KR101549113B1 - Apparatus for aligning substrate and Method for deposition substrate using the same - Google Patents

Abstract

The present invention relates to a aligning apparatus for a substrate and a method for depositing a substrate using the same. The present invention relates to a lithographic apparatus, A mask shuttle on which the mask is seated; An aligning plate having an aligning pin passing through a through hole formed in the mask to support one surface of the substrate; And a through-hole opening / closing unit which is provided in the mask shuttle, opens the through-hole when loading / unloading the substrate, and closes the through-hole when the substrate is deposited. According to the present invention, it is possible to prevent unnecessary deposition, such as deposition of particles, by closing the through holes formed in the mask when depositing the substrate.

Description

[0001] The present invention relates to a method of aligning a substrate and a method of depositing a substrate using the same,

The present invention relates to a device for aligning a substrate and a method for depositing a substrate using the same, and more particularly, to a method for depositing a substrate by depositing a through hole formed in a mask when loading / unloading a substrate, And to a method of depositing a substrate using the same.

BACKGROUND ART Organic light emitting diodes (OLEDs) are self-light emitting devices that emit light by using an electroluminescent phenomenon that emits light when a current flows through a fluorescent organic compound. A backlight for applying light to a non- Therefore, a lightweight thin flat panel display device can be manufactured.

A flat panel display device using such an organic electroluminescent device has a fast response speed and a wide viewing angle, and is emerging as a next generation display device. Particularly, since the manufacturing process is simple, it is advantageous in that the production cost can be saved more than the conventional liquid crystal display device.

The organic electroluminescent device comprises an organic thin film such as a hole injecting layer, a hole transporting layer, a light emitting layer, an electron transporting layer, and an electron injecting layer which are the remaining constituent layers except for the anode and the cathode. / RTI >

In the vacuum thermal deposition method, a substrate is loaded on a substrate support in a vacuum chamber, a shadow mask having a predetermined pattern is aligned with a substrate, heat is applied to an evaporation source containing the evaporation material, Is evaporated onto the substrate.

 It is very important to precisely align the substrate with the shadow mask after the substrate is loaded on the substrate support in the vacuum chamber, since it becomes a cornerstone in subsequent processes. Accordingly, various aligning apparatuses and methods have been proposed.

Korean Patent Laid-Open No. 10-2006-0075110 discloses a method of manufacturing a large area full-color display panel. Referring to the prior patent documents, in order to provide a shadow mask for preventing deflection of a substrate during manufacture of a large area full-color organic EL display panel to prevent misalignment, a plurality of fins are formed around the central region A shadow mask for a full-color in which a plurality of patterns for a unit element and a plurality of holes through which the pins pass are mounted on a mask holder.

However, if a through hole is formed in the shadow mask to penetrate the shadow mask as in the above prior art, there is a problem that unnecessary deposition such as deposition of particles occurs due to deposition through the through hole.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve the problems of the prior art as described above, and it is an object of the present invention to provide a substrate for improving the quality of the deposition by opening the holes formed in the mask during loading / unloading of the substrate, And a method of depositing a substrate using the same.

According to an aspect of the present invention, there is provided a substrate aligning apparatus comprising: a mask frame on which a mask is mounted and through holes are formed; And a through hole opening / closing unit installed in the mask frame and opening the through hole when loading / unloading the substrate, and closing the through hole when depositing the substrate.

Wherein the mask frame comprises: a mask having the through-holes; And a mask shuttle on which the mask is seated.

And an alignment plate having an alignment pin passing through the through hole and supporting one side of the substrate.

And a pusher for pressing one side of the through-hole opening / closing unit to move the through-hole in a direction to open the through-hole.

Wherein the through-hole opening / closing unit comprises: a body provided at a seating end formed inside the mask shuttle; And an opening / closing member movably installed in the body, the opening / closing member having a through-hole opening / closing unit for opening / closing the through-hole.

And an interlock block movably installed on the body, connected to the opening and closing member, and the pusher being pressed.

And the elastic member may be provided at one side of the interlocking block to provide an elastic force in a direction in which the opening and closing member closes the through hole.

An upper surface of the interlocking block to which the pusher is pushed may be formed with an inclined interlocking surface.

The through-hole opening / closing unit may be respectively installed on the inner side of the mask shuttle.

The through-hole opening / closing part may be formed by projecting a plurality of through-holes from one side of the opening / closing member.

According to another embodiment of the present invention, there is provided a method of depositing a substrate according to the present invention, comprising: opening a through hole when unloading the substrate; Raising the alignment plate; Supporting the one surface of the substrate through the through-hole; Lowering the alignment plate; Closing the through hole after the align pin exits the through hole; And depositing the substrate.

