KR101267841B1 - Test handler and method for loading and unloading semiconductor device using the same - Google Patents

Abstract

The present invention relates to a test handler, comprising: a test unit for testing an electrical quality of a semiconductor device to be tested; A loading unit supplying the semiconductor device under test to the test unit; An unloading unit configured to discharge the tested semiconductor device from the test unit and to classify the semiconductor device according to a test result according to a test result; And a tray transfer device configured to transfer the customer tray loaded with the semiconductor device under test to the loading unit and to recover the customer tray loaded with the semiconductor device under test from the unloading unit. A first loading arm for transferring the customer tray loaded with the semiconductor device under test to a supply position provided in the loading unit, a second loading arm for recovering an empty customer tray from the supply position, and a discharge position provided in the unloading unit And a first unloading arm for transferring an empty customer tray to the second unloading arm for recovering the customer tray loaded with the tested semiconductor device from the discharge position.

According to the present invention, four arms are provided in the supply position and the discharge position, respectively, each arm responsible for the transfer and recovery of the customer tray, so that the waiting time can be eliminated to avoid interference between the arms. The customer tray can be withdrawn from the discharge position and subsequently transferred to another customer tray. In addition, it is possible to simultaneously settle and transfer the semiconductor device to the loading and unloading buffer part, thereby improving the unit per hour (UPH) by increasing the supply and discharge rate of the semiconductor device to the test part. .

Test Handlers, Trays, Semiconductors

Description

Test handler and method for loading and unloading semiconductor device using the same}

The present invention relates to a test handler, and more particularly, to improve the transfer and withdrawal speed of the customer tray to the supply position and the discharge position, and to simultaneously mount and transfer the semiconductor element to the loading and unloading buffer unit. It's about a test handler that can improve hourly production.

In a general semiconductor device post-manufacturing process, a plurality of semiconductor chips cut from a wafer and separated separately are attached to an auxiliary substrate, and then the semiconductor device is completed by wrapping the outside with a molding material. The electrical performance is tested at various temperatures down to low temperatures.

This test process is performed by a test handler including a tray transferring apparatus (TTA) and a tester (TTR) as shown in FIGS. 1 and 2.

The tray feeder (TTA) provided in the conventional test handler forms a substructure of the test handler, and transfers a customer tray (CT) loaded with the semiconductor device to be tested to a supplying position (SP) of the tester. In addition, the customer tray CT on which the tested semiconductor device is seated is recovered from a discharging position (DP) of the tester.

The tray feeder TTA includes a loading stacking unit 11, a loading seating unit 12, an unloading seating unit 13, an unloading stacking unit 14, a check unit 15, and an empty tray stacking unit ( 16) and a transfer arm 17.

The loading stacking unit 11 is a place where the customer tray CT on which the test target semiconductor device is loaded is stored, and the loading seating unit 12 has the customer tray CT of the loading stacking unit 11 mounted thereon. It is delivered to the supply point (SP). The loading seating part 12 is provided to be elevated and lowered, and the customer tray CT is seated by the transfer arm 17, and ascends to transfer the customer tray CT to the supply position SP. .

The unloading seating part 13 is a place where the empty customer tray CT in which the tested semiconductor devices are divided by grades and in which predetermined predetermined class semiconductor devices are seated is located. The unloading seating part 13 is provided to be elevated as with the loading seating part 12.

Then, the unloading seating portion 13 is lowered when all the tested semiconductor devices are loaded in the empty customer tray CT at the discharge position DP, and then the transfer arm 17 is unloading seating portion 13. The customer tray CT seated in the is stored in the unloading stacking unit 14.

The unloading loading part 14 is a place where the customer tray CT of the unloading seating part 13 is classified and stored according to the grade of the tested semiconductor device loaded therein.

The verification unit 15 determines whether the semiconductor device remains in the empty customer tray CT remaining after all the test target semiconductor devices loaded in the customer tray CT delivered to the supply position SP are supplied to the tester. Check it. The empty customer tray CT which has been confirmed is transferred to the empty tray stacking unit 16 by the transfer arm 17 and stored. Thereafter, the empty customer tray CT of the empty tray stacking portion 16 is transferred to the unloading seating portion 13 by the transfer arm 17.

