JP6182449B2 - LED lighting heat dissipation device - Google Patents

Description

  The present invention relates to a heat radiating device that radiates heat generated from an LED used as a light source or a power source in LED lighting used in a lighting device such as a plant cultivation factory and a construction site searchlight.

  In this specification and claims, the top and bottom of FIGS. 2 and 6 to 8 are referred to as top and bottom.

  LED lighting equipped with a light emitting source having LEDs has excellent characteristics of high luminous efficiency, low power consumption and brighter than conventional incandescent bulbs, etc., but with current technology, about 80% of power consumption Becomes a heat, and the resin material surrounding the LED is deteriorated by the heat, the luminous efficiency is lowered and the life is shortened. In particular, in the high power consumption type LED lighting having a power consumption of 100 W or more, the above-described problem is remarkable.

  As a general heat dissipation device, a heating element mounting plate made of a heat conductive material and having one side as a heating element mounting surface to which the heating element is mounted and the other side as a flat heat transfer surface, and heating element mounting 2. Description of the Related Art A plate having a plurality of heat dissipating fins integrally provided in parallel and spaced apart from each other on a heat transfer surface of a plate (hereinafter referred to as a well-known heat dissipating device) is widely known.

  By the way, the LED illumination is often provided so as to illuminate the lower side. In this case, the heating element mounting plate of the well-known heat dissipating device is in a horizontal posture, and the LED lighting is mounted on the lower surface of the heating element mounting plate. However, when used in this state, depending on natural convection, it becomes difficult for low-temperature air to flow in the longitudinal center of the radiating fin, so the temperature near the longitudinal center of the radiating fin is higher than that of other parts. Become higher. Therefore, the heat dissipation performance from the vicinity of the central portion in the longitudinal direction of the heat dissipating fins is deteriorated, and the heat generated from the entire LED illumination arranged on the heat transfer surface of the heating element mounting plate cannot be effectively dissipated.

  Therefore, a heat radiating device using a heat pipe having excellent heat transport performance has been considered. For example, as a heat radiating device for LED lighting using a heat pipe, a vertical strip integrally formed in a vertically projecting manner over the entire length of one horizontal side of the horizontal strip plate portion to which a plurality of LED illuminations are attached on the upper surface. A heat spreader comprising a plate portion, a vertical heat radiating plate spaced from the outer surface of the vertical band plate portion of the heat spreader, and a heat radiator that thermally connects the vertical belt plate portion and the vertical heat radiating plate of the heat spreader. The heat spreader is fixed to a portion sandwiched between the horizontal strip portion and the vertical strip portion in a state of being in thermal contact with both strip plate portions, and the longitudinal direction thereof is directed to the longitudinal direction of both strip plate portions. 1 heat pipe, and a radiator is arranged in the longitudinal direction of the heat spreader at an interval, and the lower part is sandwiched between the vertical strip and the heat sink of the heat spreader. A second heat pipe, a substantially U-shaped third heat pipe disposed between the adjacent second heat pipes and sandwiched between the vertical band plate portion of the heat spreader and the vertical heat radiating plate; A container of second to fourth heat pipes, comprising a substantially L-shaped fourth heat pipe disposed on the outside of the two heat pipes and having a lower part sandwiched between the vertical strip plate part of the heat spreader and the vertical heat radiating plate Has been proposed (see Patent Document 1).

  According to the heat radiating device described in Patent Literature 1, heat generated from the LED illumination is transmitted to the first heat pipe, and the temperature of the heat spreader is made uniform in the longitudinal direction. Then, the heat transmitted to the heat spreader is transmitted from the vertical strip to the entire heat sink through the second to fourth heat pipes, and is radiated from the heat sink.

  However, according to the heat radiating device described in Patent Document 1, the first to fourth heat pipes are required in addition to the heat spreader and the heat radiating plate, and the heat spreader and the first to fourth heat pipes are fixed and the heat radiating plate and the second heat pipe. It is necessary to fix the fourth heat pipe, and there is a problem that the number of parts increases and the assembly work becomes troublesome.

JP 2012-4126 A

  An object of the present invention is to provide an LED illumination heat dissipation device that solves the above-described problems, has a sufficient heat dissipation performance, and has a reduced number of parts as compared to the heat dissipation device described in Patent Document 1, and is easy to assemble. It is to provide.

  In order to achieve the above object, the present invention comprises the following aspects.

  1) LED lighting mounting plate made of a heat conductive material and having one side as a lighting mounting surface on which LED lighting is mounted and the other side as a heat transfer surface, and a flat base portion and a base portion protruding upward A plurality of heat dissipating fins disposed on the heat transfer surface of the LED illumination mounting plate so that the heat dissipating portions are spaced from each other. The fin mounting grooves are formed at a distance from each other, a hollow hydraulic fluid enclosing circuit is formed in the heat dissipating portion of the heat dissipating fin, and a heat pipe is provided by enclosing the operating fluid in the operating fluid enclosing circuit. Each heat dissipating fin is in a state where the heat pipe portion is located outside the fin mounting groove and the base portion and the portion near the base portion in the heat radiating portion are fitted in the fin mounting groove. LED Lighting is fixed to the ED illumination attachment plate heat radiator.

  2) For LED lighting as described in 1) above, wherein the base portion of the radiating fin is in contact with the bottom surface of the fin mounting groove, and the portion fitted in the fin mounting groove in the radiating portion is in contact with the side surface of the fin mounting groove. Heat dissipation device.

  3) When the heat transfer surface of the LED lighting mounting plate is recessed, a plurality of recessed grooves are formed in parallel to each other, and each recessed groove is a fin mounting groove as described in 1) or 2) above LED lighting heat dissipation device.

  4) On the heat transfer surface of the LED lighting mounting plate, a plurality of pairs of upwardly protruding ridges that are paired with each other are provided at intervals so that all the ridges are parallel to each other, The heat radiation for LED lighting as described in 1) or 2) above, wherein each fin mounting groove is formed by the two protruding strips of the protruding strip pair and a portion between the two protruding strips of the protruding strip pair on the LED lighting mounting plate. apparatus.

  5) On the heat transfer surface of the LED lighting mounting plate, a flat plate and a pair of parallel ridges that are integrally formed on both side edges of the flat plate and are formed separately from the LED lighting mounting plate by a heat conductive material. A plurality of U-shaped groove forming members having a transverse cross section are fixed at intervals so that all the ridges are parallel to each other, and each fin mounting groove is formed by both ridges and flat plates of each groove forming member. The heat radiating device for LED illumination according to 1) or 2) above.

  6) The heat radiation for LED lighting according to the above 4) or 5), wherein the thickness of the portion of the heat radiation portion of the heat radiation fin fitted in the fin mounting groove and the convexity of the fin mounting groove is 1.5 mm or more. apparatus.

  7) The base part of the radiating fin is a vertical rectangle, the radiating part is provided on the two long sides of the base part, the radiating fin is U-shaped as a whole, and the part near the base part in both radiating parts is the fin mounting groove The heat dissipating device for LED lighting according to any one of the above 1) to 6), which is fitted inside.

  8) Front and rear direction on either side of the fin mounting groove of the LED lighting mounting plate, or the surface facing the outside of the fin mounting groove of the portion of the heat radiating fin that is inserted into the fin mounting groove. The heat radiation device for LED lighting according to 7) above, wherein a convex portion extending in a single direction is provided integrally, and a concave portion is formed on the other side in the front-rear direction and into which the convex portion is fitted.

  9) The heat radiating device for LED lighting according to 7) or 8) above, wherein heat pipe portions independent of each other are provided in the two heat radiating portions of the heat radiating fins.

  10) The radiating fin is formed by bending a substrate made by joining two metal plates in a laminated shape into a U-shape, and the hydraulic fluid enclosing circuit of the heat pipe portion of the radiating portion is 9. The LED illumination heat dissipating device according to 9) above, wherein at least one of the two metal plates forming the bulge bulges outward.

  11) The heat radiating device for LED lighting according to any one of 7) to 10) above, wherein an interval between the heat radiating portions of the heat radiating fin is 7 mm or more.

  12) The length of the long side of the base part of the radiating fin is 200 mm or more and the heat radiating part is provided over the entire length of the long side of the base part, and the linear distance from the base part to the tip of the radiating part is 50 mm or more. The LED illumination heat dissipation device according to any one of 7) to 11) above.

  13) The LED illumination heat dissipation device according to 12) above, wherein a dimension of the LED illumination mounting plate in a direction orthogonal to the longitudinal direction of the base portion of the heat dissipation fin is 200 mm or more.

  14) The LED illumination heat dissipating device according to any one of 1) to 13) above, and the LED illumination heat dissipating device attached to the illumination attachment surface of the LED illumination attachment plate, and having a plurality of LEDs as light emitting sources A lighting device comprising LED lighting.

  According to the heat radiating device for LED lighting of 1) to 13) above, the LED lighting mounting made of a heat conductive material and having one side as a lighting mounting surface to which the LED lighting is mounted and the other surface as a heat transfer surface A plate, a flat base portion, and a plurality of heat dissipating portions integrally provided on the base portion so as to protrude upward, and a plurality of heat dissipating portions disposed on the heat transfer surface of the LED lighting mounting plate so as to be spaced apart from each other A plurality of fin mounting grooves are formed at intervals in the LED lighting mounting plate, and a hollow hydraulic fluid encapsulating circuit is formed in the heat radiating portion of the radiating fin. The heat pipe is provided by enclosing the hydraulic fluid, and each heat dissipating fin is located outside the fin mounting groove, and the base part and the part near the base part in the heat dissipating part. Is fixed to the LED lighting mounting plate in a state of being fitted in the fin mounting groove, so that the entire LED lighting mounted on the heat transfer surface of the LED lighting mounting plate can be efficiently cooled as described below. Is possible.

  That is, the heat generated from the LED illumination is transmitted to the LED illumination mounting plate, is transmitted to the portion fitted in the fin mounting groove in the radiating fin through the bottom surface and the side surface of the fin mounting groove, and further the heat pipe portion of the heat radiating portion. The hydraulic fluid evaporates through the hydraulic fluid accumulated in the lower part of the hydraulic fluid sealing circuit in the gas and becomes a gas phase. As a result, the pressure in the lower part in the hydraulic fluid sealing circuit increases, and the gas phase hydraulic fluid spreads throughout the hydraulic fluid sealing circuit. While the vapor phase hydraulic fluid reaches the entire inside of the hydraulic fluid enclosing circuit, the heat of the vapor phase hydraulic fluid is transferred to the heat radiating section, and the heat radiated from the heat radiating section is condensed outside the vapor phase hydraulic fluid. To do. As a result, the entire heat dissipating part of the heat dissipating fins has a uniform temperature, and heat is uniformly dissipated from the entire heat dissipating part. On the other hand, since the recondensed liquid phase hydraulic fluid flows downward due to gravity, a flow of the gas phase hydraulic fluid and a flow of the liquid phase hydraulic fluid are generated in the heat pipe portion, and the circulation of the hydraulic fluid occurs. Therefore, the heat transmitted from the entire LED lighting mounting plate is evenly dissipated, and the entire LED lighting arranged on the lighting mounting surface of the LED lighting mounting plate is efficiently cooled.

  And since the heat pipe part provided in the heat radiating part of the heat radiating fin is formed by sealing the working liquid in the hollow working liquid sealing circuit provided in the heat radiating part, the heat radiation described in Patent Document 1 is provided. Compared to the device, the number of parts is reduced, and the manufacturing work is facilitated.

  Furthermore, when the base portion of each radiating fin and the portion near the base portion in the radiating portion are press-fitted into the fin mounting groove, screws and rivets for fixing each radiating fin to the LED lighting mounting plate The number of fixtures such as can be reduced, and the fixing work of the radiation fins is facilitated.

  According to the LED illumination heat dissipating device of 2), the heat transfer from the LED illumination mounting plate to the heat dissipating fins is excellent.

  According to the LED illumination heat radiating device of the above 3) to 5), the fin attachment groove can be formed relatively easily on the heat transfer surface of the LED illumination attachment plate.

  According to the LED illumination heat radiating device of the above 6), the heat transfer performance from the LED illumination mounting plate to the heat pipe portion of the heat radiation portion of the radiation fin is improved, and the LED illumination attached to the illumination mounting surface of the LED illumination mounting plate It becomes possible to cool effectively.

  According to the LED illumination heat radiating device of the above 7), the heat transfer performance from the LED illumination mounting plate to the heat pipe portion of the heat radiating portion of the radiation fin is improved, and the LED illumination attached to the illumination mounting surface of the LED illumination mounting plate It becomes possible to cool effectively.

  According to the LED illumination heat radiating device of the above 8), the displacement of the radiating fin with respect to the LED illumination mounting plate can be suppressed until the radiating fin is fixed to the LED illumination mounting plate. In addition, since the convex portions and the concave portions are used for fixing the heat radiating fins to the LED lighting mounting plate, the number of fixing tools such as screws and rivets for fixing the heat radiating fins to the LED lighting mounting plate is reduced. This makes it easy to fix the radiating fins.

  According to the LED illumination heat dissipating devices of 9) and 10) above, the heat dissipating fin in which the heat pipe portion is provided in the heat dissipating portion can be made relatively easily.

  When having the dimensions of the LED illumination heat dissipation device of the above 11) to 13), the heat generated from the LED illumination attached to the LED illumination attachment surface of the LED illumination attachment plate when having a structure like a well-known heat dissipation device It is difficult to dissipate heat effectively, but even in this case, it is attached to the LED lighting mounting surface of the LED lighting mounting plate when configured as the LED lighting heat dissipation device of 1) above. In addition, the entire LED illumination can be efficiently cooled.

  According to the illumination device of 14) above, it is possible to efficiently cool the entire LED illumination attached to the heat transfer surface of the LED illumination attachment plate.

It is a perspective view which shows the whole structure of the thermal radiation apparatus for LED illumination of this invention. It is the figure seen from the longitudinal direction one end side of the radiation fin which expands and shows a part of the thermal radiation apparatus for LED lighting of this invention. It is a perspective view which shows the thermal radiation fin used for the thermal radiation apparatus for LED illumination of FIG. 1 and FIG. It is a front view which shows the metal substrate which makes the radiation fin of FIG. 2 and FIG. It is a perspective view which shows the usage condition of the illuminating device provided with the thermal radiation apparatus for LED illumination of FIG. It is a figure equivalent to a part of FIG. 2 which shows the modification of the fin attachment groove | channel formed in the LED illumination attachment plate of the thermal radiation apparatus for LED illumination of FIG. It is an exploded view equivalent to a part of FIG. 2 which shows the other modification of the fin attachment groove formed in the LED illumination attachment plate of the heat radiating device for LED illumination of FIG. It is an exploded view equivalent to a part of FIG. 2 which shows the other modification of the fin attachment groove formed in the LED illumination attachment plate of the heat radiating device for LED illumination of FIG.

  Embodiments of the present invention will be described below with reference to the drawings.

  In the following description, the term “aluminum” includes aluminum alloys in addition to pure aluminum.

  In the following description, the left and right in FIG. 2 are referred to as the left and right, and the length direction of the heat dissipating fins (the front and back direction in FIG. 2) is referred to as the front-rear direction.

  In the drawings, the same parts and the same parts are denoted by the same reference numerals.

  FIG. 1 shows the overall configuration of the LED illumination heat dissipation device of the present invention, and FIGS. 2 and 3 show the configuration of the main part thereof. FIG. 4 shows a metal substrate on which heat dissipating fins used in the LED illumination heat dissipating device of FIG. 1 and FIG. 2 are formed. Furthermore, FIG. 5 shows the usage aspect of the illuminating device provided with the heat radiating device for LED illumination of this invention.

  1 and 2, the LED illumination heat dissipation device (1) is made of, for example, a heat conductive material such as aluminum or copper (including a copper alloy; hereinafter the same), and one side (here, the lower side) is an LED. LED lighting mounting plate (2) whose lighting mounting surface (3) to which lighting is mounted and whose other surface (here, the upper surface) is a heat transfer surface (4); for example, aluminum, copper (including copper alloy) And a plurality of heat dissipating fins (5) disposed on the heat transfer surface (4) of the LED illumination mounting plate (2).

  The LED lighting mounting plate (2) has a rectangular shape that is long in the left-right direction, and is mounted on the lighting mounting surface (3), for example, the circuit board (6a), a plurality of blue LEDs mounted on the circuit board (6a) and mounted with blue LEDs. Package (6b), a plurality of red LED packages (6c) that are also mounted on the circuit board (6a) and mounted with red LEDs, and two switching power supplies for each LED package (6b) (6c) (not shown) The LED illumination (6) having the above is attached, and the LED illumination heat dissipating device (1) and the LED illumination (6) constitute an illumination device (16) used as a cultivation illumination device for plant cultivation factories.

  In addition, a plurality of fin mounting grooves (10) extending in the front-rear direction are formed at intervals in the left-right direction on the heat transfer surface (4) of the LED illumination mounting plate (2). The fin mounting groove (10) is a concave groove formed by recessing the heat transfer surface (4) of the LED lighting mounting plate (2), and the front and rear ends are both front and rear side surfaces of the LED lighting mounting plate (2). Is open. For example, when the LED illumination mounting plate (2) is made of aluminum, it is extruded entirely including the fin mounting groove (10).

  As shown in FIG. 2 and FIG. 3, the radiating fin (5) has a rectangular horizontal flat base portion (7) which is long in the front-rear direction, and right and left side edges which are two long sides of the base portion (7). It consists of a vertically flat plate-like heat dissipating part (8) which is integrally provided in an upward projecting shape and which is long in the front-rear direction for dissipating heat transmitted from the base part (7). The heat radiating portion (8) is provided over the entire length of the base portion (7), and the heat radiating fin (5) has a U-shaped cross section as a whole.

  Each heat radiating portion (8) of the heat radiating fin (5) is provided with a heat pipe portion (11) extending almost entirely. The heat pipe part (11) of each heat radiating part (8) is one in which the working fluid is sealed in one hollow endless working liquid sealing circuit (12) bulging on both sides of the heat radiating part (8). . The hydraulic fluid enclosing circuit (12) has a rectangular lattice shape formed in substantially the entire heat dissipating part (8) and extending in the front-rear direction. In addition, in FIG. 1, illustration of a heat pipe part (11) and a hydraulic fluid enclosure circuit (12) is abbreviate | omitted. The heat dissipating fin (5) is formed by bending a substrate (13) made by joining two metal plates made of aluminum, copper, etc. into a U-shape. The hydraulic fluid sealing circuit (12) of 11) is provided by bulging at least one of the two metal plates forming the substrate (13), here both metal plates. .

  Each radiating fin (5) has a heat pipe part (11) located outside the fin mounting groove (10), and the base part (7) and the part near the base part (7) in both radiating parts (8) are fins. In a state of being fitted into the mounting groove (10), the LED lighting mounting plate (2) is fixed by using a fixing tool (9) such as a screw or a rivet penetrating the base portion (7). Therefore, all the heat radiating fins (5) are arranged on the LED illumination mounting plate (2) in a state where the heat radiating portions (8) are arranged so as to be spaced from each other in the left-right direction. The base (7) of the radiating fin (5) is in contact with the bottom surface (10a) of the fin mounting groove (10), and the portion fitted into the radiating section (8) in the fin mounting groove (10) is the fin mounting groove. It is in contact with both side surfaces (10b) of (10). In addition, it is preferable that the base part (7) of each radiating fin (5) and the part near the base part (7) in both the radiating parts (8) are press-fitted into the fin mounting groove (10).

  Here, the length L1 of the LED illumination mounting plate (2) in the left-right direction (the direction perpendicular to the longitudinal direction of the base portion (7) of the radiating fin (5)) is 200 mm or more, and the base portion of the radiating fin (5) ( 7) and the length L2 of the long side of the heat radiation part (8) in the front-rear direction is 200 mm or more, the linear distance L3 from the base part (7) to the tip of the heat radiation part (8) is 50 mm or more, and each heat radiation fin (5) It is preferable that the space | interval S between both the thermal radiation parts (8) is 7 mm or more. In addition, the upper limit of the space | interval S between both the thermal radiation parts (8) of each thermal radiation fin (5) is about 20 mm. Moreover, it is preferable that the space | interval between the adjacent thermal radiation parts (8) of the adjacent radiation fin (5) is equal to or more than the said space | interval S. FIG.

  As shown in FIG. 4, the substrate 13 before being bent into a U-shape has a first part (14) that forms a base part (7), and both long sides of the first part (14). It consists of two vertical rectangular second parts (15) that are provided integrally with each other and form a heat radiating part (8). The two second parts (15) have independent heat pipe parts (11). Is provided. The heat pipe part (11) of the second part (15) is provided by bulging at least one of the two metal plates forming the substrate (13), here both metal plates. The hydraulic fluid is sealed in one hollow endless hydraulic fluid sealing circuit (12). And the radiation fin (5) is formed by bending both the 2nd parts (15) of a board | substrate (13) with respect to the 1st part (14).

  For example, the substrate 13 before being bent into a U-shape is printed with an anti-bonding agent on a required pattern on at least one of the mating surfaces of two aluminum plates. Two hydraulic fluid enclosing circuits (12) swelled on both sides of the laminated plate by a so-called roll bond method, in which a laminated plate is made by crimping the plate and fluid pressure is introduced into the non-crimped portion of the laminated plate, Then, the hydraulic fluid is manufactured by enclosing the hydraulic fluid in the hydraulic fluid sealing circuit (12). The non-crimped portion of the laminated plate extends from the two non-crimped portions for the hydraulic fluid-filled circuit having a shape corresponding to the two hydraulic fluid-filled circuits (22) and the non-crimped portion for both hydraulic fluid-filled circuits to the periphery of the laminated plate. It consists of one non-crimp part for fluid pressure introduction. When fluid pressure is introduced from the non-crimping part for introducing fluid pressure, the non-crimping part for hydraulic fluid enclosing circuit becomes a hydraulic fluid enclosing circuit (12) that bulges on both sides of the laminated plate. It becomes a hydraulic fluid injecting portion that bulges on both sides of the laminated plate and that has one end connected to one hydraulic fluid enclosing circuit (12) and the other end opened to the periphery of the laminated plate. Then, after injecting the operating fluid into the operating fluid sealing circuit (12) through the operating fluid injection section, the substrate (13) is produced by sealing the operating fluid injection section. The sealed hydraulic fluid injection part is indicated by a chain line A in FIG.

  The substrate (13) may be formed by brazing, for example, two aluminum plates having an outward bulging portion for forming the hydraulic fluid sealing circuit (12) and the hydraulic fluid injection portion. Good.

  As shown in FIG. 5, a cover (17) that covers the entire illumination device (16) is attached to the illumination device (16), and a suspension member (18) provided on the cover (17) is used. For example, it is used suspended from a mounting bar provided above a cultivation shelf in a plant cultivation factory. On the lower wall of the cover (17), there is formed an irradiation port (not shown) for irradiating light emitted from the LED packages (6b) and (6c) of the LED lighting (6) downward. An opening (17a) for exposing all the heat radiating fins (5) to the outside is formed. In addition, vent holes (17b) are formed in both side walls on the longitudinal direction side of the radiating fin (5) among all side walls of the cover (16), and the cover (17) passes through one vent hole (17b). ) The air that has flowed into the heat sink flows between both heat dissipating parts (8) of each heat dissipating fin (5) and between adjacent heat dissipating parts (8) of adjacent heat dissipating fins (5), and then the other vent (17b ) Through the cover (17).

  In addition, each LED package (6b) (6c) arranged on the board (6a) of the LED lighting (6) attached to the lighting mounting surface (3) of the heat radiating device (1) for the LED lighting device of the lighting device (16). ), A current of 0 to 700 mA is supplied. For example, when a current of 500 mA is supplied, the LED input power per unit area of the substrate (6a) is about 6000 W / m 2.

  In the LED lighting heat dissipation device (1) described above, the heat generated from the LED lighting (6) of the lighting device (16) is transferred to the lighting mounting surface (3) of the LED lighting mounting plate (2), and the LED lighting mounting. The heat is transmitted to the base (7) of the heat dissipating fin (5) through the bottom surface (10a) of the fin mounting groove (10) formed on the heat transfer surface (4) of the plate (2) and the fin mounting groove (10). It is transmitted to both heat radiation portions (8) of the heat radiation fin (5) through both side surfaces (10b). The heat transferred to the heat radiating fin (5) is transferred to the hydraulic fluid stored in the lower part of the hydraulic fluid sealing circuit (12) in the heat pipe section (11) of the heat radiating section (8), and the hydraulic fluid evaporates. Become a phase. As a result, the pressure in the lower part of the hydraulic fluid sealing circuit (12) increases, and the vapor phase hydraulic fluid spreads throughout the hydraulic fluid sealing circuit (12). While the vapor phase hydraulic fluid reaches the entire inside of the hydraulic fluid sealing circuit (12), the heat of the vapor phase hydraulic fluid is transferred to the heat radiating section (8) and flows from the heat radiating section (8) to the inside of the cover (17). The gas phase hydraulic fluid that has been radiated to the air and deprived of heat condenses. As a result, the entire heat dissipating part (8) of the heat dissipating fin (5) has a uniform temperature, and heat is uniformly dissipated from the entire heat dissipating part (8).

  On the other hand, since the re-condensed liquid-phase working fluid flows downward due to gravity, a gas-phase working fluid flow and a liquid-phase working fluid flow are generated in the heat pipe portion (11), and the working fluid is circulated. Therefore, the heat transmitted from the entire LED lighting mounting plate (2) is evenly dissipated, and the entire LED lighting (6) disposed on the lighting mounting surface (4) of the LED lighting mounting plate (2) is efficiently cooled. Is done.

  In the LED lighting heat dissipation device (1) described above, the hydraulic fluid sealing circuit (12) of the heat pipe portion (11) provided in the heat dissipation portion (8) of the heat dissipation fin (5) shown in FIGS. It is formed by expanding both metal plates of the substrate (13) outward, but instead, it is formed by expanding only one metal plate constituting the substrate (13). May be.

  6 to 8 show modifications of the fin mounting groove formed on the LED lighting mounting plate of the LED lighting heat dissipation device.

  In FIG. 6, the LED illumination mounting plate (2) has two ridges (21) which are formed integrally with the LED illumination mounting plate (2) so as to protrude upward on the heat transfer surface (4). A plurality of pairs of ridges are spaced from each other so that all the ridges (21) are parallel to each other, the two ridges (21) of each pair of ridges, and the LED lighting mounting plate (2) Each fin mounting groove (20) is formed by the portion between the two ridges (21) of the ridge pair. The portion between the two ridges (21) of each ridge pair on the heat transfer surface (4) of the LED lighting mounting plate (2) becomes the bottom surface (20a) of the fin mounting groove (20), and both ridge pairs The surfaces of the ridges (21) facing the other ridges (21) are the side surfaces (20b) of the fin mounting groove (20).

  Each radiating fin (5) has a base part (7) and the part near the base part (7) in both radiating parts (8) so that the heat pipe part (11) is located outside the fin mounting groove (20). It is fitted in the fin mounting groove (20), and the base part (7) of the heat dissipating fin (5) contacts the bottom surface (20a) of the fin mounting groove (20), and the fin mounting groove in the heat dissipating part (8) The portion fitted in (20) is in contact with both side surfaces (20b) of the fin mounting groove (20).

  The thickness t of the heat radiating fin (5) in the heat radiating section (8) fitted into the fin mounting groove (20) and the protrusion (21) of the fin mounting groove (20) is 1.5 mm or more. It is preferable that This is obtained from the result of computer simulation calculation.

That is, the total thickness t of the portion of the heat dissipating fin (5) fitted in the fin mounting groove (20) in the heat dissipating portion (8) and the protrusion (21) of the fin mounting groove (20) is 1. LED lighting heat dissipation device of 5 mm and 5 mm and LED in which the fin mounting groove is not formed and the base portion (7) of the heat radiation fin (5) is fixed to the heat transfer surface of the flat LED lighting mounting plate Regarding the heat dissipation device for lighting, a heat source is arranged directly under the base part (7) of the heat radiating fin (5) on the lighting mounting surface (3) of the LED lighting mounting plate (2), and the heat input is set to 50W. Computer simulation calculation was performed, and the temperature of the heat source at the time when the temperature of the heat source became constant after heat input for a certain time was obtained. The ambient temperature was set to 25 ° C. The results are shown in Table 1.

  As is apparent from Table 1, when the fin mounting groove (20) is formed in the LED lighting mounting plate (2) and the thickness is 1.5 mm or more, it is mounted on the lighting mounting surface (3). It can be seen that the heat source is efficiently cooled.

  In FIG. 7, the surface facing the inside of the fin mounting groove (20) in the two ridges (21) of each pair of ridges constituting the fin mounting groove (20), and both heat radiation portions (8) of the heat radiation fin (5) A convex portion (25) extending in the front-rear direction is integrally provided on either one of the surfaces facing the outside of the fin mounting groove (20) of the portion fitted in the fin mounting groove (25), On the other side, a recess (26) is formed which extends in the front-rear direction and fits the projection (25). Here, convex portions (25) are provided on both heat radiating portions (8) of the radiating fin (5), and concave portions (26) are formed on both convex ridges (21) of each convex strip pair. Here, since the convex portion (25) and the concave portion (26) are used for fixing the heat radiation fins (5) to the LED lighting mounting plate (2), each heat radiation fin (5) is connected to the LED lighting mounting plate ( The number of fixing tools such as screws and rivets for fixing to 2) can be reduced, and fixing work of the radiation fins becomes easy.

  The other configuration is the same as that shown in FIG. 6, the portion fitted in the fin mounting groove (20) in the heat radiating portion (8) of the heat radiating fin (5), and the protrusion of the fin mounting groove (20). The thickness t combined with the strip (21) is preferably 1.5 mm or more.

  Although not shown in FIGS. 6 and 7, the radiating fin (5) is fixed to the LED illumination mounting plate (2) using a fixing tool such as a screw or a rivet that penetrates the base portion (7). Yes.

  In FIG. 8, the LED lighting mounting plate (2) is formed on the heat transfer surface (4) separately from the LED lighting mounting plate (2) with a heat conductive material such as aluminum or copper, and is flat (33). And a U-shaped groove forming member (31) having a U-shaped cross section composed of a pair of parallel protrusions (32) provided in a rising shape integrally on both side edges of the flat plate (33). The fin mounting groove (30) is formed by the two protruding ridges (32) and the connecting portion (33).

  The portion between the two ridges (32) on the upper surface of the flat plate (33) of the groove forming member (31) is the bottom surface (30a) of the fin mounting groove (30), and the two ridges (32) are mutually connected to the other ridges. The inner surface facing the (32) side is the side surface (30b) of the fin mounting groove (30). Each radiating fin (5) has a heat pipe part (11) located outside the fin mounting groove (30), and the base part (7) and the part near the base part (7) in both radiating parts (8) are fins. It is fitted in the mounting groove (30), the base part (7) of the radiating fin (5) contacts the bottom surface (30a) of the fin mounting groove (30), and the fin mounting groove ( 30) The part fitted in the inner surface is in contact with both side surfaces (30b) of the fin mounting groove (30).

  Although not shown in the drawings, the groove forming member (31) and the heat radiating fin (5) are connected to the LED lighting mounting plate (screws, rivets, etc.) through the connecting portion (33) and the base portion (7) using a fixture. It is fixed to 2).

  The thickness t of the heat radiating fin (5) in the heat radiating portion (8) fitted into the fin mounting groove (30) and the protrusion (32) of the groove forming member (31) is 1.5 mm or more. It is preferable that

  In addition, although the illuminating device used as a construction site searchlight may be constituted by the LED illumination heat dissipation device (1) and the LED illumination of the present invention, in this case, the LED illumination is white or light bulb color. Of light.

  The LED illumination heat dissipation device according to the present invention is used to efficiently dissipate heat generated from the LED in the high power consumption type LED illumination.

