KR101552279B1 - 박막 ｐｚｔ 구조의 접착력 강화 - Google Patents

박막 ｐｚｔ 구조의 접착력 강화 Download PDF

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Publication number
KR101552279B1
KR101552279B1 KR1020140054371A KR20140054371A KR101552279B1 KR 101552279 B1 KR101552279 B1 KR 101552279B1 KR 1020140054371 A KR1020140054371 A KR 1020140054371A KR 20140054371 A KR20140054371 A KR 20140054371A KR 101552279 B1 KR101552279 B1 KR 101552279B1
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KR
South Korea
Prior art keywords
layer
adhesive layer
lower electrode
electrode
passivation layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020140054371A
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English (en)
Korean (ko)
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KR20140131289A (ko
Inventor
데디 세티아디
웨이 티안
용 필 김
Original Assignee
시게이트 테크놀로지 엘엘씨
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Publication of KR20140131289A publication Critical patent/KR20140131289A/ko
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4873—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives the arm comprising piezoelectric or other actuators for adjustment of the arm
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4826—Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive
    • G11B5/483—Piezoelectric devices between head and arm, e.g. for fine adjustment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/081—Shaping or machining of piezoelectric or electrostrictive bodies by coating or depositing using masks, e.g. lift-off
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/082—Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/832—Nanostructure having specified property, e.g. lattice-constant, thermal expansion coefficient
    • Y10S977/837—Piezoelectric property of nanomaterial

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Moving Of The Head To Find And Align With The Track (AREA)
  • Micromachines (AREA)
KR1020140054371A 2013-05-03 2014-05-07 박막 ｐｚｔ 구조의 접착력 강화 Expired - Fee Related KR101552279B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/886,780 US8854772B1 (en) 2013-05-03 2013-05-03 Adhesion enhancement of thin film PZT structure
US13/886,780 2013-05-03

Publications (2)

Publication Number Publication Date
KR20140131289A KR20140131289A (ko) 2014-11-12
KR101552279B1 true KR101552279B1 (ko) 2015-09-10

Family

ID=50630658

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140054371A Expired - Fee Related KR101552279B1 (ko) 2013-05-03 2014-05-07 박막 ｐｚｔ 구조의 접착력 강화

Country Status (5)

Country Link
US (1) US8854772B1 (enExample)
EP (1) EP2800095A1 (enExample)
JP (1) JP2014225317A (enExample)
KR (1) KR101552279B1 (enExample)
CN (1) CN104218146A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9786308B1 (en) 2016-06-07 2017-10-10 Seagate Technology Llc Interconnect interposer attachable to a trailing edge of a slider
CN112201280B (zh) * 2019-07-08 2024-07-09 马格内康普公司 用于谐振改善的多层执行器电极构型
US11152024B1 (en) 2020-03-30 2021-10-19 Western Digital Technologies, Inc. Piezoelectric-based microactuator arrangement for mitigating out-of-plane force and phase variation of flexure vibration
WO2022118575A1 (ja) * 2020-12-01 2022-06-09 ローム株式会社 トランスデューサ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000269434A (ja) * 1999-03-18 2000-09-29 Sony Corp 半導体装置およびその製造方法
JP2009231405A (ja) * 2008-03-21 2009-10-08 Fujifilm Corp 圧電素子及びその製造方法
JP2011192887A (ja) * 2010-03-16 2011-09-29 Seiko Epson Corp 圧電素子、圧電アクチュエーター、液滴噴射ヘッド及び液滴噴射装置並びに圧電素子の製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1027446A (ja) * 1996-07-08 1998-01-27 Nec Corp キャリッジ機構及び該キャリッジ機構を備えた磁気ディスク装置
GB2324882B (en) 1997-04-29 2001-05-23 Daewoo Electronics Co Ltd Array of thin film actuated mirrors and method for the manufacture thereof
US7383727B2 (en) * 1999-05-20 2008-06-10 Seiko Epson Corporation Liquid cotainer having a liquid consumption detecting device therein
JP4362859B2 (ja) * 2001-01-26 2009-11-11 セイコーエプソン株式会社 インクジェット式記録ヘッドおよびプリンタ
CA2438360C (en) * 2001-12-18 2010-02-09 Matsushita Electric Industrial Co., Ltd. Piezoelectric element, ink jet head, angular velocity sensor, manufacturing method thereof, and ink jet printing apparatus
JP4146811B2 (ja) * 2004-03-03 2008-09-10 Ｔｄｋ株式会社 サスペンション、及びハードディスク装置
JP2007200534A (ja) * 2006-01-26 2007-08-09 Shinka Jitsugyo Kk 高密度磁気記録用スライダ
WO2007093921A2 (en) * 2006-02-14 2007-08-23 Delphi Technologies, Inc. Barrier coatings for a piezoelectric device
GB0602955D0 (en) * 2006-02-14 2006-03-29 Delphi Tech Inc Piezoelectric actuator
JP2008173924A (ja) * 2007-01-22 2008-07-31 Fuji Xerox Co Ltd 液滴吐出ヘッド
JP4897767B2 (ja) * 2008-10-21 2012-03-14 Ｔｄｋ株式会社 薄膜圧電体素子及びその製造方法並びにそれを用いたヘッドジンバルアセンブリ、及びそのヘッドジンバルアセンブリを用いたハードディスクドライブ
JP5085623B2 (ja) * 2009-09-18 2012-11-28 Ｔｄｋ株式会社 薄膜素子の製造方法及び薄膜素子並びにその薄膜素子を用いたヘッドジンバルアセンブリ、及び、ハードディスクドライブ
US8422172B1 (en) * 2010-10-01 2013-04-16 Western Digital Technologies, Inc. Actuator trace through a die
US8289652B2 (en) 2010-10-22 2012-10-16 Seagate Technology Llc Compact microactuator head assembly
JP2012174955A (ja) * 2011-02-23 2012-09-10 Stanley Electric Co Ltd 圧電アクチュエータ及びその製造方法
JP5592289B2 (ja) * 2011-02-25 2014-09-17 Ｔｄｋ株式会社 圧電素子及びその製造方法並びにその圧電素子を搭載したヘッドジンバルアセンブリ
JP5360129B2 (ja) * 2011-05-11 2013-12-04 Ｔｄｋ株式会社 ヘッド支持機構
US8310790B1 (en) * 2011-06-11 2012-11-13 Nhk Spring Co., Ltd Remote drive rotary head dual stage actuator
US8716858B2 (en) 2011-06-24 2014-05-06 Taiwan Semiconductor Manufacturing Company, Ltd. Bump structure with barrier layer on post-passivation interconnect
US9553195B2 (en) 2011-06-30 2017-01-24 Applied Materials, Inc. Method of IGZO and ZNO TFT fabrication with PECVD SiO2 passivation

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000269434A (ja) * 1999-03-18 2000-09-29 Sony Corp 半導体装置およびその製造方法
JP2009231405A (ja) * 2008-03-21 2009-10-08 Fujifilm Corp 圧電素子及びその製造方法
JP2011192887A (ja) * 2010-03-16 2011-09-29 Seiko Epson Corp 圧電素子、圧電アクチュエーター、液滴噴射ヘッド及び液滴噴射装置並びに圧電素子の製造方法

Also Published As

Publication number Publication date
US8854772B1 (en) 2014-10-07
JP2014225317A (ja) 2014-12-04
EP2800095A1 (en) 2014-11-05
CN104218146A (zh) 2014-12-17
KR20140131289A (ko) 2014-11-12

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