KR101412635B1 - Substrate treating apparatus and particle discharging method - Google Patents

Abstract

The present invention relates to a substrate processing apparatus. A substrate processing apparatus according to an embodiment of the present invention includes a housing; A substrate processing module located in an inner space of the housing; A shielding door coupled to the housing to open and close a maintenance port formed on one side of the housing for maintenance of the substrate processing module; And a maintenance door positioned outside the management port and the shielding door, wherein the shielding door includes a main hole formed in a surface of the substrate processing module opposite to a side surface thereof.

Description

[0001] The present invention relates to a substrate processing apparatus and a particle discharging method,

The present invention relates to a substrate processing apparatus and a particle discharging method.

Various processes of photolithography, etching, ion implantation, deposition, and cleaning are performed to fabricate semiconductor devices or liquid crystal displays. Among these processes, the photolithography process forms the desired pattern on the substrate.

In the photolithography process, a coating process for applying a chemical solution such as a photoresist on a substrate, an exposure process for forming a specific pattern on the coated photoresist film, and a developing process for removing an unnecessary region in the exposed photoresist film are sequentially performed.

In the coating step, when the chemical liquid is applied onto the substrate, the applied chemical liquid is dried. The drying of the chemical liquid is performed in a substrate processing apparatus that performs a baking process. The substrate processing apparatus includes an electrical unit and a door. The electric field unit controls each configuration of the substrate processing apparatus. The door is provided on one side adjacent to the electrical unit. The operator can perform the maintenance and repair of the substrate processing apparatus by opening the door.

A fan for cooling is attached to the electrical unit. The airflow generated by the fan can be directed into the substrate processing apparatus after hitting the door. The airflow directed to the substrate processing apparatus moves the particles on the outside of the substrate processing apparatus inward. Further, an external gas can be introduced into the gap between the doors. Externally introduced gas may contain particles.

The present invention provides a substrate processing apparatus and a particle discharging method in which particles in a space inside a housing are effectively discharged.

The present invention also provides a substrate processing apparatus and a particle discharging method that are simple in configuration for discharging a particle.

The present invention also provides a substrate processing apparatus and a particle discharging method in which particles discharged from the inner space of the housing are prevented from flowing back into the inner space of the housing.

According to an aspect of the present invention, A substrate processing module located in an inner space of the housing; A shielding door coupled to the housing to open and close a maintenance port formed on one side of the housing for maintenance of the substrate processing module; And a maintenance door positioned outside the management port and the shielding door, wherein the shielding door includes a main hole formed in a surface opposite to a side surface of the substrate processing module.

Further, the shielding door may be formed with an auxiliary hole formed above the main hole and communicating with a space formed above the substrate processing module.

In addition, the substrate processing module may include a control member positioned on a surface facing the management port.

In addition, the control member may include a fan located on a surface facing the main hole, for cooling the configurations of the control member.

The control unit may further include a connection tube provided between a side surface of the control member and the main hole to allow the fan and the main hole to communicate with each other.

Further, one end of the connecting tube may be attached to the side surface of the control member or the inner surface of the shielding door.

In addition, the connecting tube may have a variable length.

In addition, the connection tube may be provided as a bellows.

The apparatus may further include a duct attached to the outer surface of the shielding door to be positioned between the shielding door and the maintenance door.

The duct may include: a first flow path portion positioned corresponding to the main hole; And a second flow path portion extending in a direction different from a longitudinal direction of the first flow path portion at an end of the first flow path portion and corresponding to the auxiliary hole, and the end portion of the second flow path portion may be opened .

The duct may further include an auxiliary flow path portion formed in the second flow path portion and guiding the gas to flow from the auxiliary hole toward the open end of the second flow path portion.

The auxiliary flow path may further include an auxiliary flow path formed on the outer surface of the shielding door to guide the gas flow from the auxiliary hole toward the open end of the second flow path.

The apparatus may further include an exhaust port formed on one surface of the housing and discharging gas in the inner space of the housing.

