KR101561222B1 - Apparatus for rotating substrate - Google Patents

Abstract

A substrate rotating apparatus is disclosed. According to an aspect of the present invention, there is provided a substrate rotating apparatus including: a process chamber in which rotation of a substrate is advanced; A substrate flip unit disposed within the process chamber and rotating the substrate when the substrate is seated; And a clamping unit coupled to the substrate flip unit movably so as to press the substrate such that the substrate is seated on the substrate flip unit.

Description

[0001] APPARATUS FOR ROTATING SUBSTRATE [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate rotating apparatus, and more particularly, to a substrate rotating apparatus capable of easily clamping a substrate to a substrate flip unit by clamping a clamp unit to a substrate flip unit for rotating the substrate .

In general, the substrate refers to a flat panel display (FPD) such as a plasma display panel (PDP), a liquid crystal display (LCD), and organic light emitting diodes (OLED) Semiconductor wafers, photomask glass, and the like.

Here, the substrate as the flat panel display element (FPD) and the substrate as the wafer for semiconductor are different from each other in terms of material, use, and the like, but a series of processing steps for the substrates, for example, exposure, development, etching, strip, The processes such as rinsing, cleaning and the like are substantially very similar, and the substrates are produced by sequentially progressing these processes.

An organic light emitting display (OLED), which is currently popular among flat panel display devices (FPDs), is a cemented carbide type display device that implements a color image by self-emission of organic materials. And has a wide viewing angle and a fast response speed, and has been attracting attention as a next-generation promising display device because of its simple structure and high light efficiency.

The OLED includes an anode, a cathode, and organic layers interposed between the anode and the cathode. Here, the organic layers include at least a light emitting layer, and a hole injecting layer, a hole transporting layer, an electron transporting layer, .

The OLED can be divided into a polymer organic light emitting device and a low molecular weight organic light emitting device depending on an organic film, especially a material forming the light emitting layer.

In order to realize a full color in an OLED, a light emitting layer must be patterned. As a method of manufacturing a large OLED, a direct patterning method using a fine metal mask (hereinafter referred to as FMM) and a laser induced thermal Imaging method, and a method using a color filter.

The manufacturing process of the OLED includes a pattern forming process, a deposition process, an encapsulating process, and a laminating process in which a substrate having undergone a deposited substrate and an encapsulating process is attached. Here, the deposition process is a process of attaching the deposition material provided in the evaporation source to the substrate.

On the other hand, before the deposition process is performed, the substrate may be rotated so that the positions of the upper and lower substrates of the substrate are changed according to various needs.

For example, in the process of the previous step of the deposition process, when the upper and lower substrates of the substrate are turned upside down, that is, when the upper and lower substrates are positioned on the lower and upper sides, And the entire substrate is rotated so that the lower plate is positioned at the lower part.

For this purpose, a flip process may be performed on the substrate that is rotated so that the positions of the upper and lower substrates of the substrate are changed before proceeding with the deposition process.

Here, in the conventional case, the clamp for fixing the substrate when the substrate is rotated is disposed separately from the flip device, and is moved to the flip device when the substrate is fixed. However, since the time required for moving the clamp is increased and the tact time There was an increasing problem.

Further, when the clamp driving unit for moving the clamp is disposed inside the process chamber, the turning radius is increased, which increases the size of the process chamber, thereby increasing the cost required for the entire process.

Korea Registered Patent Registration No: 10-1314540 (Date of Notification: October 04, 2013)

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a substrate flip unit in which a clamp unit is movably coupled to a substrate flip unit for rotating a substrate, thereby easily mounting the substrate on the substrate flip unit, Is reduced, and the turning radius is reduced, so that the cost can be reduced as the size of the process chamber is reduced.

According to an aspect of the present invention, there is provided a plasma processing apparatus comprising: a processing chamber in which rotation of a substrate is advanced; A substrate flip unit disposed within the process chamber and rotating the substrate when the substrate is seated; And a clamping unit coupled to the substrate flip unit movably so as to press the substrate so that the substrate is seated on the substrate flip unit.

The clamp unit may further include a clamp driving unit for contacting or releasing the clamp unit to drive the clamp unit.

The clamp unit may further include an elastic unit coupled to the clamp unit and providing an elastic force to the clamp unit.

Further, the clamp unit may further include: a substrate pressing unit which is brought into contact with the substrate to press the substrate; And a driving force transmitting unit for contacting the substrate pressing unit and transmitting a driving force to the substrate pressing unit.

The driving force transmitting unit includes: a substrate pressing unit driving member which is brought into contact with the substrate pressing unit; A pivoting member coupled to the substrate pressing unit driving member and rotatable about a pivot axis; And a driving force transmitting member coupled to the pivoting member and adapted to be brought into contact with the clamp driving unit.

Further, the elastic unit may be a coil spring, one side of the coil spring may be coupled to the substrate flip unit, and the other side of the coil spring may be coupled to the substrate pressing unit.

The apparatus may further include a vertical movement guide coupled to the substrate pressing unit to guide the vertical movement of the substrate pressing unit.

In addition, the up-and-down movement guide may be provided by an LM guide (Linear Motion Guide).

The substrate pressing unit driving member may include: a rotating unit recombining unit coupled to the rotating member; A substrate pressing unit pressing part which is disposed apart from the rotary part recombining part and which presses the substrate pressing unit; And an intermediate connection part connecting the pivotal part recombination part and the substrate pressing unit pressing part.

Further, the substrate pressing unit may be arranged to press the substrate upward from the lower side of the substrate.

The substrate flip unit may include: a bottom plate disposed on the lower side; A side plate coupled to a side surface of the bottom plate; And a substrate mount plate coupled to the side plate and on which the substrate is mounted.

In addition, the substrate may be seated below the substrate seating plate.

The apparatus may further include an impact mitigation unit coupled to a lower side of the substrate seating plate to mitigate an impact upon the substrate.

In addition, the shock-absorbing unit may be formed of a polyetheretherketone (PEEK).

Further, the apparatus may further include a substrate inlet unit provided to draw the substrate into the process chamber.

The substrate drawing unit may further include: a substrate supporting plate for supporting the substrate; And a substrate loading member coupled to the substrate support plate and on which the substrate is loaded.

The plurality of clamp units may be provided, and the substrate loading member may be movable between a first clamp unit and a second clamp unit disposed adjacent to the first clamp unit.

The clamp drive unit may further include: a cylinder unit disposed outside the process chamber; And a push unit coupled to the cylinder unit and contacting the clamp unit inside the process chamber to press the clamp unit.

The push unit includes: a connection packet coupled to the cylinder unit; And a protrusion coupled to the connection packet and adapted to press the clamp unit.

In addition, the protrusions may be coupled to the upper and lower sides of the connection packet, respectively.

Embodiments of the present invention allow a clamp unit to be fluidly coupled to a substrate flip unit that rotates the substrate to easily seat the substrate on the substrate flip unit, thereby reducing clamp time and reducing tact time , The turning radius is reduced, and the cost can be reduced as the size of the process chamber is reduced.

1 is a plan view of a substrate rotating apparatus according to an embodiment of the present invention.
FIGS. 2 to 7 are front views of the operation of the substrate rotating apparatus according to the embodiment of the present invention.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

The terms " one side " and " other side " used in this specification may mean a specified side, or do not mean a specified side, but any side of a plurality of sides may be referred to as one side, And the other side is referred to as the other side.

Further, it is to be noted that the term " connection " as used herein includes not only a case where one member is directly connected to another member but also a case where one member is indirectly connected to another member through a coupling member.

As used herein, the term 'flip process' refers to a process of rotating the substrate so that the positions of the upper and lower substrates of the substrate are changed before proceeding with the deposition process.

As used herein, the substrate refers to a substrate for a flat display. The flat display may be an LCD (Liquid Crystal Display), a PDP (Plasma Display Panel), or an OLED (Organic Light Emitting Diodes).

However, in this embodiment, for convenience of explanation, a glass substrate for OLED (Organic Light Emitting Diodes) will be simply described as a substrate.

FIG. 1 is a plan view of a substrate rotating apparatus according to an embodiment of the present invention, and FIGS. 2 to 7 are front views illustrating operations of a substrate rotating apparatus according to an embodiment of the present invention.

