WO2018043312A1 - Heatsink - Google Patents

Heatsink Download PDF

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Publication number
WO2018043312A1
WO2018043312A1 PCT/JP2017/030450 JP2017030450W WO2018043312A1 WO 2018043312 A1 WO2018043312 A1 WO 2018043312A1 JP 2017030450 W JP2017030450 W JP 2017030450W WO 2018043312 A1 WO2018043312 A1 WO 2018043312A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
base plate
heat sink
heat pipe
thermally connected
Prior art date
Application number
PCT/JP2017/030450
Other languages
French (fr)
Japanese (ja)
Inventor
泰博 内村
敬大 片山
剛一 村上
Original Assignee
古河電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 古河電気工業株式会社 filed Critical 古河電気工業株式会社
Priority to JP2018537215A priority Critical patent/JP6989507B2/en
Publication of WO2018043312A1 publication Critical patent/WO2018043312A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat sink for an LED that cools illumination using a light emitting diode (LED) element installed on a ceiling or the like.
  • LED light emitting diode
  • a heat sink may be used to cool the LED lighting.
  • a conventional heat sink that cools LED lighting installed by being suspended on a ceiling or the like generally has a power supply device disposed on the upper surface thereof. This is because the center of gravity of the lighting fixture needs to be the center of the lighting fixture from the LED lighting installation mode.
  • the power supply device is subjected to heat exhausted from the heat sink, resulting in a high temperature, which shortens the life of the power supply device.
  • the LED has a longer life than the power supply device, there is a problem that the life of the lighting fixture itself is shortened as the life of the power supply device is shortened.
  • the power supply device is disposed on the upper surface of the heat sink, there is a problem that the dimension in the height direction of the lighting fixture increases.
  • Patent Document 1 since the shielding member hinders the flow of air that cools the power supply device together with hot air, the power supply device cannot be sufficiently cooled, that is, the power supply device is still at a high temperature. was there. Moreover, in patent document 1, since the power supply device is still arrange
  • the object of the present invention is to prevent the appliance such as the power supply device from receiving heat exhausted from the heat sink, reduce the dimension in the height direction of the luminaire, and is installed in a cold region. Accordingly, it is an object of the present invention to provide a heat sink having a cooling function even when the working fluid of the heat pipe is frozen and does not operate.
  • An aspect of the present invention is a heat pipe in which a heat receiving portion is disposed at a position where the LED module and a base plate that is thermally connected at the center portion on the back surface side are provided on the front surface side of the base plate and overlap with the LED module in plan view. And a plurality of flat plate-like heat radiation fins that are thermally connected to the heat pipe, wherein the heat radiation fins are not arranged at positions overlapping the LED module in plan view. At least one of the heat radiating fins is a heat sink in contact with the base plate.
  • the heat pipe (heat receiving portion of the heat pipe) is arranged at the position overlapping the LED module in a plan view on the surface of the base plate, that is, at the center of the surface of the base plate, but the heat radiation fin is arranged.
  • the heat from the LED module to be cooled is transmitted from the back surface to the front surface in the thickness direction of the base plate, and further transmitted from the surface of the base plate to the heat pipe (heat receiving portion of the heat pipe).
  • the heat transferred to the heat pipe heat receiving part is transported from the heat pipe heat receiving part to the heat pipe heat radiating part corresponding to the part to which the heat radiating fins are attached, and from the heat pipe heat radiating part to the outside through the heat radiating fins. Released to the environment.
  • the radiation fin is not arrange
  • plane view means the aspect visually recognized from the side facing the surface of the base plate provided with the heat pipe and the heat radiating fin.
  • the heat pipe has a U shape including a bottom portion and two straight portions extending from both ends of the bottom portion, and the bottom portion is thermally connected to the base plate.
  • the heat receiving portion is a heat sink in which the radiating fin is thermally connected to the two straight portions.
  • the heat pipe has an L shape including a bottom portion and one straight portion extending from one end portion of the bottom portion, and the bottom portion is thermally connected to the base plate.
  • the heat receiving portion is a heat sink in which the radiating fin is thermally connected to the straight portion.
  • a straight portion to which the radiating fins are thermally connected functions as a radiating portion.
  • An aspect of the present invention is a U-shape in which a plurality of the heat pipes are provided and includes a bottom portion and two straight portions extending from both ends of the bottom portion, and the bottom portion is thermally connected to the base plate.
  • the heat sink has an L shape, the bottom portion is the heat receiving portion thermally connected to the base plate, and the heat pipe has the heat radiation fin thermally connected to the linear portion.
  • An aspect of the present invention is a heat sink in which the heat pipe has a stepped portion between the bottom portion and the straight portion.
  • the heat pipe has a U shape including a bottom portion and two straight portions extending from both ends of the bottom portion, and one straight portion of the two straight portions is The heat receiving portion is thermally connected to a base plate, and the other straight portion of the two straight portions is a heat sink thermally connected to the radiating fin.
  • the other linear part to which the radiation fin was thermally connected among two linear parts functions as a thermal radiation part.
  • An aspect of the present invention is a heat sink in which the planar portion of the heat radiating fin is disposed in a direction perpendicular to the surface of the base plate, and passes through the center of gravity of the heat sink and is parallel to the planar portion of the radiating fin.
  • An aspect of the present invention is a heat sink in which the flat portion of the heat radiating fin is arranged in a vertical direction with respect to the surface of the base plate, and the heat radiating fin and the point of symmetry with respect to the center of gravity in a plan view of the heat sink.
  • An aspect of the present invention is a heat sink in which a fixing member of a power supply device, an electronic component, a control device, or a lighting fixture is accommodated at a position that overlaps with the LED module in a plan view and does not overlap with the heat dissipation fin in a plan view. .
  • the power supply device, the electronic component, the control device, or the fixing member of the lighting fixture can be accommodated in the space portion partitioned by the heat radiation fin.
  • the device such as the power supply device is accommodated in the space portion by accommodating the device such as the power supply device. Can be prevented from receiving heat exhausted from the heat sink, and thus the temperature of the appliance such as the power supply device can be prevented from being increased.
  • a device such as a power supply device can be accommodated in the space portion, that is, since no radiation fins are disposed between the base plate and the device such as the power supply device, The direction dimension can be reduced.
  • At least one of the plurality of radiating fins is in contact with the base plate, so that even when the working fluid enclosed in the heat pipe is frozen and does not operate due to contact with the base plate. Since heat is transferred from the base plate to the heat radiating fins, the heat sink can exhibit cooling performance.
  • the bottom part is a heat receiving part thermally connected to the base plate, and the two straight parts are thermally connected to the radiation fins, Since the heat can be efficiently transported from the portion of the base plate that overlaps with the LED module in plan view to the radiation fin that does not overlap with the LED module in plan view, the LED module can be efficiently cooled.
  • the bottom portion is a heat receiving portion that is thermally connected to the base plate, and the straight portion is thermally connected to the radiating fins, thereby Since the heat can be efficiently transported from the portion of the base plate that overlaps with the LED module to the radiation fin that does not overlap with the LED module in plan view, the LED module can be efficiently cooled.
  • the heat pipe has a step portion between the bottom portion and the straight portion, so that the heat pipe is extended to the center portion of the radiating fin without extending the radiating fin to the back surface side of the base plate. Since it can be attached, the heat radiation efficiency of the radiation fins can be improved while improving the degree of freedom in designing the shape and dimensions of the base plate.
  • one straight portion of the U-shaped heat pipe is a heat receiving portion thermally connected to the base plate, and the other straight portion is thermally connected to the radiation fin.
  • the heat sink 1 according to the first embodiment is a flat plate that is thermally connected to the LED module 100 on the heat receiving side surface (hereinafter also referred to as “back surface”).
  • a heat pipe 11 that is thermally connected to the base plate 10 at the base plate 10 (in the figure, rectangular in plan view) and a surface opposite to the heat receiving side of the base plate 10 (hereinafter also referred to as “surface”).
  • surface a surface opposite to the heat receiving side of the base plate 10
  • a plurality of plate-like heat radiation fins 12 thermally connected to the heat pipe 11.
  • a plurality of heat pipes 11 are provided.
  • each heat pipe 11 has the same shape and dimensions, and the two base portions 13 and two straight portions 14 extending from both ends of the base portion 13, It is U-shaped consisting of 14 '.
  • the heat pipe 11 is thermally connected to the base plate 10 by the base 13 contacting the surface of the base plate 10.
  • the method for thermally connecting the heat pipe 11 to the base plate 10 is not particularly limited.
  • a groove portion (not shown) is provided on the surface of the base plate 10, and the bottom portion 13 of the heat pipe 11 is fitted into the groove portion. 11 is thermally connected to the base plate 10. Therefore, the bottom part 13 functions as a heat receiving part of the heat pipe 11.
  • each heat pipe 11 is in contact with the center of the surface of the base plate 10. Moreover, in the heat sink 1, the base 13 of each heat pipe 11 is arrange
  • the base 13 of each heat pipe 11 is disposed at a position overlapping the LED module 100 in plan view. Therefore, the heat receiving portion of the heat pipe 11 can receive heat from the LED module 100 efficiently.
  • each heat pipe 11 extends from the center portion of the surface of the base plate 10 toward the peripheral portion. Further, the two straight portions 14 and 14 ′ both extend parallel or substantially parallel to the surface of the base plate 10. In the heat sink 1, the two straight portions 14 and 14 ′ of each heat pipe 11 protrude to the outside of the end surface of the base plate 10. Further, of the two heat pipes 11, the two straight portions 14 and 14 ′ of one heat pipe 11 extend in the opposite direction with respect to the two straight portions 14 and 14 ′ of the other heat pipe 11. ing. Accordingly, the two heat pipes 11 are arranged in a plane-symmetric relationship with respect to the central portion of the surface of the base plate 10.
  • the heat pipe 11 is thermally connected to the plurality of radiation fins 12 by attaching the plurality of radiation fins 12 to the two straight portions 14 and 14 ′ of the heat pipe 11.
  • the two straight portions 14 and 14 ′ are attached to the common heat radiation fin 12.
  • each radiating fin 12 is provided with two through holes (not shown), and by inserting the straight portions 14 and 14 ′ of the heat pipe 11 into the through holes, The heat pipe 11 is thermally connected to the radiating fins 12. Therefore, a portion of the straight portions 14 and 14 ′ where the radiation fins 12 are attached functions as a heat radiation portion of the heat pipe 11.
  • the radiating fins 12 are attached so that the plane portions of the radiating fins 12 are orthogonal or substantially orthogonal to the longitudinal directions of the straight portions 14 and 14 '. Further, the planar portion of the radiating fin 12 is arranged in a vertical or substantially vertical direction with respect to the surface of the base plate 10. In addition, the respective radiation fins 12 are arranged in parallel along the longitudinal direction of the straight portions 14 and 14 'so that the plane portions are parallel or substantially parallel to the plane portions of other adjacent radiation fins 12. Has been.
  • the heat pipe 11 includes a step portion 16 between the bottom portion 13 and the straight portions 14 and 14 '.
  • the step portion 16 is a step in the opposite direction to the base plate 10 side. That is, the straight portions 14 and 14 ′ are not in contact with the base plate 10. Accordingly, the straight portions 14 and 14 ′ of the heat pipe 11 are attached to the central portion of the heat radiating fin 12 without extending the heat radiating fin 12 to the back surface side of the base plate 10. Therefore, in the heat sink 1, the heat radiation efficiency of the radiation fins 12 can be improved while improving the degree of freedom in designing the shape and dimensions of the base plate 10.
  • the radiating fins 12 are They are arranged in a plane symmetry relationship. As described above, since the two heat pipes 11 are arranged in a plane-symmetrical relationship with respect to the center portion of the surface of the base plate 10, the heat sink 1 passes through the center of gravity of the heat sink 1 and the radiating fins 12. The radiating fins 12 and the heat pipes 11 are arranged symmetrically with respect to the plane parallel to the plane portion.
  • the radiating fins 12 are attached to the straight portions 14 and 14 ′ of the heat pipe 11 so that the radiating fins 12 are not arranged at the center of the surface of the base plate 10. .
  • the heat radiating fins 12 are not provided at positions overlapping the LED module 100 in plan view. That is, the radiating fins 12 are disposed on the peripheral edge of the base plate 10 and on the outside of the base plate 10.
  • the surface of the base plate 10 is a space portion 15.
  • the heat radiation fins 12 are in contact with the surface of the base plate 10.
  • a region of the plurality of heat radiating fins 12 that overlaps the base plate 10 in a plan view, that is, the heat radiating fins 12 arranged at the peripheral edge of the base plate 10 is in contact with the surface of the base plate 10.
  • the heat sink 1 can exhibit cooling performance. Therefore, even if the heat sink 1 is used in a cold region, it is possible to suppress a decrease in the cooling performance of the heat sink 1.
  • the materials of the base plate 10 and the heat radiating fins 12 are all metals having good thermal conductivity, and are made of, for example, aluminum, aluminum alloy, copper, copper alloy or the like.
  • Examples of the material of the heat pipe 11 container include copper, copper alloy, aluminum, aluminum alloy, and stainless steel.
  • the working fluid sealed in the heat pipe 11 container is compatible with the container material. Depending on the nature, it can be appropriately selected, and examples thereof include water, alternative chlorofluorocarbon, perfluorocarbon, and cyclopentane.
  • FIGS. 3 and 4 in the heat sink 1, a power supply device, an electronic component, a control device, a fixing member for a lighting fixture, or the like (power supply device 101 in FIGS. 3 and 4) can be accommodated in the space portion 15. .
  • the heat H from the LED module 100 is first transmitted to the central portion of the base plate 10, and further transmitted from the central portion of the base plate 10 to the heat pipe 11 (heat receiving portion of the heat pipe 11).
  • the heat pipe 11 is transported from the heat receiving portion of the heat pipe 11 to the heat radiating portion of the heat pipe 11 corresponding to the portion where the heat radiating fins 12 are attached, and is released from the heat radiating portion of the heat pipe 11 to the external environment via the heat radiating fins 12.
  • the power supply device 101 can be prevented from receiving the heat H from the heat sink 1, and hence the power supply device 101 can be prevented from being heated. Therefore, shortening of the life of the power supply device 101 due to receiving the heat H can be prevented, and as a result, shortening of the life of the lighting fixture itself can be prevented. Further, in the heat sink 1, the power supply device 101 can be accommodated in the space portion 15, and the heat radiation fins 12 are not disposed between the base plate 10 and the power supply device 101, so that the height dimension can be reduced.
  • the bottom portion 13 disposed at the center portion of the base plate 10 functions as a heat receiving portion thermally connected to the base plate 10, and extends from the center portion of the base plate 10 toward the peripheral portion.
  • the two extending straight portions 14 and 14 ′ are thermally connected to the radiation fins 12. Therefore, in the heat sink 1, from the central portion of the base plate 10 that overlaps the LED module 100 in a plan view, to the heat dissipating fins 12 that are provided on the outer peripheral portion and outside of the base plate 10 that do not overlap the LED module 100 in a plan view. Since the heat can be transported, the LED module 100 can be efficiently cooled.
  • the U-shaped heat pipe is provided with a stepped portion.
  • the U-shaped No step portion is provided on the heat pipe having the shape.
  • the straight portions 14 and 14 ′ of the U-shaped heat pipe 21 are in contact with the surface of the base plate 10 at a portion overlapping the base plate 10 in plan view. Therefore, among the plurality of heat radiating fins 12, the heat radiating fins 12 arranged at the portion overlapping the base plate 10 in plan view are thermally connected to the heat pipe 21 at the end of the base plate 10 side. It is in contact with the surface.
  • the bottom side portion 13 disposed in the center portion of the base plate 10 of the U-shaped heat pipe 21 functions as a heat receiving portion that is thermally connected to the base plate 10.
  • Two linear portions 14, 14 ′ extending in the direction of the portion are thermally connected to the radiation fins 12. Therefore, it is possible to efficiently transport heat from the central portion of the base plate 10 that overlaps the LED module (not shown) in plan view to the radiating fins 12 provided on the periphery and outside of the base plate 10, and efficiently cool the LED module. it can.
  • the heat sink 2 can also accommodate a power supply device or the like (not shown) in the space 15 so that the power supply device or the like can be prevented from receiving heat from the heat sink 2 and further reduce the height dimension. it can.
  • some of the plurality of heat radiating fins 12 are in contact with the surface of the base plate 10, so that the heat sink 2 is installed in a cold region and the heat pipe 21 Even when the working fluid is frozen, heat is transferred from the base plate 10 to the heat radiating fins 12 in contact with the surface of the base plate 10, so that the heat sink 2 can exhibit cooling performance.
  • the heat sink according to the first embodiment two U-shaped heat pipes 11 are provided. Instead, as shown in FIG. 6, the heat sink according to the third embodiment has a U-shape. Four shaped heat pipes are provided. In the heat sink 3 according to the third embodiment, adjacent to each U-shaped heat pipe 11 provided in the heat sink 1 according to the first embodiment, another heat pipe 31 having a U-shape is further provided. Are provided.
  • the width between the two straight portions 34 and 34 ′ of the other heat pipe 31 is wider than the width between the two straight portions 14 and 14 ′ of the heat pipe 11. Further, the two straight portions 34, 34 ′ of the other heat pipe 31 extend in parallel or substantially parallel to the two straight portions 14, 14 ′ of the heat pipe 11. In the heat sink 3, the two straight portions 14 and 14 ′ of the heat pipe 11 and the two straight portions 34 and 34 ′ of the other heat pipe 31 are attached to the common heat radiating fin 12.
  • the bottom 33 of the other heat pipe 31 is also thermally connected to the center of the surface of the base plate 10.
  • the longitudinal dimension of the bottom 33 of the other heat pipe 31 is larger than the longitudinal dimension of the bottom 13 of the heat pipe 11.
  • the bottom 33 of the other heat pipe 31 is disposed adjacent to the outside of the bottom 13 of the heat pipe 11 and parallel or substantially parallel to the bottom 13 of the heat pipe 11.
  • the other heat pipe 31 includes a stepped portion 36 between the bottom portion 33 and the straight portions 34 and 34 ′, similarly to the heat pipe 11.
  • the step portion 36 is a step in a direction opposite to the base plate 10 side. Accordingly, the straight portions 34 and 34 ′ of the other heat pipes 31 are not in contact with the base plate 10.
  • the LED module can be cooled more efficiently.
  • the heat sink 3 can also accommodate a power supply device or the like (not shown) in the space portion 15, the power supply device or the like can be prevented from receiving heat from the heat sink 3, and the height dimension can also be reduced. Can be reduced. Also, in the heat sink 3, some of the plurality of heat radiating fins 12 are in contact with the surface of the base plate 10, so that the heat sink 3 is installed in a cold region and the heat pipe 11 Even when the working fluid of the other heat pipes 31 is frozen, heat is transferred from the base plate 10 to the radiating fins 12 in contact with the surface of the base plate 10, so that the heat sink 3 can exhibit cooling performance.
  • the heat sink according to the fourth embodiment has an L-shape.
  • the L-shaped heat pipe 41 provided in the heat sink 4 according to the fourth embodiment includes a bottom portion 43 and one straight portion 44 extending from one end portion of the bottom portion 43.
  • the L-shaped heat pipe 41 includes a stepped portion 46 between the bottom portion 43 and the straight portion 44.
  • the step 46 is a step in the direction opposite to the base plate 10 side. Accordingly, the straight portion 44 is not in contact with the base plate 10.
  • each of the four L-shaped heat pipes 41 is disposed at the center of the base plate 10.
  • the straight portion 44 extends from the central portion of the surface of the base plate 10 toward the peripheral portion.
  • the two bottom portions 43 of the two L-shaped heat pipes 41 are adjacent to each other, and the linear portions 44 are opposed to each other so as to be parallel or substantially parallel to the longitudinal direction. , Combined in a U-shape. Accordingly, two U-shapes are formed from the four L-shaped heat pipes 41.
  • the radiation fins 12 and the L-shaped heat pipes 41 are arranged symmetrically with respect to the center of gravity (the center point of the surface of the base plate 10) in a plan view of the heat sink 4.
  • the heat sink 4 can also efficiently heat transport from the central portion of the base plate 10 overlapping the LED module 100 in plan view to the peripheral portion of the base plate 10 and the outer heat radiation fins 12, the LED module can be efficiently cooled.
  • the heat sink 4 can also accommodate a power supply device or the like (not shown) in the space portion 15, the power supply device or the like can be prevented from receiving heat from the heat sink 4, and the dimension in the height direction can also be prevented. Can be reduced. Also, in the heat sink 4, some of the plurality of heat radiating fins 12 are in contact with the surface of the base plate 10, so that the heat sink 4 is installed in a cold region, and an L-shaped heat is applied. Even when the working fluid of the pipe 41 is frozen, heat is transferred from the base plate 10 to the heat radiating fins 12 in contact with the surface of the base plate 10, so that the heat sink 4 can exhibit cooling performance.
  • the bottom portion of the U-shaped heat pipe is attached to the central portion of the surface of the base plate.
  • one of the two straight portions (one straight portion 14 and the other straight portion 14 ′) of the U-shaped heat pipe 51 (one straight portion in the figure). 14) is attached to the center of the surface of the base plate 10.
  • the U-shaped heat pipe 51 is thermally connected to the base plate 10 by attaching one straight portion 14 to the central portion of the surface of the base plate 10.
  • the other straight portion 14 ′ of the U-shaped heat pipe 51 is not in contact with the base plate 10 and extends parallel or substantially parallel to the surface of the base plate 10.
  • the plurality of heat radiation fins 12 By attaching the plurality of heat radiation fins 12 to the other straight portion 14 ′, the U-shaped heat pipe 51 and the heat radiation fins 12 are thermally connected. In the heat sink 5, all the radiation fins 12 are in contact with the surface of the base plate 10 at the end of the base plate 10 side.
  • the one straight line portion 14 and the other straight line portion 14 ′ extend from a predetermined end portion of the base plate 10 to an end portion facing the predetermined end portion.
  • the base 13 of the U-shaped heat pipe 51 is not in contact with the base plate 10 and is erected at a predetermined angle with respect to the surface of the base plate 10 at or near a predetermined end of the base plate 10. It is an aspect.
  • each U-shaped heat pipe 51 has one straight portion 14 arranged adjacently in parallel. Yes.
  • each U-shaped heat pipe 51 has its base 13 standing at different angles with respect to the surface of the base plate 10. Further, the base portions 13 of the U-shaped heat pipes 51 are arranged on substantially the same plane (on a plane in a substantially vertical direction with respect to the surface of the base plate 10).
  • the heat sink 5 can also be attached to the U-shaped heat pipe 51 so that the space 15 is formed in a region overlapping the LED module (not shown) in the plan view on the surface of the base plate 10.
  • the power supply device or the like By accommodating a power supply device or the like (not shown) in the space portion 15, the power supply device or the like can be prevented from receiving heat from the heat sink 5, and the height dimension can be reduced.
  • one straight line portion 14 and the other straight line portion 14 ′ extend from a predetermined end portion of the base plate 10 to an end portion facing the predetermined end portion. Since the heat can be efficiently transported from the central portion of the base plate 10 that overlaps the module (not shown) to the radiating fins 12 at the peripheral portion of the base plate 10, the LED module can be efficiently cooled. Moreover, in the heat sink 5, since all the radiation fins 12 are in contact with the surface of the base plate 10, the heat sink 5 is installed in a cold region and the working fluid of the U-shaped heat pipe 51 is frozen. However, since heat is transmitted from the base plate 10 to the radiation fins 12 that are in contact with the surface of the base plate 10, the heat sink 5 can exhibit cooling performance.
  • the bottom portion 13 of the U-shaped heat pipe 51 is in an aspect standing at a predetermined angle with respect to the surface of the base plate 10. Even if it is not provided, the other straight portion 14 ′ of the U-shaped heat pipe 51 can be attached to the central portion of the radiating fin 12 without extending the radiating fin 12 to the back side of the base plate 10.
  • the base portions 13 of the U-shaped heat pipes are all arranged on substantially the same plane, but instead, as shown in FIG.
  • a plurality of U-shaped heat pipes are provided and are arranged so that the bottom sides thereof face each other.
  • ten U-shaped heat pipes 61 (U-shaped heat pipe 61-1, U-shaped heat pipe 61-2) are provided, and the bottom of the U-shaped The portions 13 are arranged in a staggered pattern on the surface of the base plate 10. That is, among the ten U-shaped heat pipes 61, the five U-shaped heat pipes 61- are arranged so that the bottom side portion 13 is arranged at the right side peripheral portion on the surface of the base plate 10 in FIG. 1 is installed. In addition, five U-shaped heat pipes 61-2 other than the U-shaped heat pipe 61-1 are installed so that the bottom side portion 13 is disposed on the left peripheral edge on the surface of the base plate 10. Has been.
  • a U-shaped heat pipe 61-1 in which the base 13 is disposed on the right peripheral edge and a U-shaped heat pipe 61-2 in which the bottom 13 is disposed on the left peripheral edge are formed on the flat surface of the radiating fin 12. On the other hand, they are arranged alternately in the parallel direction.
  • each of the U-shaped heat pipes 61-1 in which the base 13 is disposed at the right peripheral edge the bases 13 are substantially on the same plane (a plane in a substantially vertical direction with respect to the surface of the base plate 10). (Above). Further, in each of the U-shaped heat pipes 61-2 in which the base 13 is arranged on the left peripheral edge, the bases 13 are substantially flush with each other (in a substantially vertical direction with respect to the surface of the base plate 10). On the plane).
  • the bottom portion 13 of the U-shaped heat pipe 61 has a mode in which it is erected in a substantially vertical direction with respect to the surface of the base plate 10.
  • the radiation fins 12 and the U-shaped heat pipe 61 are arranged symmetrically with respect to the center of gravity (the center point of the surface of the base plate 10) in a plan view of the heat sink 6. In the heat sink 6, all the radiation fins 12 are in contact with the surface of the base plate 10.
  • the radiation fins 12 can be arranged so as to form the space portion 15 in the region overlapping the LED module (not shown) in the plan view on the surface of the base plate 10. (Not shown) can prevent the power supply device and the like from receiving heat from the heat sink 6, and can further reduce the height dimension.
  • the heat sink 6 since all the radiation fins 12 are in contact with the surface of the base plate 10, even when the heat sink 6 is installed in a cold region and the working fluid of the U-shaped heat pipe 61 is frozen, the base plate Since heat is transferred from 10 to the heat radiating fins 12 in contact with the surface of the base plate 10, the heat sink 6 can exhibit cooling performance.
  • the bottom portion 13 of the U-shaped heat pipe 61 is in an aspect standing with respect to the surface of the base plate 10, so even if the U-shaped heat pipe 61 is not provided with a stepped portion, The U-shaped heat pipe 61 can be attached to the central portion of the radiating fin 12 without extending the radiating fin 12 to the back surface side of the base plate 10.
  • the base plate has a rectangular shape in plan view, but the shape is not particularly limited, and may be, for example, a circular shape, a polygonal shape of five or more polygons, a square shape, a long shape, or the like.
  • the LED module is thermally connected to the central portion on the back surface side of the base plate, but the LED module may also be thermally connected to the peripheral portion on the back surface side.
  • the heat sink of the present invention can prevent the appliance such as the power supply device from receiving the exhaust heat from the heat sink, can exhibit the cooling performance even when the working fluid of the heat pipe freezes in a cold region, and the height of the lighting fixture Since the dimension of the direction can be reduced, for example, the utility value is high in the field of cooling LED lighting installed in an environment where a ceiling or air conditioning does not work.

Abstract

The objective of the present invention is to provide a heatsink capable of preventing an apparatus such as a power source device from receiving waste heat from the heatsink, in addition, allowing the dimension in the height direction of a lighting apparatus to be reduced, and furthermore, having a cooling function even when the working fluid in the heat pipe is frozen and does not operate due to being installed in cold climates. This heatsink comprises: a base plate thermally connected to an LED module at the back surface side center portion thereof; a heat pipe provided on the front surface side of the base plate, whereof the heat-receiving portion is disposed at a position overlapping with the LED module in a planar view; and a plurality of flat plate-shaped radiator fins thermally connected to the heat pipe. None of the radiator fins are disposed at the position overlapping with the LED module in a planar view, and at least one among the plurality of the radiator fins is in contact with the base plate.

Description

ヒートシンクheatsink
　本発明は、天井等に設置される発光ダイオード（ＬＥＤ）素子を用いた照明を冷却する、ＬＥＤ用のヒートシンクに関するものである。 The present invention relates to a heat sink for an LED that cools illumination using a light emitting diode (LED) element installed on a ceiling or the like.
　天井等に設けられるＬＥＤ照明は、寿命や発光効率に熱の影響を受けやすいことから、許容範囲の温度に維持するよう、発光中は常に冷却することが必要である。ＬＥＤ照明の冷却には、ヒートシンクが用いられることがある。 Since the LED lighting provided on the ceiling or the like is easily affected by heat in the lifetime and light emission efficiency, it is necessary to always cool it during light emission so as to maintain the temperature within an allowable range. A heat sink may be used to cool the LED lighting.
　天井等に吊り下げられること等で設置されるＬＥＤ照明を冷却する従来のヒートシンクには、一般的に、その上面に電源装置が配置される。これは、上記ＬＥＤ照明の設置態様から、照明器具の重心が照明器具の中央部となるようにする必要があるためである。 A conventional heat sink that cools LED lighting installed by being suspended on a ceiling or the like generally has a power supply device disposed on the upper surface thereof. This is because the center of gravity of the lighting fixture needs to be the center of the lighting fixture from the LED lighting installation mode.
　しかし、ヒートシンクの上面に電源装置が配置された構造では、電源装置は、ヒートシンクからの排熱を受けて高温となり、電源装置の寿命が短縮してしまうという問題があった。また、ＬＥＤは、電源装置よりも長寿命なので、電源装置の寿命の短縮化に伴って、照明器具自体の寿命も短縮してしまうという問題があった。また、ヒートシンクの上面に電源装置が配置されるので、照明器具の高さ方向の寸法が増大してしまうという問題があった。 However, in the structure in which the power supply device is arranged on the upper surface of the heat sink, the power supply device is subjected to heat exhausted from the heat sink, resulting in a high temperature, which shortens the life of the power supply device. Further, since the LED has a longer life than the power supply device, there is a problem that the life of the lighting fixture itself is shortened as the life of the power supply device is shortened. Moreover, since the power supply device is disposed on the upper surface of the heat sink, there is a problem that the dimension in the height direction of the lighting fixture increases.
　そこで、電源装置と多数の放熱フィンの設けられた灯具の放熱部との間に遮熱部材を設置することで、放熱部で熱交換された熱気が遮断されて電源装置の温度上昇を抑制し、さらに、電源装置と灯具との距離を短くすることを可能として、照明器具の全体の高さを低くすることが提案されている（特許文献１）。しかし、特許文献１では、遮蔽部材は熱気とともに電源装置を冷却する空気の流れも妨げてしまうため、電源装置を十分に冷却することができない、すなわち、電源装置がやはり高温となってしまうという問題があった。また、特許文献１では、依然として、多数の放熱フィンからなる放熱部の上面に電源装置が配置されているので、照明器具の高さ方向の寸法を十分には低減できないという問題があった。 Therefore, by installing a heat shield member between the power supply unit and the heat radiating part of the lamp provided with a large number of radiating fins, the heat exchanged by the heat radiating part is blocked and the temperature rise of the power supply unit is suppressed. Furthermore, it has been proposed to reduce the overall height of the lighting fixture by enabling the distance between the power supply device and the lamp to be shortened (Patent Document 1). However, in Patent Document 1, since the shielding member hinders the flow of air that cools the power supply device together with hot air, the power supply device cannot be sufficiently cooled, that is, the power supply device is still at a high temperature. was there. Moreover, in patent document 1, since the power supply device is still arrange | positioned on the upper surface of the thermal radiation part which consists of many thermal radiation fins, there existed a problem that the dimension of the height direction of a lighting fixture could not fully be reduced.
特開２０１２－１２９１７２号公報JP 2012-129172 A
　上記事情に鑑み、本発明の目的は、電源装置等の器具がヒートシンクからの排熱を受けることを防止でき、また、照明器具の高さ方向の寸法を低減でき、さらに、寒冷地に設置されてヒートパイプの作動流体が凍結して動作しない場合でも、冷却機能を有するヒートシンクを提供することにある。 In view of the above circumstances, the object of the present invention is to prevent the appliance such as the power supply device from receiving heat exhausted from the heat sink, reduce the dimension in the height direction of the luminaire, and is installed in a cold region. Accordingly, it is an object of the present invention to provide a heat sink having a cooling function even when the working fluid of the heat pipe is frozen and does not operate.
　本発明の態様は、ＬＥＤモジュールと裏面側中央部において熱的に接続されるベースプレートと、前記ベースプレートの表面側に設けられ、平面視において前記ＬＥＤモジュールと重なり合う位置に受熱部が配置されたヒートパイプと、前記ヒートパイプと熱的に接続された、複数の平板状の放熱フィンと、を有するヒートシンクであって、前記ＬＥＤモジュールと平面視において重なり合う位置に前記放熱フィンは配置されておらず、複数の前記放熱フィンの少なくとも１つが、前記ベースプレートと接触しているヒートシンクである。 An aspect of the present invention is a heat pipe in which a heat receiving portion is disposed at a position where the LED module and a base plate that is thermally connected at the center portion on the back surface side are provided on the front surface side of the base plate and overlap with the LED module in plan view. And a plurality of flat plate-like heat radiation fins that are thermally connected to the heat pipe, wherein the heat radiation fins are not arranged at positions overlapping the LED module in plan view. At least one of the heat radiating fins is a heat sink in contact with the base plate.
　上記態様では、ベースプレートの表面のうち、平面視においてＬＥＤモジュールと重なり合う位置、すなわち、ベースプレート表面の中央部には、ヒートパイプ（ヒートパイプの受熱部）が配置されているが、放熱フィンは配置されていない。上記態様では、被冷却対象であるＬＥＤモジュールからの熱は、ベースプレートを厚さ方向に裏面から表面へ伝達され、さらに、ベースプレートの表面からヒートパイプ（ヒートパイプの受熱部）へ伝達される。ヒートパイプの受熱部へ伝達された熱は、ヒートパイプの受熱部から、放熱フィンが取り付けられた部位に対応するヒートパイプの放熱部へ輸送され、ヒートパイプの放熱部から放熱フィンを介して外部環境へ放出される。 In the above aspect, the heat pipe (heat receiving portion of the heat pipe) is arranged at the position overlapping the LED module in a plan view on the surface of the base plate, that is, at the center of the surface of the base plate, but the heat radiation fin is arranged. Not. In the above aspect, the heat from the LED module to be cooled is transmitted from the back surface to the front surface in the thickness direction of the base plate, and further transmitted from the surface of the base plate to the heat pipe (heat receiving portion of the heat pipe). The heat transferred to the heat pipe heat receiving part is transported from the heat pipe heat receiving part to the heat pipe heat radiating part corresponding to the part to which the heat radiating fins are attached, and from the heat pipe heat radiating part to the outside through the heat radiating fins. Released to the environment.
　また、上記態様では、ベースプレートの表面のうち、平面視においてＬＥＤモジュールと重なり合う位置（すなわち、中央部）には、放熱フィンが配置されていないので、ベースプレート表面の中央部は、放熱フィンによって仕切られた空間部となっている。なお、本明細書中、「平面視」とは、ヒートパイプと放熱フィンが設けられたベースプレートの表面に対向する側から視認した態様を意味する。 Moreover, in the said aspect, since the radiation fin is not arrange | positioned in the position (namely, center part) which overlaps with an LED module in planar view among the surfaces of a baseplate, the center part of the baseplate surface is partitioned off with a radiation fin. It has become a space part. In addition, in this specification, "plan view" means the aspect visually recognized from the side facing the surface of the base plate provided with the heat pipe and the heat radiating fin.
　本発明の態様は、前記ヒートパイプが、底辺部と該底辺部の両端部から延在する２つの直線部とからなるＵ字形状であり、前記底辺部が前記ベースプレートと熱的に接続された前記受熱部であり、２つの前記直線部に前記放熱フィンが熱的に接続されたヒートシンクである。 In an aspect of the present invention, the heat pipe has a U shape including a bottom portion and two straight portions extending from both ends of the bottom portion, and the bottom portion is thermally connected to the base plate. The heat receiving portion is a heat sink in which the radiating fin is thermally connected to the two straight portions.
　本発明の態様は、前記ヒートパイプが、底辺部と該底辺部の一方の端部から延在する１つの直線部とからなるＬ字形状であり、前記底辺部が前記ベースプレートと熱的に接続された前記受熱部であり、前記直線部に前記放熱フィンが熱的に接続されたヒートシンクである。 In an aspect of the present invention, the heat pipe has an L shape including a bottom portion and one straight portion extending from one end portion of the bottom portion, and the bottom portion is thermally connected to the base plate. The heat receiving portion is a heat sink in which the radiating fin is thermally connected to the straight portion.
　上記各態様では、Ｕ字形状またはＬ字形状のヒートパイプにおいて、放熱フィンが熱的に接続された直線部が、放熱部として機能する。 In each of the above aspects, in a U-shaped or L-shaped heat pipe, a straight portion to which the radiating fins are thermally connected functions as a radiating portion.
　本発明の態様は、前記ヒートパイプが複数設けられ、底辺部と該底辺部の両端部から延在する２つの直線部とからなるＵ字形状であり、前記底辺部が前記ベースプレートと熱的に接続された前記受熱部であり、２つの前記直線部に前記放熱フィンが熱的に接続されたヒートパイプと、底辺部と該底辺部の一方の端部から延在する１つの直線部とからなるＬ字形状であり、前記底辺部が前記ベースプレートと熱的に接続された前記受熱部であり、前記直線部に前記放熱フィンが熱的に接続されたヒートパイプと、を有するヒートシンクである。 An aspect of the present invention is a U-shape in which a plurality of the heat pipes are provided and includes a bottom portion and two straight portions extending from both ends of the bottom portion, and the bottom portion is thermally connected to the base plate. A heat pipe that is connected to the heat receiving portion, the heat radiating fin being thermally connected to the two straight portions, and a bottom portion and one straight portion that extends from one end of the bottom portion. The heat sink has an L shape, the bottom portion is the heat receiving portion thermally connected to the base plate, and the heat pipe has the heat radiation fin thermally connected to the linear portion.
　本発明の態様は、前記ヒートパイプが、前記底辺部と前記直線部との間に段差部を有するヒートシンクである。 An aspect of the present invention is a heat sink in which the heat pipe has a stepped portion between the bottom portion and the straight portion.
　本発明の態様は、前記ヒートパイプが、底辺部と該底辺部の両端部から延在する２つの直線部とからなるＵ字形状であり、２つの前記直線部の一方の直線部が、前記ベースプレートと熱的に接続された前記受熱部であり、２つの前記直線部の他方の直線部が、前記放熱フィンと熱的に接続されたヒートシンクである。上記態様では、２つの直線部のうち、放熱フィンが熱的に接続された他方の直線部が、放熱部として機能する。 In an aspect of the present invention, the heat pipe has a U shape including a bottom portion and two straight portions extending from both ends of the bottom portion, and one straight portion of the two straight portions is The heat receiving portion is thermally connected to a base plate, and the other straight portion of the two straight portions is a heat sink thermally connected to the radiating fin. In the said aspect, the other linear part to which the radiation fin was thermally connected among two linear parts functions as a thermal radiation part.
　本発明の態様は、前記放熱フィンの平面部が、前記ベースプレートの表面に対して鉛直方向に配置されたヒートシンクであって、前記ヒートシンクの重心を通過し且つ前記放熱フィンの平面部に対して平行方向の面に対して、対称に前記放熱フィン及び前記ヒートパイプが配置されているヒートシンクである。 An aspect of the present invention is a heat sink in which the planar portion of the heat radiating fin is disposed in a direction perpendicular to the surface of the base plate, and passes through the center of gravity of the heat sink and is parallel to the planar portion of the radiating fin. A heat sink in which the radiating fins and the heat pipes are arranged symmetrically with respect to a plane in the direction.
　本発明の態様は、前記放熱フィンの平面部が、前記ベースプレートの表面に対して鉛直方向に配置されたヒートシンクであって、前記ヒートシンクの平面視における重心に対して、点対称に前記放熱フィン及び前記ヒートパイプが配置されているヒートシンクである。 An aspect of the present invention is a heat sink in which the flat portion of the heat radiating fin is arranged in a vertical direction with respect to the surface of the base plate, and the heat radiating fin and the point of symmetry with respect to the center of gravity in a plan view of the heat sink. A heat sink in which the heat pipe is arranged.
　本発明の態様は、前記ＬＥＤモジュールと平面視において重なり合い、且つ前記放熱フィンと平面視において重なり合わない位置に、電源装置、電子部品、制御装置または照明器具の固定部材が収容されるヒートシンクである。 An aspect of the present invention is a heat sink in which a fixing member of a power supply device, an electronic component, a control device, or a lighting fixture is accommodated at a position that overlaps with the LED module in a plan view and does not overlap with the heat dissipation fin in a plan view. .
　上記態様では、放熱フィンによって仕切られた空間部に、電源装置、電子部品、制御装置または照明器具の固定部材を収容できる。 In the above aspect, the power supply device, the electronic component, the control device, or the fixing member of the lighting fixture can be accommodated in the space portion partitioned by the heat radiation fin.
　本発明の態様によれば、ベースプレートの表面の中央部は、放熱フィンによって仕切られた空間部となっているので、該空間部に電源装置等の器具を収容することで、電源装置等の器具がヒートシンクからの排熱を受けることを防止でき、ひいては、電源装置等の器具の高温化を防止できる。また、本発明の態様によれば、上記空間部に電源装置等の器具を収容できる、すなわち、ベースプレートと電源装置等の器具との間に放熱フィンが配置されていないので、照明器具の高さ方向の寸法を低減できる。 According to the aspect of the present invention, since the central portion of the surface of the base plate is a space portion partitioned by the heat radiating fins, the device such as the power supply device is accommodated in the space portion by accommodating the device such as the power supply device. Can be prevented from receiving heat exhausted from the heat sink, and thus the temperature of the appliance such as the power supply device can be prevented from being increased. In addition, according to the aspect of the present invention, a device such as a power supply device can be accommodated in the space portion, that is, since no radiation fins are disposed between the base plate and the device such as the power supply device, The direction dimension can be reduced.
　また、本発明の態様によれば、複数の放熱フィンの少なくとも１つがベースプレートと接触していることにより、寒冷地に設置されて、ヒートパイプに封入された作動流体が凍結して動作しない場合でも、ベースプレートから放熱フィンへ熱が伝達されるので、ヒートシンクは冷却性能を発揮できる。 Further, according to the aspect of the present invention, at least one of the plurality of radiating fins is in contact with the base plate, so that even when the working fluid enclosed in the heat pipe is frozen and does not operate due to contact with the base plate. Since heat is transferred from the base plate to the heat radiating fins, the heat sink can exhibit cooling performance.
　本発明の態様によれば、Ｕ字形状のヒートパイプのうち、底辺部がベースプレートと熱的に接続された受熱部であり、２つの直線部が放熱フィンと熱的に接続されることにより、平面視においてＬＥＤモジュールと重なり合うベースプレートの部位から平面視においてＬＥＤモジュールと重なり合わない放熱フィンへ、効率的に熱輸送できるので、ＬＥＤモジュールを効率的に冷却できる。 According to the aspect of the present invention, among the U-shaped heat pipes, the bottom part is a heat receiving part thermally connected to the base plate, and the two straight parts are thermally connected to the radiation fins, Since the heat can be efficiently transported from the portion of the base plate that overlaps with the LED module in plan view to the radiation fin that does not overlap with the LED module in plan view, the LED module can be efficiently cooled.
　本発明の態様によれば、Ｌ字形状のヒートパイプのうち、底辺部がベースプレートと熱的に接続された受熱部であり、直線部が放熱フィンと熱的に接続されることにより、平面視においてＬＥＤモジュールと重なり合うベースプレートの部位から平面視においてＬＥＤモジュールと重なり合わない放熱フィンへ、効率的に熱輸送できるので、ＬＥＤモジュールを効率的に冷却できる。 According to the aspect of the present invention, among the L-shaped heat pipes, the bottom portion is a heat receiving portion that is thermally connected to the base plate, and the straight portion is thermally connected to the radiating fins, thereby Since the heat can be efficiently transported from the portion of the base plate that overlaps with the LED module to the radiation fin that does not overlap with the LED module in plan view, the LED module can be efficiently cooled.
　本発明の態様によれば、ヒートパイプが底辺部と直線部との間に段差部を有することにより、ベースプレートの裏面側へ放熱フィンを延在させることなく、ヒートパイプを放熱フィンの中央部に取り付けることができるので、ベースプレートの形状、寸法の設計の自由度を向上させつつ、放熱フィンの放熱効率を向上させることができる。 According to the aspect of the present invention, the heat pipe has a step portion between the bottom portion and the straight portion, so that the heat pipe is extended to the center portion of the radiating fin without extending the radiating fin to the back surface side of the base plate. Since it can be attached, the heat radiation efficiency of the radiation fins can be improved while improving the degree of freedom in designing the shape and dimensions of the base plate.
　本発明の態様によれば、Ｕ字形状のヒートパイプのうち、一方の直線部がベースプレートと熱的に接続された受熱部であり、他方の直線部が放熱フィンと熱的に接続されることにより、平面視においてＬＥＤモジュールと重なり合うベースプレートの部位から平面視においてＬＥＤモジュールと重なり合わない放熱フィンへ、効率的に熱輸送できるので、ＬＥＤモジュールを効率的に冷却できる。 According to the aspect of the present invention, one straight portion of the U-shaped heat pipe is a heat receiving portion thermally connected to the base plate, and the other straight portion is thermally connected to the radiation fin. Thus, since the heat can be efficiently transported from the portion of the base plate that overlaps with the LED module in plan view to the heat radiation fin that does not overlap with the LED module in plan view, the LED module can be efficiently cooled.
本発明の第１実施形態例に係るヒートシンクの底面側からの斜視図である。It is a perspective view from the bottom face side of a heat sink concerning the example of a 1st embodiment of the present invention. 本発明の第１実施形態例に係るヒートシンクの説明図である。It is explanatory drawing of the heat sink which concerns on the example of 1st Embodiment of this invention. 本発明の第１実施形態例に係るヒートシンクの使用方法例の説明図である。It is explanatory drawing of the usage example of the heat sink which concerns on the example of 1st Embodiment of this invention. 本発明の第１実施形態例に係るヒートシンクの熱輸送の仕組みの説明図である。It is explanatory drawing of the mechanism of the heat transport of the heat sink which concerns on the example of 1st Embodiment of this invention. 本発明の第２実施形態例に係るヒートシンクの説明図である。It is explanatory drawing of the heat sink which concerns on the 2nd Example of this invention. 本発明の第３実施形態例に係るヒートシンクの説明図である。It is explanatory drawing of the heat sink which concerns on the example of 3rd Embodiment of this invention. 本発明の第４実施形態例に係るヒートシンクの説明図である。It is explanatory drawing of the heat sink which concerns on the example of 4th Embodiment of this invention. 本発明の第５実施形態例に係るヒートシンクの説明図である。It is explanatory drawing of the heat sink which concerns on the example of 5th Embodiment of this invention. 本発明の第６実施形態例に係るヒートシンクの説明図である。It is explanatory drawing of the heat sink which concerns on the 6th Example of this invention.
　以下に、本発明の第１実施形態例に係るヒートシンクについて、図面を用いながら説明する。図１、２に示すように、第１実施形態例に係るヒートシンク１は、受熱側の面（以下、「裏面」という場合がある。）でＬＥＤモジュール１００と熱的に接続される平板状のベースプレート１０（図では、平面視矩形状）と、ベースプレート１０の受熱側とは反対側の面（以下、「表面」という場合がある。）にてベースプレート１０に熱的に接続されたヒートパイプ１１と、ヒートパイプ１１と熱的に接続された、複数の平板状の放熱フィン１２とを備えている。 The heat sink according to the first embodiment of the present invention will be described below with reference to the drawings. As shown in FIGS. 1 and 2, the heat sink 1 according to the first embodiment is a flat plate that is thermally connected to the LED module 100 on the heat receiving side surface (hereinafter also referred to as “back surface”). A heat pipe 11 that is thermally connected to the base plate 10 at the base plate 10 (in the figure, rectangular in plan view) and a surface opposite to the heat receiving side of the base plate 10 (hereinafter also referred to as “surface”). And a plurality of plate-like heat radiation fins 12 thermally connected to the heat pipe 11.
　ヒートシンク１では、ヒートパイプ１１が複数（図では、２つ）設けられている。ヒートパイプ１１の形状、寸法は特に限定されないが、ヒートシンク１では、各ヒートパイプ１１は同一の形状、寸法であり、底辺部１３と底辺部１３の両端部から延在する２つの直線部１４、１４’とからなるＵ字形状となっている。底辺部１３がベースプレート１０表面と接することで、ヒートパイプ１１がベースプレート１０と熱的に接続されている。ヒートパイプ１１をベースプレート１０に熱的に接続する方法は特に限定されないが、ヒートシンク１では、ベースプレート１０表面に図示しない溝部を設け、該溝部にヒートパイプ１１の底辺部１３を嵌めることで、ヒートパイプ１１をベースプレート１０に熱的に接続している。よって、底辺部１３がヒートパイプ１１の受熱部として機能する。 In the heat sink 1, a plurality of heat pipes 11 (two in the figure) are provided. Although the shape and dimensions of the heat pipe 11 are not particularly limited, in the heat sink 1, each heat pipe 11 has the same shape and dimensions, and the two base portions 13 and two straight portions 14 extending from both ends of the base portion 13, It is U-shaped consisting of 14 '. The heat pipe 11 is thermally connected to the base plate 10 by the base 13 contacting the surface of the base plate 10. The method for thermally connecting the heat pipe 11 to the base plate 10 is not particularly limited. In the heat sink 1, a groove portion (not shown) is provided on the surface of the base plate 10, and the bottom portion 13 of the heat pipe 11 is fitted into the groove portion. 11 is thermally connected to the base plate 10. Therefore, the bottom part 13 functions as a heat receiving part of the heat pipe 11.
　各ヒートパイプ１１の底辺部１３は、ベースプレート１０表面の中央部と接している。また、ヒートシンク１では、各ヒートパイプ１１の底辺部１３は、相互に平行となるように並列に配置されている。 The bottom 13 of each heat pipe 11 is in contact with the center of the surface of the base plate 10. Moreover, in the heat sink 1, the base 13 of each heat pipe 11 is arrange | positioned in parallel so that it may become mutually parallel.
　ＬＥＤモジュール１００はベースプレート１０の裏面側中央部に熱的に接続されるので、平面視においてＬＥＤモジュール１００と重なり合う位置に、各ヒートパイプ１１の底辺部１３が配置されている。従って、ヒートパイプ１１の受熱部は、効率よくＬＥＤモジュール１００から受熱できる。 Since the LED module 100 is thermally connected to the central portion on the back surface side of the base plate 10, the base 13 of each heat pipe 11 is disposed at a position overlapping the LED module 100 in plan view. Therefore, the heat receiving portion of the heat pipe 11 can receive heat from the LED module 100 efficiently.
　各ヒートパイプ１１の２つの直線部１４、１４’は、ベースプレート１０表面の中央部から周縁部の方向へ延在している。また、２つの直線部１４、１４’は、いずれも、ベースプレート１０表面に対して平行または略平行に延在している。なお、ヒートシンク１では、各ヒートパイプ１１の２つの直線部１４、１４’は、ベースプレート１０端面の外側まで突出している。また、２つのヒートパイプ１１のうち、一方のヒートパイプ１１の２つの直線部１４、１４’は、他方のヒートパイプ１１の２つの直線部１４、１４’に対して、反対方向へ延在している。従って、２つのヒートパイプ１１は、ベースプレート１０表面の中央部に対し、相互に面対称の関係に配置されている。 The two straight portions 14 and 14 ′ of each heat pipe 11 extend from the center portion of the surface of the base plate 10 toward the peripheral portion. Further, the two straight portions 14 and 14 ′ both extend parallel or substantially parallel to the surface of the base plate 10. In the heat sink 1, the two straight portions 14 and 14 ′ of each heat pipe 11 protrude to the outside of the end surface of the base plate 10. Further, of the two heat pipes 11, the two straight portions 14 and 14 ′ of one heat pipe 11 extend in the opposite direction with respect to the two straight portions 14 and 14 ′ of the other heat pipe 11. ing. Accordingly, the two heat pipes 11 are arranged in a plane-symmetric relationship with respect to the central portion of the surface of the base plate 10.
　ヒートパイプ１１の２つの直線部１４、１４’に、複数の放熱フィン１２が取り付けられることで、ヒートパイプ１１が複数の放熱フィン１２と熱的に接続されている。ヒートシンク１では、２つの直線部１４、１４’は、共通の放熱フィン１２に取り付けられている。取り付け方法は特に限定されないが、ヒートシンク１では、各放熱フィン１２に図示しない２つの貫通孔が設けられており、該貫通孔にヒートパイプ１１の直線部１４、１４’を嵌挿することで、ヒートパイプ１１が放熱フィン１２と熱的に接続されている。よって、直線部１４、１４’のうち、放熱フィン１２の取り付けられた部位が、ヒートパイプ１１の放熱部として機能する。 The heat pipe 11 is thermally connected to the plurality of radiation fins 12 by attaching the plurality of radiation fins 12 to the two straight portions 14 and 14 ′ of the heat pipe 11. In the heat sink 1, the two straight portions 14 and 14 ′ are attached to the common heat radiation fin 12. Although the attachment method is not particularly limited, in the heat sink 1, each radiating fin 12 is provided with two through holes (not shown), and by inserting the straight portions 14 and 14 ′ of the heat pipe 11 into the through holes, The heat pipe 11 is thermally connected to the radiating fins 12. Therefore, a portion of the straight portions 14 and 14 ′ where the radiation fins 12 are attached functions as a heat radiation portion of the heat pipe 11.
　ヒートシンク１では、放熱フィン１２の平面部が、直線部１４、１４’の長手方向に対して直交または略直交するように、放熱フィン１２が取り付けられている。また、放熱フィン１２の平面部が、ベースプレート１０表面に対して鉛直または略鉛直方向に配置されている。また、それぞれの放熱フィン１２は、平面部が隣接する他の放熱フィン１２の平面部に対して平行または略平行となるように、直線部１４、１４’の長手方向に沿って、並列に配置されている。 In the heat sink 1, the radiating fins 12 are attached so that the plane portions of the radiating fins 12 are orthogonal or substantially orthogonal to the longitudinal directions of the straight portions 14 and 14 '. Further, the planar portion of the radiating fin 12 is arranged in a vertical or substantially vertical direction with respect to the surface of the base plate 10. In addition, the respective radiation fins 12 are arranged in parallel along the longitudinal direction of the straight portions 14 and 14 'so that the plane portions are parallel or substantially parallel to the plane portions of other adjacent radiation fins 12. Has been.
　ヒートパイプ１１は、底辺部１３と直線部１４、１４’との間に段差部１６を備えている。段差部１６は、ベースプレート１０側とは反対方向への段差となっている。つまり、直線部１４、１４’は、ベースプレート１０と接していない態様となっている。従って、ベースプレート１０の裏面側へ放熱フィン１２を延在させることなく、ヒートパイプ１１の直線部１４、１４’が放熱フィン１２の中央部に取り付けられている。よって、ヒートシンク１では、ベースプレート１０の形状、寸法の設計の自由度を向上させつつ、放熱フィン１２の放熱効率を向上させることができる。 The heat pipe 11 includes a step portion 16 between the bottom portion 13 and the straight portions 14 and 14 '. The step portion 16 is a step in the opposite direction to the base plate 10 side. That is, the straight portions 14 and 14 ′ are not in contact with the base plate 10. Accordingly, the straight portions 14 and 14 ′ of the heat pipe 11 are attached to the central portion of the heat radiating fin 12 without extending the heat radiating fin 12 to the back surface side of the base plate 10. Therefore, in the heat sink 1, the heat radiation efficiency of the radiation fins 12 can be improved while improving the degree of freedom in designing the shape and dimensions of the base plate 10.
　一方のヒートパイプ１１と他方のヒートパイプ１１とは、同じ寸法、形状の放熱フィン１２が、同じ枚数、同じ間隔で設けられているので、放熱フィン１２は、ベースプレート１０表面の中央部に対し、面対称の関係にて配置されている。上記のように、２つのヒートパイプ１１は、ベースプレート１０表面の中央部に対し、相互に面対称の関係に配置されているので、ヒートシンク１では、ヒートシンク１の重心を通過し且つ放熱フィン１２の平面部に対して平行方向の面に対して、対称に放熱フィン１２及びヒートパイプ１１が配置されている。 Since one heat pipe 11 and the other heat pipe 11 have the same size and shape of radiating fins 12 with the same number and the same interval, the radiating fins 12 are They are arranged in a plane symmetry relationship. As described above, since the two heat pipes 11 are arranged in a plane-symmetrical relationship with respect to the center portion of the surface of the base plate 10, the heat sink 1 passes through the center of gravity of the heat sink 1 and the radiating fins 12. The radiating fins 12 and the heat pipes 11 are arranged symmetrically with respect to the plane parallel to the plane portion.
　図１、２に示すように、ヒートシンク１では、ベースプレート１０表面の中央部には、放熱フィン１２が配置されないように、ヒートパイプ１１の直線部１４、１４’に放熱フィン１２が取り付けられている。放熱フィン１２は、ＬＥＤモジュール１００と平面視において重なり合う位置には設けられていない。すなわち、放熱フィン１２は、ベースプレート１０の周縁部とベースプレート１０の外側に配置されている。 As shown in FIGS. 1 and 2, in the heat sink 1, the radiating fins 12 are attached to the straight portions 14 and 14 ′ of the heat pipe 11 so that the radiating fins 12 are not arranged at the center of the surface of the base plate 10. . The heat radiating fins 12 are not provided at positions overlapping the LED module 100 in plan view. That is, the radiating fins 12 are disposed on the peripheral edge of the base plate 10 and on the outside of the base plate 10.
　上記から、ベースプレート１０の表面のうち、放熱フィン１２の配置されていない、平面視においてＬＥＤモジュール１００と重なり合う領域では、ベースプレート１０の表面上は、空間部１５となっている。 From the above, in the region of the surface of the base plate 10 where the radiation fins 12 are not disposed and overlapped with the LED module 100 in plan view, the surface of the base plate 10 is a space portion 15.
　また、複数の放熱フィン１２のうち、一部の放熱フィン１２は、ベースプレート１０の表面と接触した状態となっている。ヒートシンク１では、複数の放熱フィン１２のうち、平面視においてベースプレート１０と重なり合う領域、すなわち、ベースプレート１０の周縁部に配置された放熱フィン１２が、ベースプレート１０の表面と接触した状態となっている。 Further, among the plurality of heat radiation fins 12, some of the heat radiation fins 12 are in contact with the surface of the base plate 10. In the heat sink 1, a region of the plurality of heat radiating fins 12 that overlaps the base plate 10 in a plan view, that is, the heat radiating fins 12 arranged at the peripheral edge of the base plate 10 is in contact with the surface of the base plate 10.
　従って、ヒートシンク１が寒冷地に設置されて、ヒートパイプ１１に封入された作動流体が凍結して動作しない場合でも、ベースプレート１０からベースプレート１０の表面と接触した放熱フィン１２へ熱が伝達されるので、ヒートシンク１は冷却性能を発揮できる。よって、ヒートシンク１が寒冷地で使用されても、ヒートシンク１の冷却性能の低下を抑制できる。 Therefore, even when the heat sink 1 is installed in a cold region and the working fluid enclosed in the heat pipe 11 freezes and does not operate, heat is transferred from the base plate 10 to the heat radiating fins 12 that are in contact with the surface of the base plate 10. The heat sink 1 can exhibit cooling performance. Therefore, even if the heat sink 1 is used in a cold region, it is possible to suppress a decrease in the cooling performance of the heat sink 1.
　ベースプレート１０及び放熱フィン１２の材料は、いずれも熱伝導性のよい金属であり、例えば、アルミニウム、アルミニウム合金、銅、銅合金などで製造されている。ヒートパイプ１１のコンテナの材料としては、例えば、銅、銅合金、アルミニウム、アルミニウム合金、ステンレス等を挙げることができ、ヒートパイプ１１のコンテナに封入される作動流体としては、コンテナの材料との適合性に応じて、適宜選択可能であり、例えば、水、代替フロン、パーフルオロカーボン、シクロペンタン等を挙げることができる。 The materials of the base plate 10 and the heat radiating fins 12 are all metals having good thermal conductivity, and are made of, for example, aluminum, aluminum alloy, copper, copper alloy or the like. Examples of the material of the heat pipe 11 container include copper, copper alloy, aluminum, aluminum alloy, and stainless steel. The working fluid sealed in the heat pipe 11 container is compatible with the container material. Depending on the nature, it can be appropriately selected, and examples thereof include water, alternative chlorofluorocarbon, perfluorocarbon, and cyclopentane.
　次に、本発明の第１実施形態例に係るヒートシンク１の使用方法例について、図面を用いて説明する。図３、４に示すように、ヒートシンク１では、空間部１５に、電源装置、電子部品、制御装置または照明器具の固定部材等（図３、４では、電源装置１０１）を収容することができる。一方で、図４に示すように、ＬＥＤモジュール１００からの熱Ｈは、まず、ベースプレート１０中央部へ伝達され、さらに、ベースプレート１０中央部からヒートパイプ１１（ヒートパイプ１１の受熱部）へ伝達され、ヒートパイプ１１の受熱部から、放熱フィン１２が取り付けられた部位に対応するヒートパイプ１１の放熱部へ輸送され、ヒートパイプ１１の放熱部から放熱フィン１２を介して外部環境へ放出される。 Next, an example of how to use the heat sink 1 according to the first embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 3 and 4, in the heat sink 1, a power supply device, an electronic component, a control device, a fixing member for a lighting fixture, or the like (power supply device 101 in FIGS. 3 and 4) can be accommodated in the space portion 15. . On the other hand, as shown in FIG. 4, the heat H from the LED module 100 is first transmitted to the central portion of the base plate 10, and further transmitted from the central portion of the base plate 10 to the heat pipe 11 (heat receiving portion of the heat pipe 11). The heat pipe 11 is transported from the heat receiving portion of the heat pipe 11 to the heat radiating portion of the heat pipe 11 corresponding to the portion where the heat radiating fins 12 are attached, and is released from the heat radiating portion of the heat pipe 11 to the external environment via the heat radiating fins 12.
　従って、図４に示すように、電源装置１０１がヒートシンク１からの熱Ｈを受けることを防止でき、ひいては、電源装置１０１の高温化を防止できる。よって、熱Ｈを受けることによる電源装置１０１の寿命の短縮化を防止でき、結果、照明器具自体の寿命の短縮化を防止できる。また、ヒートシンク１では、空間部１５に電源装置１０１を収容でき、ベースプレート１０と電源装置１０１との間には、放熱フィン１２が配置されていないので、高さ方向の寸法を低減できる。 Therefore, as shown in FIG. 4, the power supply device 101 can be prevented from receiving the heat H from the heat sink 1, and hence the power supply device 101 can be prevented from being heated. Therefore, shortening of the life of the power supply device 101 due to receiving the heat H can be prevented, and as a result, shortening of the life of the lighting fixture itself can be prevented. Further, in the heat sink 1, the power supply device 101 can be accommodated in the space portion 15, and the heat radiation fins 12 are not disposed between the base plate 10 and the power supply device 101, so that the height dimension can be reduced.
　Ｕ字形状のヒートパイプ１１のうち、ベースプレート１０の中央部に配置された底辺部１３が、ベースプレート１０と熱的に接続された受熱部として機能し、ベースプレート１０の中央部から周縁部の方向へ延在している２つの直線部１４、１４’が、放熱フィン１２と熱的に接続される。よって、ヒートシンク１では、平面視においてＬＥＤモジュール１００と重なり合うベースプレート１０の中央部から平面視においてＬＥＤモジュール１００と重なり合わない、ベースプレート１０の周縁部と外側に設けられた放熱フィン１２へ、効率的に熱輸送できるので、ＬＥＤモジュール１００を効率的に冷却できる。 Of the U-shaped heat pipe 11, the bottom portion 13 disposed at the center portion of the base plate 10 functions as a heat receiving portion thermally connected to the base plate 10, and extends from the center portion of the base plate 10 toward the peripheral portion. The two extending straight portions 14 and 14 ′ are thermally connected to the radiation fins 12. Therefore, in the heat sink 1, from the central portion of the base plate 10 that overlaps the LED module 100 in a plan view, to the heat dissipating fins 12 that are provided on the outer peripheral portion and outside of the base plate 10 that do not overlap the LED module 100 in a plan view. Since the heat can be transported, the LED module 100 can be efficiently cooled.
　次に、本発明の第２実施形態例に係るヒートシンクについて、図面を用いながら説明する。なお、第１実施形態例に係るヒートシンクと同じ構成要素については、同じ符号を用いて説明する。 Next, a heat sink according to a second embodiment of the present invention will be described with reference to the drawings. The same components as those of the heat sink according to the first embodiment will be described using the same reference numerals.
　第１実施形態例に係るヒートシンクでは、Ｕ字形状のヒートパイプに段差部が設けられていたが、これに代えて、図５に示すように、第２実施形態例に係るヒートシンクでは、Ｕ字形状のヒートパイプに段差部が設けられていない。第２実施形態例に係るヒートシンク２では、Ｕ字形状のヒートパイプ２１の直線部１４、１４’は、平面視においてベースプレート１０と重なり合う部位にて、ベースプレート１０表面と接した態様となっている。従って、複数の放熱フィン１２のうち、平面視においてベースプレート１０と重なり合う部位に配置された放熱フィン１２は、そのベースプレート１０側端部にて、ヒートパイプ２１と熱的に接続され、さらに、ベースプレート１０表面と接している。 In the heat sink according to the first embodiment, the U-shaped heat pipe is provided with a stepped portion. Instead, as shown in FIG. 5, in the heat sink according to the second embodiment, the U-shaped No step portion is provided on the heat pipe having the shape. In the heat sink 2 according to the second embodiment, the straight portions 14 and 14 ′ of the U-shaped heat pipe 21 are in contact with the surface of the base plate 10 at a portion overlapping the base plate 10 in plan view. Therefore, among the plurality of heat radiating fins 12, the heat radiating fins 12 arranged at the portion overlapping the base plate 10 in plan view are thermally connected to the heat pipe 21 at the end of the base plate 10 side. It is in contact with the surface.
　ヒートシンク２でも、Ｕ字形状のヒートパイプ２１のうち、ベースプレート１０の中央部に配置された底辺部１３が、ベースプレート１０と熱的に接続された受熱部として機能し、ベースプレート１０の中央部から周縁部の方向へ延在している２つの直線部１４、１４’が、放熱フィン１２と熱的に接続されている。よって、平面視においてＬＥＤモジュール（図示せず）と重なり合うベースプレート１０の中央部からベースプレート１０の周縁部及び外側に設けられた放熱フィン１２へ、効率的に熱輸送でき、ＬＥＤモジュールを効率的に冷却できる。 Also in the heat sink 2, the bottom side portion 13 disposed in the center portion of the base plate 10 of the U-shaped heat pipe 21 functions as a heat receiving portion that is thermally connected to the base plate 10. Two linear portions 14, 14 ′ extending in the direction of the portion are thermally connected to the radiation fins 12. Therefore, it is possible to efficiently transport heat from the central portion of the base plate 10 that overlaps the LED module (not shown) in plan view to the radiating fins 12 provided on the periphery and outside of the base plate 10, and efficiently cool the LED module. it can.
　ヒートシンク２でも、空間部１５に、電源装置等（図示せず）を収容することができるので、電源装置等がヒートシンク２からの熱を受けることを防止でき、さらに、高さ方向の寸法を低減できる。また、ヒートシンク２でも、複数の放熱フィン１２のうち、一部の放熱フィン１２は、ベースプレート１０の表面と接触した状態となっているので、ヒートシンク２が寒冷地に設置されて、ヒートパイプ２１の作動流体が凍結した場合でも、ベースプレート１０からベースプレート１０の表面と接触した放熱フィン１２へ熱が伝達されるので、ヒートシンク２は冷却性能を発揮できる。 The heat sink 2 can also accommodate a power supply device or the like (not shown) in the space 15 so that the power supply device or the like can be prevented from receiving heat from the heat sink 2 and further reduce the height dimension. it can. In the heat sink 2 as well, some of the plurality of heat radiating fins 12 are in contact with the surface of the base plate 10, so that the heat sink 2 is installed in a cold region and the heat pipe 21 Even when the working fluid is frozen, heat is transferred from the base plate 10 to the heat radiating fins 12 in contact with the surface of the base plate 10, so that the heat sink 2 can exhibit cooling performance.
　次に、本発明の第３実施形態例に係るヒートシンクについて、図面を用いながら説明する。なお、第１、第２実施形態例に係るヒートシンクと同じ構成要素については、同じ符号を用いて説明する。 Next, a heat sink according to a third embodiment of the present invention will be described with reference to the drawings. The same constituent elements as those of the heat sink according to the first and second embodiments will be described using the same reference numerals.
　第１実施形態例に係るヒートシンクでは、Ｕ字形状のヒートパイプ１１が２つ設けられていたが、これに代えて、図６に示すように、第３実施形態例に係るヒートシンクでは、Ｕ字形状のヒートパイプが４つ設けられている。第３実施形態例に係るヒートシンク３では、第１実施形態例に係るヒートシンク１に設けられた、それぞれのＵ字形状のヒートパイプ１１に隣接して、さらに、Ｕ字形状の他のヒートパイプ３１が２つ設けられている。 In the heat sink according to the first embodiment, two U-shaped heat pipes 11 are provided. Instead, as shown in FIG. 6, the heat sink according to the third embodiment has a U-shape. Four shaped heat pipes are provided. In the heat sink 3 according to the third embodiment, adjacent to each U-shaped heat pipe 11 provided in the heat sink 1 according to the first embodiment, another heat pipe 31 having a U-shape is further provided. Are provided.
　他のヒートパイプ３１の２つの直線部３４、３４’間の幅は、ヒートパイプ１１の２つの直線部１４、１４’間の幅よりも広くなっている。また、他のヒートパイプ３１の２つの直線部３４、３４’は、ヒートパイプ１１の２つの直線部１４、１４’に対して平行または略平行に延在している。ヒートシンク３では、ヒートパイプ１１の２つの直線部１４、１４’と他のヒートパイプ３１の２つの直線部３４、３４’は、共通の放熱フィン１２に取り付けられている。 The width between the two straight portions 34 and 34 ′ of the other heat pipe 31 is wider than the width between the two straight portions 14 and 14 ′ of the heat pipe 11. Further, the two straight portions 34, 34 ′ of the other heat pipe 31 extend in parallel or substantially parallel to the two straight portions 14, 14 ′ of the heat pipe 11. In the heat sink 3, the two straight portions 14 and 14 ′ of the heat pipe 11 and the two straight portions 34 and 34 ′ of the other heat pipe 31 are attached to the common heat radiating fin 12.
　ヒートシンク３では、他のヒートパイプ３１の底辺部３３も、ベースプレート１０表面の中央部と熱的に接続されている。他のヒートパイプ３１の底辺部３３の長手方向の寸法は、ヒートパイプ１１の底辺部１３の長手方向の寸法よりも大きくなっている。また、他のヒートパイプ３１の底辺部３３は、ヒートパイプ１１の底辺部１３の外側に隣接して、ヒートパイプ１１の底辺部１３に対して平行または略平行に配置されている。 In the heat sink 3, the bottom 33 of the other heat pipe 31 is also thermally connected to the center of the surface of the base plate 10. The longitudinal dimension of the bottom 33 of the other heat pipe 31 is larger than the longitudinal dimension of the bottom 13 of the heat pipe 11. In addition, the bottom 33 of the other heat pipe 31 is disposed adjacent to the outside of the bottom 13 of the heat pipe 11 and parallel or substantially parallel to the bottom 13 of the heat pipe 11.
　他のヒートパイプ３１は、ヒートパイプ１１と同様に、底辺部３３と直線部３４、３４’との間に段差部３６を備えている。段差部３６は、ベースプレート１０側とは反対方向への段差となっている。従って、他のヒートパイプ３１の直線部３４、３４’は、ベースプレート１０と接していない態様となっている。 The other heat pipe 31 includes a stepped portion 36 between the bottom portion 33 and the straight portions 34 and 34 ′, similarly to the heat pipe 11. The step portion 36 is a step in a direction opposite to the base plate 10 side. Accordingly, the straight portions 34 and 34 ′ of the other heat pipes 31 are not in contact with the base plate 10.
　ヒートシンク３では、ヒートパイプ１１に加えて、さらに、他のヒートパイプ３１が設けられているので、ベースプレート１０の中央部からベースプレート１０の周縁部及び外側の放熱フィン１２へ、熱輸送特性がさらに向上するので、さらに効率的にＬＥＤモジュールを冷却できる。 In the heat sink 3, in addition to the heat pipe 11, another heat pipe 31 is further provided, so that the heat transport characteristic is further improved from the center portion of the base plate 10 to the peripheral edge portion of the base plate 10 and the heat radiating fins 12 on the outside. Therefore, the LED module can be cooled more efficiently.
　また、ヒートシンク３でも、空間部１５に、電源装置等（図示せず）を収容することができるので、電源装置等がヒートシンク３からの熱を受けることを防止でき、さらに、高さ方向の寸法を低減できる。また、ヒートシンク３でも、複数の放熱フィン１２のうち、一部の放熱フィン１２は、ベースプレート１０の表面と接触した状態となっているので、ヒートシンク３が寒冷地に設置されて、ヒートパイプ１１と他のヒートパイプ３１の作動流体が凍結した場合でも、ベースプレート１０からベースプレート１０の表面と接触した放熱フィン１２へ熱が伝達されるので、ヒートシンク３は冷却性能を発揮できる。 Further, since the heat sink 3 can also accommodate a power supply device or the like (not shown) in the space portion 15, the power supply device or the like can be prevented from receiving heat from the heat sink 3, and the height dimension can also be reduced. Can be reduced. Also, in the heat sink 3, some of the plurality of heat radiating fins 12 are in contact with the surface of the base plate 10, so that the heat sink 3 is installed in a cold region and the heat pipe 11 Even when the working fluid of the other heat pipes 31 is frozen, heat is transferred from the base plate 10 to the radiating fins 12 in contact with the surface of the base plate 10, so that the heat sink 3 can exhibit cooling performance.
　次に、本発明の第４実施形態例に係るヒートシンクについて、図面を用いながら説明する。なお、第１～第３実施形態例に係るヒートシンクと同じ構成要素については、同じ符号を用いて説明する。 Next, a heat sink according to a fourth embodiment of the present invention will be described with reference to the drawings. The same components as those of the heat sinks according to the first to third embodiments will be described using the same reference numerals.
　第１実施形態例に係るヒートシンクでは、Ｕ字形状のヒートパイプが２つ設けられていたが、これに代えて、図７に示すように、第４実施形態例に係るヒートシンクでは、Ｌ字状ヒートパイプが４つ設けられている。第４実施形態例に係るヒートシンク４で設けられたＬ字状ヒートパイプ４１は、底辺部４３と底辺部４３の一方の端部から延在する１つの直線部４４とからなる。Ｌ字状ヒートパイプ４１は、底辺部４３と直線部４４との間に段差部４６を備えている。段差部４６は、ベースプレート１０側とは反対方向への段差となっている。従って、直線部４４は、ベースプレート１０と接していない態様となっている。 In the heat sink according to the first embodiment, two U-shaped heat pipes are provided. Instead, as shown in FIG. 7, the heat sink according to the fourth embodiment has an L-shape. Four heat pipes are provided. The L-shaped heat pipe 41 provided in the heat sink 4 according to the fourth embodiment includes a bottom portion 43 and one straight portion 44 extending from one end portion of the bottom portion 43. The L-shaped heat pipe 41 includes a stepped portion 46 between the bottom portion 43 and the straight portion 44. The step 46 is a step in the direction opposite to the base plate 10 side. Accordingly, the straight portion 44 is not in contact with the base plate 10.
　ヒートシンク４では、４つのＬ字状ヒートパイプ４１は、いずれも、底辺部４３がベースプレート１０の中央部に配置されている。また、４つのＬ字状ヒートパイプ４１は、いずれも、直線部４４は、ベースプレート１０表面の中央部から周縁部の方向へ延在している。 In the heat sink 4, the bottom side 43 of each of the four L-shaped heat pipes 41 is disposed at the center of the base plate 10. In each of the four L-shaped heat pipes 41, the straight portion 44 extends from the central portion of the surface of the base plate 10 toward the peripheral portion.
　ヒートシンク４では、２つのＬ字状ヒートパイプ４１について、相互の底辺部４３が隣接し、相互の直線部４４が、対向し、その長手方向に平行または略平行となるように配置されることで、Ｕ字形状に組み合わされている。従って、４つのＬ字状ヒートパイプ４１から、２つのＵ字形状が形成されている。また、ヒートシンク４では、ヒートシンク４の平面視における重心（ベースプレート１０表面の中心点）に対して、点対称に放熱フィン１２及びＬ字状ヒートパイプ４１が配置されている。 In the heat sink 4, the two bottom portions 43 of the two L-shaped heat pipes 41 are adjacent to each other, and the linear portions 44 are opposed to each other so as to be parallel or substantially parallel to the longitudinal direction. , Combined in a U-shape. Accordingly, two U-shapes are formed from the four L-shaped heat pipes 41. In the heat sink 4, the radiation fins 12 and the L-shaped heat pipes 41 are arranged symmetrically with respect to the center of gravity (the center point of the surface of the base plate 10) in a plan view of the heat sink 4.
　ヒートシンク４でも、平面視においてＬＥＤモジュール１００と重なり合うベースプレート１０の中央部からベースプレート１０の周縁部及び外側の放熱フィン１２へ効率的に熱輸送できるので、ＬＥＤモジュールを効率的に冷却できる。 Since the heat sink 4 can also efficiently heat transport from the central portion of the base plate 10 overlapping the LED module 100 in plan view to the peripheral portion of the base plate 10 and the outer heat radiation fins 12, the LED module can be efficiently cooled.
　また、ヒートシンク４でも、空間部１５に、電源装置等（図示せず）を収容することができるので、電源装置等がヒートシンク４からの熱を受けることを防止でき、さらに、高さ方向の寸法を低減できる。また、ヒートシンク４でも、複数の放熱フィン１２のうち、一部の放熱フィン１２は、ベースプレート１０の表面と接触した状態となっているので、ヒートシンク４が寒冷地に設置されて、Ｌ字状ヒートパイプ４１の作動流体が凍結した場合でも、ベースプレート１０からベースプレート１０の表面と接触した放熱フィン１２へ熱が伝達されるので、ヒートシンク４は冷却性能を発揮できる。 Further, since the heat sink 4 can also accommodate a power supply device or the like (not shown) in the space portion 15, the power supply device or the like can be prevented from receiving heat from the heat sink 4, and the dimension in the height direction can also be prevented. Can be reduced. Also, in the heat sink 4, some of the plurality of heat radiating fins 12 are in contact with the surface of the base plate 10, so that the heat sink 4 is installed in a cold region, and an L-shaped heat is applied. Even when the working fluid of the pipe 41 is frozen, heat is transferred from the base plate 10 to the heat radiating fins 12 in contact with the surface of the base plate 10, so that the heat sink 4 can exhibit cooling performance.
　次に、本発明の第５実施形態例に係るヒートシンクについて、図面を用いながら説明する。なお、第１～第４実施形態例に係るヒートシンクと同じ構成要素については、同じ符号を用いて説明する。 Next, a heat sink according to a fifth embodiment of the present invention will be described with reference to the drawings. The same components as those of the heat sinks according to the first to fourth embodiments will be described using the same reference numerals.
　第１～第３実施形態例に係るヒートシンクでは、Ｕ字形状のヒートパイプは、その底辺部が、ベースプレート表面の中央部に取り付けられていたが、これに代えて、図８に示すように、第５実施形態例に係るヒートシンク５では、Ｕ字形状のヒートパイプ５１の２つの直線部（一方の直線部１４と他方の直線部１４’）のうちの一つ（図では、一方の直線部１４）が、ベースプレート１０表面の中央部に取り付けられている。 In the heat sinks according to the first to third embodiments, the bottom portion of the U-shaped heat pipe is attached to the central portion of the surface of the base plate. Instead, as shown in FIG. In the heat sink 5 according to the fifth embodiment, one of the two straight portions (one straight portion 14 and the other straight portion 14 ′) of the U-shaped heat pipe 51 (one straight portion in the figure). 14) is attached to the center of the surface of the base plate 10.
　Ｕ字形状のヒートパイプ５１は、一方の直線部１４が、ベースプレート１０表面の中央部に取り付けられることで、ベースプレート１０と熱的に接続されている。ヒートシンク５では、Ｕ字形状のヒートパイプ５１の他方の直線部１４’は、ベースプレート１０とは接しておらず、ベースプレート１０表面に対し平行または略平行に延在している。他方の直線部１４’に複数の放熱フィン１２が取り付けられることで、Ｕ字形状のヒートパイプ５１と放熱フィン１２が熱的に接続されている。なお、ヒートシンク５では、全ての放熱フィン１２が、そのベースプレート１０側端部にて、ベースプレート１０表面と接触した態様となっている。 The U-shaped heat pipe 51 is thermally connected to the base plate 10 by attaching one straight portion 14 to the central portion of the surface of the base plate 10. In the heat sink 5, the other straight portion 14 ′ of the U-shaped heat pipe 51 is not in contact with the base plate 10 and extends parallel or substantially parallel to the surface of the base plate 10. By attaching the plurality of heat radiation fins 12 to the other straight portion 14 ′, the U-shaped heat pipe 51 and the heat radiation fins 12 are thermally connected. In the heat sink 5, all the radiation fins 12 are in contact with the surface of the base plate 10 at the end of the base plate 10 side.
　一方の直線部１４と他方の直線部１４’は、ベースプレート１０の所定の端部から該所定の端部と対向する端部まで延在している。Ｕ字形状のヒートパイプ５１の底辺部１３は、ベースプレート１０とは接しておらず、ベースプレート１０の所定の端部またはその近傍にて、ベースプレート１０表面に対して、所定の角度にて立設した態様となっている。 The one straight line portion 14 and the other straight line portion 14 ′ extend from a predetermined end portion of the base plate 10 to an end portion facing the predetermined end portion. The base 13 of the U-shaped heat pipe 51 is not in contact with the base plate 10 and is erected at a predetermined angle with respect to the surface of the base plate 10 at or near a predetermined end of the base plate 10. It is an aspect.
　ヒートシンク５では、複数（図では４つ）のＵ字形状のヒートパイプ５１が設けられ、それぞれのＵ字形状のヒートパイプ５１は、その一方の直線部１４が、隣接して並列に配置されている。また、それぞれのＵ字形状のヒートパイプ５１は、その底辺部１３が、ベースプレート１０表面に対して、相互に異なる角度で立設されている。また、Ｕ字形状のヒートパイプ５１は、いずれも、その底辺部１３が、相互に、略同一平面上（ベースプレート１０表面に対して略鉛直方向の平面上）に配置されている。 In the heat sink 5, a plurality (four in the figure) of U-shaped heat pipes 51 are provided, and each U-shaped heat pipe 51 has one straight portion 14 arranged adjacently in parallel. Yes. In addition, each U-shaped heat pipe 51 has its base 13 standing at different angles with respect to the surface of the base plate 10. Further, the base portions 13 of the U-shaped heat pipes 51 are arranged on substantially the same plane (on a plane in a substantially vertical direction with respect to the surface of the base plate 10).
　ヒートシンク５でも、ベースプレート１０表面のうち、平面視においてＬＥＤモジュール（図示せず）と重なり合う領域に空間部１５を形成するように、放熱フィン１２をＵ字形状のヒートパイプ５１に取り付けることができるので、空間部１５に電源装置等（図示せず）を収容することで、電源装置等がヒートシンク５からの熱を受けることを防止でき、さらに、高さ方向の寸法を低減できる。 Since the heat sink 5 can also be attached to the U-shaped heat pipe 51 so that the space 15 is formed in a region overlapping the LED module (not shown) in the plan view on the surface of the base plate 10. By accommodating a power supply device or the like (not shown) in the space portion 15, the power supply device or the like can be prevented from receiving heat from the heat sink 5, and the height dimension can be reduced.
　また、ヒートシンク５では、一方の直線部１４と他方の直線部１４’は、ベースプレート１０の所定の端部から該所定の端部と対向する端部まで延在しているので、平面視においてＬＥＤモジュール（図示せず）と重なり合うベースプレート１０の中央部からベースプレート１０周縁部の放熱フィン１２へ効率的に熱輸送できるので、ＬＥＤモジュールを効率的に冷却できる。また、ヒートシンク５では、全ての放熱フィン１２がベースプレート１０の表面と接触した状態となっているので、ヒートシンク５が寒冷地に設置されて、Ｕ字形状のヒートパイプ５１の作動流体が凍結した場合でも、ベースプレート１０からベースプレート１０の表面と接触した放熱フィン１２へ熱が伝達されるので、ヒートシンク５は冷却性能を発揮できる。 Further, in the heat sink 5, one straight line portion 14 and the other straight line portion 14 ′ extend from a predetermined end portion of the base plate 10 to an end portion facing the predetermined end portion. Since the heat can be efficiently transported from the central portion of the base plate 10 that overlaps the module (not shown) to the radiating fins 12 at the peripheral portion of the base plate 10, the LED module can be efficiently cooled. Moreover, in the heat sink 5, since all the radiation fins 12 are in contact with the surface of the base plate 10, the heat sink 5 is installed in a cold region and the working fluid of the U-shaped heat pipe 51 is frozen. However, since heat is transmitted from the base plate 10 to the radiation fins 12 that are in contact with the surface of the base plate 10, the heat sink 5 can exhibit cooling performance.
　さらに、ヒートシンク５では、Ｕ字形状のヒートパイプ５１の底辺部１３は、ベースプレート１０表面に対して所定の角度にて立設した態様となっているので、Ｕ字形状のヒートパイプ５１に段差部を設けなくても、ベースプレート１０の裏面側へ放熱フィン１２を延在させることなく、Ｕ字形状のヒートパイプ５１の他方の直線部１４’を放熱フィン１２の中央部に取り付けることができる。 Further, in the heat sink 5, the bottom portion 13 of the U-shaped heat pipe 51 is in an aspect standing at a predetermined angle with respect to the surface of the base plate 10. Even if it is not provided, the other straight portion 14 ′ of the U-shaped heat pipe 51 can be attached to the central portion of the radiating fin 12 without extending the radiating fin 12 to the back side of the base plate 10.
　次に、本発明の第６実施形態例に係るヒートシンクについて、図面を用いながら説明する。なお、第１～第５実施形態例に係るヒートシンクと同じ構成要素については、同じ符号を用いて説明する。 Next, a heat sink according to a sixth embodiment of the present invention will be described with reference to the drawings. The same components as those of the heat sinks according to the first to fifth embodiments will be described using the same reference numerals.
　第５実施形態例に係るヒートシンクでは、Ｕ字形状のヒートパイプの底辺部１３は、いずれも、相互に、略同一平面上に配置されていたが、これに代えて、図９に示すように、第６実施形態例に係るヒートシンクでは、Ｕ字形状のヒートパイプが複数設けられ、その底辺部が対向するように配置されている。 In the heat sink according to the fifth embodiment, the base portions 13 of the U-shaped heat pipes are all arranged on substantially the same plane, but instead, as shown in FIG. In the heat sink according to the sixth embodiment, a plurality of U-shaped heat pipes are provided and are arranged so that the bottom sides thereof face each other.
　第６実施形態例に係るヒートシンク６では、Ｕ字形状のヒートパイプ６１（Ｕ字形状のヒートパイプ６１－１、Ｕ字形状のヒートパイプ６１－２）が１０個設けられ、Ｕ字形状の底辺部１３が、ベースプレート１０表面上に、千鳥状に配置されている。すなわち、１０個のＵ字形状のヒートパイプ６１のうち、図９において、ベースプレート１０表面上の右側周縁部に、底辺部１３が配置されるように、５個のＵ字形状のヒートパイプ６１－１が設置されている。また、ベースプレート１０表面上の左側周縁部に、底辺部１３が配置されるように、Ｕ字形状のヒートパイプ６１－１とは別の、５個のＵ字形状のヒートパイプ６１－２が設置されている。右側周縁部に底辺部１３が配置されるＵ字形状のヒートパイプ６１－１と左側周縁部に底辺部１３が配置されるＵ字形状のヒートパイプ６１－２は、放熱フィン１２の平面部に対して平行方向に、交互に配列されている。 In the heat sink 6 according to the sixth embodiment, ten U-shaped heat pipes 61 (U-shaped heat pipe 61-1, U-shaped heat pipe 61-2) are provided, and the bottom of the U-shaped The portions 13 are arranged in a staggered pattern on the surface of the base plate 10. That is, among the ten U-shaped heat pipes 61, the five U-shaped heat pipes 61- are arranged so that the bottom side portion 13 is arranged at the right side peripheral portion on the surface of the base plate 10 in FIG. 1 is installed. In addition, five U-shaped heat pipes 61-2 other than the U-shaped heat pipe 61-1 are installed so that the bottom side portion 13 is disposed on the left peripheral edge on the surface of the base plate 10. Has been. A U-shaped heat pipe 61-1 in which the base 13 is disposed on the right peripheral edge and a U-shaped heat pipe 61-2 in which the bottom 13 is disposed on the left peripheral edge are formed on the flat surface of the radiating fin 12. On the other hand, they are arranged alternately in the parallel direction.
