KR101312004B1 - The handler for high-speed test of the semiconductor device of high temperature - Google Patents

Abstract

The present invention relates to a handler for a high temperature test of a semiconductor device, comprising: an open downward loading unit loaded with trays containing semiconductor devices to be installed and tested on a front surface of a handler; A shuttle type preheater in which a loading picker loads a material in a process of advancing a tray containing a semiconductor device; A tray transfer robot and a rail unit which transfers the empty tray to the stacking position of the empty tray when all the elements of the tray are picked up and loaded on the shuttle type preheater and the elements of the tray are exhausted; A sorting picker robot unit for sorting the material loaded on the shuttle-type preheater on a set plate; A contactor unit which picks up material from the shuttle type preheater to a socket of a tester and transfers and contacts the socket on the set plate; A guide pin mask unit which picks up material from the shuttle type preheater and enters a test socket and guides the contactor when placing the material in the shuttle; And a one-touch blade block installed in the contactor to press the device to the device transfer and test sockets fixed by the leaf springs.

Description

Handler for high-speed test of the semiconductor device of high temperature}

The present invention relates to a handler for a high temperature test of a semiconductor device, and more particularly, to improve productivity per unit time by operating a semiconductor device at a high speed, to minimize the cost of a change kit that should be provided for each semiconductor device, and to be unstable. A system and method for minimizing productivity degradation of a test socket stop or maintenance by contact.

Regarding the technology for conducting a high temperature test of a conventional semiconductor device, a number of applications and publications other than Korean Patent Publication No. 10-2000-0050480 (hereinafter referred to as "prior document") have been disclosed.

A preheating apparatus of a semiconductor device handler system for preheating a semiconductor device to a suitable temperature prior to testing, according to the prior document.

The test of the semiconductor device is mainly performed by a "semiconductor device handler system". In the conventional semiconductor device handler system, a semiconductor device is supplied from a tray loader in which a tray containing a semiconductor device is stacked, and a tray loader is pre-loaded at a temperature suitable for testing. A preheating unit for pre-heating, a test facility for testing a preheated semiconductor device, and a sorter unit for sorting a good result semiconductor device and a defective semiconductor device.

The preheating unit, which is a component of the semiconductor device handler system having such a configuration, has already been developed and applied. For example, a heating chamber may be used as a loading buffer to heat a semiconductor device to be tested to a test temperature condition, or a single preheater block containing a predetermined number of semiconductor devices to be tested from a tray loader is transferred to a test facility. There may be a pre-heating unit method, but this has the problem that the volume of equipment, the configuration of the system is complicated, and the process time required to perform the test process is greatly increased.

The prior art document includes a preheater unit for preheating and transferring a semiconductor device from a tray loader to a test facility, wherein the preheater unit is a first step in which a height displacement is generated by the height displacement generating means during transfer from the tray loader to the test facility. The preheater block, the second preheater block and the first preheater unit and the second preheater unit which are transported intersecting with the first preheater unit having a height displacement without generating the height displacement from the test facility to the tray loader, have the same feed rate. It characterized in that it comprises a pre-heater block drive unit so that the conveying direction is reversed.

Therefore, in the existing methods including the above-mentioned literature, in general, a horizontal handler for testing a semiconductor device before shipment, and a heating plate having a function of aligning the devices before the semiconductor device is subjected to a high temperature test Using the device, the tray is transferred to a heating plate, heated for a specified time, and then transferred to a shuttle for transport to the test site. The shuttle is equipped with guide pins to ensure that the material contacts the socket at the test site accurately. The contactor vacuums the device by inducing the guide pins and inserts the device into the test socket. The test is performed by pressing. When the high temperature test in the above manner takes time to transfer to the heating plate and heating, the production per unit time is reduced compared to the room temperature test of the method of directly transferring the device to the shuttle and inserted into the test socket.

The present invention has been made in view of the above problems and consists of a method for minimizing the reduction in production during the high temperature test and maintaining the same production at room temperature. It also aims to double the output compared to conventional methods.

An object of the present invention is to reduce the production cost of the product by minimizing or minimizing the kit (KIT) used in semiconductor production.

It is an object of the present invention to provide a technique aimed at preventing a device from deteriorating a yield of a test socket due to contact instability during a test by a contactor.

According to an aspect of the present invention, there is provided an open top-down loading unit in which trays containing semiconductor devices to be tested are installed on a front surface of a handler; An unloading unit installed on the right side of the loading unit and mounted with an elevation stacker to load a tray containing semiconductor devices classified after testing; Tray feeder for transferring the element to the shuttle (Tray feeder); A loader picker robot unit for picking up and transferring elements from a tray to a shuttle at a predetermined position of the tray transfer unit; A tray transfer robot and rail unit which transfers the elements of the tray to the stacking position of the empty tray when the elements of the tray are picked up and used up; A test site having a test socket installed at the rear portion of the handler to be electrically connected to an external test device and configured to test a semiconductor device; Forward and reverse shuttle units configured in a two-stage structure in which the device is picked up and transferred to a test contactor position, and the tested device is transferred to a position of an unloading robot; A contactor unit for picking up material from the shuttle to the socket of the tester and transferring the material to the socket; A guide pin mask portion at two positions that picks up material from the shuttle to the test socket and guides the contactor when placing the material in the shuttle; An unloader robot unit which sorts the tested devices and picks them up and transfers them to a tray; A set plate unit for fixing the tray so that the unloader robot classifies the elements; It characterized in that it comprises a stacker tray transfer robot unit for transferring a set plate tray to a sorted loading site and loading an empty tray on a set plate. The picker also includes an automatic picker pad changer that automatically replaces vacuum pads to pick up semiconductor elements; An automatic socket cleaner is included to prevent debris from accumulating in the socket at the test site.

According to the present invention as described above, the production amount of the semiconductor device at room temperature and high temperature by the use of the shuttle type preheater is equal, the shuttle type preheater does not attach the shuttle guide pin by manufacturing in the form of a guide pin mask form The cost of production can be lowered and the size and weight of the shuttle can be reduced. In addition, products within the mask area do not require replacement of the mask, which reduces the compatibility and response time when changing products. In the case of the contactor, the contact characteristics of the semiconductor device are changed according to the horizontal degree of the inclination of the docking plate that fixes the test socket. The contactor is kept horizontal by the spherical bearing and the spring, which has a unique effect of contributing to maintaining the yield.

1 is a plan view schematically showing the configuration of one embodiment of a handler according to the present invention
Figure 2 is a block diagram showing a shuttle-type pre-heater and guide pin mask of the handler according to the present invention
Figure 3 is a block diagram showing a configuration and sorting method of the loading and unloading unit of the handler according to the present invention
Figure 4 is a block diagram for the horizontal structure and adjustment of the contactor arm in the present invention
5 is a block diagram of a one-touch blade block in the present invention

Specific features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings. It is to be noted that the detailed description of known functions and constructions related to the present invention is omitted when it is determined that the gist of the present invention may be unnecessarily blurred.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings.

1 illustrates an embodiment of a loader part of a handler configured to enable high-speed testing of a semiconductor device as described above, and a loading part 2 for loading a tray containing a semiconductor device is provided on the left side of the front part of the handler body 1. A cylinder is installed, in which a tray loaded on the loading section is adapted to move from top to bottom. In order to drive the cylinder, a separate cylinder is provided which distinguishes and positions the tray to be transported and the tray to be loaded (not shown). The tray lowered to the lower tray rail is advanced by the latch hook to the tray transfer rail 3, and stops at the horizontal position of the loader picker 4, and 16 devices are shuttled by the loader picker (5a), ( Transfer to 5b). The tray, which is transported to the shuttle and becomes empty, is advanced for the next material transfer, and the tray which is exhausted is moved to the end of the forward transfer rail 6a with the transfer rail 6b to load the empty tray. . The tray transfer robot 7 positions the empty tray on the conveyance rail 6b in the vertical raising and horizontal movement manner.

