KR20070116331A - Radiator for light emitting diode - Google Patents

Radiator for light emitting diode Download PDF

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Publication number
KR20070116331A
KR20070116331A KR1020060050221A KR20060050221A KR20070116331A KR 20070116331 A KR20070116331 A KR 20070116331A KR 1020060050221 A KR1020060050221 A KR 1020060050221A KR 20060050221 A KR20060050221 A KR 20060050221A KR 20070116331 A KR20070116331 A KR 20070116331A
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South Korea
Prior art keywords
heat
light emitting
emitting diode
heat pipe
diode lamp
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KR1020060050221A
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Korean (ko)
Inventor
송규섭
한재섭
김광수
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주식회사 에이팩
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Priority to KR1020060050221A priority Critical patent/KR20070116331A/en
Publication of KR20070116331A publication Critical patent/KR20070116331A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A radiator for a light emitting diode lamp is provided to extend the life time of the lamp by preventing the overheat of the lamp without depending on the directionality of a ceiling or a wall. A radiator for a light emitting diode lamp includes a heat pipe(100), and a plurality of radiating fins(200). The heat pipe is a heat transferring medium to which an earth plate(110) is attached on one side. Further, the heat pipe has a hollow part. The size and thickness of the earth plate correspond to the number of the light emitting diode and the size of a circuit plate. The plurality of radiating fins are arranged radially along the circumference of an outer surface of the heat pipe. The radiating fins are formed by plural convection current grooves(210) cut from the outer end to the inside of plate type surfaces.

Description

발광다이오드 램프용 방열기{Radiator for light emitting diode}Radiator for light emitting diode lamp

도 1은 본 발명에 따른 사시도,1 is a perspective view according to the present invention,

도 2는 본 발명에 따른 발광다이오드 램프의 일 설치예를 나타낸 측면도,2 is a side view showing an example of installation of a light emitting diode lamp according to the present invention;

도 3은 도 2에 대한 본 발명 발광다이오드 램프의 다른 설치예를 나타낸 측면도,Figure 3 is a side view showing another installation example of the light emitting diode lamp of the present invention for Figure 2,

도 4는 본 발명에 따른 방열기의 평면도,4 is a plan view of a radiator according to the present invention;

도 5는 종래 발광다이오드 램프의 일 설치예를 나타낸 측면도,5 is a side view showing an example of installation of a conventional LED lamp;

도 6은 도 5에 대한 종래 발광다이오드 램프의 다른 설치예를 나타낸 측면도이다.FIG. 6 is a side view illustrating another installation example of the conventional LED lamp of FIG. 5.

<도면의 주요 부분에 대한 부호의 간단한 설명><Brief description of symbols for the main parts of the drawings>

10 ... 발광다이오드 램프 20 ... 방열수단10 ... light emitting diode lamp 20 ... heat dissipation means

30 ... 방열축 40 ... 방열판30 ... heat sink 40 ... heat sink

100 ... 히트파이프 110 ... 접지판100 ... heat pipe 110 ... ground plate

200 ... 방열휜(FIN) 210 ... 대류유도홈200 ... FIN 210 ... Convection induction groove

본 발명은 발광다이오드 램프용 방열기에 관한 것으로, 그 기술적 요지는 상기 발광다이오드 램프에서 발열하는 고온열을 외부로 신속하게 방열시킬 수 있도록 형성함으로써, 발광다이오드 램프를 포함한 회로기판상의 소자들이 고온열에 의해 훼손되어 수명이 단축되는 것을 방지하도록 하는 발광다이오드 램프용 방열기에 관한 것이다.The present invention relates to a radiator for a light emitting diode lamp, the technical spirit of which is formed so as to quickly dissipate the high temperature heat generated by the light emitting diode lamp to the outside, the elements on the circuit board including the light emitting diode lamp by the high temperature heat The present invention relates to a radiator for a light emitting diode lamp that is prevented from being damaged and shortened.

발광다이오드 램프는 다른 조명등에 비해 발열되는 열이 적고, 높은 조도를 얻을 수 있는 것으로, 특히 장시간 사용할 수 있는 긴 수명에 비해 전력소모량이 적은 장점이 있다.The light emitting diode lamp generates less heat than other lamps and obtains high illuminance, and in particular, the light emitting diode lamp consumes less power than a long service life that can be used for a long time.

