KR101374529B1 - 프로브 장치 및 프로브 장치의 프로브 카드 장착 방법 - Google Patents
프로브 장치 및 프로브 장치의 프로브 카드 장착 방법 Download PDFInfo
- Publication number
- KR101374529B1 KR101374529B1 KR1020130024513A KR20130024513A KR101374529B1 KR 101374529 B1 KR101374529 B1 KR 101374529B1 KR 1020130024513 A KR1020130024513 A KR 1020130024513A KR 20130024513 A KR20130024513 A KR 20130024513A KR 101374529 B1 KR101374529 B1 KR 101374529B1
- Authority
- KR
- South Korea
- Prior art keywords
- tray
- probe
- probe card
- mark
- transfer
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2012-057236 | 2012-03-14 | ||
JP2012057236A JP2013191741A (ja) | 2012-03-14 | 2012-03-14 | プローブ装置及びプローブ装置のプローブカード装着方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130105397A KR20130105397A (ko) | 2013-09-25 |
KR101374529B1 true KR101374529B1 (ko) | 2014-03-13 |
Family
ID=49134176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020130024513A KR101374529B1 (ko) | 2012-03-14 | 2013-03-07 | 프로브 장치 및 프로브 장치의 프로브 카드 장착 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2013191741A (zh) |
KR (1) | KR101374529B1 (zh) |
CN (1) | CN103308734A (zh) |
TW (1) | TW201348709A (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104820181A (zh) * | 2015-05-14 | 2015-08-05 | 中南大学 | 一种封装晶圆阵列微探针全自动测试系统及方法 |
JP6478891B2 (ja) | 2015-10-07 | 2019-03-06 | 三菱電機株式会社 | プローブ位置検査装置 |
US11125814B2 (en) * | 2017-02-22 | 2021-09-21 | Sintokogio, Ltd. | Test system |
CN106910444B (zh) * | 2017-02-28 | 2020-11-27 | 京东方科技集团股份有限公司 | 点灯装置和点灯测试方法 |
JP7018784B2 (ja) * | 2018-02-23 | 2022-02-14 | 東京エレクトロン株式会社 | コンタクト精度保証方法および検査装置 |
JP7076360B2 (ja) * | 2018-11-14 | 2022-05-27 | 東京エレクトロン株式会社 | 挿抜機構及びブロック部材の交換方法 |
CN109782031A (zh) * | 2018-12-27 | 2019-05-21 | 上海华岭集成电路技术股份有限公司 | 一种高低温测试环境自动更换探针卡的方法 |
CN110095708B (zh) * | 2019-05-14 | 2020-05-01 | 日本电产理德机器装置(浙江)有限公司 | 窄边基板用检查装置和窄边基板的检查方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06118115A (ja) * | 1992-09-30 | 1994-04-28 | Nitto Seiko Co Ltd | 両面基板検査装置 |
JPH06129831A (ja) * | 1992-10-14 | 1994-05-13 | Nitto Seiko Co Ltd | 基板検査装置 |
KR100809600B1 (ko) * | 2007-02-05 | 2008-03-04 | 뉴센트 주식회사 | 웨이퍼 검사장치 |
KR20100056727A (ko) * | 2008-11-20 | 2010-05-28 | 주식회사 쎄믹스 | 웨이퍼 프로브 스테이션 및 그의 제어방법 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4104099B2 (ja) * | 1999-07-09 | 2008-06-18 | 東京エレクトロン株式会社 | プローブカード搬送機構 |
US7026832B2 (en) * | 2002-10-28 | 2006-04-11 | Dainippon Screen Mfg. Co., Ltd. | Probe mark reading device and probe mark reading method |
JP5032170B2 (ja) * | 2007-03-23 | 2012-09-26 | 東京エレクトロン株式会社 | 検査装置 |
JP4954608B2 (ja) * | 2006-05-16 | 2012-06-20 | 東京エレクトロン株式会社 | 被撮像物の移動方法及びこの方法を用いる処理装置 |
CN201508323U (zh) * | 2009-09-24 | 2010-06-16 | 清华大学 | Led晶圆显微定位测试装置 |
KR101257570B1 (ko) * | 2010-04-26 | 2013-04-23 | 가부시키가이샤 히다치 하이테크놀로지즈 | 표시 패널 모듈 조립 장치 |
-
2012
- 2012-03-14 JP JP2012057236A patent/JP2013191741A/ja active Pending
-
2013
- 2013-03-01 TW TW102107259A patent/TW201348709A/zh unknown
- 2013-03-07 KR KR1020130024513A patent/KR101374529B1/ko active IP Right Grant
- 2013-03-14 CN CN2013100812387A patent/CN103308734A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06118115A (ja) * | 1992-09-30 | 1994-04-28 | Nitto Seiko Co Ltd | 両面基板検査装置 |
JPH06129831A (ja) * | 1992-10-14 | 1994-05-13 | Nitto Seiko Co Ltd | 基板検査装置 |
KR100809600B1 (ko) * | 2007-02-05 | 2008-03-04 | 뉴센트 주식회사 | 웨이퍼 검사장치 |
KR20100056727A (ko) * | 2008-11-20 | 2010-05-28 | 주식회사 쎄믹스 | 웨이퍼 프로브 스테이션 및 그의 제어방법 |
Also Published As
Publication number | Publication date |
---|---|
CN103308734A (zh) | 2013-09-18 |
KR20130105397A (ko) | 2013-09-25 |
JP2013191741A (ja) | 2013-09-26 |
TW201348709A (zh) | 2013-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101374529B1 (ko) | 프로브 장치 및 프로브 장치의 프로브 카드 장착 방법 | |
JP5088167B2 (ja) | プローブ装置、プロービング方法及び記憶媒体 | |
KR102479608B1 (ko) | 콘택트 정밀도 보증 방법, 콘택트 정밀도 보증 기구, 및 검사 장치 | |
TWI706487B (zh) | 探針機台及探針機台的操作方法 | |
TWI455221B (zh) | A checking method and a program recording medium in which the inspection method is recorded | |
TWI453846B (zh) | Detection device and detection method | |
JP5987967B2 (ja) | プロービング装置及びプローブコンタクト方法 | |
JP6401113B2 (ja) | 電子部品ハンドリング装置及び電子部品試験装置 | |
WO2015019447A1 (ja) | 電子部品装着機、および転写確認方法 | |
JP6285697B2 (ja) | 電子部品検査装置及び電子部品実装装置 | |
KR101674707B1 (ko) | 프로브 장치 | |
TW201906055A (zh) | 基板搬出方法 | |
KR20080112964A (ko) | 프로브 카드의 등록 방법 및 이 프로그램을 기록한프로그램 기록 매체 | |
KR20190103957A (ko) | 검사 시스템 | |
JP2008028103A (ja) | ウエハプローバ | |
US8542029B1 (en) | Methods and apparatus for testing of integrated circuits | |
JPH08335614A (ja) | プロ−ブシステム | |
US20090287341A1 (en) | Pre-aligner search | |
KR101467121B1 (ko) | 웨이퍼 표면 검사 장치 | |
KR101977305B1 (ko) | 셀 얼라인을 통한 디스플레이 패널의 열화상 검사장치 | |
CN104620121B (zh) | 探针设备 | |
KR101838805B1 (ko) | 반도체 소자 테스트 장치 및 방법 | |
KR100750207B1 (ko) | 프로브 스테이션 | |
KR100621627B1 (ko) | 웨이퍼 테스트 설비 및 그 설비의 정렬 방법 | |
JP6341693B2 (ja) | 基板保持装置および基板検査装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |