KR101486221B1 - 경화성 에폭시 수지 조성물 및 이의 경화체 - Google Patents
경화성 에폭시 수지 조성물 및 이의 경화체 Download PDFInfo
- Publication number
- KR101486221B1 KR101486221B1 KR1020097023769A KR20097023769A KR101486221B1 KR 101486221 B1 KR101486221 B1 KR 101486221B1 KR 1020097023769 A KR1020097023769 A KR 1020097023769A KR 20097023769 A KR20097023769 A KR 20097023769A KR 101486221 B1 KR101486221 B1 KR 101486221B1
- Authority
- KR
- South Korea
- Prior art keywords
- component
- epoxy resin
- resin composition
- curable epoxy
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Silicon Polymers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2007-130547 | 2007-05-16 | ||
| JP2007130547A JP5473196B2 (ja) | 2007-05-16 | 2007-05-16 | 硬化性エポキシ樹脂組成物およびその硬化物 |
| PCT/JP2008/058506 WO2008142997A1 (en) | 2007-05-16 | 2008-04-25 | Curable epoxy resin composition and cured body thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20100016552A KR20100016552A (ko) | 2010-02-12 |
| KR101486221B1 true KR101486221B1 (ko) | 2015-01-27 |
Family
ID=39591435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097023769A Active KR101486221B1 (ko) | 2007-05-16 | 2008-04-25 | 경화성 에폭시 수지 조성물 및 이의 경화체 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100234520A1 (OSRAM) |
| EP (1) | EP2147052A1 (OSRAM) |
| JP (1) | JP5473196B2 (OSRAM) |
| KR (1) | KR101486221B1 (OSRAM) |
| CN (1) | CN101679751B (OSRAM) |
| TW (1) | TWI475076B (OSRAM) |
| WO (1) | WO2008142997A1 (OSRAM) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5473195B2 (ja) * | 2007-05-16 | 2014-04-16 | 東レ・ダウコーニング株式会社 | 架橋シリコーン粒子およびその製造方法 |
| US20120219804A1 (en) * | 2011-02-28 | 2012-08-30 | Kazuho Uchida | Layered body |
| KR101840642B1 (ko) | 2011-06-07 | 2018-03-21 | 한국전자통신연구원 | 분산 안테나 무선 통신 시스템 및 그 방법 |
| JP2013203865A (ja) * | 2012-03-28 | 2013-10-07 | Kyocera Chemical Corp | 半導体封止用樹脂組成物および半導体装置 |
| JP2013227446A (ja) | 2012-04-26 | 2013-11-07 | Dow Corning Toray Co Ltd | 新規なオルガノポリシロキサン、それを含む熱硬化性樹脂用添加剤、およびそれを含む熱硬化性樹脂組成物 |
| TWI663220B (zh) * | 2014-02-19 | 2019-06-21 | 日商日本化藥股份有限公司 | 樹脂改質塡料之製造方法 |
| EP3001544A1 (de) * | 2014-09-29 | 2016-03-30 | Siemens Aktiengesellschaft | Aktivteil als Rotor oder Stator, ein Verfahren zur Herstellung eines solchen Aktivteils und eine elektrische Maschine |
| JP6547220B2 (ja) * | 2014-12-16 | 2019-07-24 | リンテック株式会社 | ダイ接着用接着剤 |
| WO2016136243A1 (ja) * | 2015-02-25 | 2016-09-01 | 東レ・ダウコーニング株式会社 | 硬化性粒状シリコーン組成物、およびその製造方法 |
| TWI814835B (zh) * | 2018-12-29 | 2023-09-11 | 大陸商廣東生益科技股份有限公司 | 樹脂組合物、預浸料、層壓板、覆金屬箔層壓板和印刷電路板 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0312771A1 (en) * | 1987-09-24 | 1989-04-26 | BASF Aktiengesellschaft | Thermosetting resin systems containing secondary amine-terminated siloxane modifiers |
| US4851481A (en) * | 1986-11-13 | 1989-07-25 | Sunstar Giken Kabushiki Kaisha | Epoxy resin composition |
| US4892918A (en) * | 1987-05-29 | 1990-01-09 | Basf Corporation | Secondary amine terminated siloxanes, methods for their preparation and use |
| WO2005010115A1 (en) | 2003-07-16 | 2005-02-03 | Dow Corning Corporation | Coating compositions comprising epoxy resins and aminofunctional silicone resins |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58219218A (ja) | 1982-06-15 | 1983-12-20 | Toray Silicone Co Ltd | 熱硬化性エポキシ樹脂組成物 |