그러나, 이러한 발광다이오드 램프는 여타 조명등에 비해 발열량이 적을 뿐이지 지속적인 사용에 따라 중온열의 발열이 계속 누적되어 장시간 사용시 결국 고온열이 발생되는 바, 이는 발광다이오드 램프를 포함한 회로기판 전체에 과열을 조장하여 제품이 훼손되는 문제가 발생된다.However, these light emitting diode lamps generate less heat than other lighting lamps, and the heat generated in the medium temperature heat continues to accumulate with continuous use, resulting in high temperature heat for a long time, which encourages overheating of the entire circuit board including the light emitting diode lamp. The problem is that the product is damaged.

이를 보완하고자 종래에는 도 5 및 도 6에 도시된 바와같이, 상기 발광다이오드 램프(10)의 후방에 별도의 방열수단(20)을 형성하되, 상기 방열수단(20)은 몸체 중앙에 방열축(30)이 형성되고, 상기 방열축(30)의 일측에는 접지판(50)이 형성되어 발광다이오드 램프(10)가 부설된 회로기판(11)이 고정되는 한편, 타측에는 겹겹이 적층된 원판형의 방열판(40)이 고정되어 발광다이오드 램프(10)로부터 발생되는 고온열을 후방 대기중으로 방열시키도록 형성된다.In order to compensate for this, as shown in FIGS. 5 and 6, a separate heat dissipation means 20 is formed at the rear of the LED lamp 10, wherein the heat dissipation means 20 has a heat dissipation shaft ( 30 is formed, and the ground plate 50 is formed on one side of the heat dissipation shaft 30 to fix the circuit board 11 on which the light emitting diode lamp 10 is mounted, while on the other side of the disk-shaped disc. The heat sink 40 is fixed and is formed to radiate the high temperature heat generated from the light emitting diode lamp 10 to the rear atmosphere.

그러나, 이러한 종래의 방열수단(20)은 도 5에 나타낸 바와 같이, 발광다이오드 램프(10)를 벽체에 고정하였을 경우, 전방에서 발생된 고온열을 후방으로 방열시킴에 있어서 열이 전도되는 수평방향에 대해 방열판(40)이 수직방향으로 결합되는 바, 이러한 결합구조는 상,하 방향에 대해 원활한 대류작용을 일으켜 고온열을 방열시키도록 형성되기는 하나, 수평방향에 대해서는 방열판(40)이 칸막이 개념으로 형성됨으로써, 신속한 방열에 오히려 장애가 되는 문제가 발생되고 있다.However, in the conventional heat dissipation means 20, as shown in FIG. 5, when the light emitting diode lamp 10 is fixed to the wall, the heat dissipation means is conducted in the horizontal direction in which the heat is radiated in the rear. The heat sink 40 is coupled to the vertical direction with respect to the bar, such a coupling structure is formed to radiate high temperature heat by causing a smooth convection action in the up and down directions, but the heat sink 40 in the horizontal direction partition concept As a result, it is a problem that is rather an obstacle to rapid heat dissipation.

또한, 도 6에 도시된 바와 같이, 상기 발광다이오드 램프(10)를 천정에 고정하였을 경우, 상술한 벽체 고정시와 유사한 방열 부작용이 발생되는 것으로, 이는 천정에 대해 수평으로 형성된 발광다이오드 램프(10)에 대해 수직방향으로 방열판(40)이 적층되어 좌,우측면으로의 방열은 어느 정도 효과가 있으나 상,하 방향에 대한 방열에는 상기 방열판(40)이 칸막이 역할을 함으로써, 신속한 방열을 저해하는 원인이 되고 있다.In addition, as shown in FIG. 6, when the light emitting diode lamp 10 is fixed to the ceiling, heat dissipation side effects similar to those of the above-described wall fixing are generated, and the light emitting diode lamp 10 is formed horizontally with respect to the ceiling. Heat radiation plate 40 is stacked in the vertical direction with respect to the heat dissipation to the left and right sides, but the heat dissipation plate 40 acts as a partition for heat dissipation in the up and down directions, causing rapid heat dissipation. It is becoming.

