TW201812213A - Heatsink - Google Patents

Abstract

The objective of the present invention is to provide a heatsink capable of preventing an apparatus such as a power source device from receiving waste heat from the heatsink, in addition, allowing the dimension in the height direction of a lighting apparatus to be reduced, and furthermore, having a cooling function even when the working fluid in the heat pipe is frozen and does not operate due to being installed in cold climates. This heatsink comprises: a base plate thermally connected to an LED module at the back surface side center portion thereof; a heat pipe provided on the front surface side of the base plate, whereof the heat-receiving portion is disposed at a position overlapping with the LED module in a planar view; and a plurality of flat plate-shaped radiator fins thermally connected to the heat pipe. None of the radiator fins are disposed at the position overlapping with the LED module in a planar view, and at least one among the plurality of the radiator fins is in contact with the base plate.

Description

   heat sink   

The present invention relates to a heat sink for an LED for cooling a lighting device using a light emitting diode (LED) element installed on a ceiling or the like.

An LED lighting device installed on a ceiling or the like is susceptible to heat due to its lifetime and luminous efficiency. Therefore, it is necessary to continuously cool the light to maintain a temperature within an allowable range during light emission. Cooling of LED lighting sometimes uses heat sinks.

A conventional heat sink for cooling an LED lighting device installed from a ceiling or the like is generally provided with a power supply device thereon. This is because the center of gravity of the lighting fixture must be located at the center of the lighting fixture according to the installation state of the LED lighting device.

However, in the structure in which the power supply device is disposed on the heat sink, the power supply device becomes hot due to the heat emitted from the heat sink, which causes a problem that the life of the power supply device is shortened. In addition, LEDs have a longer life than power supply devices. Therefore, as the life of power supply devices is shortened, there is a problem that the life of the lighting device itself is shortened. In addition, since a power supply device is arranged on the upper surface of the heat sink, a problem arises that the size in the height direction of the lighting fixture increases.

Therefore, there is a proposal to provide a heat shielding member between a power supply device and a heat radiation portion of a lamp provided with a plurality of heat sinks, so that the heat exchanged in the heat radiation portion is blocked to suppress the temperature rise of the power supply device, and The distance between the power supply device and the lamp can be shortened, and the height of the entire lighting fixture can be reduced (Patent Document 1). However, in Patent Document 1, in addition to the hot air, the shielding member hinders the flow of air that cools the power supply device. Therefore, the power supply device cannot be sufficiently cooled, that is, the power supply device is still too hot. In Patent Document 1, the power supply device is still disposed on the upper surface of the heat radiating portion composed of a plurality of heat radiating fins, so there is still a problem that the size in the height direction of the lighting fixture cannot be sufficiently reduced.

Patent Document 1: Japanese Patent Application Laid-Open No. 2012-129172

In view of the above-mentioned problems, an object of the present invention is to provide a heat sink, which can prevent appliances such as a power supply device from receiving heat from the heat sink, and can reduce the height dimension of the lighting appliance, even if it is installed in a cold zone radiator. Even if the working fluid freezes and cannot operate, it also has a cooling function.

According to an aspect of the present invention, a heat sink is provided, which includes: a bottom plate whose central portion on the inner surface side is thermally connected to the LED module; a heat pipe is provided on the outer surface side of the bottom plate; Groups of overlapping positions; and a plurality of flat plate-shaped heat sinks which are thermally connected to the heat pipe, wherein the heat sinks are not arranged at positions where they overlap with the LED module in planar view, and at least one of the plurality of heat sinks Will come into contact with the base plate.

In the above aspect, the outer surface of the base plate overlaps the LED module in a planar view, that is, a central portion of the outer surface of the base plate is provided with a heat pipe (heat receiving portion of the heat pipe), but no heat sink is provided. In the above state. The heat from the LED module to be cooled is transmitted from the inner surface of the bottom plate to the outer surface in the thickness direction, and from the outer surface of the bottom plate to the heat pipe (heat-receiving part of the heat pipe). The heat transmitted to the heat receiving part of the heat pipe is transferred from the heat receiving part of the heat pipe to the heat sink of the heat pipe corresponding to the place where the heat sink is installed, and is released from the heat sink of the heat pipe to the external environment through the heat sink.

Also, in the above aspect, the outer surface of the bottom plate is located at a position overlapping the LED module in a planar view (that is, the central portion), and there is no heat sink, so the central portion of the outer surface of the bottom plate is formed by the heat sink. Department of Space. In addition, the term “plan view” in the present specification means that it is viewed from the outer surface side of the bottom plate on which the heat pipe and the heat sink are provided.

According to an aspect of the present invention, a heat sink is provided, wherein the heat dissipation pipe is a U-shape composed of a bottom edge portion and two straight portions extending from both ends of the bottom edge portion, and the bottom edge portion is thermally connected to The heat receiving portion of the bottom plate is thermally connected to the heat sink by the two straight portions.

