KR101410847B1 - 펌프 시스템, 이산화탄소 공급 시스템, 추출 시스템, 리소그래피 장치 및 디바이스 제조 방법 - Google Patents

펌프 시스템, 이산화탄소 공급 시스템, 추출 시스템, 리소그래피 장치 및 디바이스 제조 방법 Download PDF

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KR101410847B1
KR101410847B1 KR1020120149727A KR20120149727A KR101410847B1 KR 101410847 B1 KR101410847 B1 KR 101410847B1 KR 1020120149727 A KR1020120149727 A KR 1020120149727A KR 20120149727 A KR20120149727 A KR 20120149727A KR 101410847 B1 KR101410847 B1 KR 101410847B1
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pressure
gas
carbon dioxide
flow rate
flow
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KR20130071407A (ko
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데르 가그 마크 레온 반
덴 휴벨 레오나르다 헨드리카 반
아르얀 후브레쉬트 요셉 안나 마튼즈
박스텔 프랭크 요하네스 야코부스 반
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에이에스엠엘 네델란즈 비.브이.
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0396—Involving pressure control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8158—With indicator, register, recorder, alarm or inspection means
    • Y10T137/8326—Fluid pressure responsive indicator, recorder or alarm
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85978—With pump
    • Y10T137/85986—Pumped fluid control

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020120149727A 2011-12-20 2012-12-20 펌프 시스템, 이산화탄소 공급 시스템, 추출 시스템, 리소그래피 장치 및 디바이스 제조 방법 Active KR101410847B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161578114P 2011-12-20 2011-12-20
US61/578,114 2011-12-20

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KR20130071407A KR20130071407A (ko) 2013-06-28
KR101410847B1 true KR101410847B1 (ko) 2014-06-23

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US (1) US9575406B2 (https=)
JP (2) JP6010445B2 (https=)
KR (1) KR101410847B1 (https=)
CN (1) CN103176367B (https=)
NL (1) NL2009899A (https=)
TW (1) TWI461860B (https=)

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US10122591B1 (en) * 2013-03-13 2018-11-06 Google Llc Managing access to no-cost content
CN104238277B (zh) * 2013-06-19 2016-12-28 上海微电子装备有限公司 一种浸没式光刻机的流场维持方法
KR101408834B1 (ko) * 2014-01-06 2014-06-20 한국지역난방공사 배기가스 정량 공급이 가능한 산업설비용 추기장치
CN107106938B (zh) 2014-12-19 2019-06-18 Asml荷兰有限公司 流体处理结构、光刻设备和器件制造方法
WO2017036830A1 (en) * 2015-08-31 2017-03-09 Asml Netherlands B.V. A gas leak detector and a method of detecting a leak of gas
US10883866B2 (en) * 2015-09-24 2021-01-05 Fujikin Incorporated Pressure-based flow rate control device and malfunction detection method therefor
CN107991384B (zh) * 2017-12-21 2023-10-13 浙江启尔机电技术有限公司 一种微管内气液两相流流型的检测装置及方法
CN109976098B (zh) * 2019-03-22 2024-04-12 福建华佳彩有限公司 一种光阻刀头
DE102020204545A1 (de) 2020-04-08 2021-10-14 Carl Zeiss Smt Gmbh Verfahren und vorrichtung zum trocknen eines bauteilinnenraums
TW202439039A (zh) * 2023-03-21 2024-10-01 聯華電子股份有限公司 微影機台系統及其液體儲存槽的漏液檢測方法
CN121002450A (zh) * 2023-04-04 2025-11-21 Asml荷兰有限公司 流体处理系统和方法以及制造器件的方法
CN119439646B (zh) * 2024-12-10 2026-03-31 上海新毅东半导体科技有限公司 光刻机的微环境控制架构

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Also Published As

Publication number Publication date
JP2013131746A (ja) 2013-07-04
JP6145131B2 (ja) 2017-06-07
US9575406B2 (en) 2017-02-21
NL2009899A (en) 2013-06-24
JP2015146047A (ja) 2015-08-13
TWI461860B (zh) 2014-11-21
KR20130071407A (ko) 2013-06-28
CN103176367B (zh) 2016-02-03
US20130155380A1 (en) 2013-06-20
TW201335723A (zh) 2013-09-01
JP6010445B2 (ja) 2016-10-19
CN103176367A (zh) 2013-06-26

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