KR101419145B1 - Copper alloy sheet material, connector using same, and copper alloy sheet material production method for producing same - Google Patents

Abstract

An object of the present invention is to provide a lead frame, a connector, and a terminal for an electric / electronic device, which are excellent in bending workability, excellent strength, and excellent in stress relaxation resistance, , A switch, and the like. [MEANS FOR SOLVING PROBLEMS] A plate material comprising a copper alloy composition containing 0.5 to 5.0 mass% of at least one of Ni and Co, 0.1 to 1.2 mass% of Si, and the balance of Cu and unavoidable impurities, The area ratio of the Cube orientation {0 0 1} <1 0 0> of the material surface layer in the crystal orientation analysis in the measurement is W 0, the Cube orientation area ratio at the entire 1/4 position of the material is W 4 , A ratio of W0 / W4 of not less than 0.8, a W0 of 5 to 48%, and an average crystal grain size of 12 to 100 mu m, and excellent in 180 ° close bending workability and stress relaxation resistance.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper alloy sheet material, a connector using the copper alloy sheet material, and a method for manufacturing a copper alloy sheet material for manufacturing the copper alloy sheet material,

The present invention relates to a copper alloy sheet material, and more particularly, to a copper alloy sheet material which is applied to a lead frame, a connector, a terminal material, a relay, a switch and a socket for a vehicle-mounted component or an electric / A connector using the same, and a method for manufacturing a copper alloy sheet material for manufacturing the same.

BACKGROUND ART Copper alloy sheets used for applications such as parts mounted on vehicles and lead frames, connectors, short materials, relays, switches and sockets for electric and electronic devices are required to have properties such as electric conductivity, yield strength (yield stress) Strength, bending workability, and stress relaxation resistance are required. In recent years, along with the miniaturization, weight reduction, high performance, high density mounting, and high temperature of use environments of electric and electronic devices, the level required for these characteristics is increasing. Here are some representative examples.

Materials have been made thinner in the background of reduction of mineral resources and lightening of parts, and in order to maintain the spring contact, materials having higher strength than the conventional ones are used. At that time, generally, the bending workability is in a trade off relationship with the strength, so that when a high-strength material is processed to a bending radius of the conventional bending radius, there arises a problem that cracks occur. In particular, in many cases, a U-shaped bending design is required for a vehicle-mounted terminal or a connector for use in electronic equipment. However, since a large stress is applied to the outside of the bending portion, cracks are generated in a material having poor bending workability, There arises a problem that conduction failure due to a reduction in the contact pressure of the connector becomes a problem. As a countermeasure, there are cases where a plurality of notches are machined on the inner side bent at 180 占 or design changes are made to increase the inner bending radius from the design of the close bending. However, There arises a problem that it is incompatible with reduction in size and miniaturization of electronic device parts.

In addition, the use environment is getting higher. For example, in automobile parts, the weight of the vehicle body is being reduced in order to reduce the amount of carbon dioxide generated. Conventionally, an electronic device such as an ECU for engine control installed in a door is installed in an engine room or in the vicinity of an engine, Movements are underway to shorten the wire harness between the engines. In addition, as the use of high current increases in conjunction with the electric vehicle, joule heat becomes a problem. When the contact material used for the connector is exposed to a high temperature of 100 占 폚 or more for a long time, the displacement within the elastic limit becomes plastic displacement and the contact pressure of the terminal fitting portion is lowered. Therefore, development of a copper alloy sheet material excellent in stress relaxation resistance is required.

In order to solve the above problems, a copper alloy material having excellent stress relaxation resistance and improved bending workability is desired.

Several proposals have been made to solve the demand for improvement in the bending workability of the copper alloy material by controlling the crystal orientation.

Patent Document 1 discloses a Cu-Ni-Si based copper alloy in which the crystal grain size and the X-ray diffraction intensity from {3 1 1}, {2 2 0}, and {2 0 0} In the case of the crystal orientation, it was found that the bending workability was excellent. Further, in Patent Document 2, in the Cu-Ni-Si based copper alloy, when the X-ray diffraction intensity from {2 0 0} plane and {2 2 0} plane is a crystal orientation satisfying any condition, And excellent workability was found. In Patent Document 3, it has been found that the Cu-Ni-Si based copper alloy has excellent bending workability by appropriately controlling the ratio of the Cube orientation {1 0 0} <0 0 1>.

In addition, with respect to the demand for improvement of the stress relaxation resistance, generally, since the stress relaxation is difficult as the crystal grain size is larger, it is possible to use the Cu-Ni-Si based copper alloy for both stress relaxation resistance and bending workability Is disclosed in Patent Document 4 and the like.

Japanese Patent Application Laid-Open No. 2006-009137 Japanese Patent Application Laid-Open No. 2008-013836 Japanese Patent Application Laid-Open No. 2006-283059 Japanese Patent Application Laid-Open No. 2008-106356

In the inventions described in Patent Documents 1, 2, and 4, the measurement of the crystal orientation by X-ray diffraction from the specific surface relates only to a very specific portion of the distribution of the crystal orientations having a certain extent. Furthermore, since only the crystal plane in the sheet surface direction is measured, it is not evaluated which crystal plane faces in the rolling direction or the plate width direction, so that the control of the crystal orientation is insufficient and the improvement of the bending workability is insufficient There was a case. Further, in the X-ray measurement of the plate surface shown in these documents, since the penetration length of the X-rays is several tens of microns, the crystal orientation inside the X-ray is not controlled. In the invention described in Patent Document 3, the effectiveness of the Cube orientation is pointed out, but the distribution in the thickness direction and other crystal orientation components are not controlled. As described above, in the prior art, the improvement in the bending workability is sometimes insufficient, and in some cases, the level at which the bending can be performed without cracking at the high stress of the 180 ° contact bending is insufficient.

SUMMARY OF THE INVENTION In view of the above-described problems, an object of the present invention is to provide a lead frame, a connector, and a terminal material (terminal material) for an electric / electronic device having excellent bending workability, excellent strength, And the like, and a copper alloy plate material suitable for a connector, a terminal, a relay, a switch or the like for mounting on an automobile vehicle. It is also an object of the present invention to provide a connector using the copper alloy sheet material, and a method of manufacturing a copper alloy sheet material suitably producing the same.

The inventors of the present invention have repeatedly studied various copper alloys suitable for use in electrical and electronic parts and have found that by controlling the Cube orientation area ratio at the plate thickness layer and plate thickness 1/4 position, The characteristics can be remarkably improved and the above problems can be solved by controlling the crystal grain size to a specific range. Further, it has been found that the reduction in the Brass orientation further contributes to the bending workability. Further, in addition to this, it has been found that by using a specific additive element in the copper alloy, the strength and the stress relaxation property can be improved without impairing the electric conductivity and the bending workability. The present inventors have arrived at the present invention based on these findings.

That is, the present invention provides the following means.

(1) A plate material comprising a copper alloy composition comprising 0.5 to 5.0 mass% of at least one of Ni and Co, 0.1 to 1.2 mass% of Si, and the balance of Cu and unavoidable impurities, The area ratio of the Cube orientation {0 0 1} <1 0 0> of the material surface layer in the crystal orientation analysis is W0, and the Cube orientation area ratio at the entire 1/4 position at the depth position of the material is W4 , Wherein the ratio of W0 / W4 is 0.8 or more, W0 is 5 to 48%, and the average crystal grain size is 12 to 100 占 퐉. The copper alloy sheet material excellent in 180 ° close bending workability and stress relaxation resistance.

(2) A positive electrode active material as described in (1), further containing 0.005 to 2.0% by mass in total of at least one selected from the group consisting of Sn, Zn, Ag, Mn, B, P, Mg, Cr, Fe, Ti, Zr and Hf Copper alloy sheet described.

(3) The copper alloy sheet according to (1) or (2), wherein the area ratio of the brass direction {1 1 0} <1 1 2> is not more than 20%.

(4) A connector comprising the copper alloy sheet material according to any one of (1) to (3).

(5) A method for producing a copper alloy sheet material according to any one of (1) to (3)
The copper alloy ingot (copper alloy ingot) having the composition described in the above (1) or (2) is subjected to at least the following processes I, II, III, IV and V in that order, And the finish rolling is carried out at 40%.

[Process I: hot rolling step with a 1-pass processing rate of 30% or less and a holding time between 20 and 30 seconds in each pass]
[Process II: Cold rolling process with a processing rate of 80% to 99%]

[Process III: intermediate heat treatment at a temperature of 300 to 700 占 폚 for 10 seconds to 5 hours and cold rolling at a processing rate of 5 to 50%
[Process IV: Solution heat treatment step performed at 800 to 1000 占 폚]

[Process V: aging precipitation heat treatment process at a temperature of 350 to 600 占 폚 for 5 minutes to 20 hours and a finish cold rolling process at a processing rate of 5 to 40%

The copper alloy sheet material of the present invention is excellent in bending workability, has excellent strength, and is suitable for connectors, end pieces, relays, switches, and the like for mounting on automobiles, such as lead frames, connectors, and end pieces for electric and electronic devices. Further, according to the method for producing a copper alloy sheet material of the present invention, a copper alloy sheet material having the above excellent properties can be suitably produced.

Fig. 1 is an explanatory diagram showing a calculation method of the rotation angle from the Cube orientation. Fig.
Fig. 2 is an explanatory view of a test method of stress relaxation characteristics in the embodiment, wherein (a) shows a state before heat treatment and (b) shows a state after heat treatment, respectively.

Preferred embodiments of the copper alloy sheet material of the present invention will be described in detail. Here, the &quot; copper alloy material &quot; means a copper alloy material which is processed into a predetermined shape (e.g., plate, . Among them, a plate material means a material having a specific thickness and stable in shape and having a width in a plane direction, and broadly means a material including a joining material. Here, in the plate material, the term "material surface layer" means "plate surface layer" and "depth position of material" means "position in the plate thickness direction". The thickness of the sheet material is not particularly limited, but is preferably 8 to 800 m, more preferably 50 to 70 m, in view of the fact that the effect of the present invention is better and suitable for practical applications.

The characteristics of the copper alloy sheet material of the present invention are defined by the integration ratio of the element surface in a predetermined direction of the rolled sheet. However, it is sufficient that the copper alloy sheet material has such characteristics as the copper alloy sheet material, But the present invention is not limited thereto, and the tube material may be interpreted and treated as a plate material.

(Regulation by EBSD measurement)

In order to clarify the cause of occurrence of cracks during bending of the material, the inventors of the present invention examined the metallic structure of the cross section after bending deformation in detail by electron microscope and electron backscattering diffraction measurement (hereinafter also referred to as EBSD) . As a result, it was observed that the base material was not uniformly deformed but the nonuniform deformation was progressed so that deformation was concentrated only in a specific crystal orientation region. It was also found that wrinkles and cracks of several micrometers in depth were generated on the surface of the base material after bending due to the nonuniform deformation.

In 90 ° bending, deformation is imparted to the outermost layer in the plate thickness direction. In 180 ° bending, the deformation is largely deformed not only to the uppermost layer in the thickness direction of the thin plate, but also to the 1/4 plate thickness, It was found that not only crystal grains in the vicinity of the surface layer but also crystal grains up to a depth of 1/4 plate thickness were involved. Then, it was found that the local strain zone was not observed in the Cube orientation particle, and the Cube orientation had an effect of suppressing the non-uniform deformation. As a result, it was found that wrinkles generated on the surface of the plate were reduced and cracks were suppressed. Also, it was found that the brass bearing often accompanies the local deformation after the bending deformation and adversely affects the bending property.

When the area ratio W0 of the Cube orientation of the plate surface layer is 5 to 48% and the ratio W0 / W4 to the Cube orientation area ratio W4 at the plate thickness 1/4 depth position is 0.8 or more, the 180 ° contact bending property is excellent. Preferably, W0 is 10 to 40% and W0 / W4 is 0.9 or more. By setting W0 / W4 within the above range, the bending workability can be improved in particular, and the bending workability and the material strength can be suitably matched.

The Brass bearing areal ratio of the surface layer of the plate is preferably 20% or less, more preferably 15% or less, further preferably 10% or less. Setting the Brass bearing area ratio in the above range is likewise preferable from the viewpoint of achieving high bending workability and compatibility with the material strength.

In this specification, a crystal orientation display method is a rectangular coordinate system in which the rolling direction (RD) of a material is an X axis, the width direction (TD) is a Y axis, and the rolling normal direction (ND) is a Z axis, (Hkl) [uvw] using the exponent hkl of the crystal plane perpendicular to the Z axis (parallel to the rolling plane) and the exponent [uvw] of the crystal direction parallel to the X axis . For the equivalent bearing under the cubic symmetry of the copper alloy, such as (1 3 2) [6 -4 3] and (2 3 1) [3 -4 6], the brackets , And is indicated by {hkl} <uvw>.

Cube orientation refers to a state in which the (100) plane faces the (100) plane in the rolling direction normal direction (ND) and the (100) plane in the rolling direction RD and is represented by an index of {0 0 1} <1 0 0>.

The Brass bearing is a state in which the (110) plane faces the (112) plane in the rolling direction (RD) in the normal direction (ND) of the rolling plane, and is represented by an index of {1 1 0} <1 1 2>.

The EBSD method is used for the analysis of the crystal orientation in the present invention. EBSD is an abbreviation of Electron Back Scatter Diffraction (EBSD). It is used as an electron backscattering diffraction (EBSD). It is used in a scanning electron microscope (SEM) Interpretation technique. In the present invention, the sample is scanned in units of 0.5 mu m with respect to a sample area of 500 mu m each of four sides including 200 or more crystal grains, and the orientation is analyzed.

The area ratio of the Cube orientation and the Brass orientation is calculated by dividing the area of the region where the deviation angle from each ideal orientation (the Cube orientation or the Brass orientation) is within 10 占 by the measurement area.

With respect to the deviation angle from the ideal azimuth, the rotation angle was calculated around the common axis of rotation to obtain the deviation angle. Fig. 1 shows an example of a bearing whose deviation angle from the Cube orientation is within 10 [deg.]. Herein, the directions of the rotation axes of (100), (110) and (111) are shown to be within 10 degrees, but the rotation angle with respect to the cube direction is calculated with respect to all the rotation axes. And the rotation axis can be expressed by the smallest deviation angle. This deviation angle was calculated for all measurement points, and the area up to the first decimal place was regarded as an effective number, and the area of the crystal grains having an orientation within 10 degrees from each of the Cube orientation and Brass orientation was divided by the total measurement area to obtain the area ratio.

The information obtained by the orientation analysis by the EBSD includes orientation information up to a depth of several tens of nanometers at which the electron beam enters the sample but is sufficiently small for the area to be measured. Further, the orientation distribution was measured from the plate surface.

Further, in the EBSD measurement, it is preferable to carry out the measurement after polishing the surface of the base body by mirror polishing using abrasive particles of colloidal silica after mechanical polishing in order to obtain a clear Kikuchi ray diffraction image.

When the EBSD measurement was performed at the plate thickness 1/4 position, the surface layer portion up to the 1/4 position was dissolved by electrolytic polishing, and then the surface was mirror-polished and measured in the same manner as in the case of the plate surface layer.

Here, the characteristics of the EBSD measurement will be described in comparison with the X-ray diffraction measurement. First of all, there is a crystal orientation which can not be measured by X-ray diffraction measurement, that is, S orientation and BR orientation. In other words, by adopting the EBSD, the information about the S orientation and the BR orientation can be obtained by the ratio, and the relationship between the specified alloy structure and the operation becomes clear. Secondly, X-ray diffraction measures the amount of crystal orientation included in the range of +/- 0.5 DEG of ND // {hk l}. On the other hand, the EBSD measures the amount of the crystal orientation contained within ± 10 degrees from the orientation. Therefore, according to the EBSD measurement, information on a remarkably wide range of alloy structure can be obtained enormously, and it becomes clear that the alloy material as a whole is difficult to specify in X-ray diffraction. As described above, the information obtained by the EBSD measurement and the X-ray diffraction measurement is different in content and property. In addition, unless otherwise specified in the present specification, the results of the EBSD are obtained in the ND direction of the copper alloy sheet material.

(Alloy composition etc.)

The copper-based material suitably used as the material for the connector is divided into a pure copper system and a high-strength copper system, and the high-strength copper-based material is further divided into a solid solution type and a precipitation type. In the present invention, a precipitation-type copper alloy having electrical conductivity, mechanical strength and heat resistance required for a connector is preferable. In particular, Cu-Ni-Si-based, Cu-Ni-Co-Si-based, and Cu-Co-Si-based alloys are preferable for achieving both high strength and high conductivity.

Ni, Co, Si

In the present invention, Ni-Si, Co-Si, Ni (Ni), cobalt (Co) and silicon (Si), which are the first group of additive elements to be added to copper It is possible to improve the strength of the copper alloy by precipitating a compound of -Co-Si. The additive amount thereof is preferably 0.5 to 5.0 mass%, more preferably 0.6 to 4.5 mass%, and even more preferably 0.8 to 4.0 mass%, based on the total amount of one or both of Ni and Co. The Si content is preferably 0.1 to 1.5% by mass, more preferably 0.2 to 1.2% by mass. Too large an amount of these elements tends to lower the conductivity, while an excessively small amount tends to result in insufficient strength. In addition, when it is desired to increase the conductivity, the addition of Co is essential, and the addition amount of Co is 0.4 to 1.5% by mass, more preferably 0.6 to 2.0% by mass. In addition, since Co is a rare element and increases the solution temperature by addition, it is preferable not to add Co if it is not necessary to increase the conductivity remarkably depending on the application.

Average particle size

The average crystal grain size is 12 to 100 mu m. If it is too small, the stress relaxation property is deteriorated. If it is too large, the bending workability is deteriorated, which is not preferable. Further, in order to control the crystal grain size to a range smaller than 12 占 퐉, it is necessary to control the arrival temperature to a relatively low temperature as the final solution heat treatment as described later. In that case, however, the solute element is insufficiently dissolved, There is a case of decrease in precipitation hardening. From this point of view, the average crystal grain size is set to 12 占 퐉 or more. More preferably, it is 22 to 80 mu m.

The average crystal grain size in the present invention is measured according to JIS H 0501 (cutting method).

· Other elements

The copper alloy sheet material of the present invention is characterized in that at least one selected from the group consisting of Sn, Zn, Ag, Mn, B, P, Mg, Cr, Fe, Ti, . The average crystal grain size and the preferable range thereof in this composition are the same as described above.

At least one additive element selected from the group consisting of Sn, Zn, Ag, Mn, B, P, Mg, Cr, Fe, Ti, Zr and Hf is added in order to sufficiently manifest the additive effect and not to lower the conductivity. Is preferably 0.005 to 2.0% by mass, more preferably 0.1 to 1.5% by mass, and still more preferably 0.7 to 1.2% by mass. If the total amount of these added elements is too large, the conductivity is lowered. If it is too small, the effect of adding these elements is hardly exerted.

The effect of addition of each element is shown below. Mg, Sn and Zn are added to a Cu-Ni-Si alloy, a Cu-Ni-Co-Si alloy and a Cu-Co-Si alloy to improve stress relaxation resistance. The stress relaxation property is further improved by the synergistic effect in the case of addition of each of them together. In addition, there is an effect of remarkably improving the brittleness of the solder. The preferable total range of Mg, Sn, and Zn is 0.12 to 1.0 mass% in total.

When Mn, Ag, B and P are added, the hot workability is improved and the strength is improved. The preferable range of the total of Mn, Ag, B, and P is 0.12 to 0.5 mass% in total.

Cr, Fe, Ti, Zr, and Hf precipitate finely in a compound or a single compound with Ni, Co, or Si as a main additive element, and contribute to precipitation hardening. Further, the compound precipitates in a size of 50 to 500 nm to suppress the grain growth, thereby making the grain size finer, and the bending workability is improved. The preferable range of the total of Cr, Fe, Ti, Zr and Hf is 0.12 to 0.5 mass% in total.

(Manufacturing method, etc.)

Next, a method for controlling the area ratio of the Cube orientation and the Brass orientation at the vicinity of the sheet thickness surface layer and at the plate thickness 1/4 position will be described. Here, the plate material (provisional material) of the precipitation-type copper alloy is described as an example, but it is possible to develop it with a solid alloy material, a lean alloy material, and a pure copper material.

Generally, in the precipitation-type copper alloy, the ingot subjected to homogenization heat treatment is thinned (thinned) in each step of hot rolling and cold rolling, and final solubilization heat treatment is performed in a temperature range of 700 to 1020 캜 to reuse solute atoms , And is manufactured so as to satisfy the required strength by the age precipitation heat treatment and the finish cold rolling. The conditions of the age precipitation heat treatment and the finish cold rolling are adjusted in accordance with desired properties such as strength and conductivity. The texture is determined roughly by recrystallization occurring during the final solution heat treatment in this series of steps, and finally determined by the rotation of the orientation occurring during the finish rolling.

The hot rolling is intended to take advantage of low deformation resistance and high deformability at high temperatures and has a great advantage in reducing the energy required for machining as compared with cold. On the other hand, in the precipitation hardening type alloy, precipitation may occur depending on the hot rolling temperature, but the precipitates at such a high temperature are generally coarse, so that they are not completely dissolved in the final solution heat treatment, Precipitation hardening in the age-precipitation heat treatment may be insufficient. Alternatively, when the final solution heat treatment is performed at a high temperature and the precipitate in the hot rolling is completely used, the crystal grains are coarsened, and the bending workability may deteriorate at this time. For this reason, in order to suppress the precipitation of the excessive amount during the hot rolling, it is necessary to increase the one-pass machining rate as much as possible to reduce the total number of passes and to maintain the hot- , And after hot rolling, it is quenched by a method such as water cooling, and is kept in a state close to a supersaturated solid solution, which is a general design guide of the hot rolling step.

It is difficult to stably control the area ratio of the Cube orientation and the Brass orientation in the vicinity of the surface thickness of the plate thickness and 1/4 of the plate thickness in the range specified by the present invention in the general hot rolling and the series of production methods described above, &Lt; / RTI &gt;

· Process condition I

First, the hot rolling is preferably a rolling in which the one-pass processing rate is 30% or less, and the rolling direction of the material is alternately changed for each pass by the reverse-type rolling. This is because, by changing the rolling direction alternately in each rolling for the surface layer to which a large shear stress is applied, the rotation of the crystal of the plate surface layer is controlled by canceling the shear strain to each other, And is thought to be due to the effect of inhibiting the formation of the tissue. By the above-described conditions, it is possible to reduce the fluctuation of the structure in the plate thickness direction. The holding time between pass and pass is set to 20 seconds to 100 seconds (preferably 20 to 50 seconds, more preferably 20 to 30 seconds), and the temperature drop between passes and passes is preferably 5 to 100 ° C . Static recrystallization and recovery occur in the material due to the control of the time and temperature between the passes and the pass, and the fluctuation of the structure in the plate thickness direction can be reduced. The temperature between the pass and the pass is measured by a radiation thermometer or a contact thermocouple thermometer. In the temperature control of the pass and the pass, it is cooled by a burner or the like, and by air cooling or water cooling.

In addition, when the holding time of the pass and the pass exceeds 100 seconds, the material temperature becomes too low, which causes surface cracking and edge cracking during rolling, which is not preferable.

· Process condition II

Secondly, cold rolling performed after hot rolling and subsequent descaling is preferably lubrication rolling at a machining ratio of 90% to 99%. If it is less than 90%, the surface layer formed by hot rolling may be influenced by the internal structure fluctuation. If the ratio exceeds 99%, edge disintegration may occur.

· Process condition III

Third, before the final solution heat treatment, annealing heat treatment (intermediate heat treatment) and then cold rolling at a low processing rate are preferably introduced and then subjected to final solution heat treatment. Annealing is carried out at a temperature of 300 to 700 占 폚 for 10 seconds to 5 hours, and the subsequent cold rolling is preferably performed at a working rate of 5 to 50%.

· Process conditions IV

Fourth, the final solution heat treatment is preferably carried out at a relatively high temperature at which the average crystal grain size is 12 to 100 mu m in size. This is because the precipitates generated between the pass and the pass of the hot rolling and the precipitates generated in the annealing heat treatment before the final solution heat treatment are solved. In the general process described above, when the temperature of the final solution heat treatment is increased, the bending workability is lowered due to coarsening of crystal grains. However, when the Cube orientation area ratio is increased as in the present invention, the deterioration of the bending property is slight . The temperature for controlling the average crystal grain size to 12 to 100 占 퐉 depends on the alloy component, but a temperature of 800 占 폚 to 1000 占 폚 is preferable.

Among the above four methods, the manufacturing method shown in the first (condition I), the third (condition III), and the fourth (condition IV) is different from the conventional manufacturing method of the conventional precipitation type copper alloy and is very important in the present invention. A more preferable state can be obtained by concurrently using the second production method.

In the above-mentioned literature on hot rolling in a Cu-Ni-Si system, precipitation during hot rolling is described as a phenomenon to be suppressed to the utmost. Therefore, as a method for suppressing precipitation of Ni and Si and coarsening of the precipitate, which causes a decrease in bending workability and strength, for example, in Japanese Patent No. 4209749, the hot rolling time is shortened Method is disclosed. Further, for example, Japanese Patent No. 4444143 discloses a two-roll casting method as a method of not performing hot rolling itself.

The new production method of the present invention is characterized in that the holding time between passes is rather long as in the process condition I in order to achieve a difficult problem of reducing the difference in the thickness in the plate thickness direction and as a countermeasure for precipitation occurring therebetween, And actively adopts a high temperature as in Process Condition IV.

By satisfying the above content, for example, the characteristics required for a copper alloy sheet for a connector can be satisfied. In one preferred embodiment of the copper alloy sheet of the present invention, the 0.2% proof stress is 500 MPa or more and the conductivity is 30% IACS or more. Particularly preferably, it is possible to perform bending without cracking in a 180 ° contact bending test with a test piece width of 1 mm for bending workability, at least 700 MPa for 0.2% proof stress, 35% IACS or more for conductivity, Is a copper alloy sheet material having good characteristics of 30% or less by a measuring method of holding at a temperature of 150 ° C, which will be described later, for a period of 1000 hours, which is an advantage of the present invention. In the present invention, the 0.2% proof stress is a value based on JIS Z 2241. The above-mentioned% IACS indicates the conductivity when the resistivity 1.7241 x 10 &lt; ^-8 &gt; OMEGA m of the International Annealed Cupper Standard is set to 100% IACS.

Example

Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited thereto.

Example  One

As shown in the composition of the alloy component column in Tables 1-1 and 1-2, an alloy containing Ni, Co, and Si and the remainder consisting of Cu and unavoidable impurities was dissolved by a high frequency melting furnace, . By using this state as the supporting material, the copper alloy sheet material of the present invention examples 1-1 to 1-12 and the comparative examples 1-1 to 1-8 ). In addition, it was shown whether the process of any one of A to G in Table 1-10 and Table 1-2 was used. The thickness of the final alloy sheet was set to 150 탆, unless otherwise specified.

