KR101261638B1 - 유기 전자 장치를 위한 수직 상호연결 - Google Patents

유기 전자 장치를 위한 수직 상호연결 Download PDF

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Publication number
KR101261638B1
KR101261638B1 KR1020050099255A KR20050099255A KR101261638B1 KR 101261638 B1 KR101261638 B1 KR 101261638B1 KR 1020050099255 A KR1020050099255 A KR 1020050099255A KR 20050099255 A KR20050099255 A KR 20050099255A KR 101261638 B1 KR101261638 B1 KR 101261638B1
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South Korea
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conductive
organic
organic electronic
layer
disposed
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KR1020050099255A
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Korean (ko)
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KR20060071855A (ko
Inventor
지 리우
아닐 라예 듀갈
크리스챤 마리아 안톤 헬러
도날드 프랭클린 포우스트
타미 자넨 페어클로스
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제너럴 일렉트릭 캄파니
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/26—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/82—Interconnections, e.g. terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/84—Parallel electrical configurations of multiple OLEDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/86—Series electrical configurations of multiple OLEDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
KR1020050099255A 2004-12-22 2005-10-20 유기 전자 장치를 위한 수직 상호연결 Expired - Fee Related KR101261638B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/020,338 2004-12-22
US11/020,338 US7259391B2 (en) 2004-12-22 2004-12-22 Vertical interconnect for organic electronic devices

Publications (2)

Publication Number Publication Date
KR20060071855A KR20060071855A (ko) 2006-06-27
KR101261638B1 true KR101261638B1 (ko) 2013-05-06

Family

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KR1020050099255A Expired - Fee Related KR101261638B1 (ko) 2004-12-22 2005-10-20 유기 전자 장치를 위한 수직 상호연결

Country Status (6)

Country Link
US (1) US7259391B2 (https=)
EP (1) EP1684354A3 (https=)
JP (1) JP5486756B2 (https=)
KR (1) KR101261638B1 (https=)
CN (2) CN100565899C (https=)
TW (1) TWI431826B (https=)

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US8215787B2 (en) * 2008-08-19 2012-07-10 Plextronics, Inc. Organic light emitting diode products
US8414304B2 (en) * 2008-08-19 2013-04-09 Plextronics, Inc. Organic light emitting diode lighting devices
US8288951B2 (en) * 2008-08-19 2012-10-16 Plextronics, Inc. Organic light emitting diode lighting systems
TWI537900B (zh) * 2008-08-19 2016-06-11 索爾維美國有限公司 使用者可組態之鑲嵌發光裝置
DE102008050332A1 (de) * 2008-10-07 2010-04-22 Leonhard Kurz Stiftung & Co. Kg Photovoltaische Zellen sowie Mehrschichtfolie
WO2010125493A1 (en) * 2009-04-23 2010-11-04 Koninklijke Philips Electronics N. V. Segmented electroluminescent device with resistive interconnect layers
US9161448B2 (en) 2010-03-29 2015-10-13 Semprius, Inc. Laser assisted transfer welding process
US9899329B2 (en) 2010-11-23 2018-02-20 X-Celeprint Limited Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
US8692457B2 (en) 2010-12-20 2014-04-08 General Electric Company Large area light emitting electrical package with current spreading bus
KR101881462B1 (ko) * 2011-02-10 2018-07-26 삼성디스플레이 주식회사 유기 발광 표시 장치
US8889485B2 (en) 2011-06-08 2014-11-18 Semprius, Inc. Methods for surface attachment of flipped active componenets
US9412727B2 (en) 2011-09-20 2016-08-09 Semprius, Inc. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
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CN113035851B (zh) 2014-06-18 2022-03-29 艾克斯展示公司技术有限公司 微组装led显示器
CN117198903A (zh) 2014-07-20 2023-12-08 艾克斯展示公司技术有限公司 用于微转贴印刷的设备及方法
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US10468363B2 (en) 2015-08-10 2019-11-05 X-Celeprint Limited Chiplets with connection posts
US10380930B2 (en) 2015-08-24 2019-08-13 X-Celeprint Limited Heterogeneous light emitter display system
US10230048B2 (en) 2015-09-29 2019-03-12 X-Celeprint Limited OLEDs for micro transfer printing
US10066819B2 (en) 2015-12-09 2018-09-04 X-Celeprint Limited Micro-light-emitting diode backlight system
US9786646B2 (en) 2015-12-23 2017-10-10 X-Celeprint Limited Matrix addressed device repair
CN105629543B (zh) * 2016-01-04 2019-03-01 京东方科技集团股份有限公司 一种柔性液晶显示面板及显示装置
TWI681508B (zh) 2016-02-25 2020-01-01 愛爾蘭商艾克斯瑟樂普林特有限公司 有效率地微轉印微型裝置於大尺寸基板上
US10193025B2 (en) 2016-02-29 2019-01-29 X-Celeprint Limited Inorganic LED pixel structure
US10153257B2 (en) 2016-03-03 2018-12-11 X-Celeprint Limited Micro-printed display
US10153256B2 (en) 2016-03-03 2018-12-11 X-Celeprint Limited Micro-transfer printable electronic component
US10103069B2 (en) 2016-04-01 2018-10-16 X-Celeprint Limited Pressure-activated electrical interconnection by micro-transfer printing
US10199546B2 (en) 2016-04-05 2019-02-05 X-Celeprint Limited Color-filter device
US10008483B2 (en) 2016-04-05 2018-06-26 X-Celeprint Limited Micro-transfer printed LED and color filter structure
US9997501B2 (en) 2016-06-01 2018-06-12 X-Celeprint Limited Micro-transfer-printed light-emitting diode device
US11137641B2 (en) 2016-06-10 2021-10-05 X Display Company Technology Limited LED structure with polarized light emission
US10222698B2 (en) 2016-07-28 2019-03-05 X-Celeprint Limited Chiplets with wicking posts
US11064609B2 (en) 2016-08-04 2021-07-13 X Display Company Technology Limited Printable 3D electronic structure
US9980341B2 (en) 2016-09-22 2018-05-22 X-Celeprint Limited Multi-LED components
US10782002B2 (en) 2016-10-28 2020-09-22 X Display Company Technology Limited LED optical components
US10347168B2 (en) 2016-11-10 2019-07-09 X-Celeprint Limited Spatially dithered high-resolution
US10395966B2 (en) 2016-11-15 2019-08-27 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
WO2018091459A1 (en) 2016-11-15 2018-05-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US10600671B2 (en) 2016-11-15 2020-03-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
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Also Published As

Publication number Publication date
JP2006179867A (ja) 2006-07-06
JP5486756B2 (ja) 2014-05-07
CN1794464A (zh) 2006-06-28
CN101604702B (zh) 2012-02-15
EP1684354A2 (en) 2006-07-26
CN101604702A (zh) 2009-12-16
KR20060071855A (ko) 2006-06-27
US7259391B2 (en) 2007-08-21
CN100565899C (zh) 2009-12-02
EP1684354A3 (en) 2010-10-06
US20060134822A1 (en) 2006-06-22
TWI431826B (zh) 2014-03-21
TW200625709A (en) 2006-07-16

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