2 illustrates an embodiment of a shuttle unit configured to shorten a transfer time with respect to device heating. In order to test a semiconductor device contained in a tray of a loader at a high temperature, a heating device for heating the device is required. The semiconductor element supplied to the tray from the loader part uses a contact heating method called a preheater. In order for the material transferred to the preheater to be transferred to the test site, a mobile heating plate called a shuttle is required. It takes time to supply elements to the furnace. In this case, the time required for supplying, testing, and sorting the components of the handler becomes long, thereby reducing productivity per unit time. In the present invention, using the shuttle type preheater (8) eliminates the time taken to transfer the shuttle from the preheater to the shuttle as in the usual method, and the space between the rows and columns to maximize the number of elements per unit area Was optimized. According to an embodiment of the shuttle type preheater, the semiconductor element is transferred to the shuttle type preheater by the loader picker 4 (see FIG. 1), and the transferred element is heated by a heating plate to the shuttle. In the case of the shuttle type preheater, due to space optimization, there is no space for inserting a pin to guide the guide hole of the contactor (not shown). In order to solve this problem, the present invention has been developed in the same form as the guide pin mask (9b) and using the jig (9a) for fixing the guide pin mask and the cylinder (9c) to move in two positions to adjust the size of the guide pin mask Minimized. The contactor is aligned by the guide pin of the guide pin mask, and upon one pick up, the shuttle type preheater moves in the longitudinal direction of the position to pick up the material and waits at the position. The feature of the guide pin mask is that semiconductor elements within the size of the holes of the guide mask are compatible without replacement of the guide mask. The shuttle fixed guide pin 10 is guided to the guide hole of the shuttle type preheater and is used to minimize the pickup position error.

3 shows the loader section and the unloader section. The loader unit operates as described in the embodiment in FIG. 1 as described above. Adding a description of the loader section which is not described in FIG. 1 is as follows. In the loader section, the empty tray is moved to the rail under the loader section, and is placed in the temporary loading station 11 until the empty tray is transported by the tray transfer 1 (12) robot. The tray is processed by a diverter for use of the material hair 13 to remove the remaining material by an empty tray transfer robot loaded in a temporary loading place. The processed empty tray is transferred to the empty tray loading place 15 by the tray transfer 2 (14). The RFID tray resembles the tray bundle information at the top of the loading section. The RFID (16) tray stores the information of the tray in a bundle unit and is located at the top of the tray bundle so that the information is read at the time of initial loading. It is loaded in the cow. The tray transfer 17 attached to the loader part serves to convey the tray forward transfer rail 6a (Fig. 1) when configuring the loader among them. The unloading picker robots 18a and 18b serve to sort after the device has been tested. According to the embodiment, when the tested device is loaded into the shuttles 5a and 5b (FIG. 1) and waits in the sorting area, the unloading picker transfers the sorted sets of devices from the shuttle to the tray on the set plates 19a, 19b and 19c. . The tray filled with the elements is moved down to the standby position of the tray transfer robot 20 by lowering the set plate, and the tray is divided into stackers 21 by the tray transfer robot.

 Figure 4 shows a contactor (Contactor) is a conventional contactor has a structure in which the contactor arm and the contactor base is connected directly, in the present invention is installed spherical bearing 23 on the bottom of the contactor arm 22 High tension springs were placed above and below the bearings. This is to induce horizontality when the horizontality between the contactor base 24 and the docking plate 25 is not. The rod end 26 was placed in the center of the contactor base so that the horizontality of the contactor base could be adjusted by screws 27a and 27b.

FIG. 5 shows an example of a one-touch blade that pushes an element into a device transfer and test socket secured by a leaf spring. The blade is a component that is replaced whenever there is a change in the semiconductor device. Conventionally, the blade is fixed by using a screw. However, as the number of blades in contactors increases, there is a time loss due to replacement. Therefore, in the present invention, the blade 29, which was fixed with a conventional screw, can be fixed in a one-touch manner so that the blade can be fixed using the leaf springs 28a and 28b.

While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It will be appreciated by those skilled in the art that numerous changes and modifications may be made without departing from the invention. Accordingly, all such appropriate modifications and changes, and equivalents thereof, should be regarded as within the scope of the present invention.