| DE3634084A1 (de) * | 1986-10-07 | 1988-04-21 | Hanse Chemie Gmbh | Modifiziertes reaktionsharz, verfahren zu seiner herstellung und seine verwendung |
| JPH07733B2 (ja) * | 1986-11-13 | 1995-01-11 | サンスタ−技研株式会社 | エポキシ樹脂組成物 |
| JP2508550B2 (ja) | 1991-02-21 | 1996-06-19 | 信越化学工業株式会社 | アミノ基含有シリコ―ンエラストマ―微粉末の製造方法 |
| JP3206222B2 (ja) * | 1993-06-28 | 2001-09-10 | 東レ株式会社 | ポリエステル組成物 |
| JP4469052B2 (ja) * | 2000-02-29 | 2010-05-26 | 東レ・ダウコーニング株式会社 | 架橋シリコーン粒子の製造方法 |
| JP4693953B2 (ja) * | 2000-02-29 | 2011-06-01 | 東レ・ダウコーニング株式会社 | 水性塗料組成物の製造方法 |
| DE10228649A1 (de) * | 2002-06-26 | 2004-01-22 | Bakelite Ag | Verfahren zur Herstellung eines faserverstärkten Produktes auf Epoxidharzbasis |
| CN1315905C (zh) * | 2003-02-18 | 2007-05-16 | 住友电木株式会社 | 环氧树脂组合物和半导体器件 |
| MY148463A (en) * | 2004-07-29 | 2013-04-30 | Sumitomo Bakelite Co | Epoxy resin composition and semiconductor device |
-
2007
- 2007-05-16 JP JP2007130547A patent/JP5473196B2/ja active Active
-
2008
- 2008-04-24 TW TW097115113A patent/TWI475076B/zh not_active IP Right Cessation
- 2008-04-25 EP EP08752398A patent/EP2147052A1/en not_active Withdrawn
- 2008-04-25 KR KR1020097023769A patent/KR101486221B1/ko active Active
- 2008-04-25 US US12/600,142 patent/US20100234520A1/en not_active Abandoned
- 2008-04-25 WO PCT/JP2008/058506 patent/WO2008142997A1/en not_active Ceased
- 2008-04-25 CN CN2008800163247A patent/CN101679751B/zh not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4851481A (en) * | 1986-11-13 | 1989-07-25 | Sunstar Giken Kabushiki Kaisha | Epoxy resin composition |
| US4892918A (en) * | 1987-05-29 | 1990-01-09 | Basf Corporation | Secondary amine terminated siloxanes, methods for their preparation and use |
| EP0312771A1 (en) * | 1987-09-24 | 1989-04-26 | BASF Aktiengesellschaft | Thermosetting resin systems containing secondary amine-terminated siloxane modifiers |
| WO2005010115A1 (en) | 2003-07-16 | 2005-02-03 | Dow Corning Corporation | Coating compositions comprising epoxy resins and aminofunctional silicone resins |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101679751A (zh) | 2010-03-24 |
| WO2008142997A1 (en) | 2008-11-27 |
| CN101679751B (zh) | 2012-08-29 |
| JP2008285553A (ja) | 2008-11-27 |
| US20100234520A1 (en) | 2010-09-16 |
| TWI475076B (zh) | 2015-03-01 |
| TW200904901A (en) | 2009-02-01 |
| KR20100016552A (ko) | 2010-02-12 |
| JP5473196B2 (ja) | 2014-04-16 |
| EP2147052A1 (en) | 2010-01-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20091113 Patent event code: PA01051R01D Comment text: International Patent Application |
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| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20121130 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20140313 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20141024 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20150120 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20150121 End annual number: 3 Start annual number: 1 |
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| PG1601 | Publication of registration | ||
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