KR200468035Y1 - Apparatus for picking up semiconductor devices - Google Patents

Abstract

In the apparatus for picking up the semiconductor elements, the apparatus comprises a fixed frame, a movable frame coupled to the fixed frame so as to be movable in a horizontal direction, and mounted to the fixed frame and the movable frame, respectively, for picking up the semiconductor elements, respectively. A picker, a cam block mounted to one of the fixed and movable frames, the cam block having an inclined surface, a roller disposed on the inclined surface, and mounted to the other of the fixed and movable frames and connected to the roller And a drive for moving the roller in the vertical direction to adjust the gap between the pickers.

Description

A device for picking up semiconductor devices {APPARATUS FOR PICKING UP SEMICONDUCTOR DEVICES}

Embodiments of the present invention relate to an apparatus for picking up semiconductor devices. More particularly, the present invention relates to an apparatus for picking up semiconductor devices to transfer them between trays of a semiconductor device manufacturing facility, such as a test handler.

Semiconductor devices, such as integrated circuit devices, can generally be formed by a series of iterative microprocessing processes on a substrate, such as a silicon wafer. For example, a deposition process for forming a film on a substrate, an etching process for forming the film into specific patterns, an ion implantation process or a diffusion process for imparting electrical properties to the patterns, impurities from the substrate on which the patterns are formed Various types of semiconductor devices may be formed on a substrate by repeatedly performing a cleaning and rinsing process for removing them.

The semiconductor devices formed as described above are shipped after their operating characteristics are inspected through various test procedures. A test handler transports the semiconductor devices to a test chamber to inspect the semiconductor devices. In particular, the semiconductor devices are transferred from the customer tray to the test tray via the buffer tray, and the semiconductor devices inspected in the test chamber are transferred from the test tray to the customer tray via the buffer tray.

The test handler may include a pick-up device for transferring semiconductor devices between the trays. The pick-up apparatus may include a plurality of pickers for picking up the semiconductor elements, and may be used to transfer the semiconductor elements between the customer tray and the test tray.

On the other hand, because the pitch of the customer tray and the test tray is different from each other, the pickup device may include a mechanism for adjusting the distance between the pickers. For example, Korean Patent Application Publication No. 10-2008-0102746 filed on May 22, 2007, and published on November 26, 2008 by the present applicant, discloses a cam plate type gap adjusting member having a gap guide groove. A pickup device is disclosed for adjusting the spacing between a plurality of pickers.

In particular, the pickup apparatus may include a plurality of first pickers and a plurality of second pickers, and the second pickers may be coupled to each other to be movable in a first horizontal direction with respect to the first pickers. The first pickers and the second pickers may be spaced apart in the first horizontal direction by a guide member and a first driving part, and the first and second pickers may be secondly moved by a cam plate and a second driving part. The spacing can be adjusted in the horizontal direction.

However, as the types of semiconductor devices are diversified recently, the socket sizes of the trays and the gaps between the sockets are changed in various ways, and a new type of pickup device is required to cope with this.

Embodiments of the present invention have a purpose to provide a new type of semiconductor device pickup device that can be adjusted more freely between the pickers for picking up the semiconductor devices.

According to an aspect of the present invention for achieving the above object, the semiconductor element pickup device is mounted to the fixed frame, the movable frame coupled to the fixed frame to be movable in the horizontal direction, and the fixed frame and the movable frame, respectively Pickers for picking up semiconductor elements respectively, a cam block having an inclined surface mounted on one of the fixed and movable frames, a roller disposed on the inclined surface, and mounted on the other of the fixed and movable frames And a drive unit connected to the roller and moving the roller in a vertical direction to adjust the distance between the pickers, and connected between the fixed frame and the movable frame and reducing the distance between the pickers. It may include an elastic member for applying a restoring force.

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According to embodiments of the present invention, the drive unit may include a pneumatic or hydraulic cylinder and the roller may be mounted to the cylinder rod of the drive unit through a bracket.