The transfer arm 17 is between the loading and unloading stacking sections 11 and 14, the loading and unloading seating sections 12 and 13, the checking section 15, and the empty tray stacking section 16 as described above. To move the customer tray (CT).

On the other hand, the above-described tester (TTR) forms an upper structure of the test handler, the loading picker 21, the loading buffer unit 22, the test unit 23, the unloading picker 24, and the unloading buffer unit 25 ).

The loading picker 21 transfers the test target semiconductor device loaded and transferred to the customer tray CT to an empty test tray (TT) via the loading buffer unit 22.

The test unit 23 performs an electrical performance test on the test target semiconductor device loaded in the test tray TT. Then, when the test is completed, the unloading picker 24 is loaded in the test tray TT, and the empty customer tray CT at the discharge position DP through the unloading buffer unit 25 through the unloading buffer unit 25. To load).

Thereafter, the customer tray CT on which the tested semiconductor element is loaded is recovered from the discharge position DP by the tray feeder TTA as described above.

In the conventional test handler as described above, one of the transfer arms 17 is responsible for the transfer and recovery of the customer tray CT to the supply position SP and the discharge position DP. There is a problem of slow delivery and recovery.

Recently, in order to solve this problem, a test handler having two transfer arms 17 has been developed, but in this case, one of the transfer arms 17 is used to avoid interference with another transfer arm 17. Since there is a waiting time, there is a limit to increasing the transfer and recovery speed of the customer tray CT, which prevents the use of a tester which has recently improved the speed of semiconductor device test faster.

In the conventional test handler, the loading buffer unit 22 includes one loading buffer unit 22, and one loading picker 21 loads the test target semiconductor device loaded on the customer tray CT at the supply position SP. 22) After transporting and seating, transfer to empty test tray (TT). Therefore, the loading picker 21 may not simultaneously carry the transfer to the test tray TT when the semiconductor element is transferred to the loading buffer unit 22.

Similarly, the unloading buffer unit 25 is also provided as one, and one unloading picker 24 transfers and seats the tested semiconductor device loaded on the test tray TT to the unloading buffer unit 25 and then discharges it. Transfer it to the empty customer tray CT of the position DP. Therefore, the unloading picker 24 cannot simultaneously transfer the semiconductor device to the customer tray CT when the semiconductor device is transferred to the unloading buffer unit 25.

As described above, the conventional test handler has a slow transfer and recovery rate of the customer tray CT with respect to the supply position SP and the discharge position DP, and the transfer speed of the semiconductor element by the loading and unloading pickers 21 and 24. There is a limitation as described above for improvement. Therefore, the speed of supplying the semiconductor device under test to the test unit 23 and the speed of discharging the tested semiconductor device from the test unit 23 are slow, resulting in a problem of poor unit per hour (UPH) of the test handler. have.

In order to solve the problems as described above, the present invention can eliminate the waiting time to avoid the interference between the arm responsible for the transfer and recovery of the customer tray to the supply position and discharge position, respectively, from the supply position or discharge position The present invention provides a test handler capable of continuously transferring another customer tray after recovering the customer tray and a method of discharging a semiconductor device using the same.

Another object of the present invention is to provide a test handler capable of simultaneously mounting and transferring a semiconductor device to a loading / unloading buffer unit and a method of discharging a semiconductor device using the same.

In order to solve the above problems, the test handler of the present invention includes a test unit for testing the electrical integrity of the test target semiconductor device; A loading unit supplying the semiconductor device under test to the test unit; An unloading unit configured to discharge the tested semiconductor device from the test unit and to classify the semiconductor device according to a test result according to a test result; And a tray transfer device configured to transfer the customer tray loaded with the semiconductor device under test to the loading unit and to recover the customer tray loaded with the semiconductor device under test from the unloading unit. A first loading arm for transferring the customer tray loaded with the semiconductor device under test to a supply position provided in the loading unit, a second loading arm for recovering the empty customer tray from the supply position, and an discharge unit provided in the unloading unit And a first unloading arm for delivering an empty customer tray to a position, and a second unloading arm for recovering the customer tray loaded with the tested semiconductor device from the discharge position.

The loading unit includes a first and a second loading buffer unit in which the test target semiconductor elements loaded in the customer tray at the supply position are seated and aligned, and the test target semiconductor devices loaded in the customer tray in the first and second loads. And a first loading picker for transferring and seating the loading buffer unit, and a second loading picker for transferring and seating the semiconductor device seated on the first and second loading buffer units in the test tray carried in the test unit. .

The first and second loading buffer units may be provided to reciprocately move between the supply position and the test unit and to alternate positions.

The first and second loading pickers may be provided to transfer 32 semiconductor elements at a time.

The unloading unit may include: first and second unloading buffer parts in which the semiconductor devices tested in the test part are aligned and seated, and the test-completed semiconductor devices loaded in a test tray and taken out from the test part. A second unloading picker for transferring and seating the second unloading buffer unit, and a second unloading picker for transferring and seating the semiconductor element of the first and second unloading buffer units to the empty customer tray at the discharge position; Can be.

The first and second unloading buffer units may be provided to reciprocately move positions between the test unit and the discharge position.

The first and second unloading pickers may be provided to transfer 32 semiconductor elements at a time.

In the semiconductor device supply and discharge method of the present invention, (a) the customer tray loaded with the semiconductor device to be tested is transferred to the supply position of the loading portion by the first loading arm, (b) the semiconductor device of the customer tray Transported by one loading picker and aligned and seated in any one of the first and second loading buffer sections, (c) an empty customer tray remaining after the semiconductor device is transported is recovered from the supply position by the second loading arm (D) transferring the empty customer tray to the discharge position of the unloading unit by the first unloading arm, and (e) discharging from the test unit to any one of the first and second unloading buffer units. Transfer of the seated test-completed semiconductor device to the empty customer tray at the discharge position by a second unloading picker; and (f) the loaded tester loaded with the semiconductor device. Recovering the customer tray from the discharge position by a second unloading arm.

The step (b) may include: loading the test target semiconductor device seated on the other of the first and second loading buffer parts by a second loading picker and loading the test tray to be supplied to the test part; and The first and second loading buffer parts may include the step of position alternate with each other.

In the semiconductor element supply and discharge method, the first and second loading pickers each transfer 32 of the semiconductor elements at a time.

In the step (e), the tested semiconductor device loaded on the test tray and discharged from the test unit is seated on the other one of the first and second unloading buffer units by a first loading picker, and the The first and second unloading buffer parts may include a step alternate with each other.

In the semiconductor element supply and discharge method, the first and second unloading pickers transfer 32 semiconductor elements at a time.

According to the test handler of the present invention and the method for discharging a semiconductor device using the same, four arms are provided at the supply position and the discharge position, respectively, one arm that is responsible for the transfer and recovery of the customer tray, so as to avoid interference between the arms. The waiting time can be eliminated, and the customer tray can be withdrawn from the supply or discharge position and subsequently transferred to another customer tray.

In addition, a pair of loading and unloading buffer units are provided, respectively, so as to alternately position each other by reciprocating between the supply position and the test unit or the test unit and the discharge position. A second loading picker for transferring and loading the semiconductor device of the loading buffer unit into an empty test tray, a first unloading picker for seating the semiconductor element of the test tray in the unloading buffer unit, and a semiconductor device of the unloading buffer unit Four pickers of the second unloading picker for transfer loading to the empty customer tray are provided to simultaneously carry out mounting and transfer of the semiconductor device to the loading and unloading buffer unit.

Therefore, by supplying the test target semiconductor device to the test unit and by increasing the discharge rate of the tested semiconductor device it is possible to improve the output per hour.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Hereinafter, with reference to the accompanying Figures 3 and 4, the configuration and effect of the test handler according to a preferred embodiment of the present invention will be described in detail.

The test handler of the present invention includes a tray transferring apparatus (TTA) and a tester (TTR).