According to an aspect of the present invention, a heat sink is provided, wherein the heat dissipation pipe is an L-shape formed by a bottom edge portion and a straight portion extending from an end portion on one side of the bottom edge portion, and the bottom edge portion is a heat The heat receiving portion connected to the bottom plate, and the straight portion is thermally connected to the heat sink.

In each of the above aspects, in the U-shaped or L-shaped heat pipe, the linear portion to which the heat sink is thermally connected functions as a heat sink.

According to an aspect of the present invention, a heat sink is provided, wherein the heat pipe is provided with a plurality of heat pipes, including: a heat pipe, a U formed by a bottom edge portion and two straight portions extending from both ends of the bottom edge portion; Shape, the bottom edge portion is thermally connected to the heat receiving portion of the bottom plate, two linear portions are thermally connected to the heat sink; and another heat pipe is formed by the bottom edge portion and a side of the bottom edge portion. An L-shape consisting of a straight portion extending at the end, the bottom edge portion is the heat receiving portion thermally connected to the bottom plate, and the straight portion is thermally connected to the heat sink.

According to an aspect of the present invention, a heat sink is provided, wherein the heat dissipation pipe has a stepped portion between the bottom edge portion and the straight portion.

According to an aspect of the present invention, a heat sink is provided, wherein the heat pipe is a U-shape composed of a bottom edge portion and two straight portions extending from both ends of the bottom edge portion, and a straight line in the two straight portions. The portion is the heat receiving portion thermally connected to the bottom plate, and the other linear portion of the two linear portions is thermally connected to the heat sink. In the aspect described above, among the two straight portions, the other straight portion that is thermally connected to the heat sink functions as a heat dissipation portion.

According to an aspect of the present invention, a heat sink is provided, wherein a flat portion of the heat sink is disposed in a direction perpendicular to the plane of the bottom plate, and the heat sink and the heat pipe are parallel to the center of gravity of the heat sink and parallel to the heat sink. The surfaces of the flat portions of the fins are arranged symmetrically.

According to an aspect of the present invention, a heat sink is provided, wherein a flat portion of the heat sink is disposed in a direction perpendicular to an outer surface of the bottom plate, and the heat sink and the heat pipe are relative to a center of gravity of the heat sink when viewed from a plane. , Point symmetrically configured.

According to an aspect of the present invention, a heat sink is provided, in which the LED module overlaps with the LED module in a planar view and does not overlap with the heat sink in a planar view, and houses a power source device, an electronic part, a control device, or a fixing member of a lighting fixture. .

In the aspect described above, the power supply device, electronic component, control device, or lighting fixture can be housed in a space portion partitioned by a heat sink.

According to an aspect of the present invention, a space portion partitioned by a heat sink is formed in the central portion of the outer surface of the bottom plate, and appliances such as a power supply device are accommodated in the space portion, thereby preventing appliances such as the power supply device from being radiated from the heat. The exhaust heat of the device can even prevent the heating of the device such as the power supply device. Furthermore, according to an aspect of the present invention, appliances such as a power supply device can be accommodated in the space portion. That is, since no heat sink is disposed between the base plate and appliances such as the power supply device, the size in the height direction of the lighting appliance can be reduced.

Furthermore, according to the aspect of the present invention, at least one of the plurality of fins is in contact with the bottom plate, so that even if it is installed in a cold area, the operating fluid enclosed in the heat pipe is frozen and does not operate, because heat is transmitted from the bottom plate to the heat sink. Sheet, so the heat sink can exert cooling performance.

According to an aspect of the present invention, in the U-shaped heat pipe, the bottom edge portion is a heat receiving portion that is thermally connected to the bottom plate, and the two straight portions are thermally connected to the heat sink, so that the heat can be efficiently viewed from a plane. The portion of the bottom plate that overlaps with the LED module is conveyed toward the heat sink that does not overlap with the LED module when viewed in a plane, so the LED module can be efficiently cooled.

According to an aspect of the present invention, in the L-shaped heat pipe, the bottom edge portion is a heat receiving portion that is thermally connected to the bottom plate, and the linear portion is thermally connected to the heat sink, so that the heat can be efficiently viewed from the plane to the LED. The parts of the bottom plate where the modules overlap are transported toward the heat sink which does not overlap with the LED module when viewed in a plane, so the LED module can be efficiently cooled.

According to an aspect of the present invention, the heat radiation pipe has a stepped portion between the bottom edge portion and the straight portion, so that the heat radiation pipe is not extended to the inner surface side of the bottom plate, and the heat radiation pipe can be attached to the central portion of the heat radiation plate. While improving the freedom of the shape and size design of the bottom plate, the heat dissipation efficiency of the heat sink is improved.

According to an aspect of the present invention, in the U-shaped heat pipe, a straight portion on one side is a heat receiving portion that is thermally connected to the bottom plate, and a straight portion on the other side is thermally connected to the heat sink, thereby efficiently removing heat. The portion of the bottom plate that overlaps the LED module in plan view is conveyed toward the heat sink that does not overlap with the LED module in plan view, so the LED module can be efficiently cooled.

