014208887A (ja
Inventor
村田　英夫
英夫 村田
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Hitachi Metals Ltd
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Hitachi Metals Ltd
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Priority to JP2014050030A priority Critical patent/JP6361957B2/ja
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physical Vapour Deposition (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
JP2014050030A 2013-03-22 2014-03-13 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材 Active JP6361957B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014050030A JP6361957B2 (ja) 2013-03-22 2014-03-13 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013059489 2013-03-22
JP2013059489 2013-03-22
JP2014050030A JP6361957B2 (ja) 2013-03-22 2014-03-13 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材

Publications (2)

Publication Number Publication Date
JP2014208887A JP2014208887A (ja) 2014-11-06
JP6361957B2 true JP6361957B2 (ja) 2018-07-25

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JP2014050030A Active JP6361957B2 (ja) 2013-03-22 2014-03-13 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材

Country Status (4)

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JP (1) JP6361957B2 (zh)
KR (1) KR101553472B1 (zh)
CN (1) CN104064549B (zh)
TW (1) TWI498441B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6455303B2 (ja) * 2014-12-19 2019-01-23 住友金属鉱山株式会社 被覆はんだワイヤおよびその製造方法
JP6823799B2 (ja) * 2015-10-01 2021-02-03 日立金属株式会社 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材
JP6997945B2 (ja) * 2016-12-27 2022-01-18 日立金属株式会社 積層配線膜およびその製造方法ならびにＭｏ合金スパッタリングターゲット材

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4419037B2 (ja) * 2000-11-27 2010-02-24 三菱マテリアル株式会社 ブラックマトリックス用遮光膜を形成するためのスパッタリングターゲット
JP3649238B2 (ja) * 2002-10-17 2005-05-18 旭硝子株式会社 積層体、配線付き基体、有機ｅｌ表示素子、有機ｅｌ表示素子の接続端子及びそれらの製造方法
KR100938885B1 (ko) * 2003-06-30 2010-01-27 엘지디스플레이 주식회사 액정표시장치용 어레이기판과 제조방법
JP2005079130A (ja) 2003-08-28 2005-03-24 Hitachi Metals Ltd 薄膜配線層
JP4730662B2 (ja) * 2005-03-02 2011-07-20 日立金属株式会社 薄膜配線層
JP2011523978A (ja) * 2008-04-28 2011-08-25 ハー ツェー シュタルク インコーポレイテッド モリブデン−ニオブ合金、かかる合金を含有するスパッタリングターゲット、かかるターゲットの製造方法、それから製造される薄膜、およびその使用
JP6016083B2 (ja) * 2011-08-19 2016-10-26 日立金属株式会社 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材

Also Published As

Publication number Publication date
CN104064549A (zh) 2014-09-24
CN104064549B (zh) 2016-08-31
TW201437405A (zh) 2014-10-01
TWI498441B (zh) 2015-09-01
KR20140116002A (ko) 2014-10-01
KR101553472B1 (ko) 2015-09-15
JP2014208887A (ja) 2014-11-06

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