(1): Radiator for LED lighting
(2): LED lighting mounting plate
(3): Lighting mounting surface
(4): Heat transfer surface
(5): Radiating fin
(6): LED lighting
(7): Base part
(8): Heat radiation part
(10) (20) (30): Fin mounting groove
(10a) (20a) (30a): Bottom
(10b) (20b) (30b): Side view
(11): Heat pipe section
(12): Hydraulic fluid sealing circuit
(16): Lighting device
(21): Projection
(31): Groove forming member
(32): Projection
(33): Flat plate

Claims (14)

An LED illumination mounting plate made of a heat conductive material and having one surface as an illumination mounting surface to which LED lighting is mounted and the other surface as a heat transfer surface, and a flat base portion and a base portion integrally projecting upward And a plurality of heat radiation fins disposed on the heat transfer surface of the LED illumination mounting plate so that the heat radiation portions are spaced from each other. Mounting grooves are formed at a distance from each other, a hollow hydraulic fluid enclosing circuit is formed in the heat dissipating portion of the radiating fin, and a heat pipe is provided by enclosing the operating fluid in the operating fluid enclosing circuit, Each heat dissipating fin is located in a state where the heat pipe portion is located outside the fin mounting groove and the base portion and the portion near the base portion in the heat dissipating portion are fitted in the fin mounting groove. D Lighting Mounting LED lighting heat dissipation device is secured to the plate. 2. A heat dissipation device for LED lighting according to claim 1, wherein the base portion of the heat dissipating fin is in contact with the bottom surface of the fin mounting groove, and the portion fitted in the fin mounting groove in the heat dissipating portion is in contact with the side surface of the fin mounting groove. . The LED illumination mounting plate according to claim 1 or 2, wherein the heat transfer surface of the LED illumination mounting plate is recessed so that a plurality of recessed grooves are formed in parallel to each other, and each recessed groove is a fin mounting groove. Heat dissipation device. On the heat transfer surface of the LED lighting mounting plate, a plurality of pairs of upwardly protruding ridges that are paired with each other are provided at intervals so that all the ridges are parallel to each other. The heat dissipation device for LED lighting according to claim 1 or 2, wherein each fin mounting groove is formed by two pairs of ridges and a portion between the two ridges of the pair of ridges on the LED lighting mounting plate. A plurality of parallel projections formed on the heat transfer surface of the LED lighting mounting plate separately from the LED lighting mounting plate by a thermally conductive material and provided integrally on both side edges of the flat plate and the flat plate. A U-shaped groove forming member having a U-shaped cross section is fixed at a distance from each other so that all protrusions are parallel to each other, and each fin mounting groove is formed by both protrusions and a flat plate of each groove forming member. The heat dissipation device for LED illumination according to 1 or 2. The LED illumination heat dissipation device according to claim 4 or 5, wherein a thickness of a portion of the heat dissipating portion of the heat dissipating fin fitted into the fin mounting groove and a protrusion of the fin mounting groove is 1.5 mm or more. The base part of the radiating fin is a vertical rectangle, the radiating part is provided on the two long sides of the base part, the radiating fin is U-shaped as a whole, and the part near the base part in both radiating parts is in the fin mounting groove The heat dissipating device for LED lighting according to any one of claims 1 to 6, which is fitted. Extends in the front-rear direction on either side of the fin mounting groove of the LED lighting mounting plate, or on the surface facing the outside of the fin mounting groove in the fin mounting groove of both heat radiation portions of the heat radiation fin The heat radiation device for LED lighting according to claim 7, wherein a convex portion is provided integrally, and a concave portion is formed on the other side so as to extend in the front-rear direction and fit the convex portion. The LED heat dissipating device according to claim 7 or 8, wherein the heat dissipating portions of the heat dissipating fins are provided with heat pipe portions independent of each other. The heat dissipating fin is formed by bending a substrate made by joining two metal plates in a laminated shape into a U shape, and the hydraulic fluid enclosing circuit of the heat pipe part of the heat dissipating part forms the substrate The heat radiating device for LED lighting according to claim 9, wherein at least one of the two metal plates is provided by bulging outward. The space | interval between both the thermal radiation parts of a thermal radiation fin is 7 mm or more, The thermal radiation apparatus for LED lighting in any one of Claims 7-10. The length of the long side of the base part of the heat radiating fin is 200 mm or more, the heat radiating part is provided over the entire length of the long side of the base part, and the linear distance from the base part to the tip of the heat radiating part is 50 mm or more. Item 12. A heat dissipation device for LED illumination according to any one of Items 7 to 11. The heat dissipation device for LED lighting according to claim 12, wherein a dimension in a direction orthogonal to the longitudinal direction of the base portion of the heat radiation fin in the LED lighting mounting plate is 200 mm or more. The LED illumination heat dissipating device according to claim 1, and the LED illumination attached to the illumination attachment surface of the LED illumination attachment plate of the LED illumination heat dissipating device and having a plurality of LEDs as a light source. A lighting device comprising:

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