1, 2, 3, 4, 5, 6‧‧‧ radiator

10‧‧‧ floor

11, 21, 31, 41, 51, 61-1, 61-2‧‧‧ heat pipes

12‧‧‧ heat sink

13, 33, 43‧‧‧ bottom edge

14, 14 ’, 34, 34’, 44‧‧‧ straight

15‧‧‧ Ministry of Space

16, 36, 46‧‧‧ steps

100‧‧‧LED Module

101‧‧‧ Power supply unit

FIG. 1 is a perspective view of the heat sink viewed from the bottom surface side of the first embodiment of the present invention.

Fig. 2 is an explanatory diagram of a heat sink according to a first embodiment of the present invention.

FIG. 3 is an explanatory diagram of an example of a method of using the heat sink according to the first embodiment of the present invention.

Fig. 4 is an explanatory diagram of a heat transfer design mechanism of a heat sink according to a first embodiment of the present invention.

Fig. 5 is an explanatory diagram of a heat sink according to a second embodiment of the present invention.

Fig. 6 is an explanatory diagram of a heat sink according to a third embodiment of the present invention.

Fig. 7 is an explanatory diagram of a heat sink according to a fourth embodiment of the present invention.

Fig. 8 is an explanatory diagram of a heat sink according to a fifth embodiment of the present invention.

Fig. 9 is an explanatory diagram of a heat sink according to a sixth embodiment of the present invention.

Hereinafter, a heat sink according to a first embodiment of the present invention will be described using drawings. As shown in FIGS. 1 and 2, the heat sink 1 of the first embodiment has a flat plate shape that is thermally connected to the LED module 100 as a heat-receiving surface (hereinafter sometimes referred to as an “inner surface”). Base plate 10 (rectangular in plan view in the figure); a heat pipe 11 thermally connected to the base plate 10 on a surface opposite to the heated side of the base plate 10 (hereinafter sometimes referred to as the "outer surface"); 11 A plurality of plate-shaped heat sinks 12 thermally connected.

In the heat sink 1, a plurality of heat pipes 11 are provided (two in the figure). The shape and size of the heat dissipation tube 11 are not particularly limited. In the heat sink 1, each heat dissipation tube 11 has the same shape and size. The bottom edge portion 13 and two straight portions 14, 14 'extending from both ends of the bottom edge portion 13. Form a U shape. When the bottom edge portion 13 is in contact with the outer surface of the bottom plate 10, the heat dissipation pipe 11 is thermally connected to the bottom plate 10. The method for thermally connecting the heat pipe 11 to the bottom plate 10 is not particularly limited, but in the heat sink 1, a groove portion (not shown) is provided on the outer surface of the base plate 10, and the bottom edge portion 13 of the heat pipe 11 is fitted into the groove portion, thereby The heat pipe 11 is thermally connected to the bottom plate 10. Therefore, the bottom edge portion 13 functions as a heat receiving portion of the heat pipe 11.

The bottom edge portion 13 of each heat radiation pipe 11 is connected to the center portion of the outer surface of the bottom plate 10. In the heat sink 1, the bottom edge portions 13 of the heat radiation pipes 11 are arranged side by side so as to be parallel to each other.

The LED module 100 is thermally connected to the central portion of the bottom surface side of the bottom plate 10, so that the bottom portion 13 of each heat pipe 11 is disposed at a position overlapping the LED module in plan view. Therefore, the heat receiving portion of the heat pipe 11 can efficiently receive heat from the LED module.

The two straight portions 14, 14 'of each heat pipe 11 extend from the center portion of the outer surface of the bottom plate 10 toward the peripheral edge portion. Each of the two straight portions 14 and 14 'extends parallel or slightly parallel to the outer surface of the bottom plate 10. Further, in the heat sink 1, the two straight portions 14, 14 'of each heat radiation pipe 11 protrude outside the end surface of the bottom plate 10. Among the two heat radiation pipes 11, the two straight portions 14, 14 'of one heat radiation pipe 11 extend in opposite directions with respect to the two straight portions 14, 14' of the other heat radiation pipe 11. Therefore, the two heat radiation pipes 11 are arranged in a plane-symmetrical relationship with respect to the central portion of the outer surface of the bottom plate 10.

The two straight portions 14 and 14 'of the heat radiation pipe 11 are provided with a plurality of heat radiation fins 12, whereby the heat radiation pipe 11 is thermally connected to the plurality of heat radiation fins 12. In the heat sink 1, two linear portions 14, 14 'are attached to a common heat sink 12. The mounting method is not particularly limited, but in the heat sink 1, each heat sink 12 is provided with two through holes (not shown), and the through holes are inserted into the straight portions 14 and 14 ′ of the heat pipe 11, thereby the heat pipe 11 It is thermally connected to the heat sink 12. Therefore, among the linear portions 14, 14 ', the portion where the fins 12 are mounted functions as a radiating portion of the radiating tube 11.

