KR101359675B1 - LED Lamp with heat dissipation device - Google Patents

Abstract

The present invention has been made to solve the heat dissipation problem when applied to the lighting fixture of the LED chip, the object of the present invention is to provide an LED lamp having a heat dissipation device that can further improve the heat dissipation capability.

An LED lamp having a heat dissipation device according to the present invention for achieving the above object comprises a substrate on which a plurality of LED packages are mounted; And a heat dissipation device configured to be installed under the substrate to radiate heat generated from the plurality of LED packages, wherein the heat dissipation device comprises: a hollow inner cylinder, an outer radial direction from the inner cylinder; A plurality of inner pins extending and radially spaced apart from the inner cylinder, a hollow outer cylinder connected to the plurality of inner pins, and a plurality of outer pins extending radially from the outer cylinder. It is made to include.

Description

LED lamp with heat dissipation device {LED Lamp with heat dissipation device}

The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package capable of improving heat dissipation capability.

Recently, light emitting diode (LED) devices using compound semiconductor materials such as GaAs, GaN, and AlGaInP have been developed, and thus, light sources of various colors can be realized. In general, such an LED is an electronic component that generates a small number of carriers (electrons or holes) injected using a p-n junction structure of a semiconductor and emits light by recombination thereof. In other words, when a forward voltage is applied to a semiconductor of a specific element, electrons and holes are recombined with each other as the electrons and holes move through the junction portions of the anode and the cathode, which is smaller than when the electrons and holes are separated. Will be emitted.

Factors that determine the characteristics of LED products include color, brightness and light conversion efficiency. The characteristics of such LED products are primarily determined by the compound semiconductor materials used in LED devices and their structures, but are also greatly influenced by the structure of packages for mounting LED chips as secondary elements.

In addition to the primary elements such as the material or structure of the LED chip to obtain the luminous effect according to the user's requirements, it is necessary to improve the structure of the LED package and the material used therefor. In particular, as the use range of the LED package is extended to various fields such as indoor and outdoor lighting devices, automotive headlights, and back light units of liquid crystal displays (LCDs), high efficiency and high heat dissipation characteristics are required.

If the heat generated by the LED chip is not effectively dissipated from the LED package, the temperature of the LED chip becomes high, which deteriorates the characteristics of the LED chip and decreases its lifespan. Therefore, efforts are being made to effectively dissipate heat generated from LED chips in high power LED packages.

In order to improve the heat dissipation efficiency of the LED package, a lead frame made of Cu is conventionally used.

On the other hand, in the application of the conventional LED chip to the luminaire described above, the efficiency of light is significantly higher than that of incandescent lamps or fluorescent lamps, which are currently being used, and the unit power is excellent. It is obtained, and since it is excellent in stability, the use for lighting is also increasing gradually.

In case of using LED for lighting, there is a limit to the amount of light that can be obtained through a single LED, so it is difficult to obtain enough light as desired. Therefore, a large number of LED lamps are needed to obtain enough light for lighting. Should be used. In this case, it is more economical to use as few LEDs as possible by flowing more current per unit LED since the more economically the more LEDs are used, the lower the economics are.

However, the LED has a high efficiency of converting power to light, but the light emitting part is made of a semiconductor device, so it is relatively weak to heat compared to light emitting devices such as incandescent lamps using filaments or fluorescent lamps using cathode rays. That is, the LED is easily degraded due to thermal stress caused by self-heat generated from the light emitting device when the LED is used for a long time, and thus its performance is degraded. Therefore, in order to allow a large amount of current to flow through the LED, a heat dissipation structure for effectively dissipating heat generated therefrom becomes a very important factor.

After all, since LED does not generate light in the infrared region, there is no heat of light itself, but a large part of the power consumption of the LED is changed to heat, and when the temperature is increased by heat radiation, the luminous flux and lifetime are deteriorated. Products are being developed to solve the heat problem of the LED lamp.

In order to solve this problem, a board mounted with LEDs is recently attached to a heat sink to radiate heat. Specifically, a method of forcibly cooling a board mounted with LEDs using a heat sink and a fan corresponding thereto, and a heat pipe to the heat sink. The method of attaching a heat dissipation promotion mechanism part, etc., etc. is used, and the heat sink is generally used aluminum which carried out the extrusion process.

Accordingly, the present invention has been made to solve the heat dissipation problem when applied to the lighting fixture of the LED chip, the object of the present invention is to provide an LED lamp having a heat dissipation device that can further improve the heat dissipation capability.

An LED lamp having a heat dissipation device according to the present invention for achieving the above object comprises a substrate on which a plurality of LED packages are mounted; And a heat dissipation device configured to be installed under the substrate to radiate heat generated from the plurality of LED packages, wherein the heat dissipation device comprises: a hollow inner cylinder, an outer radial direction from the inner cylinder; A plurality of inner pins extending and radially spaced apart from the inner cylinder, a hollow outer cylinder connected to the plurality of inner pins, and a plurality of outer pins extending radially from the outer cylinder. It is made to include.

Here, each of the plurality of inner pins preferably has a plate shape formed over the entire height of the inner cylinder.

Further, each of the plurality of outer pins preferably has a plate shape formed over the entire height of the outer cylinder.

More preferably, each of the plurality of outer pins has a plate shape divided up and down two over the entire height of the outer cylinder.

The outer cylinder preferably includes a plurality of through holes formed over its entire height.

Here, the through holes formed in the inner and outer cylinders are more preferably formed at positions corresponding to the positions of the plurality of LED packages mounted on the substrate.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. It should be noted that terms such as 'substantial' and 'approximately' used throughout the present specification are not only in the case of configurations that are exactly the same as the configurations disclosed in the present invention, but also in the lexical sense, even though there is a difference in the literary meaning. If the modification can be carried out to the extent that the same effect can be obtained it was used to mean that it is included in the technical scope of the present invention.

In the drawings, the thickness is enlarged to clearly represent the layers and regions. Like reference numerals designate like parts throughout the specification.

Now with reference to the drawings with respect to the LED package according to an embodiment of the present invention will be described in detail.

First, an LED package using a lead frame made of Cu and an array thereof according to embodiments of the present invention will be described in detail with reference to FIGS. 1 to 3.

1 is a cross-sectional view illustrating a structure of a unit LED package, and FIG. 2 is a cross-sectional view and an external perspective view of a unit LED package of FIG. 1 with a lens.

First, referring to FIG. 1, the LED package includes a pair of lead frames 110 including a first lead frame 110a and a second lead frame 110b and a portion of the lead frame 110 inside. The LED is mounted on the package mold 120 formed to define the molding material filling space and the second lead frame 110b which is one of the lead frames 110 inside the package mold 120. The chip 130, the wire 140 for the electrical connection between the lead frame 110 and the LED chip 130, and the package mold 120 are filled in the LED chip 130 and the wire 140. It includes a molding material 150 to protect).

The lead frame 110 is preferably made of Cu excellent in thermal conductivity in order to effectively release heat generated from the LED chip 130.

Meanwhile, Ag that reflects light generated from the LED chip 130 may be coated on the surface of the lead frame 110.

When the power is applied to the LED chip 130, as shown by the arrow of Figure 2, the heat generated by the operation of the LED chip 130, the lead frame 110 of the Cu material on which the LED chip is mounted The heat is discharged to the outside of the package, and the heat is also discharged to the outside of the package through Ag coated on the surface of the lead frame 110. In addition, heat may be released through the outer resin of the package.

The LED package with the lens attached to this basic LED package is shown in FIG. 2. 2A and 2B show a cross-sectional view and an external perspective view of a light emitting diode package with a lens, respectively.

As shown in FIG. 2, the LED package including the lens includes a lead frame 110 including at least one pair of lead terminals 110a and 110b, and accommodates the lead frame 110 therein. The LED chip 130 mounted on the package body 120 having the molding material injection space 151 formed thereon and one of the lead terminals 110a and 110b positioned inside the package body 120. ), The wire 140 for energizing the LED chip 130 and the lead terminals 110a and 110b, and the molding material injection space 151 of the package body 120 are filled in the LED chip 130. ) And a molding material 150 to protect the wire 140.

Here, on the molding material 150, an adhesive 160 for attaching the lens 170 and the package body 120 to each other is applied by a dispensing method or the like, and the molding material coated with the adhesive 160 ( On the package body 120 including the 150, a lens 170 for dissipating light generated from the LED chip 130 with high light efficiency is coupled. At this time, as the adhesive 160, a liquid silicone resin is generally used, and the silicone resin is gradually cured over time. The effect obtained by attaching the lens is to improve the amount of light and generally have a direct angle of about 120 degrees in the absence of a lens, whereas the wide angle can be adjusted through such a lens.

The unit LED package 100 is arranged on the substrate 200 in a plurality of forms as shown in FIG. 3 to be used as an illumination lamp as the present invention. 3 is a perspective view of a state in which a plurality of unit LED packages are arranged on a substrate.

As shown in FIG. 3, in the present embodiment, six unit LED packages 100 are arranged on the substrate 200 in a manner of being spaced apart at predetermined intervals in a radial direction about a unit LED package installed in the center. . Although the number and arrangement of LED packages have been determined in connection with the structure of the heat dissipation device described below, it should be noted that the present invention is not necessarily limited to these numbers and arrangement.

In order to radiate heat generated from the LED packages arranged in a plurality of forms to the outside, a heat dissipation device 300 according to an embodiment of the present invention is installed below the substrate 200, which will be described below with reference to FIGS. 4 and 5. It will be described in detail with reference to.

4 is a perspective view of an LED lamp with a heat dissipation device according to the present invention, and FIG. 5 shows a plan view and a side view of such a heat dissipation device.

