KR101377132B1 - 스크라이브 방법 - Google Patents

스크라이브 방법 Download PDF

Info

Publication number
KR101377132B1
KR101377132B1 KR1020120078682A KR20120078682A KR101377132B1 KR 101377132 B1 KR101377132 B1 KR 101377132B1 KR 1020120078682 A KR1020120078682 A KR 1020120078682A KR 20120078682 A KR20120078682 A KR 20120078682A KR 101377132 B1 KR101377132 B1 KR 101377132B1
Authority
KR
South Korea
Prior art keywords
longitudinal
scribe
scribe line
lines
unit product
Prior art date
Application number
KR1020120078682A
Other languages
English (en)
Korean (ko)
Other versions
KR20130036699A (ko
Inventor
토시유키 사카이
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20130036699A publication Critical patent/KR20130036699A/ko
Application granted granted Critical
Publication of KR101377132B1 publication Critical patent/KR101377132B1/ko

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/06Grooving involving removal of material from the surface of the work
    • B26D3/065On sheet material
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
KR1020120078682A 2011-10-04 2012-07-19 스크라이브 방법 KR101377132B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-220373 2011-10-04
JP2011220373A JP2013079170A (ja) 2011-10-04 2011-10-04 スクライブ方法

Publications (2)

Publication Number Publication Date
KR20130036699A KR20130036699A (ko) 2013-04-12
KR101377132B1 true KR101377132B1 (ko) 2014-03-21

Family

ID=48017724

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120078682A KR101377132B1 (ko) 2011-10-04 2012-07-19 스크라이브 방법

Country Status (4)

Country Link
JP (1) JP2013079170A (zh)
KR (1) KR101377132B1 (zh)
CN (1) CN103030267B (zh)
TW (1) TWI554479B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101479975B1 (ko) * 2013-09-06 2015-01-08 한국미쯔보시다이아몬드공업(주) 강화 유리 커팅 방법
CN107127806A (zh) * 2017-06-14 2017-09-05 嘉善圣莱斯绒业有限公司 一种移动式面料划痕设备
EP4126448A1 (en) 2020-03-25 2023-02-08 Milwaukee Electric Tool Corporation Dust collector assembly

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004359502A (ja) 2003-06-05 2004-12-24 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のスクライブ方法及びその装置
JP2009132614A (ja) 2002-10-29 2009-06-18 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のスクライブ方法及びその装置
JP2010052995A (ja) * 2008-08-29 2010-03-11 Mitsuboshi Diamond Industrial Co Ltd マザー基板のスクライブ方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100657197B1 (ko) * 2002-11-22 2006-12-14 미쓰보시 다이야몬도 고교 가부시키가이샤 기판절단방법 및 그 방법을 이용한 패널제조방법
CN101585657B (zh) * 2003-01-29 2012-03-21 三星宝石工业株式会社 基板切割设备和基板切割方法
WO2005072926A1 (ja) * 2004-02-02 2005-08-11 Mitsuboshi Diamond Industrial Co., Ltd. カッターホイールおよびこれを用いた脆性材料基板のスクライブ方法および分断方法、ならびにカッターホイールの製造方法
KR100681828B1 (ko) * 2005-07-20 2007-02-12 주식회사 에스에프에이 멀티 절단 시스템
TWI435850B (zh) * 2008-01-23 2014-05-01 Mitsuboshi Diamond Ind Co Ltd Scribing device and scribing method
TW200940421A (en) * 2008-03-21 2009-10-01 Kao-Hsiung Liao Air enclosure and check valve capable of being filled with high-pressure air

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009132614A (ja) 2002-10-29 2009-06-18 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のスクライブ方法及びその装置
JP2004359502A (ja) 2003-06-05 2004-12-24 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のスクライブ方法及びその装置
JP2010052995A (ja) * 2008-08-29 2010-03-11 Mitsuboshi Diamond Industrial Co Ltd マザー基板のスクライブ方法

Also Published As

Publication number Publication date
CN103030267B (zh) 2016-06-22
TWI554479B (zh) 2016-10-21
KR20130036699A (ko) 2013-04-12
JP2013079170A (ja) 2013-05-02
TW201315694A (zh) 2013-04-16
CN103030267A (zh) 2013-04-10

Similar Documents

Publication Publication Date Title
JP5979600B2 (ja) 板ガラスの割断離反方法
JP5988163B2 (ja) 板ガラスの割断離反方法、及び板ガラスの割断離反装置
KR101105631B1 (ko) 기판 가공 시스템
KR101377132B1 (ko) 스크라이브 방법
JP5981791B2 (ja) 脆性材料基板のブレイク装置
JP2009006715A (ja) 脆性材料基板のスクライブ方法及びその装置
TW201315557A (zh) 母基板之分斷方法
TWI532088B (zh) Breaking device
JP2016120725A (ja) 脆性材料基板のブレイク装置
KR101361604B1 (ko) 마더 기판의 스크라이브 방법 및 분단 방법
JP2014031293A (ja) 脆性材料基板のスクライブ方法
WO2018104532A1 (de) Verfahren und vorrichtung zum aufteilen von plattenförmigen werkstücken
KR20160003583A (ko) 강화 유리 기판의 스크라이브 방법 및 스크라이브 장치
JP2015164895A (ja) 分断装置
JP5731942B2 (ja) マザー基板の分断方法
KR102592384B1 (ko) 첩합 기판의 스크라이브 방법 및 스크라이브 장치
JP7032790B2 (ja) 貼り合わせ基板のスクライブ方法およびスクライブ装置
KR20210084247A (ko) 단재부의 제거 방법 그리고 기판 가공 장치
KR101558423B1 (ko) 연속무늬 다변형 석판재 제조방법 및 이의 방법으로 제조된 석판재
JP2013079169A (ja) マザー基板のスクライブ方法
KR101648010B1 (ko) 스크라이브 라인 형성 방법
US8673742B2 (en) Method for manufacturing semiconductor device
JPH03281309A (ja) マルチワイヤソーによる加工方法
JP7032789B2 (ja) スクライブ方法およびスクライブ装置
JP2014019604A (ja) 脆性材料基板のブレイク装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20170220

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee