JP5046521B2 - 発光装置 - Google Patents

発光装置 Download PDF

Info

Publication number
JP5046521B2
JP5046521B2 JP2006010197A JP2006010197A JP5046521B2 JP 5046521 B2 JP5046521 B2 JP 5046521B2 JP 2006010197 A JP2006010197 A JP 2006010197A JP 2006010197 A JP2006010197 A JP 2006010197A JP 5046521 B2 JP5046521 B2 JP 5046521B2
Authority
JP
Japan
Prior art keywords
insulating film
film
substrate
light emitting
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006010197A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007194040A5 (enExample
JP2007194040A (ja
Inventor
聖子 天野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2006010197A priority Critical patent/JP5046521B2/ja
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to US11/652,487 priority patent/US7812524B2/en
Priority to KR20070004225A priority patent/KR101495887B1/ko
Publication of JP2007194040A publication Critical patent/JP2007194040A/ja
Publication of JP2007194040A5 publication Critical patent/JP2007194040A5/ja
Priority to US12/874,372 priority patent/US8283859B2/en
Priority to US13/612,249 priority patent/US8710734B2/en
Application granted granted Critical
Publication of JP5046521B2 publication Critical patent/JP5046521B2/ja
Priority to KR1020130086375A priority patent/KR101469935B1/ko
Priority to US14/256,660 priority patent/US9356048B2/en
Priority to US15/162,667 priority patent/US9704940B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H10D86/443—Interconnections, e.g. scanning lines adapted for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2006010197A 2006-01-18 2006-01-18 発光装置 Active JP5046521B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2006010197A JP5046521B2 (ja) 2006-01-18 2006-01-18 発光装置
US11/652,487 US7812524B2 (en) 2006-01-18 2007-01-12 Light emitting device
KR20070004225A KR101495887B1 (ko) 2006-01-18 2007-01-15 발광 장치
US12/874,372 US8283859B2 (en) 2006-01-18 2010-09-02 Light emitting device
US13/612,249 US8710734B2 (en) 2006-01-18 2012-09-12 Light emitting device
KR1020130086375A KR101469935B1 (ko) 2006-01-18 2013-07-22 발광 장치
US14/256,660 US9356048B2 (en) 2006-01-18 2014-04-18 Light emitting device
US15/162,667 US9704940B2 (en) 2006-01-18 2016-05-24 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006010197A JP5046521B2 (ja) 2006-01-18 2006-01-18 発光装置

Publications (3)

Publication Number Publication Date
JP2007194040A JP2007194040A (ja) 2007-08-02
JP2007194040A5 JP2007194040A5 (enExample) 2009-03-05
JP5046521B2 true JP5046521B2 (ja) 2012-10-10

Family

ID=38262551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006010197A Active JP5046521B2 (ja) 2006-01-18 2006-01-18 発光装置

Country Status (3)

Country Link
US (5) US7812524B2 (enExample)
JP (1) JP5046521B2 (enExample)
KR (2) KR101495887B1 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5046521B2 (ja) 2006-01-18 2012-10-10 株式会社半導体エネルギー研究所 発光装置
US7863612B2 (en) 2006-07-21 2011-01-04 Semiconductor Energy Laboratory Co., Ltd. Display device and semiconductor device
JP4623068B2 (ja) * 2007-09-12 2011-02-02 ソニー株式会社 表示パネル、表示パネルモジュール及び電子機器
USD637166S1 (en) * 2010-04-09 2011-05-03 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD638379S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD643820S1 (en) * 2010-04-09 2011-08-23 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD637165S1 (en) * 2010-04-09 2011-05-03 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD638383S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD638381S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
JP1437719S (enExample) * 2010-04-09 2015-03-30
USD638382S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
KR101953724B1 (ko) * 2011-08-26 2019-03-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 모듈, 발광 장치, 발광 모듈의 제작 방법, 발광 장치의 제작 방법
JP6142151B2 (ja) 2012-07-31 2017-06-07 株式会社Ｊｏｌｅｄ 表示装置および電子機器
US12302698B2 (en) 2012-07-31 2025-05-13 Jdi Design And Development G.K. Display unit with moisture proof film outside of seal section and electronic apparatus with said display unit
KR102052746B1 (ko) * 2013-07-29 2019-12-06 엘지디스플레이 주식회사 면 봉지 방식의 유기발광 다이오드 표시장치
KR102360783B1 (ko) 2014-09-16 2022-02-10 삼성디스플레이 주식회사 디스플레이 장치
TWI606771B (zh) * 2015-04-01 2017-11-21 群創光電股份有限公司 顯示面板
KR102451728B1 (ko) * 2015-05-19 2022-10-07 삼성디스플레이 주식회사 유기발광 디스플레이 장치 및 그 제조방법
US10263016B2 (en) * 2016-01-28 2019-04-16 Sharp Kabushiki Kaisha Active matrix substrate and method for producing the same
CN109243305B (zh) * 2018-09-17 2021-10-12 京东方科技集团股份有限公司 显示面板、显示装置和显示面板的制造方法
CN111370439A (zh) 2018-12-07 2020-07-03 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
CN109728195B (zh) * 2018-12-29 2021-05-18 厦门天马微电子有限公司 显示面板以及显示装置
KR102879863B1 (ko) * 2019-10-14 2025-11-04 삼성디스플레이 주식회사 표시 장치
CN113867053B (zh) * 2020-06-30 2023-05-16 京东方科技集团股份有限公司 显示面板及其制备方法
EP4629792A3 (en) 2021-06-24 2025-12-03 BOE Technology Group Co., Ltd. Backplane and method for manufacturing same, and backlight module and display apparatus