In addition, the substrate processing module may be detachably provided through the management port in a state in which the shielding door and the maintenance door are opened.

According to another aspect of the present invention, a flow of gas is formed outside a shielding door that opens and closes a repair opening formed on one side of a housing, so that the pressure of the outside of the shielding door is formed to be lower than the pressure of the interior space of the housing And particles in the inner space of the housing are discharged out of the shielding door through auxiliary holes formed in the shielding door.

A fan positioned in the inner space of the housing forms a flow of gas in the direction of the main hole formed in the shielding door, and a duct guiding the gas discharged to the outside of the shielding door through the main hole is inserted into the main hole And the auxiliary hole, so that the particles in the inner space of the housing can be discharged through the auxiliary hole.

Further, it is possible to guide the particles discharged through the auxiliary holes to flow in the same direction as the flow direction of the gas formed on the outside of the shielding door.

According to an embodiment of the present invention, particles in the space inside the housing can be effectively discharged.

According to an embodiment of the present invention, particles can be discharged using a fan for cooling the control member.

According to an embodiment of the present invention, particles discharged from the inner space of the housing are prevented from entering the inner space again.

1 is a schematic view of a substrate processing apparatus according to an embodiment of the present invention.
2 is a perspective view showing an example of the processing unit of FIG.
3 is a plan view of the first treatment chamber.
4 is a plan view of the second treatment chamber.
5 is a rear perspective view of the bake units;
6 is a plan sectional view of the bake unit.
7 is a side sectional view of the bake unit.
8 is a rear perspective view of the present bake unit with the maintenance door opened.
FIG. 9 is a view showing a state in which a duct is removed in FIG. 8. FIG.
10 is a front perspective view of the duct.
11 is a rear perspective view of the duct.
12 is a cross-sectional view taken along the line A-A 'in FIG.
13 is a cross-sectional view taken along line B-B 'in Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.

In the present embodiment, the substrate processed by the substrate processing apparatus 1 is exemplified as a semiconductor substrate. However, the present invention is not limited to this and can be applied to various types of substrates such as a substrate used for a display panel.

1 is a schematic view of a substrate processing apparatus according to an embodiment of the present invention.

Referring to Fig. 1, the substrate processing apparatus 1 includes an index unit 10, a processing unit 20, and an interface unit 30. The substrate processing apparatus 1 performs a photolithography process on the wafer. The index unit 10, the processing unit 20 and the interface unit 30 may be arranged in a one-direction (hereinafter, referred to as a first direction 62) sequentially. The index portion 10 has a cassette holder 12 and a robot moving path 14. [

The cassettes 12a in which the substrates are accommodated are placed in the cassette holder 12. [ The robot moving path 14 is provided with a cassette 12a placed on the cassette rest 12 and a robot 14a for transferring the substrate between the processing part 20. The robot 14a has a structure that can be moved in a second direction 64 and a vertical direction perpendicular to the first direction 62 as viewed from above. The structure for transporting the robot 14a in the horizontal direction and the vertical direction can be easily constructed by those skilled in the art, and a detailed description thereof will be omitted.

The processing section 20 performs a coating process of applying a photosensitive liquid such as a photoresist to the substrate and a developing process on the substrate subjected to the exposure process. The processing unit 20 is provided with a coating unit 120a, a developing unit 120b, and a bake unit 200. [

An interface unit 30 connected to the exposure unit 40 is provided at one side of the processing unit 20. A robot 32 for transferring a substrate between the exposure unit 40 and the processing unit 20 is disposed in the interface unit 30. [ The robot 32 has a structure that can be moved in the second direction 64 and up and down directions.

2 is a perspective view showing an example of the processing unit of FIG.

Referring to Fig. 2, the processing section 20 includes a first processing chamber 100a and a second processing chamber 100b. The first treatment chamber 100a and the second treatment chamber 100b have a stacked structure. The first processing chamber 100a is provided with units for performing a coating process, and the second processing chamber 100b is provided with units for performing a developing process. That is, the first processing chamber 100a is provided with the coating units 120a and the bake units 200, and the second processing chamber 100b is provided with the developing units 120b and the bake units 200. [ According to one example, the first processing chamber 100a may be positioned above the second processing chamber 100b. Alternatively, the first process chamber 100a may be disposed below the second process chamber 100b.

