KR101519932B1 - 표면 특징물의 특성을 측정하기 위한 장치 및 방법 - Google Patents
표면 특징물의 특성을 측정하기 위한 장치 및 방법 Download PDFInfo
- Publication number
- KR101519932B1 KR101519932B1 KR1020097014917A KR20097014917A KR101519932B1 KR 101519932 B1 KR101519932 B1 KR 101519932B1 KR 1020097014917 A KR1020097014917 A KR 1020097014917A KR 20097014917 A KR20097014917 A KR 20097014917A KR 101519932 B1 KR101519932 B1 KR 101519932B1
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- South Korea
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- test
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02041—Interferometers characterised by particular imaging or detection techniques
- G01B9/02043—Imaging of the Fourier or pupil or back focal plane, i.e. angle resolved imaging
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02055—Reduction or prevention of errors; Testing; Calibration
- G01B9/02056—Passive reduction of errors
- G01B9/02057—Passive reduction of errors by using common path configuration, i.e. reference and object path almost entirely overlapping
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02055—Reduction or prevention of errors; Testing; Calibration
- G01B9/0207—Error reduction by correction of the measurement signal based on independently determined error sources, e.g. using a reference interferometer
- G01B9/02072—Error reduction by correction of the measurement signal based on independently determined error sources, e.g. using a reference interferometer by calibration or testing of interferometer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02083—Interferometers characterised by particular signal processing and presentation
- G01B9/02084—Processing in the Fourier or frequency domain when not imaged in the frequency domain
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02083—Interferometers characterised by particular signal processing and presentation
- G01B9/02088—Matching signals with a database
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/0209—Low-coherence interferometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2290/00—Aspects of interferometers not specifically covered by any group under G01B9/02
- G01B2290/70—Using polarization in the interferometer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N2021/9513—Liquid crystal panels
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/8422—Investigating thin films, e.g. matrix isolation method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Mathematical Physics (AREA)
- Databases & Information Systems (AREA)
- Instruments For Measurement Of Length By Optical Means (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US87674806P | 2006-12-22 | 2006-12-22 | |
| US60/876,748 | 2006-12-22 | ||
| PCT/US2007/088708 WO2008080127A2 (en) | 2006-12-22 | 2007-12-21 | Apparatus and method for measuring characteristics of surface features |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20090097938A KR20090097938A (ko) | 2009-09-16 |
| KR101519932B1 true KR101519932B1 (ko) | 2015-05-13 |
Family
ID=39563252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097014917A Active KR101519932B1 (ko) | 2006-12-22 | 2007-12-21 | 표면 특징물의 특성을 측정하기 위한 장치 및 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7924435B2 (enExample) |
| EP (1) | EP2097713A4 (enExample) |
| JP (1) | JP5502491B2 (enExample) |
| KR (1) | KR101519932B1 (enExample) |
| WO (1) | WO2008080127A2 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190072083A (ko) * | 2017-12-15 | 2019-06-25 | 포항공과대학교 산학협력단 | 하이퍼렌즈를 이용한 초고해상도 스캐닝 현미경 |
| KR20220015725A (ko) | 2020-07-31 | 2022-02-08 | 서울대학교산학협력단 | 공간 광 변조기를 이용한 박막의 두께 및 물성 측정 시스템 |
| KR102506393B1 (ko) * | 2021-11-23 | 2023-03-06 | (주)오로스 테크놀로지 | 분광 타원계를 사용한 다층 박막 시료의 물성 해석 방법 |
| KR20250028889A (ko) | 2023-08-22 | 2025-03-04 | (주) 오로스테크놀로지 | 온 셀 측정 장치 및 방법 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7869057B2 (en) | 2002-09-09 | 2011-01-11 | Zygo Corporation | Multiple-angle multiple-wavelength interferometer using high-NA imaging and spectral analysis |
| US7324214B2 (en) | 2003-03-06 | 2008-01-29 | Zygo Corporation | Interferometer and method for measuring characteristics of optically unresolved surface features |
| US7142311B2 (en) * | 2004-05-18 | 2006-11-28 | Zygo Corporation | Methods and systems for determining optical properties using low-coherence interference signals |
| US7446882B2 (en) * | 2005-01-20 | 2008-11-04 | Zygo Corporation | Interferometer for determining characteristics of an object surface |
| US7884947B2 (en) | 2005-01-20 | 2011-02-08 | Zygo Corporation | Interferometry for determining characteristics of an object surface, with spatially coherent illumination |