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6288764B1 (en) 1996-06-25 2001-09-11 Semiconductor Energy Laboratory Co., Ltd. Display device or electronic device having liquid crystal display panel
TW588570B (en) * 2001-06-18 2004-05-21 Semiconductor Energy Lab Light emitting device and method of fabricating the same
US6947921B2 (en) 2001-07-03 2005-09-20 Eastman Kodak Company Method and system for capturing memories of deceased individuals
JP3674848B2 (ja) * 2001-10-31 2005-07-27 富士電機ホールディングス株式会社 有機薄膜発光ディスプレイ及びその製造方法
JP3724725B2 (ja) * 2001-11-01 2005-12-07 ソニー株式会社 表示装置の製造方法
US6822264B2 (en) 2001-11-16 2004-11-23 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
EP1369499A3 (en) 2002-04-15 2004-10-20 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating light-emitting device and apparatus for manufacturing light-emitting device
JP4391126B2 (ja) * 2002-05-15 2009-12-24 株式会社半導体エネルギー研究所 発光装置の作製方法
TWI263339B (en) 2002-05-15 2006-10-01 Semiconductor Energy Lab Light emitting device and method for manufacturing the same
JP4240276B2 (ja) * 2002-07-05 2009-03-18 株式会社半導体エネルギー研究所 発光装置
US7291970B2 (en) 2002-09-11 2007-11-06 Semiconductor Energy Laboratory Co., Ltd. Light-emitting apparatus with improved bank structure
JP3915734B2 (ja) * 2003-05-12 2007-05-16 ソニー株式会社 蒸着マスクおよびこれを用いた表示装置の製造方法、ならびに表示装置
US7161184B2 (en) 2003-06-16 2007-01-09 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
SG142140A1 (en) 2003-06-27 2008-05-28 Semiconductor Energy Lab Display device and method of manufacturing thereof
US7816863B2 (en) * 2003-09-12 2010-10-19 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method for manufacturing the same
JP3915806B2 (ja) * 2003-11-11 2007-05-16 セイコーエプソン株式会社 電気光学装置および電子機器
JP4131243B2 (ja) 2004-02-06 2008-08-13 セイコーエプソン株式会社 電気光学装置の製造方法、電気光学装置、及び電子機器
KR100615212B1 (ko) 2004-03-08 2006-08-25 삼성에스디아이 주식회사 평판 표시 장치
US7183147B2 (en) 2004-03-25 2007-02-27 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, method for manufacturing thereof and electronic appliance
US7202504B2 (en) * 2004-05-20 2007-04-10 Semiconductor Energy Laboratory Co., Ltd. Light-emitting element and display device
JP2005340020A (ja) * 2004-05-27 2005-12-08 Hitachi Displays Ltd 有機エレクトロルミネッセンス表示装置およびその製造方法
US7550769B2 (en) * 2004-06-11 2009-06-23 Semiconductor Energy Laboratory Co., Ltd. Light emitting element, light emitting device and semiconductor device
US8217396B2 (en) 2004-07-30 2012-07-10 Semiconductor Energy Laboratory Co., Ltd. Display device comprising electrode layer contacting wiring in the connection region and extending to pixel region
US20060250078A1 (en) * 2005-05-09 2006-11-09 City University Of Hong Kong Organic electroluminescent devices incorporating UV-illuminated fluorocarbon layers
US7838347B2 (en) 2005-08-12 2010-11-23 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of display device
JP5046521B2 (ja) * 2006-01-18 2012-10-10 株式会社半導体エネルギー研究所 発光装置

Also Published As

Publication number Publication date
KR20070076481A (ko) 2007-07-24
US9704940B2 (en) 2017-07-11
US20160268365A1 (en) 2016-09-15
US20130001608A1 (en) 2013-01-03
KR101495887B1 (ko) 2015-02-25
US20100327739A1 (en) 2010-12-30
KR20130098945A (ko) 2013-09-05
JP2007194040A (ja) 2007-08-02
US8283859B2 (en) 2012-10-09
US20140306228A1 (en) 2014-10-16
US20070164675A1 (en) 2007-07-19
KR101469935B1 (ko) 2014-12-08
US7812524B2 (en) 2010-10-12
US8710734B2 (en) 2014-04-29
US9356048B2 (en) 2016-05-31

Similar Documents

Publication Publication Date Title
JP5046521B2 (ja) 発光装置
KR20230107195A (ko) 유기 발광 표시 장치
KR102761222B1 (ko) 표시 장치
CN100459142C (zh) 半导体显示器件、半导体器件和电子设备
TW538246B (en) Display panel, display panel inspection method, and display panel manufacturing method
US20190157608A1 (en) Organic light emitting display device
CN108122947B (zh) 柔性显示装置
KR20180073762A (ko) 편광판, 표시장치 및 이의 제조방법
KR20170063259A (ko) 유기발광 표시장치 및 그의 제조방법
US12268061B2 (en) Display device
US20250280670A1 (en) Display panel and display device
JP2003255845A (ja) 有機ｅｌディスプレイパネル
CN116390536A (zh) 显示面板
CN104637459A (zh) 半导体器件
US20240224740A1 (en) Flexible display device
CN117594605A (zh) 发光显示装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090115

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090115

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20101215

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101221

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110209

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111025

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111125

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120710

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120717

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150727

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5046521

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150727

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250