The tray transfer device (TTA) forms a lower structure of the test handler, transfers a customer tray (CT; Customer tray) loaded with a test target semiconductor device to a supplying position (SP; supplying position) of the tester, and the tested semiconductor device. The customer tray CT which has been seated is recovered from the discharge position DP of the tester.

In a preferred embodiment of the present invention, the tray feeder TTA is largely divided into a loading area 100 and an unloading area 200.

The loading area 100 is a place where a means for transferring and recovering the customer tray CT on which the semiconductor device is loaded is installed at the supply position SP. The loading area 100, the loading seating part 120, and the confirmation area are installed. The unit 130, the first loading arm 140, and the second loading arm 150 are installed.

The loading stack 110 stores a customer tray CT loaded with a semiconductor device under test.

The loading seating part 120 is a place where the customer tray CT on which the test target semiconductor device of the loading stacking part 110 is loaded is seated and delivered to the supply position SP. The loading seating unit 120 is provided to be able to move up and down, and the customer tray CT is seated by the first loading arm 140 in the lowered state, and ascends, thereby raising the customer tray CT to the tester loading area TLA. To pass).

The verification unit 130 checks whether the semiconductor device remains in the empty customer tray CT recovered from the supply position SP. The checker 130 flips the recovered empty customer tray CT and discharges the remaining semiconductor device downward when the semiconductor device remains.

The empty customer tray CT which has been confirmed by the checking unit 130 is an empty tray stacking unit provided in the unloading area 200 described later by a horizontal transfer unit (not shown) provided in the checking unit 130. Sliding to 210. As such, the horizontal transfer unit for slidingly conveying the empty customer tray CT supports the customer tray CT and pushes the guide rail and the empty customer tray CT for guiding the transfer to the empty tray loading part 210. (Pusher) can be made.

The horizontal transfer unit, in addition to the configuration of the guide rail and the pusher as described above, any element capable of horizontally transferring the customer tray CT in one direction may be easily adopted. The configuration of the horizontal transfer unit, as those skilled in the art can easily be combined as a detailed description thereof will be omitted.

The first loading arm 140 seats the customer tray CT loaded with the test target semiconductor device stored in the loading stacking unit 110 on the loading seating unit 120.

The second loading arm 150 has a test target semiconductor device of the customer tray CT delivered to the supply position SP supplied to a test part TP provided in the tester TTR for a test process. Thereafter, the remaining empty customer tray CT is recovered from the loading seating unit 120 and transferred to the checking unit 130.

That is, the loading seating unit 120 descends with the empty customer tray CT remaining after the test target semiconductor device loaded in the customer tray CT is supplied to the test unit TP. The second loading arm 150 recovers the empty customer tray CT of 120.

As described above, the first and second loading arms 140 and 150 move only in the loading area 100 to transfer and retrieve the tray CT.

The unloading area 200 described above transfers the empty customer tray CT to the discharge position DP or discharges the tray CT on which the tested semiconductor device discharged from the test part TP is loaded. ), The empty tray stacking portion 210, the unloading seating portion 220, the unloading stacking portion 230, the first unloading arm 240, and the second unloading arm. 250 is installed.

The empty tray stacking unit 210 is a place where the empty customer tray CT, which has been confirmed by the identification unit 130, is transferred and stored. The empty tray stacking unit 210 is provided between the loading stacking unit 110 and the unloading stacking unit 230 together with the identification unit 130. The empty customer tray CT of the empty tray stacking unit 210 is transferred to the unloading seating unit 220 and used to transport the tested semiconductor device.

Therefore, when the positions of the check unit 130 and the empty tray stacking unit 210 are provided in this way, the loading stacking unit 110 passes through the check unit 130 and the empty tray stacking unit 210 to unload the stacking unit. There is an advantage to minimize the transfer path of the customer tray (CT) to 230.

The unloading seating part 220 is a place where the empty customer tray CT in which the tested semiconductor device is classified and loaded according to a predetermined grade is positioned. The unloading seating part 220 is provided to be elevated as in the loading seating part 120.

