KR101238962B1 - 전자 부품 장착 장치 - Google Patents

전자 부품 장착 장치 Download PDF

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Publication number
KR101238962B1
KR101238962B1 KR1020060118868A KR20060118868A KR101238962B1 KR 101238962 B1 KR101238962 B1 KR 101238962B1 KR 1020060118868 A KR1020060118868 A KR 1020060118868A KR 20060118868 A KR20060118868 A KR 20060118868A KR 101238962 B1 KR101238962 B1 KR 101238962B1
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KR
South Korea
Prior art keywords
tape
component
supply unit
component supply
electronic component
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Active
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KR1020060118868A
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English (en)
Korean (ko)
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KR20070057018A (ko
Inventor
아끼오 와타나베
아끼히로 가와이
데쯔지 오노
마끼오 가메다
가즈요시 오오야마
가즈요시 이에이즈미
Original Assignee
가부시끼가이샤 히다찌 하이테크 인스트루먼츠
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Publication of KR20070057018A publication Critical patent/KR20070057018A/ko
Application granted granted Critical
Publication of KR101238962B1 publication Critical patent/KR101238962B1/ko
Assigned to 야마하하쓰도키 가부시키가이샤 reassignment 야마하하쓰도키 가부시키가이샤 권리의 전부이전등록 Assignors: 가부시끼가이샤 히다찌 하이테크 인스트루먼츠
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/0215—Interconnecting of containers, e.g. splicing of tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020060118868A 2005-11-30 2006-11-29 전자 부품 장착 장치 Active KR101238962B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005345114A JP4450788B2 (ja) 2005-11-30 2005-11-30 電子部品装着装置
JPJP-P-2005-00345114 2005-11-30

Publications (2)

Publication Number Publication Date
KR20070057018A KR20070057018A (ko) 2007-06-04
KR101238962B1 true KR101238962B1 (ko) 2013-03-04

Family

ID=37781824

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060118868A Active KR101238962B1 (ko) 2005-11-30 2006-11-29 전자 부품 장착 장치

Country Status (5)

Country Link
US (2) US7712208B2 (https=)
EP (1) EP1793660B1 (https=)
JP (1) JP4450788B2 (https=)
KR (1) KR101238962B1 (https=)
CN (1) CN1976577B (https=)

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ES2331195T3 (es) 2004-07-15 2009-12-23 Gynaecologiq B.V. Composicion y metodo para imagineria medica de cavidades corporales.
JP4450772B2 (ja) * 2005-06-30 2010-04-14 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP4450788B2 (ja) * 2005-11-30 2010-04-14 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP4922014B2 (ja) * 2007-02-28 2012-04-25 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP5171408B2 (ja) * 2008-06-10 2013-03-27 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP5074334B2 (ja) * 2008-09-22 2012-11-14 株式会社日立ハイテクインスツルメンツ 部品装着装置、部品装着設定算出装置、プログラム及び部品装着設定算出方法
JP5192453B2 (ja) * 2009-06-25 2013-05-08 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
NL2003660C2 (en) 2009-10-16 2011-04-19 Giskit B V Composition and method for medical imaging of body cavities.
JP5434884B2 (ja) * 2010-10-27 2014-03-05 パナソニック株式会社 電子部品実装装置および電子部品実装方法
JP2012195508A (ja) * 2011-03-17 2012-10-11 Juki Corp 電子部品実装装置
JP2012240166A (ja) * 2011-05-20 2012-12-10 Fanuc Ltd ビジョンセンサ及び吸引装置を備えた吸着搬送装置
WO2013140581A1 (ja) * 2012-03-22 2013-09-26 富士機械製造株式会社 テープフィーダ
JP5918622B2 (ja) * 2012-05-11 2016-05-18 ヤマハ発動機株式会社 部品または基板の作業装置および部品実装装置
JP5822819B2 (ja) * 2012-12-05 2015-11-24 ヤマハ発動機株式会社 電子部品の実装方法、および表面実装機
CN103869711B (zh) * 2012-12-11 2016-04-06 成都先进功率半导体股份有限公司 编带齿轮自动下降的控制方法
US10052858B2 (en) * 2014-03-12 2018-08-21 Edo Segal Interlocking object construction units
JP6663845B2 (ja) * 2014-06-17 2020-03-13 株式会社Ｆｕｊｉ 電子部品の装着方法および電子部品装着システム
JP6413084B2 (ja) * 2015-01-06 2018-10-31 パナソニックＩｐマネジメント株式会社 電子部品供給装置
WO2016132438A1 (ja) * 2015-02-16 2016-08-25 富士機械製造株式会社 実装管理装置
WO2016162974A1 (ja) * 2015-04-08 2016-10-13 富士機械製造株式会社 部品実装機の部品吸着率算出システム
CN107615904B (zh) * 2015-06-02 2019-10-08 株式会社富士 元件安装装置及吸附位置设定方法
JP6742334B2 (ja) * 2015-11-25 2020-08-19 株式会社Ｆｕｊｉ ツール検索装置及びツール検索方法
JP6748717B2 (ja) * 2016-07-08 2020-09-02 株式会社Ｆｕｊｉ フィーダ
JP6759423B2 (ja) * 2019-06-17 2020-09-23 株式会社Ｆｕｊｉ 部品実装装置
DE102019120932B4 (de) * 2019-08-02 2021-04-22 Asm Assembly Systems Gmbh & Co. Kg Verfahren zum Abholen von Bauelementen aus einem mittels einer Spleißverbindung verbundenen Bauelementgurt, Bestückautomat