본 발명은 이와 같은 문제점을 해결하기 위한 것으로, 발광다이오드 램프에서 발열하는 고온열을 외부로 신속하게 방열시킬 수 있도록 형성함으로써, 발광다이오드 램프를 포함한 회로기판상의 소자들이 고온열에 의해 훼손되어 수명이 단축되는 것을 방지하도록 하는 발광다이오드 램프용 방열기를 제공함에 그 목적이 있다.The present invention is to solve such a problem, by forming a high temperature heat generated by the light emitting diode lamp to quickly dissipate to the outside, the elements on the circuit board including the light emitting diode lamp is damaged by the high temperature heat to shorten the lifespan It is an object of the present invention to provide a heat sink for a light emitting diode lamp to prevent it.

상술한 목적을 달성하기 위해 본 발명은 일측에 접지판(110)이 부설된 열전달 매체인 히트파이프(100)와; 상기 히트파이프(100)의 외주면상에 원주방향을 따라 방사형으로 배열된 다수개의 방열휜(200:FIN)들이 구성되어 이루어진다.In order to achieve the above object, the present invention provides a heat pipe (100) which is a heat transfer medium in which a ground plate (110) is attached to one side; A plurality of heat dissipation fins 200 (FIN) are arranged on the outer circumferential surface of the heat pipe 100 in a radial direction along the circumferential direction.

이때, 상기 방열휜(200)은 판형으로 형성된 면상에 외측 단부측에서 내측으로 절취된 대류유도홈(210)이 형성되어 이루어지는 것이 바람직하다.At this time, the heat dissipation fin 200 is preferably formed by forming a convection guide groove 210 cut inward from the outer end side on the surface formed in a plate shape.

다음은 첨부된 도면을 참조하며 본 발명을 보다 상세히 설명하겠다.The following describes the present invention in more detail with reference to the accompanying drawings.

먼저, 도 1 내지 도 4에 도시된 바와 같이, 본 발명은 몸체 중앙에 축을 이루는 히트파이프(100)와 상기 히트파이프(100)를 기준으로 원주방향을 따라 배열된 다수개의 방열휜(200)으로 크게 구성된다.First, as shown in Figures 1 to 4, the present invention is a plurality of heat radiation (200) arranged along the circumferential direction with respect to the heat pipe 100 and the heat pipe 100 forming an axis in the center of the body It is largely composed.

이에 상기 구성요소를 보다 자세히 살펴보면, 상기 히트파이프(100)는 일측에 접지판(110)이 부설된 열전달 매체로써, 내측에 진공상태의 중공부가 형성된다.Thus, the components in more detail, the heat pipe 100 is a heat transfer medium in which the ground plate 110 is attached to one side, a hollow portion in a vacuum state is formed inside.

이때, 상기 접지판(110)은 후술되는 발광다이오드 램프(10)의 수 및 회로기판(11)의 규격에 맞춰 크기와 두께를 대응시키는 것이 바람직하다.At this time, the ground plate 110 preferably corresponds to the size and thickness in accordance with the number of the LED lamp 10 and the specification of the circuit board 11 to be described later.

이때, 상기 접지판(110)은 열전도율이 높은 알루미늄, 구리 및 이와 동등한 개념의 열전도판을 사용하는 것이 바람직하다. 이는 발광다이오드 램프를 포함한 회로기판에서 발생되는 고온열을 보다 신속하고 안전하게 방열시키도록 전도하기 위함이다.In this case, it is preferable that the ground plate 110 uses a high thermal conductivity aluminum, copper, and a heat conductive plate having an equivalent concept. This is to conduct heat dissipation more quickly and safely from the high temperature heat generated from the circuit board including the light emitting diode lamp.

이때, 상기 히트파이프(100)의 중공부에는 원활하고 신속한 방열을 도모하기 위해 물, 알콜 및 이와 동등한 개념의 열교환수를 충진하여 상술한 방열효과를 증 진시키도록 형성된다.At this time, the hollow portion of the heat pipe 100 is formed to increase the above-described heat dissipation effect by filling water, alcohol, and heat exchange water having an equivalent concept in order to facilitate smooth and rapid heat dissipation.