In the heat sink 1, the radiating fins 12 are attached so that the flat portions thereof are perpendicular or slightly perpendicular to the longitudinal directions of the linear portions 14, 14 '. The planar portion of the heat sink 12 is disposed in a vertical or slightly vertical direction with respect to the outer surface of the bottom plate 10. Further, the respective fins 12 are arranged side by side along the longitudinal direction of the linear portions 14, 14 ', so that the flat portions are parallel or slightly parallel to the flat portions of the other fins 12 adjacent to each other.

The heat radiation pipe 11 includes a step portion 16 between the bottom portion 13 and the linear portions 14, 14 '. The step portion 16 is a step formed in a direction opposite to the bottom plate 10 side. In other words, the straight portions 14 and 14 'are not in contact with the bottom plate 10. Therefore, it is not necessary to extend the heat sink 12 toward the inner surface side of the bottom plate 10, and the straight portions 14, 14 'of the heat sink tube 11 are attached to the central portion of the heat sink 12. Thereby, in the heat sink 1, the shape of the bottom plate 10 can improve the design freedom of the shape and size, and improve the heat dissipation efficiency of the heat sink 12.

One heat pipe 11 and another heat pipe 11 are provided with the same number and the same space of the same size and shape of the heat sinks 12. Therefore, the heat sinks 12 are arranged symmetrically with respect to the center of the outer surface of the bottom plate 10. relationship. As described above, the two heat pipes 11 are arranged in a plane-symmetrical relationship with respect to the central portion of the outer surface of the bottom plate 10. Therefore, in the heat sink 1, the heat sink 1 is parallel to the flat portion of the heat sink 1 and to the flat portion of the heat sink 12 Surface, the heat sink 12 and the heat pipe 11 are arranged symmetrically.

As shown in FIGS. 1 and 2, in the heat pipe 1, the heat sink 12 is attached to the straight portions 14 and 14 ′ of the heat pipe 11 so that the heat sink 12 is not arranged at the center portion of the outer surface of the heat sink 10. The heat sink 12 is not disposed at a position overlapping with the LED module 100 in a planar view. That is, the heat sink 12 is disposed on the peripheral edge portion of the bottom plate 10 and outside the bottom plate 10.

From the above, it can be seen that, in an area overlapping with the LED module 100 when viewed from a plane without the heat sink 12 disposed on the outer surface of the base plate 10, a space portion 15 is formed on the outer surface of the base plate 10.

In addition, among the plurality of fins 12, a part of the fins 12 is brought into contact with the outer surface of the base plate 10. In the heat sink 1, among the plurality of heat sinks 12, they are arranged in an area overlapping with the heat sink 10 in a planar view, that is, the heat sinks 12 arranged on the periphery of the heat sink 10 are formed outside the base plate 10. State of surface contact.

Therefore, even if the heat sink 1 is installed in a cold area, when the working fluid enclosed in the heat pipe 11 freezes and cannot operate, heat is transmitted from the bottom plate 10 to the fins 12 that are in contact with the outer surface of the bottom plate 10, so the heat sink 1 can perform Cooling performance. Thereby, even if the radiator 1 is used in a cold area, it is possible to suppress a decrease in the cooling performance of the radiator 1.

Either the material of the base plate 10 or the heat sink 12 is a metal with good thermal conductivity, and is made of, for example, aluminum, aluminum alloy, copper, copper alloy, or the like. Examples of the material of the container of the heat pipe 11 include copper, copper alloy, aluminum, aluminum alloy, and stainless steel. The working fluid enclosed in the container of the heat pipe 11 can be appropriately selected according to the suitability of the material of the container, and examples thereof include water. Other examples include chlorofluorocarbon substitutes, perfluorocarbons, and cyclopentane.

Next, an example of a method of using the heat pipe 1 according to the first embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 3 and 4, in the radiator 1, the space portion 15 can accommodate a power supply device, an electronic component, a control device, a fixing member of a lighting fixture, and the like (power supply device 101 in FIGS. 3 and 4). On the other hand, as shown in FIG. 4, the heat H from the LED module 100 is first transmitted to the center portion of the bottom plate 10, and then transmitted from the center portion of the bottom plate 10 to the heat radiation pipe 11 (the heat receiving portion of the heat radiation pipe 11), and is dissipated from the heat. The heat receiving portion of the tube 11 is conveyed to the heat radiation portion of the heat radiation tube 11 corresponding to the portion where the heat radiation fin 12 is installed, and is discharged from the heat radiation portion of the heat radiation tube 11 to the external environment through the heat radiation fin 12.

Therefore, as shown in FIG. 4, the power source device 101 can be prevented from receiving heat H from the heat sink 1, and the temperature of the power source device 101 can be further prevented. Therefore, it is possible to prevent the life of the power supply device 101 from being shortened due to heat H, and as a result, it is possible to prevent the life of the lighting fixture body from being shortened. In addition, the heat sink 1 can accommodate the power supply device 101 in the space portion 15, and the heat sink 12 is not disposed between the bottom plate 10 and the power supply device 101. Therefore, the size in the height direction can be reduced.

Among the U-shaped heat pipes 11, the bottom portion 13 disposed at the central portion of the heat sink 10 functions as a heat receiving portion that is thermally connected to the bottom plate 10, and extends from the central portion of the base row 10 toward the peripheral portion. The two straight portions 14 and 14 ′ are thermally connected to the heat sink 12. Thereby, in the heat sink 1, the central portion of the heat sink 10 overlapping the LED module 100 when viewed from a plane can be efficiently directed toward the bottom plate 10 provided on the bottom plate 10 which does not overlap with the LED module 100 when viewed from a plane. The peripheral edge portion and the outer fins 12 are transported, so that the LED module 100 can be efficiently cooled.

Next, a heat sink according to a second embodiment of the present invention will be described using drawings. Here, the same constituent elements as those of the heat sink of the first embodiment will be described using the same symbols.

In the heat sink of the first embodiment, a U-shaped heat pipe is provided with a stepped portion, but instead, as shown in FIG. 5, the heat sink of the second embodiment has a U-shaped heat sink. The tube has no step difference. In the heat sink 2 according to the second embodiment, the straight portions 14 and 14 'of the U-shaped heat pipe 21 are overlapped with the bottom plate 10 when viewed in plan, and are in contact with the outer surface of the bottom plate 10. Therefore, among the plurality of heat sinks 12, the heat sinks 12 arranged in a position overlapping with the base plate 10 in a plan view will be thermally connected to the heat dissipation tube 21 at the end of the base plate 10 side, and then connected to the outer surface of the base plate 10 .

Even in the heat sink 2, the U-shaped heat pipe 21 is disposed on the bottom portion 13 of the center portion of the bottom plate 10. It functions as a heat receiving portion that is thermally connected to the bottom plate 10, and two straight portions 14, 14 'extending from the center portion of the bottom plate 10 toward the peripheral edge portion are thermally connected to the heat sink 12. Thereby, the central portion of the bottom plate 10 overlapping the LED module (not shown) as viewed from a plane can be efficiently transferred toward the peripheral edge portion of the bottom plate 10 and the fins 12 provided on the outside and efficiently cooled. LED module.

Even the heat sink 2 can store a power supply device or the like (not shown) in the space portion 15. Therefore, the power supply device or the like can be prevented from receiving heat from the heat sink 2, and the size in the height direction can be reduced. Moreover, even with the heat sink 2, a part of the plurality of heat sinks 12 is in a state of being in contact with the outer surface of the bottom plate 10. Therefore, even if the heat sink 2 is installed in a cold area, the working fluid of the heat pipe 21 is frozen. In the case of heat, heat is transferred from the bottom plate 10 to the fins 12 that are in contact with the outer surface of the bottom plate 10, so the heat sink 2 can exhibit cooling performance.

Next, a heat sink according to a third embodiment of the present invention will be described using drawings. Here, the same constituent elements as those of the heat sinks of the first and second embodiments will be described using the same symbols.

In the heat sink of the first embodiment, two U-shaped heat pipes 11 are provided, but instead, as shown in FIG. 6, the heat sink of the third embodiment has a U-shaped heat sink. Set of 4 tubes. The heat sink 3 of the third embodiment is adjacent to each of the U-shaped heat pipes 11 provided in the heat sink 1 of the first embodiment, and two other heat pipes 31 of a U-shape are further provided. .

The width between the two straight portions 34, 34 'of the other heat radiating tube 21 is wider than the width between the two straight portions 14, 14' of the heat radiating tube 11. The two straight portions 34 and 34 'of the other heat radiating tubes 31 extend parallel or slightly parallel to the two straight portions 14 and 14' of the heat radiating tube 11. In the heat sink 3, the two straight portions 14, 14 'of the heat sink tube 11 and the two straight portions 34, 34' of the other heat sink 31 are mounted on a common heat sink 12.

In the heat sink 3, the bottom edge portion 33 of the other fins 31 is also thermally connected to the center portion of the outer surface of the bottom plate 10. The longitudinal dimension of the bottom edge portion 33 of the other heat dissipation tube 31 is larger than the longitudinal dimension of the bottom edge portion 13 of the heat dissipation tube 11. The bottom edge portion 33 of the other heat radiation tube 31 is adjacent to the outside of the bottom edge portion 13 of the heat radiation tube 11 and is arranged in parallel or slightly parallel to the bottom edge portion 13 of the heat radiation tube 11.

Similar to the heat radiating pipe 11, the other heat radiating pipes 31 include a stepped portion 36 between the bottom edge portion 33 and the linear portions 34 and 34 '. The step portion 36 forms a step that faces in a direction opposite to the bottom plate 10 side. Therefore, the straight portions 34 and 34 'of the other heat radiation pipes 31 are not connected to the bottom plate 10.