The unloading seating portion 220 raises the empty customer tray CT and transfers it to the discharge position DP. When the unloaded seating part 220 is loaded in the empty customer tray CT, the unloading seating portion 220 lowers the customer tray CT. Recover from discharge position DP.

The unloading loading part 230 is a place where the customer tray CT located in the unloading seating part 220 thus lowered is transferred and stored by the second unloading arm 250. The unloading stacker 230 includes a plurality of stackers capable of storing the customer trays CT, and the customer trays CT in which semiconductor devices of the same grade are loaded are stored separately for each stacker.

The first unloading arm 240 transports the empty customer tray CT located in the empty tray stacking unit 210 to be seated on the unloading seating unit 220. The empty customer tray CT rises in a state of being seated on the unloading seating part 220 and is transferred to the discharge position DP so that the tested semiconductor device can be loaded.

When the unloading seat 220 lowers the customer tray CT on which the unloaded seat 220 is loaded, the second unloading arm 250 recovers the customer tray CT from the unloading seat 220. To store in the unloading stacking unit 230. At this time, the customer tray CT is stored in the corresponding stacker of the unloading stacking unit 230 according to the grade of the tested semiconductor device loaded in the customer tray CT.

As described above, the first and second unloading arms 240 and 250 move only in the unloading area 200 to transfer and retrieve the customer tray CT.

In general, the operation of recovering and transferring the customer tray CT to the loading seating unit 120 and recovering and transferring the customer tray CT to the unloading seating unit 220 is continuously performed.

However, as shown in the present invention, the first and second loading arms 140 and 150 are transferred to and retrieved from the customer tray CT to the loading seat 120, and the first and second unloading arms 240 and 250 are moved. In the case of transferring and retrieving the customer tray CT to the unloading seating unit 220, the first loading arm 140 or the first unloading arm 240 grips the customer tray CT to be delivered in advance. Then, when the second loading arm 150 or the second unloading arm 250 recovers the customer tray CT, the customer tray CT that has been gripped can be delivered immediately, thereby transferring and recovering the customer tray CT. Can be improved.

Meanwhile, the above-described tester TTR transfers and loads a test target semiconductor device loaded on a tray into an empty test tray (TT), and performs electrical performance on the test target semiconductor device loaded on the test tray TT. Perform the test. When the test is completed, the tested semiconductor device is moved back to the customer tray CT. As illustrated in FIG. 4, the tester TTR is largely divided into a loading unit 300, a test unit TP, and an unloading unit 400.

The loading unit 300 moves the test target semiconductor device loaded and loaded on the customer tray CT to the test tray TT, and mounts the test tray TT on which the test target semiconductor device is loaded. To feed. The loading unit 300 includes a first loading buffer unit 310, a second loading buffer unit 320, a first loading picker 330, and a second loading picker 340.

The first and second loading buffer units 310 and 320 align the intervals between the test target semiconductor devices when the test target semiconductor devices loaded on the customer tray CT are transferred to the test tray TT. At this time, it also serves to confirm that the semiconductor device under test is not loaded in a place where the semiconductor device at a specific position is continuously judged to be defective due to an abnormal device.

The first and second loading buffer sections 310 and 320 are respectively located adjacent to the supply position SP or adjacent to the test section TT in which the empty test tray TT is located. In the area adjacent to the supply position SP, the test target semiconductor element loaded in the customer tray CT is transferred to the first and second loading buffer parts 310 and 320 and placed adjacent to the test part TT. In this case, an operation is performed in which the test target semiconductor device seated on the first and second loading buffer units 310 and 320 is transferred to the test tray TT.

In this case, the first and second loading buffer units 310 and 320 are provided so as to alternate positions. That is, when the first loading buffer unit 310 is positioned adjacent to the supply position SP and the semiconductor device under test is seated therein, the second loading buffer unit 320 is adjacent to the test unit TT. The test target semiconductor device, which is positioned in the same position and is mounted therein, is transferred to the test tray TT.

The first loading picker 330 transfers and seats the test target semiconductor device loaded on the customer tray CT at the supply position SP to the first and second loading buffer units 310 and 320.

The second loading picker 340 transfers and loads the test target semiconductor device mounted on the first and second loading buffer units 310 and 320 to the test tray TT.

The first and second loading pickers 330 and 340 are provided to pick up 32 semiconductor devices at a time to quickly transfer the semiconductor devices under test.

The structure of the first and second loading buffers 310 and 320 and the first and second loading pickers 330 and 340 may be a test tray (eg, a semiconductor device). Compared with the conventional technology in which the test target semiconductor device of the customer tray cannot be transferred and waited when being transferred to the TT), the first and second loading buffer units 310 and 320 are alternated in position, and thus, the first ㆍ Except when the second loading buffer unit 310 or 320 is transferred, the test target semiconductor device of the customer tray CT and the test target semiconductor device of the loading buffer unit 310 or 320 are continuously transferred to the test unit. It greatly improves the speed of supplying semiconductor devices to (TP).

The test unit TP described above performs an electrical test on the test target semiconductor device loaded on the test tray TT supplied by the loading unit 300 at various temperatures.

The unloading unit 400 classifies the test-complete semiconductor devices loaded on the test tray TT discharged from the test unit TP by grade and transfers them to the customer tray CT at the discharge position DP for testing. It serves to recover the completed semiconductor device. The unloading unit 400 includes a first unloading buffer unit 410, a second unloading buffer unit 420, a first unloading picker 430, and a second unloading picker 440. .

The first and second unloading buffer units 410 and 420 align the gaps between the tested semiconductor devices when the test semiconductor devices loaded on the test tray TT are transferred to the customer tray CT. In this case, the test completed semiconductor devices are classified and seated by class, so that the test completed semiconductor devices may be classified by each class and loaded on the customer tray CT.

The first and second unloading buffer parts 410 and 420 are respectively located near the test part TT from which the test tray TT is discharged and adjacent to the discharge position DP. In the area adjacent to the test part TT, the test-complete semiconductor element loaded on the test tray TT is transferred to the first and second unloading buffer parts 410 and 420, and is adjacent to the discharge position DP. At this point, a work is carried out in which the tested semiconductor element seated in the first and second unloading buffer parts 410 and 420 is transferred to the customer tray CT.

In this case, the first and second unloading buffer units 410 and 420 are provided to be alternately positioned in the above-described two places in the same form as the first and second loading buffer units 310 and 320. That is, when the first unloading buffer unit 410 is positioned adjacent to the test unit TP and the tested semiconductor device is seated therein, the second unloading buffer unit 420 is disposed at the discharge position DP. The test-complete semiconductor device positioned in the vicinity of and positioned inside is transferred to the customer tray CT.

The first unloading picker 430 transfers and seats the tested semiconductor device loaded on the test tray TT discharged from the test part TP to the first and second unloading buffer parts 410 and 420. At this time, through the test results, the test completed semiconductor devices are classified and transported by grade.

The second unloading picker 440 classifies and classifies the test target semiconductor devices mounted on the first and second loading buffer units 410 and 420 into the corresponding customer tray CT.

The first and second unloading pickers 430 and 440 are provided to pick up 32 semiconductor devices at a time, thereby quickly transferring the tested semiconductor devices.

The structure of the first and second unloading buffer parts 410 and 420 and the first and second unloading pickers 430 and 440 is such that the tested semiconductor elements of the unloading buffer part are transferred to the customer tray CT. The first and second unloading buffer parts 410 and 420 are alternately positioned in the first and second languages for the position alternation, compared to the conventional technology in which the test tray of the test tray has to be waiting for transfer and loading. Except when the loading buffer units 410 and 420 are transferred, the tested semiconductor element of the test tray and the tested semiconductor element of the unloading buffer unit are continuously transferred to increase the semiconductor element discharge rate to the test unit TP. Greatly improve.

Hereinafter, a semiconductor device supply and discharge method according to a preferred embodiment of the present invention using the test handler will be described in detail with reference to FIG. 5.

First, the customer tray CT loaded with the semiconductor device under test is transferred from the loading loading unit 110 to the supply position SP by the first loading arm 140 (S100). Next, the test target semiconductor device of the customer tray CT positioned at the supply position SP is moved to the first loading buffer unit 310 positioned adjacent to the supply position SP by the first loading picker 330. The transport is seated (s150). The empty customer tray CT remaining after all the test target semiconductor devices are transferred is recovered to the identification unit 130 by the second loading arm 150 (S200).

When all the semiconductor devices to be tested are transferred and seated in the first loading buffer unit 310, the first and second loading buffer units 310 and 320 are exchanged with each other (S250). At this time, the second loading buffer unit 320 is in a state where all of the test target semiconductor elements inside the test unit TP are transferred to the test tray TT and are empty. After the position exchange, the first loading picker 330 transfers the test target semiconductor device to the empty second loading buffer unit 320.

Meanwhile, when the first loading buffer unit 310 is positioned adjacent to the test unit TP where the second loading buffer unit 320 is located, the second loading picker 340 is the first loading buffer unit 310. The test target semiconductor device seated on the transfer tray TT is loaded (s300). Next, when all the test target semiconductor devices are seated on the test tray TT, the corresponding test tray TT is supplied to the test unit TP to perform the test process (S350).

After the test process is performed, the test tray TT in which the test completed semiconductor device is loaded is discharged from the test unit TP (S400). Thereafter, the tested semiconductor devices loaded in the test tray TT are classified by grade into a first unloading buffer unit 410 located near the test unit TP by the first unloading picker 430. The transport is seated (s450).

Subsequently, when all the tested semiconductor devices are seated in the first unloading buffer unit 410, the first and second unloading buffer units 410 and 420 are interchanged with each other (S500). At this time, the second unloading buffer unit 420 is in a state where all of the tested semiconductor devices inside the second unloading buffer unit 420 are transferred to the customer tray CT and are empty. After the position exchange, the first unloading picker 430 transfers and seats the tested semiconductor device to the empty second unloading buffer unit 420.

Meanwhile, the empty customer tray CT is transferred to the discharge position DP by the first unloading arm 240 at the discharge position DP (S550). In addition, when the first unloading buffer unit 410 is positioned near the discharge position DP where the second unloading buffer unit 420 was located, the second unloading picker 440 is the first unloading buffer. In operation S600, the tested semiconductor devices seated in the unit 310 are transferred to the empty customer tray CT corresponding to the corresponding grade of the discharge position DP in a state classified by grades (S600).

Thereafter, the customer tray CT in which all of the tested semiconductor devices in the discharge position DP are loaded is recovered by the second unloading arm 250 from the discharge position DP to the unloading loading unit 230 ( s650).

In the present invention, the first and second loading buffer units 310 and 320 and the first and second unloading buffer units 410 and 420 each play the same role as each other. The contents of the first and second loading buffer sections 310 and 320 may be replaced with each other, or the first and second unloading buffer sections 410 and 420 may be replaced with each other.

That is, the first and second loading buffer sections 310 and 320 and the first and second unloading buffer sections 410 and 420 alternate with each other in accordance with the positional alternation of the process of seating and transferring the semiconductor device. It is provided to be made.

Through this, the semiconductor device supply and discharge method of the present invention can greatly increase the supply and discharge rate of the semiconductor device to the test unit.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical spirit of the present invention, and such modifications and variations belong to the appended claims. will be.

1 is a front view schematically showing the infrastructure of a conventional test handler,

2 is a plan view schematically showing a superstructure of a conventional test handler;

3 is a front view schematically showing the infrastructure of a test handler according to a preferred embodiment of the present invention;

4 is a plan view schematically showing the superstructure of the test handler according to the preferred embodiment of the present invention;

5 is a flowchart illustrating a method of discharging a semiconductor device supply according to a preferred embodiment of the present invention.

＊ Explanation of symbols for main part of drawing ＊

100: loading area 110: loading loading part

120: loading seat 130: check unit

140: first loading arm 150: second loading arm

200: unloading area 210: empty tray loading portion

220: unloading seating portion 230: unloading loading portion

240: first unloading arm 250: second unloading arm

300: loading unit 310: first loading buffer unit

320: second loading buffer unit 330: first loading picker

340: second loading picker 400: unloading unit

410: first unloading buffer unit 420: second unloading buffer unit

430: first unloading picker 440: second unloading picker

CT: Customer Tray TT: Test Tray

SP: Supply Position DP: Discharge Position

TP: Test Part TTA: Tray Feeder

TTR: Tester

Claims (12)

A test unit for testing an electrical quality of the test target semiconductor device; A loading unit supplying the semiconductor device under test to the test unit; An unloading unit for discharging the tested semiconductor device from the test unit and classifying the semiconductor device according to a grade according to a test result; And And a tray transfer device configured to transfer the customer tray loaded with the semiconductor device under test to the loading unit, and recover the customer tray loaded with the semiconductor device under test from the unloading unit. The tray feeder, A first loading arm transferring the customer tray loaded with the semiconductor device under test to a supply position provided in the loading unit; A second loading arm for recovering the empty customer tray from the supply position; A first unloading arm for transferring the empty customer tray to a discharge position provided in the unloading unit; A second unloading arm for recovering the customer tray loaded with the semiconductor element tested from the discharge position; The loading unit, First and second loading buffer sections in which the semiconductor device to be tested loaded on the customer tray at the supply position is seated and aligned; A first loading picker which transfers and seats the semiconductor device under test loaded on the customer tray to the first and second loading buffers; And And a second loading picker for transporting and seating the semiconductor device seated on the first and second loading buffer parts to a test tray carried in the test part. The unloading unit, First and second unloading buffer units in which the semiconductor elements tested in the test unit are aligned; A first unloading picker which is loaded on a test tray and transported to the first and second unloading buffer parts to be seated on the test-completed semiconductor element taken out from the test part; And And a second unloading picker for transferring and seating the semiconductor element in the first and second unloading buffer sections to an empty customer tray at the discharge position. delete The method of claim 1, The first and second loading buffer unit, And the test handler reciprocating between the supply position and the test part and being alternately positioned. The method of claim 1, The first and second loading picker, The test handler, characterized in that for transporting 32 semiconductor elements each at a time. delete The method of claim 1, The first and second unloading buffer parts, The test handler, characterized in that the position alternates between the test portion and the discharge position reciprocating. The method of claim 1, The first and second unloading picker, The test handler, characterized in that for transporting 32 semiconductor elements each at a time. In the method for supplying and discharging the semiconductor device to the test unit of the test handler for testing the electrical integrity of the semiconductor device, (a) transferring the customer tray loaded with the semiconductor device under test to a supply position of the loading unit by a first loading arm; (b) transferring the semiconductor device of the customer tray by a first loading picker and aligning and seating in one of the first and second loading buffer parts; (c) recovering the empty customer tray remaining after the semiconductor device is transferred from the supply position by a second loading arm; (d) transferring the empty customer tray to a discharge position of the unloading part by a first unloading arm; (e) testing the semiconductor device, which is discharged from the test part and seated in one of the first and second unloading buffer parts, and is transferred to the empty customer tray at the discharge position by a second unloading picker; ; And (f) recovering the customer tray loaded with the tested semiconductor device from the discharge position by a second unloading arm; Semiconductor device supply discharge method comprising a. 9. The method of claim 8, In step (b), A step in which the test target semiconductor device seated on the other of the first and second loading buffer units is transferred to a test tray to be supplied by the second loading picker to the test unit; And Positioning the first and second loading buffer portions alternately with each other; The semiconductor device supply and discharge method comprising a. 10. The method of claim 9, The first and second loading picker, And discharging 32 semiconductor devices at a time. 9. The method of claim 8, In step (e), Placing the test-completed semiconductor device loaded on a test tray and discharged from the test unit, on the other of the first and second unloading buffer units by a first unloading picker; And Positioning the first and second unloading buffer portions alternately with each other; The semiconductor device supply and discharge method comprising a. 12. The method of claim 11, The first and second unloading picker, And discharging 32 semiconductor devices at a time.

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