한편, 상기 방열휜(200)은 히트파이프(100)의 외주면상에 원주방향을 따라 방사형으로 배열되도록 형성된다.On the other hand, the heat dissipation fan 200 is formed to be arranged radially along the circumferential direction on the outer peripheral surface of the heat pipe (100).

이때, 상기 방열휜(200)은 판형으로 형성된 면상에 외측 단부측에서 내측으로 절취된 대류유도홈(210)이 형성되어 이루어지는 것이 바람직하다.At this time, the heat dissipation fin 200 is preferably formed by forming a convection guide groove 210 cut inward from the outer end side on the surface formed in a plate shape.

이때, 상기 대류유도홈(210)은 방열휜(200)의 면상에 다수개 절취되어 마치 머리빗처럼 형성되는 것이 바람직하다.At this time, the convection guide groove 210 is preferably formed on the surface of the heat dissipation fin 200 is cut like a hair comb.

다음은 상술한 구성에 따라 본 발명의 실시예를 설명하겠다.Next will be described an embodiment of the present invention according to the above-described configuration.

<실시예 1><Example 1>

발광다이오드 램프(10)를 벽체에 고정하는 경우 - 열교환수(물,알콜) 또는 진공상태의 중공부가 형성된 히트파이프(100) 일측에는 접지판(110)이 부설되고, 상기 부설된 접지판(110)에는 발광다이오드 램프(10)를 포함한 회로기판(11)이 결합된다.When the light emitting diode lamp 10 is fixed to the wall-A ground plate 110 is installed on one side of the heat pipe 100 in which the heat exchange water (water, alcohol) or the hollow part in the vacuum state is formed, and the ground plate 110 is installed. ) Is coupled to a circuit board 11 including a light emitting diode lamp 10.

이때, 상기 발광다이오드 램프(10)는 장시간 사용시 발생되는 고온열을 발열하게 되는 바, 이러한 발열은 접지판(110)의 높은 열전도율에 의해 히트파이프(100)로 전도시키게 된다.In this case, the light emitting diode lamp 10 generates high temperature heat generated when it is used for a long time, and the heat is conducted to the heat pipe 100 by the high thermal conductivity of the ground plate 110.

이때, 상기 히트파이프(100)는 벽체에 대해 수직된 방향으로 설치되는 바, 이러한 히트파이프(100)의 외주면에는 방사형으로 분기된 다수개의 방열휜(200)이 마련되어 대기중 사방 외측으로 고온열을 방열시키게 된다.At this time, the heat pipe 100 is installed in a direction perpendicular to the wall, the outer circumferential surface of the heat pipe 100 is provided with a plurality of radially radiated heat radiation (200) is provided to heat the high temperature heat in all directions outside the atmosphere. Heat dissipation.

이때, 상기 방열휜(200)의 몸체는 열이 전도되는 히트파이프(100)와 진행방향이 나란하게 형성되어 발열되는 고온열이 발광다이오드 램프(10)의 후방으로 신속하게 방열될 수 있도록 도모하는 한편, 벽체에 대해 수직으로 진행된 발열이 대류현상에 의해 상,하 방향으로도 방열이 원활하게 진행되도록 상기 방열휜(200)의 면상에는 다수개의 절취된 대류유도홈(210)이 형성된다.At this time, the body of the heat dissipation fan (200) is formed in parallel with the heat pipe conduction heat propagation direction so that the high temperature heat generated to be quickly radiated to the rear of the light emitting diode lamp (10) On the other hand, a plurality of cut-out convection induction grooves 210 are formed on the surface of the heat dissipation fin 200 so that the heat generated vertically with respect to the wall is radiated evenly in the up and down directions due to convection.

이러한 대류유도홈(210)은 외기열과 접촉되는 방열면적을 증대시키는 한편, 벽체에 대해 수직으로 결합된 상태에서도 특정방향에 대한 방열 장애없이 원활한 대류를 조장하게 된다.The convective induction groove 210 increases the heat dissipation area in contact with the outside heat, and promotes smooth convection without a heat dissipation obstacle in a specific direction even when coupled to the wall vertically.

