KR101441172B1 - 임프린트 장치 및 물품의 제조 방법 - Google Patents

임프린트 장치 및 물품의 제조 방법 Download PDF

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Publication number
KR101441172B1
KR101441172B1 KR1020110002712A KR20110002712A KR101441172B1 KR 101441172 B1 KR101441172 B1 KR 101441172B1 KR 1020110002712 A KR1020110002712 A KR 1020110002712A KR 20110002712 A KR20110002712 A KR 20110002712A KR 101441172 B1 KR101441172 B1 KR 101441172B1
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South Korea
Prior art keywords
substrate
resin
measuring device
stage
imprint apparatus
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KR1020110002712A
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English (en)
Korean (ko)
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KR20110085888A (ko
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히로시 사또
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Multimedia (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020110002712A 2010-01-19 2011-01-11 임프린트 장치 및 물품의 제조 방법 Active KR101441172B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-009529 2010-01-19
JP2010009529A JP5563319B2 (ja) 2010-01-19 2010-01-19 インプリント装置、および物品の製造方法

Publications (2)

Publication Number Publication Date
KR20110085888A KR20110085888A (ko) 2011-07-27
KR101441172B1 true KR101441172B1 (ko) 2014-09-17

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KR1020110002712A Active KR101441172B1 (ko) 2010-01-19 2011-01-11 임프린트 장치 및 물품의 제조 방법

Country Status (3)

Country Link
US (1) US8740604B2 (enExample)
JP (1) JP5563319B2 (enExample)
KR (1) KR101441172B1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190098405A (ko) * 2018-02-14 2019-08-22 한국기계연구원 순간가열방식 및 용액전사방식의 임프린트 장치와, 그 방법
KR20190132216A (ko) * 2018-05-18 2019-11-27 캐논 가부시끼가이샤 임프린트 장치 및 물품 제조 방법

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JP6029268B2 (ja) * 2011-09-12 2016-11-24 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6012209B2 (ja) * 2012-03-15 2016-10-25 キヤノン株式会社 インプリント装置及び物品の製造方法
JP5813603B2 (ja) * 2012-09-04 2015-11-17 株式会社東芝 インプリント装置およびインプリント方法
JP2015170815A (ja) 2014-03-10 2015-09-28 キヤノン株式会社 インプリント装置、アライメント方法及び物品の製造方法
JP6552329B2 (ja) * 2014-09-12 2019-07-31 キヤノン株式会社 インプリント装置、インプリントシステム及び物品の製造方法
JP6548560B2 (ja) * 2015-11-30 2019-07-24 キヤノン株式会社 インプリント装置、計測方法、インプリント方法、および物品の製造方法
JP6552392B2 (ja) * 2015-11-30 2019-07-31 キヤノン株式会社 インプリント装置、計測方法、インプリント方法、および物品の製造方法
WO2017094225A1 (en) * 2015-11-30 2017-06-08 Canon Kabushiki Kaisha Imprinting apparatus, measurement method, imprinting method, and article manufacturing method
JP6590667B2 (ja) * 2015-11-30 2019-10-16 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP7289895B2 (ja) * 2017-08-21 2023-06-12 キヤノン株式会社 インプリント装置、インプリント方法、および、物品の製造方法
JP2019036679A (ja) * 2017-08-21 2019-03-07 キヤノン株式会社 インプリント装置、インプリント方法、および、物品の製造方法
JP7257817B2 (ja) 2019-03-04 2023-04-14 キヤノン株式会社 インプリント装置、および物品の製造方法
JP7699993B2 (ja) * 2021-07-30 2025-06-30 キヤノン株式会社 液体吐出装置、液体吐出方法、成形装置及び物品の製造方法

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KR20100035107A (ko) * 2008-09-25 2010-04-02 캐논 가부시끼가이샤 임프린트 장치 및 임프린트 방법

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US6309580B1 (en) * 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
JP4006217B2 (ja) * 2001-10-30 2007-11-14 キヤノン株式会社 露光方法、露光装置及びデバイスの製造方法
US6653030B2 (en) * 2002-01-23 2003-11-25 Hewlett-Packard Development Company, L.P. Optical-mechanical feature fabrication during manufacture of semiconductors and other micro-devices and nano-devices that include micron and sub-micron features
JP2003251792A (ja) * 2002-02-28 2003-09-09 Seiko Epson Corp 機能液滴吐出ヘッドの位置認識装置およびヘッドユニットの組立装置、並びに液晶表示装置の製造方法、有機ｅｌ装置の製造方法、電子放出装置の製造方法、ｐｄｐ装置の製造方法、電気泳動表示装置の製造方法、カラーフィルタの製造方法、有機ｅｌの製造方法、スペーサ形成方法、金属配線形成方法、レンズ形成方法、レジスト形成方法および光拡散体形成方法
JP4478424B2 (ja) * 2003-09-29 2010-06-09 キヤノン株式会社 微細加工装置およびデバイスの製造方法
JP2005167166A (ja) 2003-12-01 2005-06-23 Bussan Nanotech Research Institute Inc 位置制御可能なパターン形成装置及び位置制御方法
US7309225B2 (en) * 2004-08-13 2007-12-18 Molecular Imprints, Inc. Moat system for an imprint lithography template
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JP2006165371A (ja) * 2004-12-09 2006-06-22 Canon Inc 転写装置およびデバイス製造方法
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US8119052B2 (en) * 2007-11-02 2012-02-21 Molecular Imprints, Inc. Drop pattern generation for imprint lithography
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KR20100035107A (ko) * 2008-09-25 2010-04-02 캐논 가부시끼가이샤 임프린트 장치 및 임프린트 방법

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190098405A (ko) * 2018-02-14 2019-08-22 한국기계연구원 순간가열방식 및 용액전사방식의 임프린트 장치와, 그 방법
KR102022268B1 (ko) * 2018-02-14 2019-09-19 한국기계연구원 순간가열방식 및 용액전사방식의 임프린트 장치와, 그 방법
KR20190132216A (ko) * 2018-05-18 2019-11-27 캐논 가부시끼가이샤 임프린트 장치 및 물품 제조 방법
KR102515960B1 (ko) 2018-05-18 2023-03-31 캐논 가부시끼가이샤 임프린트 장치 및 물품 제조 방법

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US8740604B2 (en) 2014-06-03
JP2011151092A (ja) 2011-08-04
JP5563319B2 (ja) 2014-07-30
KR20110085888A (ko) 2011-07-27
US20110177249A1 (en) 2011-07-21

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