KR100627688B1 - Small area substrate holder installable in large area substrate holder - Google Patents

Abstract

The present invention relates to a small-area substrate holder that can be mounted to a large-area substrate holder, the configuration of which is formed in a size and shape that can be mounted to a large-area substrate holder, the table is cut in the center to raise the small-area substrate; A plurality of alignment means for correcting the position of the small area substrate placed on the table; A guide shaft provided below the table and movable up and down through the table; And a mask frame connected to the guide shaft and mounted with the mask for the small area substrate.

According to the present invention, there is an effect that a small area substrate can be processed in an apparatus for processing a large area substrate.

Small area substrate. Large area substrate. Align.

Description

Small area substrate holder installable in large area substrate holder

1 is a cross-sectional view of a conventional large area substrate processing apparatus.

FIG. 2 illustrates alignment means for a large area substrate in the processing apparatus shown in FIG. 1.

3 is a plan view of a small area substrate holder mountable to a large area substrate holder according to the present invention.

4 is a cross-sectional view of FIG. 3.

5 is an enlarged view of a portion “A” of FIG. 4.

6 shows a state in which the substrate holder of the present invention is mounted on a large-area substrate deposition apparatus.

FIG. 7 shows the aligning means of the small area substrate in FIG. 6.

** Explanation of symbols for the main parts of the drawings **

500: small area substrate holder 510: small area substrate seating part

512: table 514: guide shaft

516: mask for small area substrate 518: protrusion

520: mask frame for small area substrate 528: small area substrate alignment means

530: spring

531a, 531b: spring holder 533: bolt

The present invention relates to a small area substrate holder that can be mounted to a large area substrate holder. More particularly, the present invention relates to a small area substrate that can be mounted to a large area substrate holder in a substrate processing apparatus for processing a large area substrate. It relates to a substrate holder.

A conventional substrate processing apparatus will be described. 1 and 2 illustrate a deposition apparatus for depositing organic materials on a conventional large area substrate.

As shown in FIG. 1, a substrate 110 is mounted inside the substrate S, and a chamber 110 in which deposition is performed on the substrate S, and provided inside the chamber 110 to fix side surfaces of the substrate S. A first driving part 200, a second driving part 200 'provided at an upper portion orthogonal to the first driving part 200 to provide a tensile force by pneumatic pressure so that sag does not occur, and an upper surface of the chamber 110. In the process of evaporating and evaporating the organic material on the substrate S provided in the chamber 110, the rotating lifting part 300 rotates so that the organic material is distributed on the substrate S as a whole.

Here, the chamber 110 has an internal space that is isolated from the outside, the entrance (not shown) is formed on one side so that the substrate (S) can be carried in and out of the gate (opening and closing the gate ( Not shown in the figure), the substrate S is disposed therein, and the organic thin film is deposited on the substrate S.

In addition, a vacuum pump P is provided at each of the bottom edges of the chamber 110, and the vacuum pump P is a component that lowers the internal pressure of the chamber 110. That is, in order to deposit pure organic material on the surface of the substrate S, the organic material should be deposited in a state in which impurities in the chamber 110 are removed. Thus, by inhaling and removing the gas inside the deposition chamber 110 before the organic material is deposited. Play a role.

The chamber 110 includes a plate 120 provided on an upper side of the inside, a fixed side plate 122 provided on one side of the plate 120, and a moving side plate 124 provided on the other side of the plate 120 to move horizontally. And a pressurized holder provided horizontally with the (large area) substrate holder 126 provided in the transverse direction at the lower ends of the fixed side plate 122 and the moving side plate 124, and the substrate holder 126, respectively. 128 and a substrate mounting table 140 on which the substrate S is mounted are provided.

Here, the substrate mounting table 140 is provided with a mask holder 142 in the transverse direction at the lower end of both sides in the cross-section "C" shape of the lower side and the magnet 144 to provide a magnetic force in the form of a plate on the inner upper side and the It consists of a mask 146 seated on the mask holder 142.

The pressing holder 128 provided above the substrate holder 126 and lifted by the first driving part 200 fixes the upper edge portion of the substrate S to be seated on the substrate holder 126.

As shown in FIG. 2, the substrate holder 126 is formed in a plate through a central portion thereof, and a step is formed at a portion where the upper surface and the inner surface are in contact with each other, and the substrate S is seated at the step. The substrate holder 126 is opposed to the reference cylinder 150 and the reference cylinder 150 on both sides of four sides of the substrate S to align the substrate S to be seated. An alignment cylinder 152 is provided in position.

The reference cylinder 150 is driven by pneumatic and gives a reference point to the substrate (S) to be loaded for deposition.

The alignment cylinder 152 is driven by pneumatic pressure and moves to the reference cylinder 150 which becomes a reference point when the substrate S is aligned.

Here, the four positioned on the two sides of the substrate (S) in contact with each other is a reference cylinder 150 which is a reference point at a predetermined position, and the other four positioned on the other two sides opposite to the four are reference cylinders 150 serving as a reference point. The alignment cylinder 152 is provided with a pressing force on the side of the furnace substrate (S) to align the substrate (S).

