KR101516447B1 - 격납된 층을 제조하는 방법 - Google Patents

격납된 층을 제조하는 방법 Download PDF

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Publication number
KR101516447B1
KR101516447B1 KR1020097026307A KR20097026307A KR101516447B1 KR 101516447 B1 KR101516447 B1 KR 101516447B1 KR 1020097026307 A KR1020097026307 A KR 1020097026307A KR 20097026307 A KR20097026307 A KR 20097026307A KR 101516447 B1 KR101516447 B1 KR 101516447B1
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South Korea
Prior art keywords
layer
radiation
surface energy
rsa
organic active
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Expired - Fee Related
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KR1020097026307A
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English (en)
Korean (ko)
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KR20100018570A (ko
Inventor
찰스 디. 랑
알베르토 조나가
폴 안토니 산트
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020097026307A 2007-05-18 2008-05-16 격납된 층을 제조하는 방법 Expired - Fee Related KR101516447B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US93879407P 2007-05-18 2007-05-18
US60/938,794 2007-05-18
PCT/US2008/063825 WO2008144467A1 (en) 2007-05-18 2008-05-16 Process for making contained layers

Publications (2)

Publication Number Publication Date
KR20100018570A KR20100018570A (ko) 2010-02-17
KR101516447B1 true KR101516447B1 (ko) 2015-05-04

Family

ID=39825546

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097026307A Expired - Fee Related KR101516447B1 (ko) 2007-05-18 2008-05-16 격납된 층을 제조하는 방법

Country Status (7)

Country Link
US (1) US20080286487A1 (enExample)
EP (1) EP2147129A1 (enExample)
JP (1) JP5457337B2 (enExample)
KR (1) KR101516447B1 (enExample)
CN (1) CN101688287B (enExample)
TW (1) TW200901531A (enExample)
WO (1) WO2008144467A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090142556A1 (en) * 2007-11-29 2009-06-04 E. I. Du Pont De Nemours And Company Process for forming an organic electronic device including an organic device layer
US8040048B2 (en) * 2007-12-12 2011-10-18 Lang Charles D Process for forming an organic electronic device including an organic device layer
US8497495B2 (en) 2009-04-03 2013-07-30 E I Du Pont De Nemours And Company Electroactive materials
TW201104357A (en) * 2009-07-27 2011-02-01 Du Pont Process and materials for making contained layers and devices made with same
KR101621636B1 (ko) * 2011-12-20 2016-05-16 이 아이 듀폰 디 네모아 앤드 캄파니 격납된 층을 제조하기 위한 방법 및 물질, 및 이를 사용하여 제조된 소자
KR20140033671A (ko) * 2012-09-10 2014-03-19 삼성디스플레이 주식회사 유기발광 표시장치 및 그 제조 방법
KR102019465B1 (ko) * 2012-12-13 2019-09-06 주식회사 엘지화학 적층된 층을 제조하기 위한 방법 및 재료, 및 이를 사용하여 제조된 소자

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003058077A (ja) * 2001-08-08 2003-02-28 Fuji Photo Film Co Ltd ミクロファブリケーション用基板、その製造方法および像状薄膜形成方法
US20030129321A1 (en) * 2001-12-12 2003-07-10 Daigo Aoki Process for manufacturing pattern forming body
US20040075384A1 (en) * 2002-08-05 2004-04-22 Daigo Aoki Method of producing electroluminescent element
WO2006072095A2 (en) * 2004-12-30 2006-07-06 E. I. Dupont De Nemours And Company Containment structure for an electronic device