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5694219A (en) 1995-10-10 1997-12-02 Lg Industrial System Co., Ltd. Device recognizing method and apparatus for surface mounting device mounter
US6157870A (en) 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
US6817216B2 (en) * 2002-08-22 2004-11-16 Accu-Assembly Incorporated Electronic component placement
US6902090B2 (en) * 2001-10-16 2005-06-07 Matsushita Electric Industrial Co., Ltd. Tape feeder, electronic component mounting apparatus using the same, and method of feeding electronic components

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JP2686018B2 (ja) 1992-06-09 1997-12-08 住友ベークライト株式会社 チップ型電子部品包装用カバーテープの接続方法
US5539977A (en) * 1993-10-29 1996-07-30 Sanyo Electric Co., Ltd. Apparatus and method for automatically mounting electronic parts
JP4197549B2 (ja) 1998-06-24 2008-12-17 富士機械製造株式会社 電気部品供給装置およびプリント回路板組立方法
JP2001044696A (ja) * 1999-08-03 2001-02-16 Matsushita Electric Ind Co Ltd 電子部品実装方法
JP2002050896A (ja) * 2000-08-03 2002-02-15 Sony Corp 部品把持位置補正装置および補正方法
US7273166B2 (en) * 2002-11-11 2007-09-25 Fuji Machine Mfg. Co., Ltd. Component information applying method and apparatus
JP4313620B2 (ja) 2003-06-30 2009-08-12 株式会社日立ハイテクインスツルメンツ 電子部品供給装置を備えた電子部品装着装置
US7513389B2 (en) * 2004-03-23 2009-04-07 Hitachi High-Tech Instruments Co., Ltd. Electronic component feeding device and electronic component mounting apparatus with electronic component feeding device
JP4559243B2 (ja) * 2005-01-28 2010-10-06 株式会社日立ハイテクインスツルメンツ 電子部品の装着方法及び電子部品の装着装置
JP4450772B2 (ja) * 2005-06-30 2010-04-14 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP4450788B2 (ja) * 2005-11-30 2010-04-14 株式会社日立ハイテクインスツルメンツ 電子部品装着装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5694219A (en) 1995-10-10 1997-12-02 Lg Industrial System Co., Ltd. Device recognizing method and apparatus for surface mounting device mounter
US6157870A (en) 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
US6902090B2 (en) * 2001-10-16 2005-06-07 Matsushita Electric Industrial Co., Ltd. Tape feeder, electronic component mounting apparatus using the same, and method of feeding electronic components
US6817216B2 (en) * 2002-08-22 2004-11-16 Accu-Assembly Incorporated Electronic component placement

Also Published As

Publication number Publication date
CN1976577A (zh) 2007-06-06
EP1793660A1 (en) 2007-06-06
EP1793660B1 (en) 2011-06-08
US7712208B2 (en) 2010-05-11
US8336195B2 (en) 2012-12-25
JP2007150136A (ja) 2007-06-14
CN1976577B (zh) 2013-03-27
US20100186223A1 (en) 2010-07-29
US20070130756A1 (en) 2007-06-14
JP4450788B2 (ja) 2010-04-14
KR20070057018A (ko) 2007-06-04

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