KR101472444B1 - 발광 다이오드의 형광체 위치 파악 장치, 발광 다이오드의 형광체 위치 파악 장치를 포함한 부품 실장기, 발광 다이오드의 형광체 위치 파악 방법 및 렌즈 설치 방법 - Google Patents

발광 다이오드의 형광체 위치 파악 장치, 발광 다이오드의 형광체 위치 파악 장치를 포함한 부품 실장기, 발광 다이오드의 형광체 위치 파악 방법 및 렌즈 설치 방법 Download PDF

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KR101472444B1
KR101472444B1 KR1020120065245A KR20120065245A KR101472444B1 KR 101472444 B1 KR101472444 B1 KR 101472444B1 KR 1020120065245 A KR1020120065245 A KR 1020120065245A KR 20120065245 A KR20120065245 A KR 20120065245A KR 101472444 B1 KR101472444 B1 KR 101472444B1
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South Korea
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light
substrate
phosphor
emitting diode
light emitting
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Korean (ko)
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KR20130142023A (ko
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박재현
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삼성테크윈 주식회사
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Priority to KR1020120065245A priority Critical patent/KR101472444B1/ko
Priority to CN201210427982.3A priority patent/CN103512491A/zh
Priority to CN201710846194.0A priority patent/CN107655407A/zh
Priority to JP2013126556A priority patent/JP5944349B2/ja
Publication of KR20130142023A publication Critical patent/KR20130142023A/ko
Application granted granted Critical
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Assigned to 한화정밀기계 주식회사 reassignment 한화정밀기계 주식회사 권리의 전부이전등록 Assignors: 한화에어로스페이스 주식회사
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Biochemistry (AREA)
  • Optics & Photonics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Led Device Packages (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Studio Devices (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020120065245A 2012-06-18 2012-06-18 발광 다이오드의 형광체 위치 파악 장치, 발광 다이오드의 형광체 위치 파악 장치를 포함한 부품 실장기, 발광 다이오드의 형광체 위치 파악 방법 및 렌즈 설치 방법 Active KR101472444B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020120065245A KR101472444B1 (ko) 2012-06-18 2012-06-18 발광 다이오드의 형광체 위치 파악 장치, 발광 다이오드의 형광체 위치 파악 장치를 포함한 부품 실장기, 발광 다이오드의 형광체 위치 파악 방법 및 렌즈 설치 방법
CN201210427982.3A CN103512491A (zh) 2012-06-18 2012-10-31 检测led的磷光体的位置的设备和方法以及安装透镜的方法
CN201710846194.0A CN107655407A (zh) 2012-06-18 2012-10-31 检测led的磷光体的位置的设备和方法以及安装透镜的方法
JP2013126556A JP5944349B2 (ja) 2012-06-18 2013-06-17 発光ダイオードの蛍光体位置把握装置、発光ダイオードの蛍光体位置把握装置を備える部品実装器、発光ダイオードの蛍光体位置把握方法及びレンズ取り付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120065245A KR101472444B1 (ko) 2012-06-18 2012-06-18 발광 다이오드의 형광체 위치 파악 장치, 발광 다이오드의 형광체 위치 파악 장치를 포함한 부품 실장기, 발광 다이오드의 형광체 위치 파악 방법 및 렌즈 설치 방법

Publications (2)

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KR20130142023A KR20130142023A (ko) 2013-12-27
KR101472444B1 true KR101472444B1 (ko) 2014-12-24

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JP (1) JP5944349B2 (https=)
KR (1) KR101472444B1 (https=)
CN (2) CN103512491A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10217680B2 (en) 2016-08-03 2019-02-26 Samsung Electronics Co., Ltd. Test apparatus and manufacturing apparatus of light emitting device package

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102268172B1 (ko) * 2014-07-07 2021-06-23 엘지전자 주식회사 광원 모듈 어셈블리 조립 장치 및 조립 방법
KR20160056167A (ko) * 2014-11-11 2016-05-19 삼성전자주식회사 발광 장치의 제조 방법, 발광 모듈 검사 장비 및 발광 모듈의 양불 판단 방법
JP6860440B2 (ja) * 2017-07-20 2021-04-14 日本メクトロン株式会社 基板位置認識装置、位置認識加工装置および基板製造方法
CN109216532B (zh) * 2018-11-01 2023-09-12 上海悦威电子设备有限公司 一种紫外led石英透镜装配结构及方法
KR102825008B1 (ko) * 2020-02-05 2025-06-27 삼성디스플레이 주식회사 광학 검사 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000011616A (ko) * 1998-07-10 2000-02-25 모리시타 요이찌 전자부품실장장치,인식장치및인식방법
JP2000149781A (ja) * 1998-11-06 2000-05-30 Matsushita Electric Ind Co Ltd プラズマディスプレイ蛍光体検査装置
KR20040039697A (ko) * 2002-11-04 2004-05-12 엘지전자 주식회사 플라즈마 디스플레이 패널의 형광체 검사 장치 및 방법
KR20110085957A (ko) * 2011-06-15 2011-07-27 삼성엘이디 주식회사 발광 디바이스 제조 장치 및 발광 디바이스 제조 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003196949A (ja) * 2001-12-27 2003-07-11 Hitachi High-Tech Instruments Co Ltd 光学ディスク検査装置
JP3723845B2 (ja) * 2002-03-26 2005-12-07 国立大学法人富山大学 有機エレクトロルミネッセンス素子に使用される有機薄膜の膜厚測定法および測定装置
JP2006162427A (ja) * 2004-12-07 2006-06-22 Toshiba Corp Ｌｅｄチップの検査方法及びｌｅｄチップの検査装置
KR101168316B1 (ko) * 2009-12-01 2012-07-25 삼성전자주식회사 발광다이오드 검사 장치
CN102087226B (zh) * 2009-12-04 2015-03-25 三星电子株式会社 Led测试装置及其测试方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000011616A (ko) * 1998-07-10 2000-02-25 모리시타 요이찌 전자부품실장장치,인식장치및인식방법
JP2000149781A (ja) * 1998-11-06 2000-05-30 Matsushita Electric Ind Co Ltd プラズマディスプレイ蛍光体検査装置
KR20040039697A (ko) * 2002-11-04 2004-05-12 엘지전자 주식회사 플라즈마 디스플레이 패널의 형광체 검사 장치 및 방법
KR20110085957A (ko) * 2011-06-15 2011-07-27 삼성엘이디 주식회사 발광 디바이스 제조 장치 및 발광 디바이스 제조 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10217680B2 (en) 2016-08-03 2019-02-26 Samsung Electronics Co., Ltd. Test apparatus and manufacturing apparatus of light emitting device package

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Publication number Publication date
CN107655407A (zh) 2018-02-02
KR20130142023A (ko) 2013-12-27
CN103512491A (zh) 2014-01-15
JP5944349B2 (ja) 2016-07-05
JP2014002150A (ja) 2014-01-09

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