Referring to these drawings, a substrate rotating apparatus 100 according to an embodiment of the present invention includes a process chamber 200 in which rotation of a substrate 700 is progressed, A substrate flip unit 300 for rotating the substrate 700 when the substrate 700 is mounted on the substrate flip unit 300, And a clamp unit 400 for pressing the substrate 700 to be seated.

Referring to FIG. 1, the process chamber 200 is provided to advance the rotation of the substrate 700. As described above, if necessary, the upper and lower plates of the substrate 700 are turned upside down in the process chamber 200 As shown in FIG.

This may be accomplished by rotating the substrate 700 through a flip process to correct it when the top and bottom plates of the substrate 700 are inverted in another process preceding the deposition process, The substrate 700 may be rotated to deposit the deposition surface in the opposite direction of the substrate 700. [

That is, before the deposition process, the substrate 700 is drawn into the process chamber 200 provided for the flip process, and then the substrate 700 is rotated (rotated) so that the positions of the upper and lower plates of the substrate 700 are changed And the rotated substrate 700 is moved to a deposition process chamber for deposition notarization and the deposition process proceeds.

Here, the inside of the process chamber 200 may be formed with a vacuum atmosphere so that the flip process for the substrate 700 can be performed reliably.

To this end, a vacuum pump (not shown) may be connected to one side of the process chamber 200 as a means for maintaining the inside of the process chamber 200 in a vacuum atmosphere. Here, the vacuum pump (not shown) may be a so-called turbo pump.

2 to 7, a substrate flip unit 300 is disposed inside the process chamber 200 and is provided to rotate the substrate 700 when the substrate 700 is mounted on the substrate flip unit 300 .

The substrate flip unit 300 includes a bottom plate 310 disposed on the lower side, a side plate 320 coupled to a side surface of the bottom plate 310, And a substrate mounting plate 330 on which the substrate is mounted.

That is, when the substrate 700 is mounted on the lower side of the substrate seating plate 330 while being pressed upward from the lower side of the substrate seating plate 330, the substrate flip unit 300 is rotated by 180 °, The substrate 700 mounted on the plate 330 may be inverted and the positions of the upper plate of the substrate 700 and the lower plate of the substrate 700 may be mutually changed.

The opening and closing member 350 may be coupled to the substrate flip unit 300 so that the substrate 700 can be drawn into the substrate flip unit 300. [ And to close the substrate flip unit 300 to rotate the substrate 700 when the substrate 700 is drawn into the substrate flip unit 300 (see FIGS. 6 and 7).

That is, when the open / close member 350 opens the substrate flip unit 300, the substrate 700 is loaded on the substrate take-in unit 900 to be described later, Unit 300, as shown in FIG.

4, the substrate 700, which is drawn into the substrate flip unit 300, may be placed on the lower side of the substrate seating plate 330.

3), the substrate inlet unit 900 is moved upward and the lower side of the substrate receiving plate 330 is moved to the upper side of the substrate receiving plate 900. In other words, when the substrate 700 is drawn into the substrate flip unit 300 by the substrate inlet unit 900 The substrate pressing unit 410 of the clamp unit 400 presses the substrate 700 upward from the lower side of the substrate 700 as will be described later.

The substrate 700 is positioned between the substrate seating plate 330 and the substrate pressing unit 410 and is mounted on the substrate seating plate 330 and is thereafter rotated by a rotation driving unit 340, Fig. 1) rotates the substrate flip unit 300, the substrate 700 mounted on the substrate mounting plate 330 is also rotated.

2 to 6, the shock-absorbing unit 331 can be coupled to the underside of the substrate seating plate 330 to mitigate the impact generated when the substrate 700 is seated on the substrate seating plate 330 have.

That is, as described above, the substrate 700 is mounted on the substrate seating plate 330 at a lower side of the substrate seating plate 330 while rising toward the lower side of the substrate seating plate 330 through the substrate inlet unit 900, In this case, the substrate 700 may be damaged due to an impact when the substrate 700 is seated on the substrate seating plate 330.

In order to prevent this, an impact relaxation unit 331 is coupled to the lower side of the substrate seating plate 330. When the substrate 700 rises to be seated on the substrate seating plate 330, The unit 331 is contacted and the impact is relieved, whereby the damage of the board 700 can be prevented.