The heat sink 3 is provided with other heat pipes 31 in addition to the heat pipe 11, so that the heat transfer characteristics from the central portion of the bottom plate 10 to the peripheral edge portion of the bottom plate 10 and the outer fins 12 can be further improved, so that the heat transfer characteristics can be further improved. Efficiently cools LED modules.

In addition, even the heat sink 3 can accommodate a power supply device or the like (not shown) in the space portion 15. Therefore, the power supply device or the like can be prevented from receiving heat from the heat sink 3, and the size in the height direction can be further reduced. In addition, even with the heat sink 3, a part of the plurality of heat sinks 12 is in contact with the outer surface of the bottom plate 10. Therefore, even if the heat sink 3 is installed in a cold area, the heat pipes 11 and other heat sinks When the working fluid of the tube 31 is frozen, heat is transmitted from the bottom plate 10 to the fins 12 that are in contact with the outer surface of the bottom plate 10, and therefore the heat sink 3 can exhibit cooling performance.

Next, a heat sink according to a fourth embodiment of the present invention will be described using drawings. Here, the same constituent elements as those of the heat sinks of the first to third embodiments will be described using the same symbols.

In the heat sink of the first embodiment, two U-shaped heat pipes are provided, but instead, as shown in FIG. 7, the heat sink of the fourth embodiment is provided with four L-shaped heat sinks. Radiator. The L-shaped radiating pipe 41 provided in the hot gas 4 of the fourth embodiment is composed of a bottom edge portion 43 and a straight portion 44 extending from one end of the bottom edge portion 43. The L-shaped heat pipe 41 includes a step portion 46 between the bottom portion 43 and the straight portion 44. The step portion 46 forms a step in a direction opposite to the bottom plate 10 side. Therefore, the straight portion 44 is not in contact with the bottom plate 10.

In the heat sink 4, the bottom portion 43 of any one of the four L-shaped heat pipes 41 is arranged at the center of the bottom plate 10. In addition, the straight portions of any of the four L-shaped heat pipes 41 extend from the central portion of the outer surface of the bottom plate 10 toward the peripheral edge portion.

In the heat sink 4, two L-shaped heat pipes 41 are arranged so that their bottom edge portions 43 are adjacent to each other, and their linear portions 44 extend parallel or slightly parallel to the long direction facing each other, thereby forming U Word shape. Therefore, two U-shaped heat pipes are formed from four L-shaped heat pipes 41. In the heat sink 4, the heat sink 12 and the L-shaped heat pipe 41 are arranged symmetrically with respect to the center of gravity of the heat sink 4 (the center point of the outer surface of the bottom plate 10).

Even the heat sink 4 can enhance the heat transfer from the central portion of the bottom plate 10 overlapping the LED module 100 to the peripheral portion of the bottom plate 10 and the outer fins 12 when viewed from a plane, so that the LED module can be efficiently cooled. .

In addition, even the heat sink 4 can accommodate a power supply device or the like (not shown) in the space portion 15, so that the power supply device or the like can be prevented from receiving heat from the heat sink 4, and the height dimension can be reduced. In addition, even with the heat sink 4, a part of the plurality of heat sinks 12 is in contact with the outer surface of the bottom plate 10. Therefore, even if the heat sink 4 is installed in a cold area, the L-shaped heat sink 41 When the working fluid is frozen, heat is transmitted from the bottom plate 10 to the radiating fins 12 that are in contact with the outer surface of the bottom plate 10, so the heat sink 4 can exhibit cooling performance.

Next, a heat sink according to a fifth embodiment of the present invention will be described using drawings. Here, the same constituent elements as those of the heat sinks of the first to fourth embodiments are described using the same symbols.

In the radiators according to the first to third embodiments, the bottom portion of the U-shaped heat pipe is attached to the center portion of the outer surface of the bottom plate, but instead, as shown in FIG. 8, the fifth embodiment is In the heat pipe 5 of the example, one of the two straight portions (one side straight portion 14 and the other side straight portion 14 ') of the U-shaped heat pipe 51 (a side straight portion 14 in the figure) is attached. On the center of the outer surface of the bottom plate 10.

A linear portion 14 on one side of the U-shaped heat dissipation tube 51 is attached to the center portion of the outer surface of the bottom plate 10, and is thus thermally connected to the bottom plate 10. In the heat sink 5, the linear portion 14 'on the other side of the U-shaped heat pipe 51 does not contact the bottom plate 10, but extends parallel or slightly parallel to the outer surface of the bottom plate 10. A plurality of radiating fins 12 are mounted on the linear portion 14 'on the other side, whereby the U-shaped radiating tube 51 and the radiating fins 12 are thermally connected. In addition, in the heat sink 5, the end portions of all the fins 12 on the bottom plate 10 side are in contact with the outer surface of the bottom plate 10.