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6303238B1 (en) * 1997-12-01 2001-10-16 The Trustees Of Princeton University OLEDs doped with phosphorescent compounds
KR20010085420A (ko) * 2000-02-23 2001-09-07 기타지마 요시토시 전계발광소자와 그 제조방법
TW472503B (en) * 2000-04-26 2002-01-11 Ritdisplay Corp Manufacture method of photosensitive polyimide pattern definition layer for organic light-emitting diodes display
US6670645B2 (en) * 2000-06-30 2003-12-30 E. I. Du Pont De Nemours And Company Electroluminescent iridium compounds with fluorinated phenylpyridines, phenylpyrimidines, and phenylquinolines and devices made with such compounds
EP1374641B1 (en) * 2001-03-02 2017-12-27 The Trustees Of Princeton University Double doped-layer, phosphorescent organic light emitting devices
JP2003123967A (ja) * 2001-10-10 2003-04-25 Matsushita Electric Ind Co Ltd 発光素子の製造方法
JP2004047176A (ja) * 2002-07-09 2004-02-12 Sharp Corp 有機エレクトロルミネッセンス素子
KR100858802B1 (ko) * 2002-07-31 2008-09-17 삼성에스디아이 주식회사 전자 발광 소자의 제조방법
US7098060B2 (en) * 2002-09-06 2006-08-29 E.I. Du Pont De Nemours And Company Methods for producing full-color organic electroluminescent devices
CN1681869B (zh) * 2002-09-24 2010-05-26 E.I.内穆尔杜邦公司 用于电子器件用聚合物酸胶体制成的可水分散的聚苯胺
WO2004029128A2 (en) * 2002-09-24 2004-04-08 E.I. Du Pont De Nemours And Company Water dispersible polythiophenes made with polymeric acid colloids
US6982179B2 (en) * 2002-11-15 2006-01-03 University Display Corporation Structure and method of fabricating organic devices
JP2004355949A (ja) * 2003-05-29 2004-12-16 Tdk Corp 有機ｅｌ表示体の製造方法および有機ｅｌ製造装置
CN1574214A (zh) * 2003-06-03 2005-02-02 国际商业机器公司 用于制造电子器件的基于熔化的图案化工艺
JPWO2006070713A1 (ja) * 2004-12-28 2008-06-12 出光興産株式会社 有機エレクトロルミネッセンス素子
JP2008527693A (ja) * 2004-12-30 2008-07-24 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 閉じ込め構造および方法
WO2006117914A1 (ja) * 2005-04-27 2006-11-09 Konica Minolta Holdings, Inc. 有機エレクトロルミネッセンス素子の製造方法
US20060275547A1 (en) * 2005-06-01 2006-12-07 Lee Chung J Vapor Phase Deposition System and Method
US20070020395A1 (en) * 2005-06-27 2007-01-25 Lang Charles D Process for making an electronic device
US8124172B2 (en) * 2006-03-02 2012-02-28 E.I. Du Pont De Nemours And Company Process for making contained layers and devices made with same
WO2007145978A1 (en) * 2006-06-05 2007-12-21 E. I. Du Pont De Nemours And Company Process for making contained layers and devices made with same
KR20100094475A (ko) * 2007-10-26 2010-08-26 이 아이 듀폰 디 네모아 앤드 캄파니 격납된 층을 제조하기 위한 방법 및 재료, 및 이를 사용하여 제조된 소자
US20090130296A1 (en) * 2007-11-15 2009-05-21 Universal Display Corporation Fabrication of Organic Electronic Devices by Ink-Jet Printing at Low Temperatures
KR20110014653A (ko) * 2008-05-19 2011-02-11 이 아이 듀폰 디 네모아 앤드 캄파니 전자 소자에서 증기 코팅 장치 및 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003058077A (ja) * 2001-08-08 2003-02-28 Fuji Photo Film Co Ltd ミクロファブリケーション用基板、その製造方法および像状薄膜形成方法
US20030129321A1 (en) * 2001-12-12 2003-07-10 Daigo Aoki Process for manufacturing pattern forming body
US20040075384A1 (en) * 2002-08-05 2004-04-22 Daigo Aoki Method of producing electroluminescent element
WO2006072095A2 (en) * 2004-12-30 2006-07-06 E. I. Dupont De Nemours And Company Containment structure for an electronic device

Also Published As

Publication number Publication date
KR20100018570A (ko) 2010-02-17
US20080286487A1 (en) 2008-11-20
EP2147129A1 (en) 2010-01-27
JP2010528427A (ja) 2010-08-19
TW200901531A (en) 2009-01-01
CN101688287A (zh) 2010-03-31
JP5457337B2 (ja) 2014-04-02
WO2008144467A1 (en) 2008-11-27
CN101688287B (zh) 2015-03-18

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