Here, the shock absorbing unit 331 may be made of various synthetic rubbers capable of absorbing impact, or may be made of various kinds of composite resins. Further, the shock absorbing unit 331 may be provided with, for example, a polyetheretherketone (PEEK) having excellent impact resistance.

Here, the polyetherketone has an excellent abrasion resistance and thus has an effect of reducing the replacement cost.

2 to 7, the clamp unit 400 is movably coupled to the substrate flip unit 300, and the substrate 700 is fixed to the substrate mounting plate 330 Pressure.

That is, as described above, when the substrate 700 comes into contact with the lower side of the substrate seating plate 330, the clamp unit 400 presses the substrate 700 upward from the lower side of the substrate 700, 700 are seated on the substrate seating plate 330.

Here, the clamp unit 400 may be configured to include a substrate pressing unit 410 and a driving force transmitting unit 420.

The substrate pressing unit 410 is provided to contact the substrate 700 to press the substrate 700.

Referring to FIG. 2, the substrate pressing unit 410 is provided so as to be movable in the up and down direction in contact with the lower side of the substrate pressing unit driving member 421 to be described later. The substrate pressing unit driving member 421 is connected to the clamp driving unit The substrate pressing unit 410 which is in contact with the lower side of the substrate pressing unit driving member 421 is pressed from the substrate pressing unit driving member 421 and moved in the downward direction .

Here, since the elastic unit 600 is coupled to the substrate pressing unit 410, when the substrate pressing unit 410 moves downward, the elastic unit 600 is expanded in the downward direction (see FIG. 3).

When the clamp driving unit 500 is released from the driving force transmitting member 429, the elastic unit 600 contracts upward due to the elastic recovery force of the elastic unit 600, The pressurizing unit 410 also moves upward (refer to Fig. 4).

1, the substrate pressing unit 410 may be provided so as to be movable along a linear path in a vertical direction. To guide the upward and downward movement of the substrate pressing unit 410, May be coupled to the substrate pressurizing unit 410.

2 to 7 do not show the up-and-down movement guide 800, but as shown in Fig. 1, the up-and-down movement guide 800 ) Can be combined.

Here, the vertical movement guide 800 may be provided as an LM guide (Linear Motion Guide) so that the substrate pressing unit 410 can move linearly.

Meanwhile, the elastic unit 600 may be provided by a coil spring. However, the present invention is not limited thereto, and various kinds of springs capable of providing resilient resilience can be included.

Here, the coil spring may be provided such that one side is coupled to the substrate flip unit 300 and the other side is coupled to the substrate pressing unit 410 to provide the substrate pressing unit 410 with an elastic recovery force.

The driving force transmitting unit 420 is provided to contact the substrate pressing unit 410 and to transmit the driving force to the substrate pressing unit 410. [

2 to 6, the driving force transmitting unit 420 may be configured to include a substrate pressing unit driving member 421, a rotating member 427, and a driving force transmitting member 429.

The substrate pressing unit driving member 421 contacts the substrate pressing unit 410 to provide a driving force for the downward movement of the substrate pressing unit 410. That is, as described above, when the substrate pressing unit driving member 421 contacts the substrate pressing unit 410 and rotates in the clockwise direction, the substrate joining unit 410 moves downward with reference to FIG.

The pivoting member 427 is coupled to the substrate pressing unit driving member 421, and is rotatable around the pivot axis. That is, when the tiltable member 427 rotates about the rotation axis, the substrate pressing unit driving member 421 coupled to the tiltable member 427 rotates and rotates to provide the driving force to the substrate pressing unit 410 do.

The driving force transmitting member 429 is coupled to the tiltable member 427 and is provided to transmit the driving force to the tiltable member 427.

That is, when the clamp driving unit 500 contacts the driving force transmitting member 429 to transmit the driving force, the driving force transmitting member 429 transmits the driving force to the rotating member 427 and the rotating member 427 ).