The substrate has an index portion 10, a first processing chamber 100a, an interface portion 30, an exposure portion 40, an interface portion 30, a second processing chamber 100b, and an index portion 10, . ≪ / RTI > That is, when the photolithography process is performed, the substrate is moved in a loop manner in the vertical direction.

3 is a plan view of the first treatment chamber.

Referring to FIGS. 2 and 3, a first moving path 160a is provided along the first direction 62 in the center of the first processing chamber 100a. One end of the first traveling path 160a is connected to the index part 10 and the other end of the first traveling path 160a is connected to the interface part 30. [ The bake units 200 are arranged in a line along the first moving path 160a on one side of the first moving path 160a and the coating units 120a are arranged on the other side of the first moving path 160a, Are arranged in a line along the first side 160a. In addition, the bake units 200 or the application units 120a may be arranged so that a plurality of bake units 200 are stacked up and down. The first moving path 160a is provided with a first robot 162a for transferring the substrate between the index portion 10, the coating unit 120a, the bake unit 200 and the interface portion 30. [ The first moving path 160a is provided with a guide rail 164a which is positioned to move the first robot 162a in the first direction 62. [

4 is a plan view of the second treatment chamber.

Referring to FIGS. 2 and 4, the second process chamber 100b is provided with a second transfer path 160b along the first direction 62 at the center thereof. One end of the second traveling path 160b is connected to the index unit 10 and the other end of the second traveling path 160b is connected to the interface unit 30. [ The bake units 200 are arranged in a line along the second moving path 160b at one side of the second moving path 160b and the developing units 120b are arranged at the other side of the second moving path 160b at the second moving path 160b. May be arranged in a line along the first side 160b. Further, the bake units 200 and the developing units 120b may be arranged so that a plurality of the bake units 200 and the developing units 120b are stacked one on the other. The second moving path 160b is provided with a second robot 162b for transferring the substrate between the index unit 10, the developing unit 120b, the bake unit 200 and the interface unit 30. [

A guide rail 164b is provided along the first direction 62 in the second moving path 160b. The second robot 162b is located on the guide rail 162b and can be moved in the first direction 62. [ Unlike the above, the first moving path is disposed on one side of the first processing chamber, and the coating units and the bake units 200 may be disposed on the other side of the first processing chamber. Further, a second moving path may be disposed on one side of the second processing chamber, and developing units and bake units 200 may be disposed on the other side of the second processing chamber.

5 is a rear perspective view of the bake units;

Referring to FIG. 5, a maintenance door 250 is provided on a rear surface of the bake unit 200. The maintenance door 250 may be provided rotatably with respect to a housing (210 of FIG. 6) to be described later. For example, the maintenance door 250 may be hinged to the housing 210 to open and close the rear surface of the bake unit 200. The maintenance door 250 may be provided with a plurality of bake units 200 stacked one above the other. Therefore, the maintenance door 250 can simultaneously open and close the rear surface of the bake unit 200 stacked up and down. Alternatively, one maintenance door 250 may be provided for each bake unit 200, so that each bake unit 200 can be individually opened and closed.

Fig. 6 is a plan sectional view of the bake unit, and Fig. 7 is a side sectional view of the bake unit.

And Fig. 7 is a side sectional view of the baking unit.

5 to 7, the bake unit 200 includes a housing 210, a substrate processing module 220, a shielding door 230, and a maintenance door 250.