1: handler body 2: loading section
3: tray feed rail 4: loader picker
5a, 5b: Shuttle 6a: Tray Advance Transfer Rail
6b: Transfer Rail 7: Tray Transfer Robot
8: Shuttle-type preheater 9a: jig
9b: guide pin mask 9c: cylinder
10: Shuttle Fixed Guide Pin 11: Temporary Storage
12: Tray Transfer 1 13: Diver
14: Tray Transfer 2 15: Empty Tray Stack
16: RFID 17: Tray Transfer
18a, 18b: unloading picker robot 19a, 19b, 19c: set plate
20: tray transfer robot 21: stacker part
22: contactor arm 23: spherical bearing
24: contactor base 25: docking plate
26: rod end 27a, 27b: screw
28a, 28b: leaf spring 29: blade

Claims (12)

In the handler for high speed test of a high temperature semiconductor element,
An open downward loading unit loaded with trays containing semiconductor elements to be installed and tested in front of the handler;
A shuttle type preheater in which a loading picker loads a material in a process of advancing a tray containing a semiconductor device;
A tray transfer robot and a rail unit which transfers the empty tray to the stacking position of the empty tray when all the elements of the tray are picked up and loaded on the shuttle type preheater and the elements of the tray are exhausted;
A sorting picker robot unit for sorting the material loaded on the shuttle-type preheater on a set plate;
A contactor unit which picks up material from the shuttle type preheater to a socket of a tester and transfers and contacts the socket on the set plate;
A guide pin mask unit which picks up material from the shuttle type preheater and enters a test socket and guides the contactor when placing the material in the shuttle; And
And a one-touch blade block installed on the contactor to press the device to the device transfer and test sockets fixed by the leaf springs.
The method of claim 1,
A tray loading station of the loading portion protruding from the upper portion;
A tray feeder for transferring an element to a shuttle type preheater;
A loader picker robot unit for picking up and transferring elements from a tray to a shuttle at a predetermined position of the tray transfer unit;
A test site having a test socket installed at the rear portion of the handler to be electrically connected to an external test device and testing a semiconductor device picked up and transferred from a shuttle;
Forward and reverse shuttle units configured in a two-stage structure in which the picked-up device is transferred to a test contactor position and the tested device is transferred to a position of an unloading robot;
An unloading unit installed on the right side of the loading unit and mounted with an elevation stacker in which a tray containing semiconductor devices sorted after testing is loaded;
An unloader robot unit which sorts the tested devices and picks them up and transfers them to a tray;
A set plate unit for fixing the tray so that the unloader robot sorts the elements;
A stacker tray transfer robot unit for transferring a set plate tray to a sorted loading site and loading an empty tray on a set plate;
An automatic picker pad exchanger for automatically replacing a picker's vacuum pad to pick up a semiconductor element from the picker robot unit;
Automatic socket cleaner device for weaving foreign matter accumulated in the socket of the test site; handler for the high-speed semiconductor device of the high temperature semiconductor device characterized in that it further comprises.

The method of claim 1,
The loading picker is a handler for a high-speed testing of a high-temperature semiconductor device, characterized in that the device is loaded in a shuttle-type preheater and heated to a high temperature in the process of moving the tray containing the semiconductor device.
The method of claim 3, wherein
The shuttle type preheater is disposed on both sides of the contactor, the shuttle is configured in a double structure to change the position and supply and discharge the material, characterized in that the high-speed semiconductor handler handler.
The method of claim 1,
The tray transfer robot transfers the empty tray to the lower portion of the handler base and drives up, down, left, and right, and moves the empty tray transferred to the front portion by the conveying rail to the empty tray loading station.
The method of claim 1,
The sorting picker robot unit is composed of a double for sorting the material of the shuttle on the set plate, characterized in that the high-speed semiconductor device handler for high-speed testing.
The method of claim 1,
The high speed test handler is a high speed test handler for a high temperature semiconductor device, characterized in that each of the three tray transfer is driven.
The method of claim 1,
The guide pin mask unit picks up the device seated in the shuttle using the guide pin mask and the guide pin mask has two positions from side to side so that the number of guide masks can be used as one. Handler for high speed testing of semiconductor devices.
The method of claim 1,
The contactor unit,
Contactor arms;
Contactor bases;
Spherical bearings mounted on the bottom of the contactor arm;
High-tension spring applied to the lower portion, on the spherical bearings; handler for the high-speed test of a high-temperature semiconductor device comprising a.
delete The method of claim 9,
The contactor base of the contactor unit,
A handler for high-speed testing of high-temperature semiconductor devices, comprising a contactor for adjusting the contactor horizontally including a load end and adjustment screws.
The method of claim 1,
The blade block,
A high-speed test handler for high-temperature semiconductor devices, characterized by a one-touch replacement type that vacuum-adsorbs the semiconductor devices and fixes the blade blocks used for testing using leaf springs.

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