KR101227827B1 - Apparatus for picking up semiconductor devices - Google Patents

Abstract

An apparatus for picking up semiconductor elements, the apparatus comprising: a first guide rail extending in a horizontal direction, a plurality of first moving members movably coupled to the first guide rail, and the first moving members A plurality of second guide rails respectively disposed on and extending in parallel with the first guide rail, a plurality of second moving members coupled to the second guide rails to be movable respectively, and the first and second guide rails. A plurality of pickers respectively coupled to the second moving members and extending in a vertical direction, respectively, for picking up a semiconductor element, and the first and second moving members being arranged to adjust the distance between the pickers; And a spacing adjuster for moving along the second guide rails, respectively. Therefore, since the second moving members are disposed to be movable on the first moving members, respectively, the distance between the pickers can be minimized.

Description

A device for picking up semiconductor devices {APPARATUS FOR PICKING UP SEMICONDUCTOR DEVICES}

Embodiments of the present invention relate to an apparatus for picking up semiconductor elements. More particularly, the present invention relates to an apparatus for picking up semiconductor devices to transfer them between trays of a semiconductor device manufacturing facility, such as a test handler.

Semiconductor devices, such as integrated circuit devices, can generally be formed by a series of iterative microprocessing processes on a substrate, such as a silicon wafer. For example, a deposition process for forming a film on a substrate, an etching process for forming the film into specific patterns, an ion implantation process or a diffusion process for imparting electrical properties to the patterns, impurities from the substrate on which the patterns are formed Various types of semiconductor devices may be formed on a substrate by repeatedly performing a cleaning and rinsing process for removing them.

The semiconductor devices formed as described above are shipped after their operating characteristics are inspected through various test procedures. A test handler transfers the semiconductor devices to a test chamber to inspect the semiconductor devices. In particular, the semiconductor devices are transferred from the customer tray to the test tray via the buffer tray, and the semiconductor devices inspected in the test chamber are transferred from the test tray to the customer tray via the buffer tray.

The test handler may have a pickup device for transferring semiconductor elements between the trays. The pick-up apparatus may include a plurality of pickers for picking up the semiconductor elements, and may be used to transfer the semiconductor elements between the customer tray and the test tray.

On the other hand, because the pitch of the customer tray and the test tray is different from each other, the pickup device may include a mechanism for adjusting the distance between the pickers. For example, Korean Patent Publication No. 10-2008-0102746, filed on May 22, 2007, and published on November 26, 2008 by the present applicant, discloses a cam plate-shaped gap adjusting member having a gap guide groove. A pickup device is disclosed for adjusting the spacing between a plurality of pickers.

Each of the pickers in the pick-up apparatus as described above may be guided by a linear motion guide. In this case, the linear motion guide may include a guide rail for guiding the pickers and a plurality of guide blocks coupled to the guide rail to enable the pickers to move along the guide rail. Each guide block includes a plurality of balls therein that are movable along the guide rail.

On the other hand, when picking up small semiconductor devices such as a light emitting diode (LED) chip, the distance between the pickers must be adjusted very narrowly, but there are physical limitations in reducing the size of the guide blocks. There are some difficulties in transferring small semiconductor elements using the same pickup device.

Embodiments of the present invention have an object of providing a semiconductor device pickup apparatus capable of adjusting the distance between the pickers to a minimum.

According to an aspect of the present invention for achieving the above object, the semiconductor device pickup device comprises a first guide rail extending in a horizontal direction, a plurality of first moving members coupled to the first guide rail to be movable; A plurality of second guide rails respectively disposed on the first moving members and extending in parallel with the first guide rail, and a plurality of second moving members respectively coupled to the second guide rails to be movable; And a plurality of pickers respectively coupled to the first and second moving members to extend in a vertical direction and for picking up the semiconductor elements, respectively, and the first and second moving parts to adjust a distance between the pickers. It may include a gap adjusting portion for moving the members along the first and second guide rails, respectively.

According to embodiments of the present invention, the gap adjusting part may include a cam plate having guide slots extending in different directions to adjust the gap between the pickers. In this case, the first and second moving members may be equipped with rollers inserted into each of the guide slots and configured to move along the inner surfaces of the guide slots.