The housing 210 provides an internal space in which the substrate is processed. An opening 211 is formed on one side of the housing 210. For example, the opening 211 may be formed on the side of the housing 210 facing the traveling paths 160a and 160b. The substrate is introduced into the opening 211 by the robots 162a and 162b. A management port 212 is formed on the other surface of the housing 210. The management port 212 may be formed such that all of one side of the housing 210 is opened. For example, the management port 212 may be formed on a side surface of the housing 210 opposed to the opening 211. Hereinafter, the direction in which the opening 211 is formed in the housing 210 is referred to as a front end, and the direction opposite to the front end is referred to as a rear end. An exhaust port 213 may be formed on one surface of the housing 210. The exhaust port 213 may be formed on a side surface of the housing 210 where the opening 211 and the management port 212 are not formed. The end of the exhaust port 213 communicates with the outside of the substrate processing apparatus. The exhaust port 213 may be formed long in the vertical direction. Accordingly, the exhaust ports 213 of the bake units 200 stacked in the vertical direction can be formed to communicate with each other. The exhaust port 213 may be connected to the pump 214. The pump 214 provides a suction pressure to suck the gas, particles, or fumes in the interior space and exhaust the exterior of the substrate processing apparatus. The exhaust port 213 may be provided in plural. For example, the exhaust ports 213 may be formed on the side of the housing 210 facing each other.

The substrate processing module 220 is located in the inner space of the housing 210. The substrate processing module 220 includes a cooling member 221, a heating member 222, and a control member 223. The substrate processing module 220 performs a heat treatment process on the substrate. The cooling member 221 may be positioned adjacent to the opening 211 and the heating member 222 may be located away from the opening 211. [ On the other hand, the heating member 222 may be positioned adjacent to the opening 211, and the cooling member 221 may be located on the side of the opening 211. The cooling member 221 performs a cooling process on the loaded substrate. The heating member 222 performs a heating process on the loaded substrate. A transfer member (not shown) may be provided inside the housing 210. For example, the conveying member may be provided on the inner side wall of the housing 210. [ The conveying member is provided to move between the cooling member 221 and the heating member 222. The substrate is moved between the cooling member 221 and the heating member 222 by the conveying member. The cooling member 221 and the heating member 222 are positioned above the support plate 225. The support plate 225 is located on the lower surface of the housing 210. A control member 223 is located at one side of the support plate 225. The control member 223 is located on the side adjacent to the maintenance port 212. [ The control member 223 is positioned at the rear end of the support plate 225 when the control member 212 is positioned at the rear end of the housing 210. [ The control member 223 controls the operation of the bake unit 200. Thus, the control member 223 controls the operation of the heating member 222 and the cooling member 221. [ Further, the control member 223 can control the conveying member or the pump 214. [ The control member 223 includes a fan 224. The fan 224 is located on the side of the control member 223 adjacent to the control port 212. [ When the control port 212 is located at the rear end of the housing 210, the fan 224 is positioned at the rear end of the control member 223. The fan 224 generates a flow of gas around the control member 223 to cool the control member 223.

The substrate processing module 220 may be detachably provided. Accordingly, the substrate processing module 220 can be taken out of the housing 210 through the management port 212. The user can perform the maintenance work while the substrate processing module 220 is taken out of the housing 210 or the substrate processing module 220 of the bake unit 200 can be replaced.

In yet another embodiment, the support plate may be omitted. At this time, the side surfaces of the heating member and the cooling member are provided to be in contact with each other. Then, the control member is provided so as to abut the side surface of the heating member 222 or the cooling member.

FIG. 8 is a rear perspective view of the present bake unit in a state where the maintenance door is opened, and FIG. 9 is a view showing a state in which the duct is removed in FIG.

