KR101256086B1 - 금속박과 그 제조 방법, 절연기판, 및 배선기판 - Google Patents

금속박과 그 제조 방법, 절연기판, 및 배선기판 Download PDF

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Publication number
KR101256086B1
KR101256086B1 KR1020117013392A KR20117013392A KR101256086B1 KR 101256086 B1 KR101256086 B1 KR 101256086B1 KR 1020117013392 A KR1020117013392 A KR 1020117013392A KR 20117013392 A KR20117013392 A KR 20117013392A KR 101256086 B1 KR101256086 B1 KR 101256086B1
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KR
South Korea
Prior art keywords
plating
metal foil
roughening
copper
foil
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Application number
KR1020117013392A
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English (en)
Korean (ko)
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KR20110094187A (ko
Inventor
료이치 오구로
히로토 쿠츠나
Original Assignee
후루카와 덴키 고교 가부시키가이샤
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Publication of KR20110094187A publication Critical patent/KR20110094187A/ko
Application granted granted Critical
Publication of KR101256086B1 publication Critical patent/KR101256086B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020117013392A 2009-02-13 2010-02-12 금속박과 그 제조 방법, 절연기판, 및 배선기판 KR101256086B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009031025 2009-02-13
JPJP-P-2009-031025 2009-02-13
PCT/JP2010/052056 WO2010093009A1 (ja) 2009-02-13 2010-02-12 金属箔およびその製造方法，絶縁基板，配線基板

Publications (2)

Publication Number Publication Date
KR20110094187A KR20110094187A (ko) 2011-08-22
KR101256086B1 true KR101256086B1 (ko) 2013-04-23

Family

ID=42561849

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117013392A KR101256086B1 (ko) 2009-02-13 2010-02-12 금속박과 그 제조 방법, 절연기판, 및 배선기판

Country Status (5)

Country Link
JP (1) JP5435505B2 (zh)
KR (1) KR101256086B1 (zh)
CN (1) CN102317510B (zh)
TW (1) TWI432615B (zh)
WO (1) WO2010093009A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5885054B2 (ja) * 2010-04-06 2016-03-15 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
CN106028638B (zh) 2010-09-27 2019-09-03 吉坤日矿日石金属株式会社 印刷电路板用铜箔、其制造方法以及印刷电路板
JP6166614B2 (ja) * 2013-07-23 2017-07-19 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、基材、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
EP3026145A4 (en) 2013-07-23 2017-04-12 JX Nippon Mining & Metals Corporation Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method
WO2015111756A1 (ja) * 2014-01-27 2015-07-30 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP6261037B2 (ja) * 2014-02-06 2018-01-17 古河電気工業株式会社 高周波回路用銅箔、銅張積層板及びプリント配線板
WO2015186752A1 (ja) 2014-06-06 2015-12-10 株式会社Uacj 集電体用金属箔、集電体及び集電体用金属箔の製造方法
JP2017133105A (ja) * 2017-03-06 2017-08-03 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
KR102298165B1 (ko) * 2018-03-14 2021-09-06 주식회사 엘지화학 매립형 투명 전극 기판 및 이의 제조방법
JP7166335B2 (ja) * 2018-03-27 2022-11-07 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
TWI697549B (zh) 2019-12-23 2020-07-01 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
TWI740515B (zh) 2019-12-23 2021-09-21 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07226575A (ja) * 1994-02-14 1995-08-22 Hitachi Chem Co Ltd プリント配線板の製造法
JP2006103189A (ja) 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk 表面処理銅箔並びに回路基板
JP2006196813A (ja) 2005-01-17 2006-07-27 Matsushita Electric Ind Co Ltd 配線基板およびその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004263300A (ja) * 2003-02-12 2004-09-24 Furukawa Techno Research Kk ファインパターンプリント配線用銅箔とその製造方法
JP4354271B2 (ja) * 2003-12-26 2009-10-28 三井金属鉱業株式会社 褐色化表面処理銅箔及びその製造方法並びにその褐色化表面処理銅箔を用いたプラズマディスプレイの前面パネル用の電磁波遮蔽導電性メッシュ
TW200535259A (en) * 2004-02-06 2005-11-01 Furukawa Circuit Foil Treated copper foil and circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07226575A (ja) * 1994-02-14 1995-08-22 Hitachi Chem Co Ltd プリント配線板の製造法
JP2006103189A (ja) 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk 表面処理銅箔並びに回路基板
JP2006196813A (ja) 2005-01-17 2006-07-27 Matsushita Electric Ind Co Ltd 配線基板およびその製造方法

Also Published As

Publication number Publication date
TW201037104A (en) 2010-10-16
JPWO2010093009A1 (ja) 2012-08-16
KR20110094187A (ko) 2011-08-22
JP5435505B2 (ja) 2014-03-05
CN102317510B (zh) 2014-12-03
TWI432615B (zh) 2014-04-01
CN102317510A (zh) 2012-01-11
WO2010093009A1 (ja) 2010-08-19

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