According to embodiments of the present invention, the semiconductor device pickup device may further include a base plate extending in the horizontal direction in a standing state in the vertical direction, and the first guide rail may be mounted on the front surface of the base plate. have. In addition, the gap adjusting portion is disposed in the vertical direction on the rear surface of the base plate and has a cam plate having a plurality of guide slots extending in a fan shape to adjust the gap between the picker, and is connected to the cam plate and the It may include a drive for moving the cam plate in the vertical direction. In particular, the first and second moving members may be equipped with rollers inserted into each of the guide slots and configured to be movable along inner surfaces of the guide slots.

According to embodiments of the present invention, the cam plate is formed with a slot parallel to the first guide rail and the rollers may be mounted to the first and second moving members through the slot.

According to the embodiments of the present invention, the front of the first moving member may be provided with a projection for mounting the pickers respectively, the projections of the first moving member so that the pickers are arranged in parallel to the horizontal direction And the height of the second moving member may be configured to be the same.

According to the embodiments of the present invention as described above, a first guide member is coupled to the first guide rail, and a second guide rail so that the second guide member is movable on the first guide member, respectively. Can be mounted. That is, the distance between the first moving members coupled to the first guide rail can be adjusted to a minimum, and thus the distance between the pickers can be adjusted to the minimum. As a result, pickup for relatively small semiconductor devices can be easily performed.

1 is a schematic diagram illustrating a semiconductor device pickup device according to an embodiment of the present invention.
FIG. 2 is a schematic configuration diagram for describing the first moving member and the second moving member illustrated in FIG. 1.
FIG. 3 is a schematic rear view illustrating the gap controller shown in FIG. 1.
4 is a schematic diagram illustrating the base plate illustrated in FIG. 1.
FIG. 5 is a schematic front view illustrating the protrusion of the first moving member illustrated in FIG. 1.
FIG. 6 is a schematic plan view for describing a protrusion of the first moving member illustrated in FIG. 1.
7 and 8 are schematic diagrams for describing an operating method of the semiconductor device pickup apparatus illustrated in FIG. 1.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected sufficiently. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the areas illustrated in the drawings, but include deviations in shapes, the areas described in the drawings being entirely schematic and their shapes Is not intended to illustrate the exact shape of the area and is not intended to limit the scope of the invention.

The semiconductor device pickup apparatus according to an embodiment of the present invention may be used to transfer semiconductor devices having a relatively small size. For example, it can be used to easily pick up semiconductor devices having a relatively small size, such as light emitting diode chips.

In the case of the test tray or the customer tray in which the small semiconductor elements are accommodated, the distance between the sockets in which the semiconductor elements are accommodated is relatively small. It is desired to reduce the spacing between the pickers, i.e., the pitch, to a minimum.

Hereinafter, a semiconductor device pickup device according to an exemplary embodiment will be described in detail with reference to the accompanying drawings.

1 is a schematic diagram illustrating a semiconductor device pickup device according to an embodiment of the present invention.

Referring to FIG. 1, the semiconductor device pickup apparatus 100 includes a first guide rail 110 and a plurality of first moving members 120 movably coupled to the first guide rail 110. can do. The first guide rail may be disposed on the base plate 102. For example, the base plate 102 may extend in the horizontal direction while standing in the vertical direction, and both ends of the base plate 102 may be mounted to the frame 104. In addition, a pair of first guide rails 110 may be disposed in parallel in the horizontal direction on a front surface of the base plate 102.

FIG. 2 is a schematic configuration diagram for describing the first moving member and the second moving member illustrated in FIG. 1.

Referring to FIG. 2, the first moving members 120 may be coupled to the first guide rail 110 to be movable. For example, the first moving members 120 may be coupled to the first guide rail 110 by a plurality of first guide blocks (or ball blocks) 130 to allow linear movement. . That is, the first moving members 120 are coupled on the base plate 102 to be movable in the horizontal direction by using a conventional linear motion guide (LM Guide) using a guide rail and a guide block. Can be.

A second guide rail 112 may be disposed on each first moving member 120 in a direction parallel to the first guide rail 110, and a second moving member may be disposed on the second guide rail 112. 122 may be movably coupled. For example, as illustrated, the second moving member 122 may be coupled to the second guide rail 112 by a second guide block 132 to allow linear movement. As a result, the base plate 102 so that both the first moving members 120 and the second moving members 122 disposed on the respective first moving members 120 are movable in the horizontal direction. It can be mounted on.

