KR101495887B1 - 발광 장치 - Google Patents

발광 장치 Download PDF

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Publication number
KR101495887B1
KR101495887B1 KR20070004225A KR20070004225A KR101495887B1 KR 101495887 B1 KR101495887 B1 KR 101495887B1 KR 20070004225 A KR20070004225 A KR 20070004225A KR 20070004225 A KR20070004225 A KR 20070004225A KR 101495887 B1 KR101495887 B1 KR 101495887B1
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South Korea
Prior art keywords
insulating film
film
light emitting
substrate
conductive
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KR20070004225A
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Korean (ko)
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KR20070076481A (ko
Inventor
세이코 아마노
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가부시키가이샤 한도오따이 에네루기 켄큐쇼
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H10D86/443—Interconnections, e.g. scanning lines adapted for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR20070004225A 2006-01-18 2007-01-15 발광 장치 Active KR101495887B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00010197 2006-01-18
JP2006010197A JP5046521B2 (ja) 2006-01-18 2006-01-18 発光装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020130086375A Division KR101469935B1 (ko) 2006-01-18 2013-07-22 발광 장치

Publications (2)

Publication Number Publication Date
KR20070076481A KR20070076481A (ko) 2007-07-24
KR101495887B1 true KR101495887B1 (ko) 2015-02-25

Family

ID=38262551

Family Applications (2)

Application Number Title Priority Date Filing Date
KR20070004225A Active KR101495887B1 (ko) 2006-01-18 2007-01-15 발광 장치
KR1020130086375A Active KR101469935B1 (ko) 2006-01-18 2013-07-22 발광 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020130086375A Active KR101469935B1 (ko) 2006-01-18 2013-07-22 발광 장치

Country Status (3)

Country Link
US (5) US7812524B2 (enExample)
JP (1) JP5046521B2 (enExample)
KR (2) KR101495887B1 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5046521B2 (ja) 2006-01-18 2012-10-10 株式会社半導体エネルギー研究所 発光装置
US7863612B2 (en) 2006-07-21 2011-01-04 Semiconductor Energy Laboratory Co., Ltd. Display device and semiconductor device
JP4623068B2 (ja) * 2007-09-12 2011-02-02 ソニー株式会社 表示パネル、表示パネルモジュール及び電子機器
USD638382S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD638381S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD643820S1 (en) * 2010-04-09 2011-08-23 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD637166S1 (en) * 2010-04-09 2011-05-03 Panasonic Electric Works Co., Ltd. Electroluminescence module
JP1437719S (enExample) * 2010-04-09 2015-03-30
USD638379S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD637165S1 (en) * 2010-04-09 2011-05-03 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD638383S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
KR101953724B1 (ko) * 2011-08-26 2019-03-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 모듈, 발광 장치, 발광 모듈의 제작 방법, 발광 장치의 제작 방법
JP6142151B2 (ja) * 2012-07-31 2017-06-07 株式会社Ｊｏｌｅｄ 表示装置および電子機器
US12302698B2 (en) 2012-07-31 2025-05-13 Jdi Design And Development G.K. Display unit with moisture proof film outside of seal section and electronic apparatus with said display unit
KR102052746B1 (ko) * 2013-07-29 2019-12-06 엘지디스플레이 주식회사 면 봉지 방식의 유기발광 다이오드 표시장치
KR102360783B1 (ko) 2014-09-16 2022-02-10 삼성디스플레이 주식회사 디스플레이 장치
TWI606771B (zh) * 2015-04-01 2017-11-21 群創光電股份有限公司 顯示面板
KR102451728B1 (ko) * 2015-05-19 2022-10-07 삼성디스플레이 주식회사 유기발광 디스플레이 장치 및 그 제조방법
WO2017131078A1 (ja) * 2016-01-28 2017-08-03 シャープ株式会社 アクティブマトリクス基板およびその製造方法
CN109243305B (zh) * 2018-09-17 2021-10-12 京东方科技集团股份有限公司 显示面板、显示装置和显示面板的制造方法
CN111370439A (zh) * 2018-12-07 2020-07-03 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
CN109728195B (zh) * 2018-12-29 2021-05-18 厦门天马微电子有限公司 显示面板以及显示装置
KR102879863B1 (ko) * 2019-10-14 2025-11-04 삼성디스플레이 주식회사 표시 장치
CN113867053B (zh) * 2020-06-30 2023-05-16 京东方科技集团股份有限公司 显示面板及其制备方法
EP4207291B1 (en) 2021-06-24 2025-10-15 BOE Technology Group Co., Ltd. Backplane and method for manufacturing same, and backlight module and display apparatus

Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2003142259A (ja) 2001-10-31 2003-05-16 Fuji Electric Co Ltd 有機薄膜発光ディスプレイ及びその製造方法
JP2004047446A (ja) 2002-05-15 2004-02-12 Semiconductor Energy Lab Co Ltd 発光装置およびその作製方法
KR20050002572A (ko) * 2003-06-27 2005-01-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시장치 및 그의 제작방법
KR20050090259A (ko) * 2004-03-08 2005-09-13 삼성에스디아이 주식회사 평판 표시 장치

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US20060250078A1 (en) * 2005-05-09 2006-11-09 City University Of Hong Kong Organic electroluminescent devices incorporating UV-illuminated fluorocarbon layers
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JP5046521B2 (ja) * 2006-01-18 2012-10-10 株式会社半導体エネルギー研究所 発光装置

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Publication number Priority date Publication date Assignee Title
JP2003142259A (ja) 2001-10-31 2003-05-16 Fuji Electric Co Ltd 有機薄膜発光ディスプレイ及びその製造方法
JP2004047446A (ja) 2002-05-15 2004-02-12 Semiconductor Energy Lab Co Ltd 発光装置およびその作製方法
KR20050002572A (ko) * 2003-06-27 2005-01-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시장치 및 그의 제작방법
KR20050090259A (ko) * 2004-03-08 2005-09-13 삼성에스디아이 주식회사 평판 표시 장치

Also Published As

Publication number Publication date
US9704940B2 (en) 2017-07-11
JP2007194040A (ja) 2007-08-02
US7812524B2 (en) 2010-10-12
KR101469935B1 (ko) 2014-12-08
US8283859B2 (en) 2012-10-09
US20140306228A1 (en) 2014-10-16
US9356048B2 (en) 2016-05-31
JP5046521B2 (ja) 2012-10-10
US20130001608A1 (en) 2013-01-03
US20070164675A1 (en) 2007-07-19
US20100327739A1 (en) 2010-12-30
US8710734B2 (en) 2014-04-29
US20160268365A1 (en) 2016-09-15
KR20070076481A (ko) 2007-07-24
KR20130098945A (ko) 2013-09-05

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