When the clamp drive unit 500 contacts and presses the driving force transmitting member 429, the pivoting member 427 coupled to the driving force transmitting member 429 rotates in the clockwise direction with reference to Fig. 3, The substrate pressing unit driving member 421 coupled to the member 427 rotates in a clockwise direction in conjunction with the rotation of the rotating member 427. [

The elastic unit 600 provided by a coil spring or the like may be coupled to the substrate pressing unit 410 to provide an elastic force to the substrate pressing unit 410. Here, The clamp drive unit 500 releases the contact from the drive force transmitting member 429 as shown in FIG. 4 when the substrate 700 is mounted on the substrate mount plate 330 after the drive shaft 427 is rotated in the clockwise direction with reference to FIG. do.

In this case, the elastic unit 600 such as a coil spring provides an elastic restoring force to the substrate pressing unit 410, wherein the rotating member 427 is rotated in the counterclockwise direction with reference to Fig. 4, The unit 410 moves upward and contacts the substrate 700 to press the substrate 700.

3, the substrate pressing unit driving member 421 may include a rotating unit recombination unit 422, a substrate pressing unit pressing unit 423, and an intermediate connection unit 424. [

Referring to the enlarged view of FIG. 2 and FIG. 3, the rotary part recombination part 422 can be formed of a longitudinal member and is coupled to the pivoting member 427 by a fastening member such as a bolt.

The intermediate connection portion 424 is coupled to the rotary portion recombination portion 422 so that one side thereof is at an angle with the rotary portion recombination portion 422 and the other side is connected to the substrate pressing unit pressing portion 423 Directional member.

The substrate pressing unit pressing portion 423 is provided as a longitudinal member which is coupled to the intermediate connecting portion 424 and spaced apart from the rotary portion recombining portion 422, (Not shown).

On the other hand, the substrate pressing unit pressing portion 423 may be provided to press the substrate 700. That is, the substrate pressing unit pressing portion 423 may be provided so as to contact the substrate 700 by rotating in the counterclockwise direction with reference to FIG.

In this case, the substrate pressing unit pressing portion 423 and the substrate pressing unit 410 together can be provided to press the substrate 700, or the substrate pressing unit pressing portion 423 and the substrate pressing unit 410 One may be provided to press the substrate 700.

Referring to FIGS. 1 and 2, the clamp drive unit 500 may include a cylinder unit 510 and a push unit 520.

Here, the cylinder unit 510 is disposed outside the process chamber 200, that is, at an area provided at atmospheric pressure, to provide a driving force to the push unit 520.

The pushing unit 520 is coupled to the cylinder unit 510 and is driven by receiving a driving force from the cylinder unit 510. The pushing unit 520 is in contact with the driving force transmitting member 429 in the process chamber 200, (See Fig. 3).

2, the push unit 520 may include a connection packet 521 coupled to the cylinder unit 510 and a protrusion 522 coupled to the connection packet 521, 3, the projecting portion 522 is provided so as to press the driving force transmitting member 429.

As shown in FIGS. 2 to 7, the protrusions 522 may be provided as a pair and may be coupled to the upper and lower sides of the connection packet 521, respectively, .

3, the upper projecting portion 522a presses the driving force transmitting member 429, but the lower projecting portion 522b does not contact the driving force transmitting member 429. As shown in Fig.

When the projecting portion 522 is provided as a pair of the upper projecting portion 522a and the lower projecting portion 522b, the lower projecting portion 522b, while the upper projecting portion 522a presses the driving force transmitting member 429, Since the tilting member 427 is wrapped by the upper projecting portion 522a and the lower projecting portion 522b when the driving force transmitting member 429 of the projecting portion 522 is pressed, .

1 and 3, a substrate drawing unit 900 is provided to draw the substrate 700 into the process chamber 200. [

That is, if the substrate 700 is placed on the upper part of the substrate inlet unit 900, the substrate inlet unit 900 moves into the process chamber 200 and moves up to the substrate receiving plate 330 side, When the substrate 700 is placed on the plate 330 and the substrate 700 is pressed by the clamp unit 400, the substrate drawing unit 900 moves down to the lower side of the substrate placing plate 330 and moves to the outside of the process chamber 200 do.

Here, the substrate inlet unit 900 is provided with a driving robot engagement member 930 so as to be coupled to a driving robot (not shown). That is, the movement of the substrate inlet unit 900 can be controlled by moving the driving robot (not shown) to the driving robot engagement member 930 of the substrate inlet unit 900 and moving in the front, rear, left, right, and up and down directions.