| US8537366B2 (en) | 2005-10-11 | 2013-09-17 | Duke University | Systems and methods for endoscopic angle-resolved low coherence interferometry |
| JP2007294763A (ja) * | 2006-04-26 | 2007-11-08 | Toshiba Corp | 半導体装置の製造方法及び製造システム |
| JP5087864B2 (ja) * | 2006-06-21 | 2012-12-05 | 富士通株式会社 | 膜厚予測プログラム、記録媒体、膜厚予測装置および膜厚予測方法 |
| CN101500472B (zh) * | 2006-07-21 | 2014-02-12 | 昂科斯科公司 | 特别是用于内窥镜应用的光纤探头的保护探头尖端 |
| WO2008080127A2 (en) | 2006-12-22 | 2008-07-03 | Zygo Corporation | Apparatus and method for measuring characteristics of surface features |
| DE102007023826A1 (de) * | 2007-05-21 | 2008-11-27 | Polytec Gmbh | Verfahren und Vorrichtung zur berührungslosen Schwingungsmessung |
| US7619746B2 (en) | 2007-07-19 | 2009-11-17 | Zygo Corporation | Generating model signals for interferometry |
| US20090073456A1 (en) * | 2007-09-13 | 2009-03-19 | Duke University | Apparatuses, systems, and methods for low-coherence interferometry (lci) |
| US8072611B2 (en) | 2007-10-12 | 2011-12-06 | Zygo Corporation | Interferometric analysis of under-resolved features |
| WO2009064670A2 (en) | 2007-11-13 | 2009-05-22 | Zygo Corporation | Interferometer utilizing polarization scanning |
| EP2232195B1 (en) | 2007-12-14 | 2015-03-18 | Zygo Corporation | Analyzing surface structure using scanning interferometry |
| WO2009089344A1 (en) * | 2008-01-08 | 2009-07-16 | Oncoscope, Inc. | Systems and methods for tissue examination, diagnostic, treatment, and/or monitoring |
| US8004688B2 (en) | 2008-11-26 | 2011-08-23 | Zygo Corporation | Scan error correction in low coherence scanning interferometry |
| KR101005179B1 (ko) | 2009-01-21 | 2011-01-04 | (주)펨트론 | 광학적 간섭을 이용한 ocd 측정 방법 및 장치 |
| US8107084B2 (en) * | 2009-01-30 | 2012-01-31 | Zygo Corporation | Interference microscope with scan motion detection using fringe motion in monitor patterns |
| US9823127B2 (en) | 2010-01-22 | 2017-11-21 | Duke University | Systems and methods for deep spectroscopic imaging of biological samples with use of an interferometer and spectrometer |
| WO2011091369A1 (en) | 2010-01-22 | 2011-07-28 | Duke University | Multiple window processing schemes for spectroscopic optical coherence tomography (oct) and fourier domain low coherence interferometry |
| JP2011191285A (ja) * | 2010-02-22 | 2011-09-29 | Takaoka Electric Mfg Co Ltd | 光が透過可能な材料の段差構造測定方法 |
| DE102010026351B4 (de) * | 2010-07-07 | 2012-04-26 | Siltronic Ag | Verfahren und Vorrichtung zur Untersuchung einer Halbleiterscheibe |
| US10124410B2 (en) | 2010-09-25 | 2018-11-13 | Ipg Photonics Corporation | Methods and systems for coherent imaging and feedback control for modification of materials |
| US12397368B2 (en) | 2010-09-25 | 2025-08-26 | Ipg Photonics Corporation | Methods and systems for coherent imaging and feedback control for modification of materials using dynamic optical path switch in the reference arms |
| ES2971465T3 (es) * | 2010-09-25 | 2024-06-05 | Ipg Photonics Canada Inc | Procedimiento de formación de imágenes coherentes y de control por retroalimentación para la modificación de materiales |
| US20120089365A1 (en) * | 2010-10-08 | 2012-04-12 | Zygo Corporation | Data interpolation methods for metrology of surfaces, films and underresolved structures |
| WO2012067940A2 (en) * | 2010-11-15 | 2012-05-24 | Zygo Corporation | Interferometer with a virtual reference surface |
| KR101186464B1 (ko) * | 2011-04-13 | 2012-09-27 | 에스엔유 프리시젼 주식회사 | Tsv 측정용 간섭계 및 이를 이용한 측정방법 |
| WO2013096660A1 (en) * | 2011-12-23 | 2013-06-27 | Rudolph Technologies, Inc. | On-axis focus sensor and method |
| TWI546518B (zh) * | 2012-04-20 | 2016-08-21 | 德律科技股份有限公司 | 三維量測系統與三維量測方法 |
| EP2662661A1 (de) * | 2012-05-07 | 2013-11-13 | Leica Geosystems AG | Messgerät mit einem Interferometer und einem ein dichtes Linienspektrum definierenden Absorptionsmedium |
| DE102012011315B4 (de) * | 2012-06-04 | 2018-12-27 | Carl Zeiss Ag | Mikroskop und Verfahren zur Charakterisierung von Strukturen auf einem Objekt |
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| JP2007187655A (ja) | 2005-12-23 | 2007-07-26 | Jordan Valley Semiconductors Ltd | Xrfを用いた層寸法の正確な測定 |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2010515027A (ja) | 2010-05-06 |
| US20080174784A1 (en) | 2008-07-24 |
| KR20090097938A (ko) | 2009-09-16 |
| EP2097713A2 (en) | 2009-09-09 |
| EP2097713A4 (en) | 2010-09-15 |
| US7924435B2 (en) | 2011-04-12 |
| JP5502491B2 (ja) | 2014-05-28 |
| WO2008080127A3 (en) | 2008-09-04 |
| WO2008080127A2 (en) | 2008-07-03 |
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