Referring back to FIG. 1, pickers 140 for picking up semiconductor devices (not shown) may be coupled to the first moving blocks 120 and the second moving blocks 122, respectively. The pickers 140 may be disposed in the vertical direction, and may pick up the semiconductor devices using a vacuum pressure. Although not shown, each of the pickers 140 may be connected to a vacuum system (not shown) for providing the vacuum pressure.

The first moving blocks 120 and the second moving blocks 122 may be connected to the interval adjusting unit 150 for adjusting the interval, that is, the pitch between the pickers 140. In particular, the gap adjusting unit 150 moves the first moving blocks 120 and the second moving blocks 122 along the first guide rail 110 and the second guide rail 112, respectively. By doing so, the distance between the pickers 140 may be adjusted.

In this case, since each of the second moving members 122 is coupled to each of the first moving members 120, first guide blocks coupled to the first guide rail 110 on the base plate 102 ( 130) can be reduced by half compared to the prior art. As a result, despite the limitation in reducing the physical size of the first guide block 130, the distance between the pickers 140 can be adjusted to a minimum compared to the prior art, accordingly the semiconductor device pickup device 100 may easily pick up relatively small semiconductor devices such as light emitting diode chips.

FIG. 3 is a schematic rear view illustrating the gap controller shown in FIG. 1.

Referring to FIG. 3, the gap adjusting unit 150 may include a cam plate 152 having guide slots 154 extending in different directions to adjust the gap between the pickers 140. have. The guide slots 154 may be formed in different directions, for example, in a fan shape as shown, and the first and second moving members 120 and 122 may be formed inside the guide slots 154. And rollers 160 (see FIG. 6) connected thereto may be disposed. The rollers 160 are respectively inserted into the guide slots 154 and are movable along the inner surfaces of the guide slots 154 by the vertical movement of the cam plate 152. The first and second moving members 120 and 122 may be moved in the horizontal direction. Although not shown in detail, the rollers 160 may be rotatably mounted to the rotating shafts 162 (see FIG. 6) respectively extending rearward from the first and second moving members 120 and 122, respectively. have.

The cam plate 152 may be disposed to be movable in the vertical direction on the rear surface of the base plate 102. For example, a third guide rail 114 may be disposed on the rear surface of the base plate 102. In particular, as shown in the drawing, a pair of third guide rails 114 may be disposed in a vertical direction on the rear surface of the base plate 102, and the cam plate 152 may include the third guide rails 114. Third guide blocks 134 coupled to each other may be mounted to be movable in a vertical direction on the rear surface of the base plate 102.

In addition, according to an embodiment of the present invention, a driving unit 170 for moving the cam plate 150 in the vertical direction may be disposed on the rear surface of the base plate 102. For example, as illustrated, a pair of motors 172 may be connected to the cam plate 152 through the ball screw 174 and the ball nut 176 on the rear surface of the base plate 102. That is, since the ball nut 176 coupled to the ball screw 174 rotated by the motor 172 moves in the vertical direction, the cam plate 152 coupled to the ball nut 176 moves in the vertical direction. Can be moved.

However, the configuration of the driving unit 170 may be variously changed. For example, the driver 170 may use one motor. In this case, the ball screws 174 may be connected to the motor using a belt and a pulley. In addition, the driving unit 170 may include one or two pneumatic or hydraulic cylinders. In addition, although shown, the driving unit 170 is disposed on the rear surface of the base plate 102. Alternatively, the driving unit 170 may be mounted to the frame 104. Therefore, the scope of the present invention is not limited by the configuration of the driving unit 170, and the range is a configuration capable of moving the cam plate 152 in the vertical direction on the rear surface of the base plate 102. Will be enough.

4 is a schematic diagram illustrating the base plate illustrated in FIG. 1.

Referring to FIG. 4, the base plate 102 may be provided with a slot 102A formed parallel to the first guide rail 110. The rotating shafts 162 extending rearward from the first and second moving members 120 and 122 may pass through the slot 102A, and the rollers 160 may be formed at the ends of the rotating shafts 162. Each can be mounted. In addition, the slot 102A may function as a passage through which the rotation shafts 162 move when the first and second moving members 120 and 122 are moved in the horizontal direction.

FIG. 5 is a schematic front view illustrating the protrusion of the first moving member illustrated in FIG. 1, and FIG. 6 is a schematic plan view illustrating the protrusion of the first movable member illustrated in FIG. 1.