The linear portion 14 on one side and the linear portion 14 'on the other side extend from a predetermined end portion of the bottom plate 10 toward an end portion facing the predetermined end portion. The bottom edge portion 13 of the U-shaped radiating tube 51 is not connected to the bottom plate 10, and may be erected at a predetermined angle at or near a predetermined end portion of the bottom plate 10.

The heat sink 5 is provided with a plurality of U-shaped heat pipes 51 (four in the figure), and each of the U-shaped heat pipes 51 has a straight portion 14 on one side adjacent to each other. In addition, the bottom edge portion 13 of each U-shaped heat dissipation tube 51 is erected at an angle different from each other with respect to the outer surface of the bottom plate 10. In addition, the bottom edge portions 13 of any one of the U-shaped heat dissipation tubes 51 are arranged on a substantially flat plane (a plane slightly perpendicular to the outer surface of the bottom plate 10).

Even with the heat sink 5, the heat sink 12 is attached to a U-shaped heat pipe 51 so that a space portion 15 is formed in an area of the outer surface of the bottom plate 10 that overlaps with an LED module (not shown) in plan view. By accommodating the power supply device (not shown) in the space portion 15, it is possible to prevent the power supply device from receiving heat from the heat sink 5 and further reduce the size in the height direction.

Further, in the heat sink 5, the linear portion 14 on one side and the linear portion 14 ′ on the other side extend from a predetermined end portion of the bottom plate 10 to an end portion facing the predetermined end portion. The central portion of the bottom plate 10 overlapping the LED module (not shown) viewed from a plane is transported toward the heat sink 12 at the peripheral portion of the bottom plate 10, and the LED module can be efficiently cooled. In the radiator 5, all the fins 12 are in contact with the outer surface of the bottom plate 10. Therefore, even if the radiator 5 is installed in a cold area, when the working fluid of the U-shaped heat radiating tube 51 is frozen, heat will be removed from The bottom plate 10 is transmitted to the fins 12 that are in contact with the outer surface of the bottom plate 10, and therefore the heat sink 5 can exhibit cooling performance.

In the heat sink 5, the bottom portion 13 of the U-shaped radiating tube 51 is erected at a predetermined angle with respect to the outer surface of the bottom plate 10. Therefore, even if the U-shaped heating tube is not provided with a stepped portion 51. It is also possible to attach the straight portion 14 'on the other side of the U-shaped heat pipe 51 to the central portion of the heat sink 12 without extending the heat sink 12 to the inner surface side of the bottom plate 10.

Next, a heat sink according to a sixth embodiment of the present invention will be described using drawings. Here, the same constituent elements as those of the heat sinks of the first to fifth embodiments will be described using the same symbols.

In the heat sink according to the fifth embodiment, the bottom portions 13 of the U-shaped heat pipes are arranged on the same plane with each other, but instead, as shown in FIG. 9, the sixth embodiment A plurality of U-shaped heat pipes are provided in the heat sink, and the bottom edges thereof are arranged to face each other.

In the heat sink 6 according to the sixth embodiment, ten U-shaped heat pipes 61 (U-shaped heat pipes 61-1, U-shaped heat pipes 61-2) are provided, and the bottom of the U-shape is provided. The portion 13 is provided in a comb shape on the outer surface of the bottom plate 10. That is, among the ten U-shaped heat pipes 61, in FIG. 9, five U-shaped heat pipes 61-1 are provided so that the bottom edge portion 13 is arranged on the right peripheral edge portion on the outer surface of the bottom plate 10. . In addition, the other five U-shaped heat pipes 61-2 different from the U-shaped heat pipe 61-1 are provided such that the bottom edge portion 13 is disposed on the left peripheral edge portion on the outer surface of the bottom plate 10. The U-shaped heat pipe 61-1 with the bottom edge portion 13 disposed on the right peripheral edge portion and the U-shaped heat pipe 61-2 with the bottom edge portion 13 disposed on the left peripheral edge portion are arranged alternately with each other on a plane facing the heat sink 12 Department parallel direction.

The bottom edge portion 13 is arranged on the bottom edge portion of any one of the U-shaped heat dissipation tubes 61-1 on the right peripheral edge portion on a substantially the same plane (a plane slightly vertical to the outer surface of the bottom plate 10). In addition, the bottom edge portion 13 is arranged on the bottom edge portion of any one of the U-shaped heat dissipation tubes 61-2 on the left peripheral edge portion on a substantially the same plane (a plane slightly vertical to the outer surface of the bottom plate 10). The bottom edge portion 13 of the U-shaped heat dissipation pipe 61 will stand upright in a slightly vertical direction with respect to the outer surface of the bottom plate 10.

In the heat sink 6, the heat sink 12 and the U-shaped heat pipe 61 are arranged symmetrically with respect to the center of gravity (the center point of the outer surface of the bottom plate 10) when viewed from the plane of the heat sink 6. In the heat sink 6, all the fins 12 are brought into contact with the outer surface of the base plate 10.