According to the present invention, at the time of loading / unloading of a substrate, alignment of the substrate is facilitated by using an alignment pin passing through the through hole formed in the mask, and when the substrate is deposited, the through hole formed in the mask is closed, it is possible to prevent unnecessary deposition such as deposition of particles.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a aligning apparatus of a substrate according to an embodiment of the present invention; Fig.
2 is a perspective view showing a through-hole opening / closing unit of the present invention.
3 is a plan view showing the mask shuttle of the present invention.
4 is a cross-sectional view showing the substrate loaded on the mask shuttle of the present invention.
Figures 5a-5d are operational state diagrams illustrating deposition of a substrate in accordance with one embodiment of the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, an embodiment of a substrate aligning apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

2 is a perspective view showing a through-hole opening / closing unit of the present invention, FIG. 3 is a plan view showing a mask shuttle of the present invention, FIG. 3 is a plan view showing a mask shuttle of the present invention, 4 is a cross-sectional view showing the substrate loaded on the mask shuttle of the present invention.

According to the drawings, the substrate aligning apparatus according to the present invention includes a mask frame 5 on which a mask 10 is mounted and on which a through hole 14 is formed; And a through hole (14) for closing the through hole (14) when the substrate (1) is deposited, the through hole (14) being opened when loading / unloading the substrate (1) And a hole opening / closing unit (30).

Although the mask frame 5 is shown in FIG. 1 as a structure including the mask 10 and the mask shuttle 20, the present invention is not limited thereto. The mask frame 5 may have a single structure, It may perform the function of the mask shuttle 20.

The mask 10 forms the pattern 14 on the substrate 1 and is seated on the mask shuttle 20. The through hole 14 through which the alignment pins 52 provided in the alignment plate 50 pass is formed in the mask 10 in this embodiment. The through holes 14 may be formed at positions corresponding to the alignment pins 52 along the edge portions of the mask 10, respectively.

The mask shuttle 20 is formed in a rectangular frame shape having an open central portion. A mounting end 22 for mounting the mask 10 is provided on the inner surface of the mask shuttle 20 and an installation groove 24 for mounting the through hole opening / . Of course, the through-hole opening / closing unit 30 may be installed directly on the seat 22.

The through-hole opening / closing unit 30 is a portion provided for opening and closing the through-hole 14 as described above. If the through hole 14 is kept open at all times, unnecessary deposition such as deposition of particles through the through hole 14 may occur during the deposition of the substrate 1. Therefore, in the present embodiment, the through hole 14 is opened when the substrate 1 is aligned, and the through hole 14 is kept closed when the substrate 1 is deposited, thereby preventing unnecessary deposition Respectively.

The configuration for the through-hole opening / closing unit 30 is well shown in Fig. Referring to this, the through-hole opening / closing unit 30 includes a body 31 installed at the seating end 22; And an opening and closing member 35 movably installed in the body 31 and having a through-hole opening / closing part 36 for closing the through-hole 14. The through-hole opening / closing unit 30 may be installed on each of four inner sides of the mask shuttle 20.

The body 31 may be formed in a plate shape having a predetermined length. At both ends of the body 31, the interlocking block 32 is elastically supported by the elastic members 34. [ That is, the interlocking block 32 is movably installed on the upper surface of the body 31, and one side is supported by the elastic member 34 to be provided with an elastic force. The elastic member 34 provides an elastic force such that the through-hole opening / closing portion 36 is moved in the direction of closing the through-hole 14. [ Further, the interlocking block 32 is connected to the opening / closing member 35 so that substantially both of them can move together.

On the other hand, the upper surface of the interlocking block 32 is formed with an interlocking surface 33 on which the pusher 40 is directly pressed. The pusher 40 is provided for the operation of the through-hole opening and closing unit 30. When the pusher 40 presses the interlocking face 33 formed to be inclined, the pushing member 40 presses the interlocking block 32 And the opening and closing member 35 is moved together with the interlocking block 32. [ In this embodiment, the configuration of the pusher 40 is shown for movement of the interlocking block 32, but the present invention is not limited thereto and other configurations can be employed. Further, the pusher 40 is moved up and down in a state of being positioned above the mask shuttle 20 to press the interlocking surface 33 of the interlocking block 32.

The opening and closing member 35 is connected to one side of the interlocking block 33 as described above and is formed to be long along the moving direction of the interlocking block 33. The opening and closing member 35 has a length longer than that of the body 31, and a plurality of through-hole opening / closing portions 36 protrude from one side thereof. The through-hole opening / closing unit 36 has a size enough to close the through-hole 14, and a plurality of the through-hole opening / closing units 36 may protrude at a predetermined interval from one side of the opening / closing member 35.