In addition, although not shown in A to G, the material temperature is too low when the holding time of the pass and the pass exceeds 100 seconds. In this case, surface disruption or edge disruption occurs during rolling, I stopped the start.

(Process A)

After homogenizing heat treatment at a temperature of 900 to 1020 占 폚 for 3 minutes to 10 hours, hot working was performed, followed by water cooling, and machining was carried out for oxide scale removal. The hot rolling was performed in a total of 4 to 12 passes with a one-pass machining ratio of 10 to 30%, and the holding time between passes and passes was 20 to 100 seconds. Thereafter, cold rolling at a machining ratio of 90 to 99% was carried out, followed by heat treatment at a temperature of 300 to 700 占 폚 for 10 seconds to 5 hours, and cold rolling at a machining ratio of 5 to 50% was carried out. Thereafter, a solution heat treatment is carried out at a temperature of 800 ° C or more for 5 seconds or longer, subjected to aging precipitation heat treatment at a temperature of 350 to 600 ° C for 5 minutes to 20 hours, finish rolling to 5 to 40% Followed by tempering and annealing at a temperature of 700 ° C for 10 seconds to 2 hours.

(Step B)

After homogenizing heat treatment at a temperature of 900 to 1020 占 폚 for 3 minutes to 10 hours, hot working was performed, followed by water cooling, and machining was performed to remove oxide scale. The hot rolling was performed in a total of 4 to 12 passes with a one-pass processing rate of 10 to 30%, and the holding time between passes and passes was 20 to 100 seconds. Thereafter, cold rolling at a working ratio of 80 to 89% was carried out, followed by a heat treatment at a temperature of 300 to 700 캜 for 10 seconds to 5 hours, and cold rolling at a working rate of 5 to 50% was carried out. Thereafter, a solution heat treatment is carried out at a temperature of 800 ° C or more for 5 seconds or longer, subjected to aging precipitation heat treatment at a temperature of 350 to 600 ° C for 5 minutes to 20 hours, finish rolling to 5 to 40% Followed by tempering and annealing at a temperature of 700 ° C for 10 seconds to 2 hours.

(Step C)

After homogenizing heat treatment at a temperature of 900 to 1020 占 폚 for 3 minutes to 10 hours, hot working was performed, followed by water cooling, and machining was carried out for oxide scale removal. The hot rolling was performed in a total of 4 to 12 passes with a one-pass processing rate of 10 to 30%, and the holding time between passes and passes was 20 to 100 seconds. Thereafter, cold rolling at a machining ratio of 90 to 99% was carried out, followed by heat treatment at a temperature of 300 to 700 占 폚 for 10 seconds to 5 hours, and cold rolling at a machining ratio of 5 to 50% was carried out. Thereafter, the solution heat treatment is performed at a temperature of 800 DEG C or more for 5 seconds or longer, subjected to aging precipitation heat treatment at a temperature of 350 to 600 DEG C for 5 minutes to 20 hours, finishing rolling of 40 to 50% Followed by tempering and annealing at a temperature of 700 ° C for 10 seconds to 2 hours.

(Step D)

After homogenizing heat treatment at a temperature of 900 to 1020 占 폚 for 3 minutes to 10 hours, hot working was performed, followed by water cooling, and machining was carried out for oxide scale removal. The hot rolling was performed in a total of 2 to 8 passes in a tandem-type one-direction rolling process in which the one-pass machining rate exceeded 30%, and the holding time between passes and passes was less than 20 seconds. Thereafter, cold rolling at a working ratio of 80 to 89% was carried out, followed by a heat treatment at a temperature of 300 to 700 캜 for 10 seconds to 5 hours, and cold rolling at a working rate of 5 to 50% was carried out. Thereafter, a solution heat treatment is carried out at a temperature of 800 ° C or more for 5 seconds or longer, subjected to aging precipitation heat treatment at a temperature of 350 to 600 ° C for 5 minutes to 20 hours, finish rolling to 5 to 40% Followed by tempering and annealing at a temperature of 700 ° C for 10 seconds to 2 hours.

(Step E)

After homogenizing heat treatment at a temperature of 900 to 1020 占 폚 for 3 minutes to 10 hours, hot working was performed, followed by water cooling, and machining was carried out for oxide scale removal. The hot rolling was performed in a total of 2 to 8 passes in a tandem type one-direction rolling with a 1-pass machining rate exceeding 30%, and the holding time between passes and passes was made less than 20 seconds. Followed by cold rolling at a machining rate of 80 to 89%, and a solution heat treatment in which the temperature is maintained at 800 DEG C or higher for 5 seconds or longer. The heat treatment is subjected to aging precipitation heat treatment at a temperature of 350 to 600 DEG C for 5 minutes to 20 hours, 5 to 40% finish rolling, and temper annealing was performed at a temperature of 300 to 700 캜 for 10 seconds to 2 hours.

(Step F)

After homogenizing heat treatment at a temperature of 900 to 1020 占 폚 for 3 minutes to 10 hours, hot working was performed, followed by water cooling, and machining was carried out for oxide scale removal. The hot rolling was performed in a total of 4 to 12 passes with a one-pass machining ratio of 10 to 30%, and the holding time between passes and passes was 20 to 100 seconds. Thereafter, cold rolling at a machining ratio of 90 to 99% was carried out, followed by heat treatment at a temperature of 300 to 700 占 폚 for 10 seconds to 5 hours, and cold rolling at a machining ratio of 5 to 50% was carried out. Subjected to a solution heat treatment in which the temperature is maintained at 650 to 750 캜 for 2 hours, subjected to aging precipitation heat treatment at a temperature of 350 to 600 캜 for 5 minutes to 20 hours, subjected to finish rolling at a temperature of 350 to 600 캜, Lt; 0 &gt; C for 10 seconds to 2 hours.

(Step G)

After homogenizing heat treatment at a temperature of 900 to 1020 占 폚 for 3 minutes to 10 hours, hot working was performed, followed by water cooling, and machining was performed to remove oxide scale. The hot rolling was performed in a total of 4 to 12 passes with a one-pass machining ratio of 10 to 30%, and the holding time between passes and passes was 20 to 100 seconds. Thereafter, cold rolling at a working ratio of 80 to 89% was carried out, followed by a heat treatment at a temperature of 300 to 700 캜 for 10 seconds to 5 hours, and cold rolling at a working rate of 5 to 50% was carried out. Annealing heat treatment is carried out at a temperature of 730 to 770 캜 for 5 to 30 seconds and subjected to aging precipitation heat treatment at a temperature of 350 to 600 캜 for 5 minutes to 20 hours and finish rolling to 5 to 40% Followed by tempering and annealing at a temperature of 700 ° C for 10 seconds to 2 hours.

(Step H)

The same conditions as those in the step A were adopted except that intermediate heat treatment between cold rolling (temperature of 300 to 700 占 폚 for 10 seconds to 5 hours) was not performed.

[Table A]

Further, after each heat treatment or rolling, pickling or surface polishing according to the oxidation or roughness state of the material surface was calibrated by the tension leveler according to the shape.

The characteristics of each of these specimens were measured and evaluated as described below. Here, the thickness of the specimen was 0.15 mm. The results are shown in Tables 1-1 and 1-2.

a. Cube of defense Area ratio  [W0, W0 / W4]:

According to the EBSD method, the measurement was performed under the condition that the scan step was 0.5 mu m in the measurement region where each of the four sides was about 500 mu m each. The measurement area was adjusted based on the inclusion of 200 or more crystal grains. As described above, regarding the deviation angle from the ideal orientation, the rotation angle is calculated around the common axis of rotation to obtain the deviation angle. The rotation angles with respect to the Cube bearing were calculated for all rotating shafts. And the rotation axis can be expressed by the smallest deviation angle. The area ratio was calculated by dividing the area of the crystal grains having an orientation within 10 degrees from the Cube orientation by the whole measured area. W0 is the measurement result from the plate surface, W4 is the measurement result at the 1/4 depth position in the plate thickness direction, and W0 / W4 is the ratio thereof.

b. Brass bearing Area ratio  [B0]:

Was measured from the surface of the plate similarly to the area ratio of the Cube orientation described above.

c. Average crystal grain size [GS]:

Was measured based on JIS H 0501 (cutting method). And a cross section parallel to the rolling direction and a cross section perpendicular to the rolling direction, and an average of both was taken. The observation of the metal structure was carried out by chemical etching the mirror-polished material surface and observing with an optical microscope.

d. 180 ° Bending workability [Bending workability]:

A GW (Good Way) in which the bending axis is bent in a W-shape so that the bending axis is perpendicular to the rolling direction, and a W-shape in which the bending axis is parallel to the rolling direction And BW (Bad Way). Bending was performed in accordance with JIS Z 2248. After a 90 占 bending die of 0.4 mm R was used and preliminary bending was performed, the bending was performed by a compression tester. The presence or absence of cracks on the outside of the bending portion was observed by naked eyes with a 50-fold optical microscope to observe the bending portion. No cracks were found in the bending portion, and slight wrinkles were evaluated as?, No cracks were found, and wrinkles were large.

e. 0.2% Strength [YS]:

Three test specimens of JIS Z2201-13B cut in the rolling direction parallel to JIS Z2241 were measured and their average values were shown. Herein, the YS value was 550 MPa or more, indicating that the strength was excellent.

f: Conductivity [EC]:

The resistivity was measured by a four-terminal method in a thermostatic chamber maintained at 20 ° C (± 0.5 ° C) to calculate the conductivity. In addition, the distance between terminals was set to 100 mm. Here, it was determined that the value of EC was 35% IACS or more and that the conductivity was excellent.

g. Stress Relaxation Ratio [SR]:

Was measured in accordance with JCBA T309: 2001 (formerly Japan Electronics and Materials Industry Association standard EMAS-3003 standard), which is a provisional standard of Japan Shin-dong Association, under the conditions after being maintained at 150 ° C for 1000 hours . The initial stress of 80% of the load was loaded by the cantilever method. Herein, the value of SR is 30% or less, which is considered to be excellent in stress relaxation resistance.

Fig. 2 is an explanatory diagram of a test method of stress relaxation characteristics, wherein (a) shows a state before heat treatment, and (b) shows a state after heat treatment. 2, as shown in (a), the position of the test piece (1) when the test piece 1 held in a cantilever to the test (4), given an initial stress of 80% of the proof stress is the δ ₀ from the reference It is a street. 2 (b), the position of the test piece 2 after the load was removed was maintained at a distance of H _t from the reference as shown in FIG. 2 (b) to be. 3 is a test piece when no stress is applied, and its position is a distance of H ₁ from the reference. From this relationship, the stress relaxation rate (%) was calculated as (H _t -H ₁ ) / ( _{0 -} H ₁ ) × 100. Δ ₀ is the distance from the reference to the test piece ₁ , H ₁ is the distance from the reference to the test piece 3 and H _t is the distance from the reference to the test piece 2.

[Table 1-1]

[Table 1-2]

As shown in Table 1-2, in the samples of the comparative examples, any one of the characteristics was deteriorated.

That is, in Comparative Example 1-1, since the total amount of Ni and Co was small, the density of the precipitate that contributed to precipitation hardening decreased and the strength dropped. In addition, Si that does not form a compound with Ni or Co is excessively solved in the metal structure and the conductivity is lowered. Also, the stress relaxation resistance was also lowered. In Comparative Example 1-2, since the total amount of Ni and Co was large, the conductivity dropped. In Comparative Example 1-3, the strength was lowered because Si was small. In Comparative Example 1-4, since the amount of Si was large, the conductivity dropped.

In Comparative Example 1-5, W0 / W4 was low and the 180 ° close bending workability was poor. In Comparative Example 1-6, W0 / W4 and W0 were low and the 180-degree close bending workability was poor. In Comparative Example 1-7, the average crystal grain size with W0 was high and the 180-degree close bending workability was poor. In Comparative Example 1-8, the average crystal grain size was small and the stress relaxation resistance was poor.

On the other hand, as shown in Table 1-1, Examples 1-1 to 1-12 of the present invention were excellent in both 180 ° close bending workability, proof stress, conductivity, and stress relaxation characteristics. Particularly, in Inventive Examples 1-1, 1-2, 1-4, 1-6, 1-7, 1-8, 1-9, 1-11, 1-12 in which the surface area ratio of Brass in the surface layer is 20% , GW, and BW showed no cracks, and the wrinkles were also slight, indicating excellent bending workability.

Example  2

2-1 to 2-8 and Comparative Examples 2-1 to 2-8 were prepared in the same manner as in Example 1, except that the copper alloy in which the remainder was composed of Cu and inevitable impurities in the composition shown in Table 2 -3 was prepared, and the characteristics of each specimen were measured and evaluated in the same manner as in Example 1. The results are shown in Table 2.

[Table 2]

Comparative Example  3

An alloy composition of the present invention 1-1 was employed, and a copper alloy sheet material was produced through the process H. On the other hand, the same evaluation as in each of the above-described examples was conducted, and the results are as follows.

[Table 3]

As described above, the copper alloy sheet produced without intermediate heat treatment had a low W0 and a poor 180-degree bending workability even when a predetermined alloy composition, a hot rolling condition, and a solution heat treatment condition were adopted.