The pressure holder 128 is formed in a plate through the center portion, and a step is formed on the bottom and the inner surface to press the edge portion of the substrate S seated on the substrate holder 126 so as not to flow.

Here, the first driving unit 200 for elevating the pressure holder 128 is reciprocated by the transmission unit 130 provided between the first driving unit 200 and the pressure holder 128. In addition, the transmission unit 130 is bent outward again in a state of being bent inwardly.

The moving side plate 124 is freely moved outwardly by a guide on one side surface of the plate 120 and allows the second driving part 200 ′ installed in the lateral direction to adjust the distance of the linear reciprocating motion.

The magnet 144 provides magnetic force to the mask 146 to bring the mask 146 into close contact with the bottom surface of the substrate S, that is, the pattern formation surface.

However, the substrate processing apparatus as described above has a problem in that only substrates having a size that can be placed on the substrate holder can be processed, thereby incompatible with the processing substrate.

For example, a substrate processing apparatus that can only process substrates for 730 × 920 large area substrates cannot process small-area substrates of smaller size. Therefore, in order to process a small area substrate, there is a problem that a separate small area substrate processing apparatus having a substantially identical configuration except for a substrate holder is required.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a small-area substrate holder that can be mounted to a large-area substrate holder that can also process a small-area substrate in an apparatus for processing a large-area substrate. Is in.

In order to solve the above technical problem, the small-area substrate holder mountable to the large-area substrate holder according to the present invention is formed in a size and shape that can be mounted to the large-area substrate holder, and the center is cut to raise the small-area substrate. table; A plurality of alignment means for correcting the position of the small area substrate placed on the table; A guide shaft provided below the table and movable up and down through the table; And a mask frame connected to the guide shaft and mounted with the mask for the small area substrate.

In addition, in the small-area substrate holder mountable to the large-area substrate holder of the present invention, the alignment means is interlocked with the reference cylinder and the alignment cylinder to align the large-area substrate, respectively, to correct the position of the small-area substrate. The aligning means may include a drive bar driven by a reference cylinder and an alignment cylinder for aligning the large area substrate, a transfer bar connected to the drive bar in a lateral direction, and a longitudinal direction connected to the transfer bar. An alignment bar for aligning the small-area substrate by the driving force of the cylinder for aligning the pressure difference, and on the other hand, the aligning means includes three reference portions and the large-area substrate which are linked to the reference cylinder for aligning the large-area substrate. More preferably, it is composed of three alignment parts that are interlocked with the alignment cylinder to align.

Particularly, one end of the driving bar and a table are provided with spring holders, springs are interposed between the spring holders, through holes are formed in the spring holders, and bolts penetrating the through holes and springs are provided. More preferably, it is configured to adjust the elastic force of the spring according to the fastening degree of the bolt.

Hereinafter, with reference to the accompanying drawings will be described the configuration and operation of an embodiment of a small area substrate holder that can be mounted to a large area substrate holder according to the present invention.

Referring to FIG. 3, a small area substrate holder 500 that can be mounted on a large area substrate holder includes a table 512, an alignment means 528 of a small area substrate, a guide shaft 514, and a mask for a small area substrate 516. ) Is configured to include a mask frame 520 to be mounted.

The table 512 is provided with a small area substrate seating portion 510 so that a small area substrate is placed on the cut-out portion of the center, and is mounted on a (large area) substrate holder of an organic vapor deposition apparatus for a large area substrate. Since it should be, it is important to be formed in a size and shape that can be mounted to this substrate holder.

Six alignment means 528 of the small-area substrate is provided around the small-area substrate seating portion 510 of the table 512, three of which are reference portions for presenting the reference point of the small-area substrate, The other three are alignments for moving the small area substrate to the reference point.

In addition, the alignment means 528 is composed of three bars, specifically, the drive bar 522 driven by the reference cylinder or alignment cylinder for aligning the large-area substrate, and the drive bar 522 And a transfer bar 524 fixedly connected to the transverse direction, and an alignment bar 526 fixedly connected to the transfer bar 524 in the longitudinal direction. Here, it can be seen that the driving bar 522 and the transmission bar 524, the transmission bar 524 and the alignment bar 526 are each screwed.

Referring to FIG. 4, a guide shaft 514 is connected to the lower portion of the table. The guide shaft 514 is configured to allow vertical movement through the table 512, and a mask frame 520 having protrusions 518 formed thereon to which a mask 516 for a small area substrate can be coupled. Is combined. Therefore, the small area substrate mask 516 can be raised and lowered by the vertical movement of the guide shaft 514.

Referring to FIG. 5, spring holders 531a and 531b are formed in the table 512 and the driving bar 522, and a spring 530 is interposed between the spring holders 531a and 531b. In addition, it can be seen that the bolts 533 having the heads 533a are fastened through the spring holders 531a and 531b and the springs 530. The aligning means 528 is driven by the spring 530 to align the small area substrate. The spring 530 is a means for providing a restoring force to return the aligning means 528 to the original position after the process is completed. Furthermore, the elastic force of the spring 530 is adjusted according to the fastening degree of the bolt 533.