5 to 9, the shielding door 230 opens and closes the management port 212. [ The shielding door 230 is rotatably hinged to the housing 210. A main hole 231 and an auxiliary hole 232 are formed in the management port 212. The main hole 231 is formed in the lower portion of the shielding door 230. The main hole 231 is formed to face the fan 224. Accordingly, the gas moving from the fan 224 toward the maintenance port 212 is discharged to the outside of the housing 210 through the main hole 231. [ A connection tube 226 may be provided between the fan 224 and the main hole 231. [ The connection tube 226 connects the fan 224 and the main hole 231 to guide the flow of the gas formed in the fan 224 toward the main hole 231. One end of the connection tube 226 is connected to the shielding door 230 or the control member 223. Therefore, even when the shielding door 230 is opened, the connection tube 226 can be fixed at a predetermined position. The connection tube 226 may be provided to be variable in length. At this time, the connection tube 226 may be provided to have elasticity so as to be in close contact with the shielding door 230 or the control member 223. For example, the connection tube 226 may be provided with a bellows in which several wrinkles are formed in a direction perpendicular to the longitudinal direction thereof, thereby varying the length thereof. Thus, when the shielding door 230 is closed, both ends of the connection tube 226 can be brought into close contact with the control member 223 and the shielding door 230. An auxiliary hole (232) is formed on the upper portion of the shielding door (230). The auxiliary hole 232 is formed to communicate with the space formed above the substrate processing module 220. Several of the auxiliary holes 232 may be formed in parallel.

A duct 240 is attached to the shielding door 230 on the opposite side of the inner space of the housing 210. The duct 240 guides the flow of gas, particles or fumes discharged from the internal space of the housing 210 through the main hole 231 and the auxiliary hole 232.

The maintenance door 250 opens and closes one side of the housing 210 to which the management port 212 and the shielding door 230 are provided. The inner surface of the maintenance door 250 is spaced apart from the outer surface of the shielding door 230 by a certain distance. Therefore, a certain space is formed between the maintenance door 250 and the shielding door 230. The duct 240 is located in a space formed between the maintenance door 250 and the shielding door 230. The maintenance door 250 is spaced apart from the side surface of the housing 210 by a predetermined distance. For example, the maintenance door 250 is positioned at a certain distance from the rear end of the housing 210. Therefore, the gas, fume, or particles discharged through the main hole 231 or the auxiliary hole 232 can be discharged to the outside of the substrate processing apparatus through the space between the housing 210 and the maintenance door 250.

10 is a front perspective view of the duct, and Fig. 11 is a rear perspective view of the duct.

6 to 11, the duct 240 includes a first flow path portion 241, a second flow path portion 242, and an auxiliary flow path portion 243.

The duct 240 is positioned between the shielding door 230 and the maintenance door 250 to provide a flow path through which gases, particles, or fumes discharged from the internal space move. When the duct 240 is attached to the shielding door 230, one end of the duct 240 is shielded and the other end of the duct 240 is opened. The first flow path portion 241 is provided at a position corresponding to the main hole 231 and the second flow path portion 242 is located at a position corresponding to the auxiliary hole 232. The first flow path portion 241 is formed to have a semicircular or polygonal space extending in one direction. The first flow path portion 241 is located at one end of the shielded duct 240. When the duct 240 is attached to the shielding door 230, gas, fumes or particles discharged into the main hole 231 flow through the first flow path portion 241.

The second flow path portion 242 is located at the other open end of the duct 240. The second flow path portion 242 extends in the direction different from the extending direction of the first flow path portion 241 at the end portion of the first flow path portion 241. Therefore, the second flow path portion 242 is formed to be inclined with respect to the first flow path portion 241. The second flow path portion 242 guides the gas, fume, or particles that have passed through the first flow path portion 241 and the gas, fume, or particles discharged through the auxiliary hole 232. And the end of the second flow path portion 242 is provided to be opened. The gas, fume, or particles discharged to the end of the second flow path are discharged to the outside of the substrate processing apparatus through the gap between the housing 210 and the maintenance door 250.

12 is a cross-sectional view taken along the line A-A 'in FIG.