As shown in FIG. 4, the heat dissipation device 300 according to the present invention includes a substrate 200 (not shown) in which an array of a plurality of LED packages 100 is mounted-the substrate 200 shown in FIG. It is installed between the heat dissipation device 300 shown-and the connector 400 connected to the external power supply, and performs the function of radiating heat generated from the plurality of LED packages.

As can be seen from FIGS. 4 and 5, the heat dissipation device 300 uses a cavity-type heat dissipation structure in which the center portion is emptied, unlike an extrusion heat dissipation plate generally used in the related art.

The heat dissipation device 300 is largely composed of a hollow inner cylinder 310 and an outer cylinder 320 formed to surround the inner cylinder 310, and the inner and outer cylinders 310 and 320 are mutually supported. The inner pin 330 and the outer pin 340 formed outside of the outer cylinder 320 are formed integrally with each other.

First, the inner and outer cylinders 310 and 320 are hollow. This is basically to increase the surface area and reduce the weight while maintaining the outermost size of the heat dissipation structure, so that the effect of improving the cooling effect and reducing the material cost can be expected.

The inner cylinder 310 has a through hole 311 formed at the center thereof in the axial direction, and a plurality of through holes 321 formed over the entire height in the axial direction thereof may be formed in the outer cylinder 320. Here, the through holes 311 and 321 formed in the inner and outer cylinders 310 and 320 are preferably formed at positions corresponding to the positions of the plurality of LED packages 100 mounted on the substrate 200. This is to maximize the cooling effect by bringing the heat generated from the lower portion of the LED package 100 directly into contact with the outside air.

In addition, a plurality of inner fins 320 formed radially extending from the inner cylinder 310 toward the outside thereof are formed so that the inner fins 320 fix the inner cylinder 310 and the outer cylinder 320 to each other. At the same time as the bridge to connect to form a space that can generate the flow of air between the inner cylinder 310 and the outer cylinder 320.

Here, each of the plurality of inner fins 330 has a plate shape formed over the entire height of the inner cylinder 310 to improve the cooling effect by increasing the surface area that can be in contact with the outside air to the maximum.

On the outer circumferential surface of the hollow outer cylinder 320 which is radially spaced apart from the inner cylinder 310 and connected to the plurality of inner pins 330, a plurality of outer pins 340 extending outward from the outer cylinder in a radial direction ) Is formed.

As in the inner fin 330, each of the plurality of outer fins 340 has a plate shape formed over the entire height of the outer cylinder 320, so as to maximize the surface area that can be in contact with the outside air to maximize the cooling effect Improved.

Preferably, each of the plurality of outer fins 340 having a plate shape has a shape 341, 342 divided up and down in the axial direction over the entire height of the outer cylinder, so that the flow of external air in the transverse direction And induce discontinuities in the outside air flow to promote heat dissipation due to the turbulence effect.

Although a preferred embodiment of the present invention has been described in detail above, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the scope of the present invention is not limited to the disclosed embodiments, but various modifications and improvements of those skilled in the art using the basic concept of the present invention as defined in the following claims also belong to the scope of the present invention.

1 is a cross-sectional view showing an LED package.

2A and 2B are cross sectional and external perspective views, respectively, of an LED package with a lens;

3 is a perspective view of a state in which a plurality of LED packages according to Figure 2 arranged on a substrate.

4 is a perspective view of an LED lamp with a heat dissipation device according to the invention;

5A and 5B are a plan view and a side view of a heat dissipation device according to the present invention;

Description of the Related Art

100: light emitting diode package 200: substrate

300: heat dissipation device 310: inner cylinder

311: inner cylinder through hole 320: outer cylinder

321: outer cylinder through hole 330: inner pin

340: outer pin 341: upper outer pin

342: lower outer pin 400: external power connector

Claims (6)

A substrate on which a plurality of LED packages are mounted; And A heat dissipation device configured to be installed below the substrate to radiate heat generated from the plurality of LED packages Including, the heat dissipation device, Hollow inner cylinder, A plurality of inner pins extending radially outward from the inner cylinder, A hollow outer cylinder positioned radially spaced from the inner cylinder and connected to the plurality of inner pins; A plurality of outer pins extending radially outward from the outer cylinder LED lamp having a heat dissipation device comprising a. The method of claim 1, And each of the plurality of inner fins has a plate shape formed over the entire height of the inner cylinder. The method according to claim 1 or 2, Each of said plurality of outer fins has a plate shape formed over the entire height of said outer cylinder. The method according to claim 1 or 2, And each of the plurality of outer fins has a plate shape divided up and down two over the entire height of the outer cylinder. The method of claim 1, And the outer cylinder includes a plurality of through holes formed over the entire height thereof. The method of claim 5, The through-holes formed in the inner and outer cylinders are formed in a position corresponding to the position of the plurality of LED packages mounted on the substrate LED lamp having a heat dissipation device.

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