KR101419279B1 - 캐리어 수명이 개선된 기판을 제조하는 방법 - Google Patents

캐리어 수명이 개선된 기판을 제조하는 방법 Download PDF

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KR101419279B1
KR101419279B1 KR1020097001023A KR20097001023A KR101419279B1 KR 101419279 B1 KR101419279 B1 KR 101419279B1 KR 1020097001023 A KR1020097001023 A KR 1020097001023A KR 20097001023 A KR20097001023 A KR 20097001023A KR 101419279 B1 KR101419279 B1 KR 101419279B1
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gas
silicon carbide
substrate
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carbon
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KR20090031573A (ko
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길영 정
마크 로보다
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다우 코닝 코포레이션
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Assigned to 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스 9 엘엘씨 reassignment 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스 9 엘엘씨 권리의 전부이전등록 Assignors: 다우 실리콘즈 코포레이션
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    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/36—Carbides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3408—Silicon carbide
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/32—Carbides
    • C23C16/325—Silicon carbide
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2902—Materials being Group IVA materials
    • H10P14/2904—Silicon carbide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2926—Crystal orientations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H10P14/3442—N-type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H10P14/3444—P-type

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
KR1020097001023A 2006-07-19 2007-07-17 캐리어 수명이 개선된 기판을 제조하는 방법 Active KR101419279B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US83183906P 2006-07-19 2006-07-19
US60/831,839 2006-07-19
PCT/US2007/016192 WO2008011022A1 (en) 2006-07-19 2007-07-17 Method of manufacturing substrates having improved carrier lifetimes

Publications (2)

Publication Number Publication Date
KR20090031573A KR20090031573A (ko) 2009-03-26
KR101419279B1 true KR101419279B1 (ko) 2014-07-15

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Country Status (8)

Country Link
US (2) US20100006859A1 (https=)
EP (1) EP2044244B1 (https=)
JP (3) JP2009544171A (https=)
KR (1) KR101419279B1 (https=)
CN (2) CN101490315A (https=)
AU (1) AU2007275780B2 (https=)
CA (1) CA2657929C (https=)
WO (1) WO2008011022A1 (https=)

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CN101540343B (zh) * 2009-04-14 2011-08-24 西安电子科技大学 偏移场板结构的4H-SiC PiN/肖特基二极管及其制作方法
US8574528B2 (en) * 2009-09-04 2013-11-05 University Of South Carolina Methods of growing a silicon carbide epitaxial layer on a substrate to increase and control carrier lifetime
US20120244684A1 (en) * 2011-03-24 2012-09-27 Kunihiko Suzuki Film-forming apparatus and method
KR101494122B1 (ko) 2011-04-21 2015-02-16 신닛테츠스미킨 카부시키카이샤 에피택셜 탄화 규소 단결정 기판 및 그 제조 방법
CN104619881A (zh) * 2012-08-17 2015-05-13 株式会社Ihi 耐热复合材料的制造方法及制造装置
US8860040B2 (en) * 2012-09-11 2014-10-14 Dow Corning Corporation High voltage power semiconductor devices on SiC
US9018639B2 (en) 2012-10-26 2015-04-28 Dow Corning Corporation Flat SiC semiconductor substrate
US9797064B2 (en) 2013-02-05 2017-10-24 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a support shelf which permits thermal expansion
US9738991B2 (en) 2013-02-05 2017-08-22 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a supporting shelf which permits thermal expansion
JP6249815B2 (ja) * 2014-02-17 2017-12-20 株式会社Ihi 耐熱複合材料の製造方法及び製造装置
US9279192B2 (en) 2014-07-29 2016-03-08 Dow Corning Corporation Method for manufacturing SiC wafer fit for integration with power device manufacturing technology
GB2540608A (en) * 2015-07-23 2017-01-25 Univ Warwick Growing epitaxial 3C-SiC on single-crystal silicon
WO2017013445A1 (en) 2015-07-23 2017-01-26 The University Of Warwick Growing expitaxial 3c-sic on single-crystal silicon
CN107578988B (zh) * 2017-09-13 2019-11-19 中国电子科技集团公司第十三研究所 碳化硅外延层钝化方法
CN111624460B (zh) * 2020-06-28 2022-10-21 西安奕斯伟材料科技有限公司 一种单晶硅缺陷分布区域的检测方法
IT202000021517A1 (it) * 2020-09-11 2022-03-11 Lpe Spa Metodo per deposizione cvd di carburo di silicio con drogaggio di tipo n e reattore epitassiale
CN113913926A (zh) * 2021-10-22 2022-01-11 西安奕斯伟材料科技有限公司 外延反应腔室的恢复方法、外延生长装置及外延晶圆

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Also Published As

Publication number Publication date
US9337027B2 (en) 2016-05-10
EP2044244B1 (en) 2013-05-08
CN101490315A (zh) 2009-07-22
CN102517631B (zh) 2015-04-01
CN102517631A (zh) 2012-06-27
KR20090031573A (ko) 2009-03-26
JP2013047181A (ja) 2013-03-07
EP2044244A1 (en) 2009-04-08
JP2009544171A (ja) 2009-12-10
CA2657929A1 (en) 2008-01-24
AU2007275780A1 (en) 2008-01-24
US20140203297A1 (en) 2014-07-24
JP2015083538A (ja) 2015-04-30
US20100006859A1 (en) 2010-01-14
AU2007275780B2 (en) 2011-02-24
CA2657929C (en) 2014-11-04
WO2008011022A1 (en) 2008-01-24

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