이때, 상기 히트파이프(100)에 대해 방사형으로 배열된 방열휜(200)은 히트파이프(100)를 기준으로 일정한 각도를 유지하게 되는 바, 이는 외측 단부측의 개구된 공간(S1)이 히트파이프의 밀폐된 공간(S2)보다 밀도가 낮게 형성되어 히트파이프(100)로부터 발생된 고온열이 밀도가 높은 곳에서 낮은 곳으로 이동하여는 원리에 의해 신속하게 방열을 도모하도록 형성된다.At this time, the heat dissipation fan 200 arranged radially with respect to the heat pipe 100 is to maintain a constant angle with respect to the heat pipe 100, which is the open space (S1) of the outer end side of the heat pipe It is formed to have a lower density than the enclosed space (S2) of the high temperature heat generated from the heat pipe 100 is moved to a low place from a high density is formed to quickly heat dissipation by the principle.

<실시예 2><Example 2>

한편, 상기 발광다이오드 램프(10)를 천정에 고정하는 경우 - 상술한 발광다이오드 램프(10)는 천정과 수평으로 형성되고, 이에 방열휜(200)을 포함한 히트파이프(100)는 발열이 대류하는 상,하 방향과 동일한 직선상에 위치되는 바, 이는 히트파이프(100) 면상에 원주방향을 따라 배열된 다수개의 방열휜(200) 틈 사이로 고온열이 대류되어 열 흐름에 지장없이 자연스럽게 신속한 방열을 조장하게 된다.Meanwhile, when the light emitting diode lamp 10 is fixed to the ceiling-The above-described light emitting diode lamp 10 is formed horizontally with the ceiling, and the heat pipe 100 including the heat dissipation beam 200 is convex in the heat generation. It is located on the same straight line as the up and down direction, which is a high temperature heat convection between the plurality of heat radiation (200) gaps arranged in the circumferential direction on the surface of the heat pipe (100) to naturally quickly dissipate heat without disruption It encourages.

다시 말해, 상기 히트파이프(100)는 발광다이오드 램프(10)에서 발생된 고온열을 수직된 상,하 방향 그대로 대류하며 방열휜(200)에 열전달하여 전,후,좌,우 원주방향 및 상,하 수직방향에 대해 원만한 통풍환경을 조장함으로써, 발열하는 방향과 설치된 방향에 대해 신속하고 원활한 방열을 조장하게 된다.In other words, the heat pipe 100 convex the high temperature heat generated from the light emitting diode lamp 10 in a vertical up and down direction, and transfers heat to the heat dissipation beam 200 so that the heat pipe 100 is moved forward, backward, left, right and circumferentially. By encouraging a smooth ventilation environment in the vertical direction below, it facilitates quick and smooth heat dissipation in the direction of heat generation and the installed direction.

이와 같이, 본 발명은 발광다이오드 램프의 설치시 벽체 또는 천정 등의 방향성에 구애받지 않으며 신속하게 고온열을 외부로 방열시킬 수 있는 것으로, 이는 발광다이오드 램프의 과열을 방지하여 결국 램프의 수명이 연장되는 효과가 있다.As such, the present invention is capable of dissipating high temperature heat to the outside quickly regardless of the orientation of the wall or ceiling when the LED is installed, which prevents overheating of the LED and thus prolongs the life of the lamp. It is effective.

Claims (2)

일측에 접지판(110)이 부설된 열전달 매체인 히트파이프(100)와;A heat pipe 100 which is a heat transfer medium in which a ground plate 110 is attached to one side; 상기 히트파이프(100)의 외주면상에 원주방향을 따라 방사형으로 배열된 다수개의 방열휜(200)들이 구성되어 이루어진 것을 특징으로 하는 발광다이오드램프용 방열기.Radiator for a light emitting diode lamp, characterized in that consisting of a plurality of heat radiation (200) arranged radially along the circumferential direction on the outer peripheral surface of the heat pipe (100). 제 1항에 있어서, 상기 방열휜(200)은The heat dissipation fan 200 according to claim 1, wherein 판형으로 형성된 면상에 외측 단부측에서 내측으로 절취된 대류유도홈(210)이 형성되어 이루어진 것을 특징으로 하는 발광다이오드 램프용 방열기.Radiator for a light emitting diode lamp, characterized in that the convection induction groove 210 cut inward from the outer end side on the plate-shaped surface formed.
KR1020060050221A 2006-06-05 2006-06-05 Radiator for light emitting diode KR20070116331A (en)