The through-hole opening / closing portion 36 formed as described above moves together when the interlocking block 33 is moved to open / close the through-hole 14. As shown in FIG. 4, the through-hole opening / closing part 36 is formed so as to be upward sloped corresponding to the lower surface of the mask shuttle 20 formed to be inclined.

Hereinafter, the operation of the aligning apparatus of the substrate according to the present invention will be described in detail.

Figures 5A through 5D are operational state diagrams showing deposition of a substrate in accordance with one embodiment of the present invention.

5A is an unloaded state (a state in which the through hole 14 is opened) of the substrate 1. As shown in Fig. At this time, in order to align the substrate 1, the alignment pins 50 of the alignment plate 50 should penetrate the mask 10 to support the lower surface of the substrate 1. Accordingly, the pusher 40 is lowered as shown in FIG. 5A. When the pusher 40 presses the interlocking surface 33 of the interlocking block 32, the interlocking block 32 moves in one direction by interlocking with the pushing. That is, the interlocking block 32 moves in the left direction on the basis of FIG.

When the interlocking block 32 is moved as described above, the through-hole opening / closing portion 36, which closes the through-hole 14 while the open / close member 35 is moved together, opens the through-hole 14. For reference, FIG. 5A shows a cross section cut around the open through-hole 14.

The alignment plate 50 is raised in order to align the substrate 1 with the above-described through-hole 14 being open. The alignment pins 52 of the elevated alignment plate 50 pass through the through holes 14 to support the lower surface of the substrate 1 to align the substrate 1. [ This state is shown in Fig. 5B.

Next, as shown in FIG. 5C, the alignment plate 50 is lowered due to the alignment of the substrate 1. At this time, the substrate 1 supported by the alignment pins 52 is loaded on the mask 10 in the process of descending. Further, the align pin (52) comes out of the through hole (14), and at the same time, the pusher (40) is raised. When the pusher 40 is lifted up, the interlocking block 40 pushed by the pusher 40 moves to the original position by the restoring force of the elastic member 34. [ Then, the through-hole opening / closing portion 36 closes the through-hole 14 while the opening / closing member 35 is moved together with the interlocking block 40.

The substrate 1 is aligned and the through hole 14 is closed, thereby depositing the substrate 1 as shown in Fig. 5D. In this embodiment, since the through-hole 14 is closed as described above in the course of the deposition of the substrate 1, it is possible to prevent unnecessary deposition on the substrate 1 through the through-hole 14.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It belongs to the scope of right.

1: substrate 5: mask frame
10: mask 12: pattern
14: Through hole 20: Mask shuttle
22: seat end 24: installation groove
30: through-hole opening / closing unit 31: body
32: interlocking block 33: interlocking face
34: elastic member 35: open / close member
36: through hole opening / closing part 40: pusher
50: alignment plate 52: alignment pin

Claims (11)

A mask frame on which a mask is seated and through holes are formed; And
And a through-hole opening / closing unit that is provided in the mask frame and opens the through-hole when the substrate is loaded / unloaded and closes the through-hole when the substrate is deposited,
The mask frame includes:
A mask having the through-holes formed therein; And
And a mask shuttle on which the mask is seated,
The through-hole opening /
A body installed at a seating end formed inside the mask shuttle; And
And an opening and closing member movably installed on the body, the opening and closing member having a through-hole opening and closing unit for opening and closing the through-hole. The method according to claim 1,
Further comprising an alignment plate having an alignment pin penetrating through the through-hole to support one surface of the substrate. 3. The method of claim 2,
Further comprising a pusher for pressing one side of the through-hole opening / closing unit to move the through-hole in a direction to open the through-hole. The method of claim 3,
Further comprising an interlocking block movably installed on the body and connected to the opening and closing member, the interlocking block pushing the pusher. 5. The method of claim 4,
And an elastic member provided on one side of the interlocking block to provide an elastic force in a direction in which the opening and closing member closes the through hole. 5. The method of claim 4,
Wherein an upper surface of the interlocking block to which the pusher is pushed is formed with an inclined interlocking surface. The method according to claim 1,
Wherein the through-hole opening / closing unit is provided on an inner surface of the mask shuttle, respectively. The method according to claim 1,
Wherein a plurality of through-hole opening / closing portions protrude from one side of the opening / closing member. 9. A method of depositing a substrate using an alignment apparatus for a substrate according to any one of claims 1 to 8,
Opening the through hole when unloading the substrate;
Raising the alignment plate;
Supporting the one surface of the substrate through the through-hole;
Lowering the alignment plate;
Closing the through hole after the align pin exits the through hole; And
And depositing the substrate. ≪ RTI ID = 0.0 > 11. < / RTI > delete delete

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