JP2013079170A - スクライブ方法 - Google Patents

スクライブ方法 Download PDF

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Publication number
JP2013079170A
JP2013079170A JP2011220373A JP2011220373A JP2013079170A JP 2013079170 A JP2013079170 A JP 2013079170A JP 2011220373 A JP2011220373 A JP 2011220373A JP 2011220373 A JP2011220373 A JP 2011220373A JP 2013079170 A JP2013079170 A JP 2013079170A
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JP
Japan
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011220373A
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English (en)
Japanese (ja)
Inventor
Toshiyuki Sakai
敏行 酒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2011220373A priority Critical patent/JP2013079170A/ja
Priority to TW101122960A priority patent/TWI554479B/zh
Priority to KR1020120078682A priority patent/KR101377132B1/ko
Priority to CN201210336388.3A priority patent/CN103030267B/zh
Publication of JP2013079170A publication Critical patent/JP2013079170A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/06—Grooving involving removal of material from the surface of the work
    • B26D3/065—On sheet material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP2011220373A 2011-10-04 2011-10-04 スクライブ方法 Pending JP2013079170A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011220373A JP2013079170A (ja) 2011-10-04 2011-10-04 スクライブ方法
TW101122960A TWI554479B (zh) 2011-10-04 2012-06-27 Scoring method
KR1020120078682A KR101377132B1 (ko) 2011-10-04 2012-07-19 스크라이브 방법
CN201210336388.3A CN103030267B (zh) 2011-10-04 2012-09-05 刻划方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011220373A JP2013079170A (ja) 2011-10-04 2011-10-04 スクライブ方法

Publications (1)

Publication Number Publication Date
JP2013079170A true JP2013079170A (ja) 2013-05-02

Family

ID=48017724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011220373A Pending JP2013079170A (ja) 2011-10-04 2011-10-04 スクライブ方法

Country Status (4)

Country Link
JP (1) JP2013079170A (zh)
KR (1) KR101377132B1 (zh)
CN (1) CN103030267B (zh)
TW (1) TWI554479B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015051910A (ja) * 2013-09-06 2015-03-19 三星ダイヤモンド工業株式会社 強化ガラスカッティング方法
CN107127806A (zh) * 2017-06-14 2017-09-05 嘉善圣莱斯绒业有限公司 一种移动式面料划痕设备

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4126448A1 (en) 2020-03-25 2023-02-08 Milwaukee Electric Tool Corporation Dust collector assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009093619A1 (ja) * 2008-01-23 2009-07-30 Mitsuboshi Diamond Industrial Co., Ltd. スクライブ装置およびスクライブ方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI286232B (en) 2002-10-29 2007-09-01 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing fragile material substrate
KR100657197B1 (ko) * 2002-11-22 2006-12-14 미쓰보시 다이야몬도 고교 가부시키가이샤 기판절단방법 및 그 방법을 이용한 패널제조방법
CN101585657B (zh) * 2003-01-29 2012-03-21 三星宝石工业株式会社 基板切割设备和基板切割方法
JP4256724B2 (ja) 2003-06-05 2009-04-22 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法及びその装置
WO2005072926A1 (ja) * 2004-02-02 2005-08-11 Mitsuboshi Diamond Industrial Co., Ltd. カッターホイールおよびこれを用いた脆性材料基板のスクライブ方法および分断方法、ならびにカッターホイールの製造方法
KR100681828B1 (ko) * 2005-07-20 2007-02-12 주식회사 에스에프에이 멀티 절단 시스템
TW200940421A (en) * 2008-03-21 2009-10-01 Kao-Hsiung Liao Air enclosure and check valve capable of being filled with high-pressure air
JP2010052995A (ja) * 2008-08-29 2010-03-11 Mitsuboshi Diamond Industrial Co Ltd マザー基板のスクライブ方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009093619A1 (ja) * 2008-01-23 2009-07-30 Mitsuboshi Diamond Industrial Co., Ltd. スクライブ装置およびスクライブ方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015051910A (ja) * 2013-09-06 2015-03-19 三星ダイヤモンド工業株式会社 強化ガラスカッティング方法
JP2019081700A (ja) * 2013-09-06 2019-05-30 三星ダイヤモンド工業株式会社 強化ガラスカッティング方法
CN107127806A (zh) * 2017-06-14 2017-09-05 嘉善圣莱斯绒业有限公司 一种移动式面料划痕设备

Also Published As

Publication number Publication date
CN103030267B (zh) 2016-06-22
TWI554479B (zh) 2016-10-21
KR20130036699A (ko) 2013-04-12
TW201315694A (zh) 2013-04-16
KR101377132B1 (ko) 2014-03-21
CN103030267A (zh) 2013-04-10

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