As shown in Table 2, in Comparative Examples 2-1, 2-2 and 2-3, Sn, Zn, Ag, Mn, B, P, Mg, Cr, Fe, Ti, Zr And Hf were added too much, the conductivity dropped.

On the other hand, Examples 2-1 to 2-8 of the present invention were excellent in bending workability, proof stress, conductivity and stress relaxation characteristics.

Thus, the copper alloy sheet material of the present invention has excellent properties suitable for the connector material.

Subsequently, in order to clarify the difference from the copper alloy sheet material according to the present invention, the copper alloy sheet material produced according to the conventional manufacturing conditions was produced under the same conditions, . In addition, the thickness of each plate was adjusted so as to have the same thickness as in the above example, unless otherwise specified.

( Comparative Example  101) · · · Conditions of Japanese Laid-Open Patent Application No. 2009-007666

An alloy containing the same metal element as that of the present invention of the present invention 1-1 and the remainder consisting of Cu and unavoidable impurities was melted by a high frequency melting furnace and cast at a cooling rate of 0.1 to 100 ° C per second to obtain an ingot. This was maintained at 900 to 1020 占 폚 for 3 minutes to 10 hours, followed by hot working, water quenching, and machining for oxide scale removal. In the subsequent steps, the copper alloy c01 was produced by performing the steps A-3 and B-3 described below. As for the hot working, in the above-mentioned publication, the detailed conditions are not clear, and temperature, which is a general condition at the time of application of the present application, is 800 to 1020 캜, 1-pass processing rate is 35 to 40% Sec. &Lt; / RTI &gt;

The manufacturing process includes one or two or more times of solution heat treatment. Here, the processes are classified before and after the final solution heat treatment in the process, and the process from the A-3 process to the intermediate solution process, The B-3 process was performed as a process subsequent to embedding.

Step A-3: Cold working with a reduction ratio of 20% or more is performed, and a heat treatment at 350 to 750 ° C for 5 minutes to 10 hours is performed, and a cold working with a section reduction ratio of 5 to 50% And heat treatment for 5 seconds to 30 minutes.

Step B-3: A cold working with a reduction ratio of 50% or less is carried out, and a heat treatment at 400 to 700 占 폚 for 5 minutes to 10 hours is carried out. 5 to 10 hours of tempering annealing is performed.

The obtained test specimen c01 was different from the above-mentioned examples in terms of hot working conditions in terms of the production conditions, and resulted in a failure to satisfy the required characteristics with respect to the 180 ° close bending workability.

( Comparative Example  102) · · · Conditions of Japanese Laid-Open Patent Application No. 2006-009137

A copper alloy having the same composition as that of the present invention 1-1 was melted in a high-frequency melting furnace and cast as an ingot having a thickness of 30 mm, a width of 100 mm and a length of 150 mm by the DC method. Next, these ingots were heated to 1000 占 폚, held at this temperature for 1 hour, hot-rolled to a thickness of 12 mm, and rapidly cooled. The conditions of the hot rolling were set at a temperature of 900 to 1000 占 폚 and a cold rolling after hot rolling at a working rate of 90% or more with reference to the same publication paragraph [0027]. The processing rate of one pass and the holding time between each pass were set to 35 to 40% and 3 to 7 seconds, which was a general condition at the time of filing of the present application.

Subsequently, the hot-rolled sheet was cut at 1.5 mm intervals on both sides to remove the oxide film, followed by cold rolling (a) to a thickness of 0.15 to 0.25 mm. Subsequently, the solution treatment temperature was changed in a temperature range of 825 to 925 ° C Treated for 15 seconds, and then cooled immediately at a cooling rate of 15 deg. C / sec or more. Subsequently, aging treatment was carried out at 475 DEG C for 2 hours in an inert gas atmosphere, followed by cold rolling (c) which was final plastic working to obtain a final plate thickness. After the final baking, the copper alloy sheet was subjected to low-temperature annealing at 375 ° C for 2 hours to produce a copper alloy sheet material (sample c02).

The obtained test piece c02 was different from the above-mentioned example in terms of the conditions of the hot rolling and the presence or absence of the intermediate heat treatment, and resulted in the 180 ° close bending workability being not satisfied.

( Comparative Example  103) · · · Japanese Unexamined Patent Publication 11 Conditions of -335756

A copper alloy having the same composition as that of the present invention of the present invention 1-1 was dissolved in a kryptol furnace atmospheres under coated with charcoal and cast into a bead mold to prepare an ingot having a size of 50 mm x 80 mm x 200 mm . The ingot was heated to 930 캜, hot-rolled to a thickness of 15 mm, and immediately quenched in water. In order to remove the oxide scale of the thermal expansion surface, the surface was cut into a glitter. After cold rolling, the material was subjected to heat treatment at 750 ° C for 20 seconds, cold rolling at 30% and precipitation annealing at 480 ° C for 2 hours to obtain a material having a plate thickness adjusted (c02). Further, in the hot rolling, the machining rate of one pass and the holding time of each pass are set to a condition that the one-pass machining rate is 35 to 40% and the holding time between each pass is 3 to 7 seconds .

The obtained specimen c02 was different from the above-mentioned examples in terms of the conditions of the hot rolling and the presence or absence of the intermediate heat treatment, and the 180 ° bending workability was not satisfied.

( Comparative Example  104) Condition of Japanese Patent Application Laid-Open No. 2006-283059

The copper alloy having the composition of the present invention 1-1 was dissolved in an atmosphere of charcoal in an atmosphere of an electric furnace to determine casting. The molten ingot was hot-rolled to a thickness of 15 mm. Subsequently, the hot rolled sheet was subjected to cold rolling and heat treatment (cold rolling 1 → continuous annealing for solution annealing → cold rolling 2 → aging treatment → cold rolling 3 → short time annealing) to obtain a copper alloy thin plate (c04 ). In addition, referring to the paragraph of the same publication, the solutioning conditions were set to be maintained for 30 seconds or less at an actual temperature of 800 to 950 ° C. There was no detailed description of the hot rolling, and the condition was that the one-pass processing rate was 35 to 40% and the holding time between each pass was 3 to 7 seconds, which was a general condition at the time of filing of the present application.

The obtained specimen c04 was different from the above-mentioned Example 1 in terms of the conditions of the hot rolling and the presence or absence of the intermediate heat treatment, and the 180 ° close bending workability was not satisfied.

( Comparative Example  105) · · · Conditions of Japanese Laid-Open Patent Application No. 2006-152392

The alloy having the composition of the present invention of the present invention 1-1 was dissolved in the atmosphere of creep tallow in the atmosphere under the coating of charcoal and cast into a mold of a cast iron mold to obtain an ingot having a thickness of 50 mm, a width of 75 mm and a length of 180 mm . The surface of the ingot was then subjected to hot rolling at a temperature of 950 캜 until the thickness became 15 mm and quenched in water at a temperature of 750 캜 or higher. Next, after the oxide scale was removed, cold rolling was carried out to obtain a plate having a predetermined thickness. Further, in the hot rolling, the machining rate of one pass and the holding time of each pass are set to a condition that the one-pass machining rate is 35 to 40% and the holding time between each pass is 3 to 7 seconds .