1, the substrate drawing unit 900 includes a substrate supporting member 910 for supporting a substrate 700, a substrate loading member 910 which is coupled to the substrate supporting member 910 and on which the substrate 700 is mounted 920).

Herein, the substrate supporting member 910 is coupled to the substrate loading member 920 at one side of the substrate loading member 920 on which the substrate 700 is mounted, and is configured to support the substrate loading member 920 and the substrate 700 do.

1, a plurality of the clamp units 400 may be provided. In this case, the substrate loading member 920 includes a first clamp unit 400a, a second clamp unit 400b, And may be provided so as to be movable between the adjacent second clamp units 400b.

That is, as shown in FIG. 1, a substrate loading member 920 is provided to be movable through a plurality of clamp units 400a and 400b. In this case, when the substrate pressing unit 410 flows, When the substrate loading member 920 is raised or lowered, the substrate loading member 920 and the substrate pressing unit 410 are prevented from interfering with each other.

A clamp unit 400 is movably coupled to a substrate flip unit 300 that rotates a substrate 700 in a substrate rotating apparatus 100 according to an embodiment of the present invention to form a substrate 700 ) Is mounted on the substrate flip unit 300, and then the flip process is performed through the rotation of the substrate flip unit 300

2, before the substrate 700 is drawn into the substrate flip unit 300, the clamp driving unit 500 is released from the driving force transmitting member 429, And may be located at the bottom of the seating plate 330. Here, the opening and closing member (not shown in FIGS. 2 to 5) is provided to open the substrate flip unit 300.

3, the clamp driving unit 500 contacts the driving force transmitting member 429 to press the driving force transmitting member 429, and the pivoting member 427 coupled to the driving force transmitting member 429 And the substrate pressing unit driving member 421 coupled to the pivoting member 427 rotates in a clockwise direction in association with the rotation.

Since the substrate pressing unit 410 is in contact with the lower side of the substrate pressing unit driving member 421, the substrate pressing unit driving member 421 rotates in the clockwise direction to press the substrate pressing unit 421.

Then, the substrate pressing unit 421 moves downward along the up-and-down movement guide 800. [

Here, a driving robot (not shown) coupled to the substrate drawing unit 900 on which the substrate 700 is loaded is operated so that the substrate drawing unit 900 is moved to the substrate flip unit 300, and moves in the upward direction in which the substrate seating plate 330 is disposed.

At this time, the substrate loading member 920 of the substrate loading unit 920 moves upward through the plurality of clamp units 400a and 400b (see FIG. 1), so that the substrate loading member 920 and the substrate pressing unit 920 410 are not interfered with each other.

4, the substrate 700 can be seated on the substrate seating plate 330 without being damaged by the shock absorbing unit 331 coupled to the lower side of the substrate seating plate 330, , The clamp drive unit 500 is released from the drive force transmitting member 429.

In this case, when the coil spring provides elastic restoring force to the substrate pressing unit 410, the substrate pressing unit 410 moves upward along the up-and-down moving guide 800 and moves to the substrate pressing unit 410, As shown in Fig.

4 by the action of the coil spring and is brought into contact with the lower side of the substrate 700 which is seated on the substrate seating plate 330 to move the substrate 700 And pressurized in the upward direction.

5, the substrate pull-in unit 900 is lowered and the substrate 700 loaded into the substrate pull-in unit 900 is separated from the substrate pull-in unit 900.

Thereby, the substrate 700 can be supported and fixed between the substrate seating plate 330 and the substrate pressing unit 410.

6, the substrate inlet unit 900 is moved to the outside of the substrate flip unit 300 by the operation of a driving robot (not shown), and then the opening and closing member 350 is moved to the substrate flip unit 300 are closed.

7, a flip process is performed in which the substrate flip unit 300 is rotated 180 ° by the rotation drive unit 340 (see FIG. 1) within the process chamber 200, whereby the substrate 700 The mutual position of the upper plate and the lower plate can be changed.