Even the heat sink 6 can be provided with a heat sink 12 so that a space portion 15 is formed in an area of the outer surface of the bottom plate 10 that overlaps with an LED module (not shown) in a planar view. (Shown) accommodated in the space portion 15, it is possible to prevent the power supply device from receiving heat from the heat sink 6, and to further reduce the size in the height direction.

In the heat sink 6, all the fins 12 are in contact with the outer surface of the bottom plate 10. Therefore, even if the heat sink 6 is installed in a cold area, if the working fluid of the U-shaped heat pipe 61 is frozen, heat will be removed from the bottom plate 10 Since it is transmitted to the radiating fins 12 in contact with the outer surface of the bottom plate 10, the heat sink 6 can exhibit the cooling performance.

Moreover, in the heat sink 6, the bottom edge portion 13 of the U-shaped heat pipe 61 is formed to stand on the outer surface of the bottom plate 10. Therefore, it is possible to provide the U-shaped heat pipe 61 without the stepped portion. Without extending the heat sink 12 to the inner surface side of the bottom plate 10, a U-shaped heat pipe 61 is attached to the central portion of the heat sink 12.

Next, another embodiment of the heat sink of the present invention will be described. In each of the above-mentioned embodiments, the shape of the bottom plate in a planar view is rectangular, but the shape is not particularly limited. For example, the shape may be a circle, a pentagon or more, a square, or a rectangle. In the heat sinks of the above-mentioned embodiments, the LED module is thermally connected to the inner surface side central portion of the bottom plate, but the LED module may be thermally connected to the inner surface side peripheral portion.

In each of the above embodiments, one of the U-shaped heat pipe and the L-shaped heat pipe is used, but instead, a U-shaped heat pipe or an L-shaped heat pipe may be used together. .

The radiator of the present invention can prevent appliances such as a power supply device from being exhausted from the radiator. Even if the working fluid of the heat pipe is frozen in a cold area, the cooling performance can be exhibited and the height dimension of the lighting appliance can be reduced. It is extremely valuable to cool LED lighting devices installed in the ceiling or in an environment with poor air conditioning.

Claims (9)

    A heat sink includes: a bottom plate whose central portion on the inner surface side is thermally connected to the LED module; a heat pipe is provided on the outer surface side of the bottom plate, and the heat receiving portion is disposed at a position overlapping with the LED module in plan view; and A plurality of flat heat sinks are thermally connected to the heat sink, wherein the heat sinks are not arranged at positions overlapping the LED module in a planar view, and at least one of the plurality of heat sinks is in contact with the bottom plate.         The heat sink according to item 1 of the scope of patent application, wherein the heat pipe is a U-shape composed of a bottom edge portion and two straight portions extending from both ends of the bottom edge portion, and the bottom edge portion is The heat receiving portion is thermally connected to the bottom plate, and the two linear portions are thermally connected to the heat sink.         The heat sink according to item 1 of the scope of patent application, wherein the heat pipe is an L-shape formed by a bottom edge portion and a straight portion extending from an end of one side of the bottom edge portion, and the bottom edge The portion is the heat receiving portion thermally connected to the bottom plate, and the linear portion is thermally connected to the heat sink.         The heat sink according to item 1 of the scope of patent application, wherein the heat pipe is provided with a plurality of heat pipes, including: a heat pipe comprising a bottom edge portion and two straight portions extending from both ends of the bottom edge portion; U-shaped, the bottom edge portion is thermally connected to the heat receiving portion of the bottom plate, and the two straight portions are thermally connected to the heat sink; and another heat pipe is formed by the bottom edge portion and a portion of the bottom edge portion. An L-shape formed by a straight portion extending from the side end portion, the bottom portion is the heat receiving portion thermally connected to the bottom plate, and the straight portion is thermally connected to the heat sink.         The heat sink according to any one of claims 2 to 4, wherein the heat dissipation pipe has a stepped portion between the bottom edge portion and the straight portion.         The heat sink according to item 1 of the scope of patent application, wherein the heat pipe has a U-shape composed of a bottom edge portion and two straight portions extending from both ends of the bottom edge portion, and the two straight portions The straight line portion in is the heat receiving portion thermally connected to the bottom plate, and the other straight portion of the two linear portions is thermally connected to the heat sink.         The heat sink according to any one of claims 1 to 6, wherein a flat portion of the heat sink is disposed in a vertical direction relative to a plane of the base plate, and the heat sink and the heat pipe are opposed to each other through the heat sink. The center of gravity of the heat sink is parallel to the surface of the flat portion of the heat sink, and is arranged symmetrically.         The heat sink according to any one of claims 1 to 6, wherein a flat portion of the heat sink is disposed in a vertical direction relative to a plane of the base plate, and the heat sink and the heat pipe are relative to the heat sink. The center of gravity in the plane view of the device is arranged symmetrically at points.         The heat sink according to any one of claims 1 to 8, wherein the LED module overlaps with the LED module in a planar view and does not overlap with the heat sink in a planar view, and houses the power supply device, electronic components, Controls or fixtures for lighting fixtures.