Subsequently, a solution treatment in which a salt-bath furnace was used and heated at a temperature for 20 seconds was quenched in water, and then subjected to finish cold rolling in the second half to obtain cold-rolled sheets of various thicknesses. At this time, as shown below, the processing rate (%) of these cold rolling was varied in various ways to obtain a cold rolled sheet (c05). These cold-rolled sheets were subjected to aging treatment at various temperatures (° C) and hours (hr) as shown below.

Cold working rate: 95%

Solution treatment temperature: 900 ° C

Artificial aging hardening treatment temperature x time: 450 캜 x 4 hours

Plate thickness: 0.6 mm

The obtained specimen c05 was different from the above-mentioned Example 1 in terms of the conditions of the hot rolling and the presence or absence of the intermediate heat treatment, and the 180 ° contact bending workability was not satisfied.

( Comparative Example  106) Condition of Japanese Patent Laid-Open No. 2008-223136

The copper alloy shown in Example 1 was dissolved and cast using a vertical continuous casting machine. A specimen having a thickness of 50 mm was cut from the obtained slab (thickness 180 mm), heated to 950 캜 and then extracted to start hot rolling. At that time, a pass schedule was set so that the rolling rate in the temperature range of 950 ° C to 700 ° C was 60% or more, and rolling was also performed in the temperature range of less than 700 ° C. The final pass temperature of the hot rolling is between 600 캜 and 400 캜. The total hot rolling rate from the cast is about 90%. After the hot rolling, the oxide layer in the surface layer was removed (ground) by mechanical polishing. In the hot rolling, the holding time between the respective passes was 3 to 7 seconds which was a general condition at the time of filing the present application.

Subsequently, cold rolling was performed and then subjected to solution treatment. The temperature change during the solution treatment was monitored by a thermocouple attached to the surface of the sample to determine the temperature rise time from 100 ° C to 700 ° C during the temperature rise. The temperature is adjusted so that the average crystal grain size (the twin crystal boundary is not regarded as a grain boundary) after the solution treatment is 10 to 60 占 퐉 in the range of 700 to 850 占 폚 according to the alloy composition, And the holding time in the temperature range was adjusted within the range of 10 sec to 10 min. Subsequently, the solution subjected to the solution treatment was subjected to intermediate cold rolling at a rolling rate, followed by aging treatment. The aging temperature was adjusted to a temperature of 450 ° C and the aging time was adjusted to a time at which the hardness peaked at an aging temperature of 450 ° C according to the composition of the alloy. The optimal solution treatment conditions and the aging treatment time are determined by preliminary experiments according to the alloy composition. Subsequently, finishing cold rolling was carried out at a rolling rate. The cold-rolled steel sheet was subjected to low-temperature annealing in which it was charged into a furnace at 400 ° C for 5 minutes. In this way, a publicly known material was obtained. In addition, as necessary, the surface was subjected to cutting, and the thickness of the specimen was adjusted to 0.2 mm. The main production conditions are described below.

[Japanese Patent Application Laid-Open No. 2008-223136 Comparative Example  1 condition]

Hot rolling at less than 700 ° C to 400 ° C: 17% (1 pass)

Cold rolling rate before solution treatment: 90%

Medium cold rolling Cold rolling rate: 20%

Finish Cold rolling Cold rolling rate: 30%

Temperature rising time from 100 ° C to 700 ° C: 10 seconds

The obtained specimen c05 was different from the above-mentioned Example 1 in terms of the conditions of the hot rolling and the presence or absence of the intermediate heat treatment, and the 180 ° contact bending workability was not satisfied.

1: Test piece when initial stress was applied
2: Test piece after removing the load
3: Specimen without stress
4: Test stand

Claims (7)

A plate material comprising a copper alloy composition containing 0.5 to 5.0 mass% of at least one of Ni and Co in a total amount of 0.1 to 1.2 mass% of Si and the balance of Cu and unavoidable impurities, The area ratio of the Cube orientation {0 0 1} <1 0 0> of the material surface layer in the crystal orientation analysis is W0 and the Cube orientation area ratio at the entire 1/4 position at the depth position of the material is W4, / W4 of 0.8 to 1.5, W0 of 5 to 48% and an average crystal grain size of 12 to 100 占 퐉. The copper alloy according to claim 1, further comprising 0.005 to 2.0% by mass in total of at least one selected from the group consisting of Sn, Zn, Ag, Mn, B, P, Mg, Cr, Fe, Ti, Zr, and Hf Alloy sheet. The copper alloy sheet according to claim 1, wherein the area ratio of the Brass orientation {1 1 0} <1 1 2> is 20% or less. The copper alloy sheet according to claim 2, wherein the area ratio of the brass direction {1 1 0} <1 1 2> is 20% or less. A connector comprising the copper alloy sheet according to any one of claims 1 to 4. A method for producing a copper alloy sheet material according to any one of claims 1 to 3,
A copper alloy ingot (copper alloy ingot) having the composition described in claim 1 is subjected to at least the following processes I, II, III, IV, and V in that order, And then rolling the copper alloy sheet.
[Process I: hot rolling step with a 1-pass processing rate of 30% or less and a holding time between 20 and 30 seconds in each pass]
[Process II: Cold rolling process with a processing rate of 80% to 99%]
[Process III: intermediate heat treatment at a temperature of 300 to 700 占 폚 for 10 seconds to 5 hours and cold rolling at a processing rate of 5 to 50%
[Process IV: Solution heat treatment step performed at 800 to 1000 占 폚]
[Process V: aging precipitation heat treatment process at a temperature of 350 to 600 占 폚 for 5 minutes to 20 hours and a finish cold rolling process at a processing rate of 5 to 40% A method for producing a copper alloy sheet material according to claim 2 or 4,
A copper alloy ingot (copper alloy ingot) having the composition described in claim 2 is subjected to at least the following processes I, II, III, IV, and V in that order, and then a finish of 5 to 40% And then rolling the copper alloy sheet.
[Process I: hot rolling step with a 1-pass processing rate of 30% or less and a holding time between 20 and 30 seconds in each pass]
[Process II: Cold rolling process with a processing rate of 80% to 99%]
[Process III: intermediate heat treatment at a temperature of 300 to 700 占 폚 for 10 seconds to 5 hours and cold rolling at a processing rate of 5 to 50%
[Process IV: Solution heat treatment step performed at 800 to 1000 占 폚]
[Process V: aging precipitation heat treatment process at a temperature of 350 to 600 占 폚 for 5 minutes to 20 hours and a finish cold rolling process at a processing rate of 5 to 40%

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