After the flip process is completed, the substrate 700 is moved to the deposition process chamber where the deposition process is performed, and then the deposition process is performed.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: substrate rotating device 200: process chamber
300: substrate flip unit 310: bottom plate
320: side plate 330: substrate seating plate
331: shock-absorbing unit 340: rotation driving unit
350: opening / closing member 400: clamp unit
410: substrate pressing unit 420: driving force transmitting unit
421: Substrate pressing unit driving member 422: Pivoting unit recombination unit
423: substrate pressing unit pressing portion 424: intermediate connecting portion
427: rotating member 429: driving force transmitting member
500: clamp drive unit 510: cylinder unit
520: push unit 521: connection packet
522: protrusion 600: elastic unit
700: substrate 800: up-and-down guide
900: substrate inlet unit 910: substrate support member
920: substrate loading member 930: driving robot joining member

Claims (20)

A process chamber in which the rotation of the substrate is advanced;
A substrate flip unit disposed within the process chamber and rotating the substrate when the substrate is seated;
A clamp unit coupled to the substrate flip unit movably so as to press the substrate such that the substrate is seated on the substrate flip unit; And
And a clamp drive unit for contacting or releasing the clamp unit to drive the clamp unit,
The clamp drive unit includes:
A cylinder unit disposed outside the process chamber; And
And a pushing unit coupled to the cylinder unit, the pushing unit contacting the clamping unit inside the process chamber to press the clamping unit. delete The method according to claim 1,
Further comprising an elastic unit coupled to the clamp unit and providing an elastic force to the clamp unit. The method of claim 3,
The clamp unit includes:
A substrate pressing unit which is brought into contact with the substrate to press the substrate;
And a driving force transmitting unit for contacting the substrate pressing unit and transmitting a driving force to the substrate pressing unit. 5. The method of claim 4,
The driving force transmitting unit includes:
A substrate pressing unit driving member contacting the substrate pressing unit;
A pivoting member coupled to the substrate pressing unit driving member and rotatable about a pivot axis; And
And a driving force transmitting member coupled to the pivoting member and adapted to be brought into contact with the clamp driving unit. 6. The method of claim 5,
The elastic unit is provided with a coil spring,
Wherein one side of the coil spring is coupled to the substrate flip unit, and the other side of the coil spring is coupled to the substrate pressing unit. The method according to claim 6,
Further comprising an up-and-down movement guide coupled to the substrate pressurizing unit for guiding the up-and-down movement of the substrate pressurizing unit. 8. The method of claim 7,
Wherein the up-and-down movement guide is provided by an LM guide (Linear Motion Guide). 9. The method according to any one of claims 5 to 8,
Wherein the substrate pressing unit driving member comprises:
A rotating unit recombining unit coupled to the rotating member;
A substrate pressing unit pressing part which is disposed apart from the rotary part recombining part and which presses the substrate pressing unit; And
And an intermediate connection part for connecting the rotary part recombination part and the substrate pressing unit pressing part. 10. The method of claim 9,
Wherein the substrate pressing unit is arranged to press the substrate upward from the lower side of the substrate. The method according to claim 1,
Wherein the substrate flip unit comprises:
A bottom plate disposed on the lower side;
A side plate coupled to a side surface of the bottom plate; And
And a substrate mounting plate coupled to the side plate and on which the substrate is mounted. 12. The method of claim 11,
Wherein the substrate is seated below the substrate seating plate. 13. The method according to claim 11 or 12,
Further comprising an impact damping unit coupled to a lower side of the substrate seating plate to mitigate an impact upon seating the substrate. 14. The method of claim 13,
Wherein the shock absorbing unit is provided with a polyetherether ketone (PEEK). The method according to claim 1,
Further comprising a substrate pull-in unit configured to pull the substrate into the process chamber. 16. The method of claim 15,
The substrate withdrawing unit includes:
A substrate support plate for supporting the substrate; And
And a substrate loading member coupled to the substrate support plate and onto which the substrate is loaded. 17. The method of claim 16,
The clamp unit may include a plurality of clamp units,
Wherein the substrate loading member comprises:
Wherein the first clamping unit is movable between a first clamping unit and a second clamping unit disposed adjacent to the first clamping unit. delete The method according to claim 1,
The push unit includes:
A connection packet coupled to the cylinder unit; And
And a protrusion coupled to the connection packet, the protrusion being adapted to press the clamp unit. 20. The method of claim 19,
Wherein the protrusions are provided in pairs and are coupled to the upper and lower sides of the connection packet, respectively.

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