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KR100910917B1 (en) * 2009-01-21 2009-08-05 주식회사 지앤에이치 Heat sink device of light emitting diode module for lighting equipment
WO2010005198A2 (en) * 2008-07-08 2010-01-14 Moon Kyu-Sik Lighting apparatus
WO2010039356A2 (en) * 2008-09-30 2010-04-08 Osram Sylvania Inc. Led source with an integrated heat pipe
WO2010083268A2 (en) * 2009-01-16 2010-07-22 Light Prescriptions Innovators, Llc Heat sink with helical fins and electrostatic augmentation
KR100966599B1 (en) * 2009-12-14 2010-07-26 주식회사 아이콘트롤스 Led lighting lamp
KR101272456B1 (en) * 2012-11-16 2013-06-07 주식회사 일성특수조명 Heat cooling apparatus assembly of led illuminating device having heat pipe and heat sink
CN103547343A (en) * 2012-11-16 2014-01-29 （株）日星 Heat cooling apparatus assembly of LED illuminating device having heat pipe and heat sink
KR101359675B1 (en) * 2008-11-14 2014-02-10 삼성전자주식회사 LED Lamp with heat dissipation device
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WO2010005198A2 (en) * 2008-07-08 2010-01-14 Moon Kyu-Sik Lighting apparatus
WO2010005198A3 (en) * 2008-07-08 2010-03-25 Moon Kyu-Sik Lighting apparatus
WO2010039356A2 (en) * 2008-09-30 2010-04-08 Osram Sylvania Inc. Led source with an integrated heat pipe
WO2010039356A3 (en) * 2008-09-30 2010-05-27 Osram Sylvania Inc. Led source with an integrated heat pipe
US8827498B2 (en) 2008-09-30 2014-09-09 Osram Sylvania Inc. LED light source having glass heat pipe with fiberglass wick
KR101359675B1 (en) * 2008-11-14 2014-02-10 삼성전자주식회사 LED Lamp with heat dissipation device
US8354779B2 (en) 2009-01-16 2013-01-15 Light Prescriptions Innovators Llc Heat sink with helical fins and electrostatic augmentation
WO2010083268A3 (en) * 2009-01-16 2010-09-30 Light Prescriptions Innovators, Llc Heat sink with helical fins and electrostatic augmentation
WO2010083268A2 (en) * 2009-01-16 2010-07-22 Light Prescriptions Innovators, Llc Heat sink with helical fins and electrostatic augmentation
KR100910917B1 (en) * 2009-01-21 2009-08-05 주식회사 지앤에이치 Heat sink device of light emitting diode module for lighting equipment
KR100966599B1 (en) * 2009-12-14 2010-07-26 주식회사 아이콘트롤스 Led lighting lamp
KR101272456B1 (en) * 2012-11-16 2013-06-07 주식회사 일성특수조명 Heat cooling apparatus assembly of led illuminating device having heat pipe and heat sink
CN103547343A (en) * 2012-11-16 2014-01-29 （株）日星 Heat cooling apparatus assembly of LED illuminating device having heat pipe and heat sink
WO2014077481A1 (en) * 2012-11-16 2014-05-22 주식회사 일성특수조명 Cooling device assembly for led lighting mechanism including heat pipe and radiation fin
US8757843B1 (en) 2012-11-16 2014-06-24 Il Sung Co., Ltd. Heat cooling apparatus assembly of LED illuminating device having heat pipe and heat sink
CN103547343B (en) * 2012-11-16 2016-06-01 （株）日星 Possesses the refrigerating unit assembly of the LED illumination utensil of heat conduction pipe and scatterer
KR20210027596A (en) * 2019-08-29 2021-03-11 삼성중공업 주식회사 Cold heat emitting apparatus for pipe of cargo

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