10 to 12, the auxiliary flow path portion 243 is provided in the second flow path portion 242. [ The auxiliary flow path portion 243 guides the gas, fume, or particles discharged from the auxiliary hole 232 to flow to the open end of the tube 240. The auxiliary flow path portion 243 may be provided in the same number as the auxiliary hole 232. [ The auxiliary flow path portion 243 includes a first guide plate 244 and a second guide plate 245. The first guide plate 244 is positioned along the longitudinal direction of the auxiliary flow path portion 243. The second guide plate 245 is bent at one end of the first guide plate 244 in a direction in which the duct 240 contacts the shielding door 230. The second guide plate 245 is positioned in the opposite direction of the open end of the second flow path portion 242. When the duct 240 is attached to the shielding door 230, the first guide plate 244 is positioned opposite the auxiliary hole 232 and the second guide plate 245 is positioned adjacent to the auxiliary hole 232 do.

In yet another embodiment, the auxiliary flow path in the duct may be omitted.

In another embodiment, the auxiliary flow path portion may be provided on the outer surface of the shielding door. At this time, the auxiliary flow path portion is provided corresponding to the auxiliary flow path portion 243 in FIGS. 10 to 12. That is, the auxiliary flow path portion is positioned adjacent to the auxiliary hole. When the duct is attached to the shielding door, the auxiliary flow path portion is located at a position corresponding to the auxiliary flow path portion in Figs.

13 is a cross-sectional view taken along line B-B 'in Fig.

The process of evacuating the bake unit 200 will be described with reference to Figs. 6 to 13. Fig.

During substrate processing in the substrate processing module 220, fumes are generated in the interior space of the housing 210. In addition, particles may be generated in the internal space due to wear caused by the operation of the components of the fume or bake unit 200 that have remained in the internal space. Particles in the inner space cause the substrate to be defective and must be discharged to the outside of the substrate processing apparatus.

When the bake unit 200 is operated, the control member 223 controls the components of the bake unit 200. The fan 224 rotates to cool the components of the control member 223 to prevent malfunction or breakage of the control member 223. The gas in the inner space is discharged by the fan 224 through the connecting tube 226 and the duct 240 out of the shielding door 230. Since the gas discharged from the duct 240 has a constant flow rate, the gas is discharged to the outside of the substrate processing apparatus through the space between the housing 210 and the maintenance door 250. The fumes or particles in the interior space flow out of the substrate processing apparatus while flowing together with the gas. The fan 224 simultaneously performs cooling of the control member 223 and particle discharge in the inner space, thereby simplifying the configuration for discharging the particles.

The gas flowing through the second flow path portion 242 has a constant flow rate. On the other hand, the gas above the substrate processing module 220 has no flow or has a flow rate slower than that of the second flow path portion 242. Accordingly, the pressure of the upper portion of the substrate processing module 220 is higher than that of the second flow path portion 242. The gas in the inner space of the housing 210 flows into the second flow path portion 242 through the auxiliary hole 232 by the pressure difference. At this time, the fumes or particles in the inner space flow toward the auxiliary hole 232 together with the gas. The auxiliary flow path portion 243 prevents the flow of the gas flowing in the second flow path portion 242 from being directed toward the auxiliary hole 232 side. Therefore, the fumes or particles contained in the gas are prevented from flowing back into the internal space.

The pump 214 may be operated while the substrate is being processed. Accordingly, a suction pressure is formed in the discharge port 213, so that the gas, fume, or particles in the internal space can be discharged to the outside of the substrate processing apparatus through the discharge port 213. [ That is, the particles or fumes in the inner space of the housing 210 are simultaneously discharged through the duct 240 and the exhaust port 213, so that the inner space can be kept clean. Therefore, it is possible to prevent the substrate from being defective due to particles and fumes.

In the above description, the bake unit is provided with the fan, the shielding door, the duct, and the maintenance door, but this is an exemplary one. Accordingly, the fan, the shielding door, the duct and the maintenance door can be provided in the application unit or the development unit. Further, although the case where the bake unit is provided with the cooling member and the heating member has been described, the cooling member and the heating member may be provided in the respective units. At this time, each unit may be provided with a fan, a shielded door, a duct, and a maintenance door.

In addition, although the substrate processing apparatus is described as an apparatus for performing photolithography on a substrate, the substrate processing apparatus may be an apparatus for performing etching, ion implantation, or cleaning on the substrate. Further, the substrate processing apparatus may be a device for discharging the substance inside the housing to the outside in the process of processing the substrate from the standpoint of the ordinary artisan.