5 and 6, protrusions 120A and 120B on which the respective pickers 140 are mounted may be provided on the front surface of the first moving member 120. For example, an upper protrusion 120A and a lower protrusion 120B may be provided on the front surface of the first moving member 120, and the picker 140 may be disposed on the front surfaces of the protrusions 120A and 120B. Can be mounted. In this case, the height of the second moving member 122 disposed on the first moving member 120 may be the same as the protrusions 120A and 120B. That is, the front surface of the second moving member 122 and the front surfaces of the protrusions 120A and 120B may be disposed on the same plane, and thus, the pickers mounted on the first moving members 120 may be formed. Pickers 140 mounted on the 140 and the second moving members 122 may be arranged parallel to the horizontal direction. In addition, as illustrated, the upper protrusion 120A may protrude upward, and the rotation shaft 162 may be connected to the upwardly protruding portion. Meanwhile, although the picker 140 is described as being mounted on the upper and lower protrusions 120A and 120B together, the picker 140 may be mounted only on the lower protrusion 120B.

7 and 8 are schematic diagrams for describing an operating method of the semiconductor device pickup apparatus illustrated in FIG. 1.

Referring to FIGS. 7 and 8, the driving unit 170 may move the cam plate 152 upwards to widen the intervals of the pickers 140, and also increase the intervals of the pickers 140. The cam plate 152 may be moved downward in order to narrow it. In this case, the first moving members 120 may move in the horizontal direction on the first guide rail 110, and the second moving members 122 may move on the first moving members 120. It may be moved in a horizontal direction on the second guide rails 112 disposed in the.

In addition, although the first moving members 120 and the second moving members 122 are linearly symmetrical in both directions with respect to the central portion of the base plate 102, the first moving members 120 and the second moving members 122 are different from each other. The first moving members 120 and the second moving members 122 may be arranged in the same shape.

According to the embodiments of the present invention as described above, first moving members 120 are movably coupled to the first guide rail 110, and a second moving member is mounted on the first moving members 120. The second guide rails 112 may be mounted so that the fields 122 may be coupled to each other so as to be movable. Therefore, even if there is a physical limit to reducing the size of the first guide blocks 130, the distance between the first moving members 120 coupled to the first guide rail 110 can be adjusted to a minimum. The distance between the pickers 140 can be adjusted to a minimum. As a result, pickup for relatively small semiconductor devices can be easily performed.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

100: pickup device 102: base plate
104: frame 110: first guide rail
112: second guide rail 120: first moving member
122: second guide rail 130: first guide block
132: second guide block 140: picker
150: space adjusting portion 152: cam plate
154: guide slot 160: roller
170: drive unit

Claims (6)

A first guide rail extending in a horizontal direction;
A plurality of first moving members coupled to the first guide rail to be movable;
A plurality of second guide rails respectively disposed on the first moving members and extending in parallel with the first guide rail;
A plurality of second moving members respectively coupled to the second guide rails to be movable;
A plurality of pickers coupled to the first and second moving members, respectively, extending in a vertical direction and picking up a semiconductor element, respectively; And
In order to adjust the distance between the pickers include a gap adjusting portion for moving the first and second moving members along the first and second guide rails, respectively,
The gap adjusting part includes a cam plate having guide slots extending in different directions, and the first and second moving members are inserted into each of the guide slots and configured to be movable along inner surfaces of the guide slots. Apparatus for picking up semiconductor elements, characterized in that the rollers are mounted respectively. delete The method of claim 1, further comprising a base plate extending in the horizontal direction in a vertical position, wherein the first guide rail is mounted on the front surface of the base plate. Device. The method of claim 3, wherein the gap adjusting portion is connected to the cam plate and comprises a drive for moving the cam plate in the vertical direction, the cam plate is disposed in the vertical direction on the rear surface of the base plate, And guide slots extend in a fan shape. The semiconductor device of claim 4, wherein a slot is formed in the base plate, the slot being parallel to the first guide rail, and the rollers are mounted to the first and second moving members through the slot. Device for 4. The protrusions of the first moving members and the second movement of claim 3, wherein the front surfaces of the first moving members are provided with protrusions on which the pickers are mounted, respectively. An apparatus for picking up semiconductor elements, characterized in that the heights of the members are the same.

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