As shown, an LM guide 542 and an LM block 543 are mounted on the table. The LM guide 542 and the table are screwed, and the LM block 543 and the driving bar 522 are also screwed. In addition, a bearing 544 is interposed in the lower portion of the alignment means to suppress the occurrence of scratches on the small-area substrate.

Due to this configuration, the driving bar 522 is horizontally moved together with the LM block 543 along the LM guide 542 on the table 512 by driving the reference cylinder or the alignment cylinder, and when the driving force is removed, the spring ( 530 is restored to the original position by the elastic force.

6 and 7, the operation of the small-area substrate holder mountable to the large-area substrate holder according to the present invention will be described. As described above, according to the present invention, it is possible to deposit a large-area substrate as well as to deposit a large-area substrate using a large-area substrate deposition apparatus. This will be described in detail below.

When the deposition process is to be performed on the large area substrate, the substrate may be placed on the large area substrate holder and the deposition process may be performed as described above.

In particular, when a deposition process is to be performed on a small area substrate, the small area substrate holder 500 according to the present invention is mounted on the large area substrate holder 126 ′ of the organic material deposition apparatus. Meanwhile, the end of the mask frame 520 is coupled to the mask holder 400 of the large area substrate mounting table 140. Next, a small area substrate is placed on the seating portion 510 of the small area substrate holder using a transfer robot (not shown).

In this state, the alignment of the small-area substrate is performed. Specifically, the three reference cylinders 150a, 150b, and 150c which align the large-area substrate are driven so that their ends are in contact with the corresponding driving bars. Then, the reference cylinder is driven in such a state that the alignment bars 528a, 528b, and 528c connected to the driving bar reach the reference point at the exact position of the small area substrate.

When the three alignment bars 528a, 528b, and 528c reach the reference point of the small-area substrate, the reference cylinders 150a, 150b, and 150c and the alignment bars 528a, 528b, and 528c linked thereto stop further driving. . Next, three alignment cylinders 152a, 152b, and 152c are driven to drive drive bars, connecting bars, and alignment bars 528d, 528e, and 528f interlocked with each other. Specifically, three small area substrates are located at a reference point. Alignment of the small area substrate is completed by driving until the alignment bars 528a, 528b, and 528c are in contact with each other.

As described above, the reference cylinders 150a, 150b, 150c and 150d and the alignment cylinders 152a, 152b, 152c and 152d are eight and the alignment means of the small area substrate is six. That is, each of the reference cylinder 150d and the alignment cylinder 152c of the reference cylinder and the alignment cylinder for aligning the large area substrate does not act on the alignment of the small area substrate. This is because, in the case of a large area substrate, the size of the substrate is large and two alignment means are required on each side, but in the case of a small area substrate, precise alignment is possible by six alignment means.

On the other hand, when the substrate processing is completed and the reference cylinders 150a, 150b, 150c and 150d and the alignment cylinders 152a, 152b, 152c and 152d are returned to their original positions, the small area substrate aligning means is also caused by the elastic force of the spring 530. Return to home position.

In the foregoing description, only the deposition apparatus of the substrate has been described, but this is merely an example, and it is obvious that the apparatus may be applied to, for example, an etching apparatus of the substrate, in addition to the deposition apparatus. If you want to, it's applicable.

According to the present invention, there is an effect that a small area substrate can be processed in a substrate processing apparatus for processing a large area substrate. Therefore, a separate processing device for processing a small area substrate is unnecessary.

Moreover, since the alignment of the small area substrate uses the alignment means provided in the large area substrate processing apparatus, the driving means for the alignment of the small area substrate is also unnecessary.

Claims (6)

A table having a size and a shape that can be mounted to a large area substrate holder, and having a center cut to raise a small area substrate; A plurality of alignment means for correcting the position of the small area substrate placed on the table; A guide shaft provided below the table and movable up and down through the table; And And a mask frame connected to the guide shaft and to which the mask for the small area substrate is mounted. The method of claim 1, The alignment means is a small area substrate holder that can be mounted to the large area substrate holder, characterized in that for interlocking the reference cylinder and the alignment cylinder to align the large area substrate, respectively. The method of claim 2, The aligning means is a drive bar driven by a reference cylinder or an alignment cylinder for aligning the large area substrate, a transfer bar laterally connected to the drive bar and a longitudinal connection to the transfer bar to freeze the large area substrate. A small-area substrate holder mountable to a large-area substrate holder, wherein the reduction consists of an alignment bar for aligning the small-area substrate by the driving force of the cylinder. The method of claim 2, The aligning means includes a three reference portion interlocked with a reference cylinder for aligning the large area substrate and three alignment portions interlocked with an alignment cylinder for aligning the large area substrate. Small footprint substrate holder. The method of claim 2, A spring holder is provided at one end of the driving bar and a table, respectively, and a spring is interposed between the spring holders. The method of claim 5, wherein And a through hole formed in the spring holder, and having a through hole and a bolt penetrating the spring, so that the small area substrate holder can be mounted to a large area substrate holder capable of adjusting elastic force of the spring according to the fastening degree of the bolt.

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