　右側周縁部に底辺部１３が配置されるＵ字形状のヒートパイプ６１－１は、いずれも、その底辺部１３が、相互に、略同一平面上（ベースプレート１０表面に対して略鉛直方向の平面上）に配置されている。また、左側周縁部に底辺部１３が配置されるＵ字形状のヒートパイプ６１－２は、いずれも、その底辺部１３が、相互に、略同一平面上（ベースプレート１０表面に対して略鉛直方向の平面上）に配置されている。Ｕ字形状のヒートパイプ６１の底辺部１３は、ベースプレート１０表面に対して、略鉛直方向に立設された態様となっている。 In each of the U-shaped heat pipes 61-1 in which the base 13 is disposed at the right peripheral edge, the bases 13 are substantially on the same plane (a plane in a substantially vertical direction with respect to the surface of the base plate 10). (Above). Further, in each of the U-shaped heat pipes 61-2 in which the base 13 is arranged on the left peripheral edge, the bases 13 are substantially flush with each other (in a substantially vertical direction with respect to the surface of the base plate 10). On the plane). The bottom portion 13 of the U-shaped heat pipe 61 has a mode in which it is erected in a substantially vertical direction with respect to the surface of the base plate 10.
　また、ヒートシンク６では、ヒートシンク６の平面視における重心（ベースプレート１０表面の中心点）に対して、点対称に放熱フィン１２及びＵ字形状のヒートパイプ６１が配置されている。ヒートシンク６では、全ての放熱フィン１２が、ベースプレート１０表面と接触した態様となっている。 Further, in the heat sink 6, the radiation fins 12 and the U-shaped heat pipe 61 are arranged symmetrically with respect to the center of gravity (the center point of the surface of the base plate 10) in a plan view of the heat sink 6. In the heat sink 6, all the radiation fins 12 are in contact with the surface of the base plate 10.
　ヒートシンク６でも、ベースプレート１０表面のうち、平面視においてＬＥＤモジュール（図示せず）と重なり合う領域に空間部１５を形成するように、放熱フィン１２を配置できるので、空間部１５に電源装置等（図示せず）を収容することで、電源装置等がヒートシンク６からの熱を受けることを防止でき、さらに、高さ方向の寸法を低減できる。 Also in the heat sink 6, the radiation fins 12 can be arranged so as to form the space portion 15 in the region overlapping the LED module (not shown) in the plan view on the surface of the base plate 10. (Not shown) can prevent the power supply device and the like from receiving heat from the heat sink 6, and can further reduce the height dimension.
　また、ヒートシンク６では、全ての放熱フィン１２がベースプレート１０の表面と接触しているので、ヒートシンク６が寒冷地に設置されて、Ｕ字形状のヒートパイプ６１の作動流体が凍結した場合でも、ベースプレート１０からベースプレート１０の表面と接触した放熱フィン１２へ熱が伝達されるので、ヒートシンク６は冷却性能を発揮できる。 Moreover, in the heat sink 6, since all the radiation fins 12 are in contact with the surface of the base plate 10, even when the heat sink 6 is installed in a cold region and the working fluid of the U-shaped heat pipe 61 is frozen, the base plate Since heat is transferred from 10 to the heat radiating fins 12 in contact with the surface of the base plate 10, the heat sink 6 can exhibit cooling performance.
　さらに、ヒートシンク６では、Ｕ字形状のヒートパイプ６１の底辺部１３は、ベースプレート１０表面に対し立設した態様となっているので、Ｕ字形状のヒートパイプ６１に段差部を設けなくても、ベースプレート１０の裏面側へ放熱フィン１２を延在させることなく、Ｕ字形状のヒートパイプ６１を放熱フィン１２の中央部に取り付けることができる。 Further, in the heat sink 6, the bottom portion 13 of the U-shaped heat pipe 61 is in an aspect standing with respect to the surface of the base plate 10, so even if the U-shaped heat pipe 61 is not provided with a stepped portion, The U-shaped heat pipe 61 can be attached to the central portion of the radiating fin 12 without extending the radiating fin 12 to the back surface side of the base plate 10.
　次に、本発明のヒートシンクの他の実施形態例について説明する。上記各実施形態例では、ベースプレートは、平面視矩形状であったが、形状は特に限定されず、例えば、円形状、５角形以上の多角形状、正方形状、長尺形状等でもよい。上記各実施形態例のヒートシンクは、ＬＥＤモジュールがベースプレートの裏面側中央部に熱的に接続されるが、さらに裏面側周縁部にも、ＬＥＤモジュールが熱的に接続されてもよい。 Next, another embodiment of the heat sink of the present invention will be described. In each of the above embodiments, the base plate has a rectangular shape in plan view, but the shape is not particularly limited, and may be, for example, a circular shape, a polygonal shape of five or more polygons, a square shape, a long shape, or the like. In the heat sink of each of the above embodiments, the LED module is thermally connected to the central portion on the back surface side of the base plate, but the LED module may also be thermally connected to the peripheral portion on the back surface side.
　上記各実施形態例では、Ｕ字形状のヒートパイプかＬ字状ヒートパイプのいずれか一方が用いられていたが、これに代えて、Ｕ字形状のヒートパイプとＬ字状ヒートパイプとを併用してもよい。 In each of the above embodiments, either a U-shaped heat pipe or an L-shaped heat pipe was used. Instead, a U-shaped heat pipe and an L-shaped heat pipe are used in combination. May be.
　本発明のヒートシンクは、電源装置等の器具がヒートシンクからの排熱を受けることを防止でき、寒冷地でヒートパイプの作動流体が凍結しても冷却性能を発揮でき、また、照明器具の高さ方向の寸法を低減できるので、例えば、天井や空調の効かない環境に設置されるＬＥＤ照明を冷却する分野で利用価値が高い。 The heat sink of the present invention can prevent the appliance such as the power supply device from receiving the exhaust heat from the heat sink, can exhibit the cooling performance even when the working fluid of the heat pipe freezes in a cold region, and the height of the lighting fixture Since the dimension of the direction can be reduced, for example, the utility value is high in the field of cooling LED lighting installed in an environment where a ceiling or air conditioning does not work.
１、２、３、４、５、６　　　　　　　　　　　ヒートシンク
１０　　　　　　　　　　　　　　　　　　　　ベースプレート
１１、２１、３１、４１、５１、６１　　　　　ヒートパイプ
１２　　　　　　　　　　　　　　　　　　　　放熱フィン 1, 2, 3, 4, 5, 6 Heat sink 10 Base plate 11, 21, 31, 41, 51, 61 Heat pipe 12 Radiation fin

Claims (9)

  1. 　ＬＥＤモジュールと裏面側中央部において熱的に接続されるベースプレートと、前記ベースプレートの表面側に設けられ、平面視において前記ＬＥＤモジュールと重なり合う位置に受熱部が配置されたヒートパイプと、前記ヒートパイプと熱的に接続された、複数の平板状の放熱フィンと、を有するヒートシンクであって、
    前記ＬＥＤモジュールと平面視において重なり合う位置に前記放熱フィンは配置されておらず、複数の前記放熱フィンの少なくとも１つが、前記ベースプレートと接触しているヒートシンク。     A base plate that is thermally connected to the LED module at the center on the back side; a heat pipe that is provided on the front side of the base plate and in which a heat receiving portion is disposed at a position overlapping the LED module in plan view; and the heat pipe A heat sink having a plurality of plate-like heat dissipating fins that are thermally connected,
    A heat sink in which at least one of the plurality of heat radiating fins is in contact with the base plate, the heat radiating fins not being disposed at a position overlapping the LED module in plan view.
  2. 　前記ヒートパイプが、底辺部と該底辺部の両端部から延在する２つの直線部とからなるＵ字形状であり、前記底辺部が前記ベースプレートと熱的に接続された前記受熱部であり、２つの前記直線部に前記放熱フィンが熱的に接続された請求項１に記載のヒートシンク。 The heat pipe has a U-shape consisting of a bottom portion and two straight portions extending from both ends of the bottom portion, and the bottom portion is the heat receiving portion thermally connected to the base plate; The heat sink according to claim 1, wherein the radiating fin is thermally connected to the two straight portions.
  3. 　前記ヒートパイプが、底辺部と該底辺部の一方の端部から延在する１つの直線部とからなるＬ字形状であり、前記底辺部が前記ベースプレートと熱的に接続された前記受熱部であり、前記直線部に前記放熱フィンが熱的に接続された請求項１に記載のヒートシンク。 The heat pipe has an L shape including a bottom portion and one straight portion extending from one end portion of the bottom portion, and the bottom portion is the heat receiving portion thermally connected to the base plate. The heat sink according to claim 1, wherein the heat radiation fin is thermally connected to the straight portion.
  4. 　前記ヒートパイプが複数設けられ、底辺部と該底辺部の両端部から延在する２つの直線部とからなるＵ字形状であり、前記底辺部が前記ベースプレートと熱的に接続された前記受熱部であり、２つの前記直線部に前記放熱フィンが熱的に接続されたヒートパイプと、底辺部と該底辺部の一方の端部から延在する１つの直線部とからなるＬ字形状であり、前記底辺部が前記ベースプレートと熱的に接続された前記受熱部であり、前記直線部に前記放熱フィンが熱的に接続されたヒートパイプと、を有する請求項１に記載のヒートシンク。 The heat receiving portion provided with a plurality of the heat pipes and having a bottom portion and two straight portions extending from both ends of the bottom portion, and the bottom portion is thermally connected to the base plate An L-shape comprising a heat pipe in which the radiating fin is thermally connected to the two straight portions, and a bottom portion and one straight portion extending from one end of the bottom portion. The heat sink according to claim 1, further comprising: a heat pipe in which the bottom part is the heat receiving part thermally connected to the base plate, and the heat radiating fin is thermally connected to the linear part.
  5. 　前記ヒートパイプが、前記底辺部と前記直線部との間に段差部を有する請求項２乃至４のいずれか１項に記載のヒートシンク。 The heat sink according to any one of claims 2 to 4, wherein the heat pipe has a step portion between the bottom portion and the straight portion.
  6. 　前記ヒートパイプが、底辺部と該底辺部の両端部から延在する２つの直線部とからなるＵ字形状であり、２つの前記直線部の一方の直線部が、前記ベースプレートと熱的に接続された前記受熱部であり、２つの前記直線部の他方の直線部が、前記放熱フィンと熱的に接続された請求項１に記載のヒートシンク。 The heat pipe has a U-shape composed of a bottom portion and two straight portions extending from both ends of the bottom portion, and one straight portion of the two straight portions is thermally connected to the base plate. The heat sink according to claim 1, wherein the other straight portion of the two straight portions is thermally connected to the radiating fin.
  7. 　前記放熱フィンの平面部が、前記ベースプレートの表面に対して鉛直方向に配置されたヒートシンクであって、前記ヒートシンクの重心を通過し且つ前記放熱フィンの平面部に対して平行方向の面に対して、対称に前記放熱フィン及び前記ヒートパイプが配置されている請求項１乃至６のいずれか１項に記載のヒートシンク。 The flat portion of the radiating fin is a heat sink disposed in a direction perpendicular to the surface of the base plate, and passes through the center of gravity of the heat sink and is parallel to the plane parallel to the flat portion of the radiating fin. The heat sink according to any one of claims 1 to 6, wherein the radiation fins and the heat pipe are arranged symmetrically.
  8. 　前記放熱フィンの平面部が、前記ベースプレートの表面に対して鉛直方向に配置されたヒートシンクであって、前記ヒートシンクの平面視における重心に対して、点対称に前記放熱フィン及び前記ヒートパイプが配置されている請求項１乃至６のいずれか１項に記載のヒートシンク。 The heat sink is a heat sink in which the flat portion of the heat sink is arranged in a direction perpendicular to the surface of the base plate, and the heat sink and the heat pipe are arranged symmetrically with respect to the center of gravity of the heat sink in plan view. The heat sink according to any one of claims 1 to 6.
  9. 　前記ＬＥＤモジュールと平面視において重なり合い、且つ前記放熱フィンと平面視において重なり合わない位置に、電源装置、電子部品、制御装置または照明器具の固定部材が収容される請求項１乃至８のいずれか１項に記載のヒートシンク。 9. The fixing member of the power supply device, the electronic component, the control device, or the lighting fixture is accommodated in a position that overlaps with the LED module in a plan view and does not overlap with the heat radiation fin in a plan view. Heat sink according to item.
PCT/JP2017/030450 2016-08-29 2017-08-25 Heatsink WO2018043312A1 (en)

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