The foregoing detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and explain the preferred embodiments of the present invention, and the present invention may be used in various other combinations, modifications, and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, within the scope of the disclosure, and / or within the skill and knowledge of the art. The embodiments described herein are intended to illustrate the best mode for implementing the technical idea of the present invention and various modifications required for specific applications and uses of the present invention are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. It is also to be understood that the appended claims are intended to cover such other embodiments.

200: bake unit 210: housing
211: aperture 220: substrate processing module
221: cooling member 222: heating member
230: Shielding door 231: Main hole
232: auxiliary hole 240: duct
250: repair door

Claims (17)

housing;
A substrate processing module located in an inner space of the housing;
A shielding door coupled to the housing to open and close a maintenance port formed on one side of the housing for maintenance of the substrate processing module; And
And a maintenance door located outside the shielding door,
Wherein the shielding door includes a main hole formed in a surface opposite to a side surface of the substrate processing module,
Wherein the substrate processing module includes a control member that is located on a surface facing the management port. The method according to claim 1,
Wherein the shielding door has an auxiliary hole formed above the main hole and communicating with a space formed above the substrate processing module. delete The method according to claim 1,
Wherein the control member is located on a side facing the main hole and includes a fan for cooling the components of the control member. 5. The method of claim 4,
Further comprising a connection tube provided between a side surface of the control member and the main hole to allow the fan and the main hole to communicate with each other. 6. The method of claim 5,
And one end of the connecting tube is attached to the side surface of the control member or the inner surface of the shielding door. 6. The method of claim 5,
Wherein the connecting tube is variable in length. 6. The method of claim 5,
Wherein the connecting tube is provided as a bellows. housing;
A substrate processing module located in an inner space of the housing;
A shielding door coupled to the housing to open and close a maintenance port formed on one side of the housing for maintenance of the substrate processing module;
A maintenance door positioned outside the management port and the shielding door; And
And a duct attached to an outer surface of the shielding door so as to be positioned between the shielding door and the maintenance door,
Wherein the shielding door has a main hole located on a side facing the side surface of the substrate processing module and an auxiliary hole located above the main hole. 10. The method of claim 9,
In the duct,
A first flow path portion positioned corresponding to the main hole; And
And a second flow path portion extending in a direction different from a longitudinal direction of the first flow path portion at an end portion of the first flow path portion and corresponding to the auxiliary hole,
And the end of the second flow path portion is formed to be open. 11. The method of claim 10,
Wherein the duct further comprises an auxiliary flow path portion formed in the second flow path portion and guiding the gas to flow in the auxiliary flow path in the direction of the open end of the second flow path portion. 11. The method of claim 10,
Further comprising an auxiliary flow path portion formed on the outer surface of the shielding door and guiding the gas to flow from the auxiliary hole toward the open end of the second flow path portion. The method according to claim 1,
Further comprising an exhaust port formed on one surface of the housing for exhausting gas in an inner space of the housing. The method according to claim 1,
Wherein the substrate processing module is detachably provided through the management port in a state in which the shielding door and the maintenance door are opened. A fan positioned in an inner space of the housing and forming a flow of gas in a direction of a main hole formed in a shielding door that opens and closes a maintenance port formed on one surface of the housing, So that the pressure of the outer side of the shielding door is formed to be lower than the pressure of the inner space of the housing so that the particles in the inner space of the housing are discharged out of the shielding door through the auxiliary holes formed in the shielding door A method of discharging particles of a substrate processing apparatus. 16. The method of claim 15,
A duct for guiding the gas discharged to the outside of the shielding door through the main hole is disposed to surround the main hole and the auxiliary hole so that the particles in the inner space of the housing are discharged through the auxiliary hole A method for particle ejection of a device. 16. The method of claim 15,
And guiding the particles discharged through the auxiliary holes to flow in the same direction as the flow direction of the gas formed on the outside of the shielding door.

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