According to another aspect of the present invention for achieving the above object, the semiconductor device pickup device is a fixed frame including a first base plate disposed in a vertical direction, and the first base plate from the first base plate to face the first base plate; And a second base plate spaced apart in a horizontal direction, the movable frame coupled to the fixed frame to be movable in the first horizontal direction, and arranged in a second horizontal direction perpendicular to the first horizontal direction. First and second pickers mounted on the first and second base plates, respectively, for picking up semiconductor elements, a cam block mounted on one of the fixed and movable frames and having an inclined surface, and on the inclined surface; A roller disposed on and mounted to the other of the fixed and movable frames and connected to the roller and The it may include a driving unit that moves along the inclined surface of the roller to adjust the spacing between the first speaker and the second speaker to the first horizontal direction.

According to embodiments of the present invention, the semiconductor device pickup apparatus is disposed to be adjacent to the first and second base plates, respectively, and the distance between the first and second pickers in the second horizontal direction is adjusted. First and second camplates each having cam slots extending in different directions for adjustment, and second rollers disposed in the cam slots and connected to the first and second pickers, respectively. And second driving parts for moving the first and second cam plates in a vertical direction.

According to embodiments of the present invention, the semiconductor device pickup apparatus may further include moving plates connected to the second driving units, and the first and second cam plates may be mounted on the moving plates, respectively. have.

According to embodiments of the present invention, the semiconductor device pickup device is mounted on the first or second cam plate so as to be adjacent to the cam block, and has a second cam block having a second inclined surface formed to have a smaller inclination angle than the cam block. The roller may be configured to be moved along the second inclined surface by the driving unit when the second cam block is positioned to be adjacent to the cam block by any one of the second driving units. have.

According to embodiments of the present invention, the second cam block may be mounted to the first or second cam plate through a mounting bracket.

According to the embodiments of the present invention as described above, the first horizontal direction first interval and the second horizontal direction second spacing between the first pickers and the second pickers arranged in parallel with each other is the first and second It can be easily adjusted by the cam plates and the first and second cam blocks. In particular, since the second interval may be adjusted at different intervals by the first and second camblocks, the operating efficiency of the semiconductor device pickup apparatus may be further improved.

In addition, since the first and second cam plates and the second cam blocks are mounted on the movable plates and the mounting bracket so as to be easily replaced, the first and second cam plates and the second cam blocks can easily cope with the change in the socket spacing of the trays for storing the semiconductor devices.

1 is a schematic front view illustrating a semiconductor device pickup device according to an embodiment of the present invention.
FIG. 2 is a schematic plan view for describing a first driver of the semiconductor device pickup device illustrated in FIG. 1.
3 and 4 are schematic side views for explaining the semiconductor device pickup device shown in FIG.
FIG. 5 is a schematic front view for describing the semiconductor device pickup device illustrated in FIG. 1.
6 and 7 are schematic side views for explaining a method of adjusting the distance between the first and second pickers using the second cam block shown in FIGS. 3 and 4.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings showing embodiments of the present invention. However, the present invention should not be construed as limited to the embodiments described below and may be embodied in various other forms. The following examples are provided to fully convey the scope of the present invention to those skilled in the art, rather than to allow the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used below is for the purpose of describing particular embodiments only and is not intended to limit the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by one of ordinary skill in the art to which this invention belongs, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed as having a meaning consistent with their meaning in the context of the description of the relevant art and the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected sufficiently. Accordingly, the embodiments of the present invention are not to be construed as being limited to the specific shapes of the regions illustrated by way of illustration, but rather to include deviations in the shapes, the regions described in the drawings being entirely schematic and their shapes Is not intended to illustrate the exact shape of the region and is not intended to limit the scope of the invention.

FIG. 1 is a schematic front view for explaining a semiconductor device pickup device according to an embodiment of the present invention, and FIG. 2 is a schematic plan view for explaining a first driving unit of the semiconductor device pickup device shown in FIG. 1. 3 and 4 are schematic side views for explaining the semiconductor element pickup device shown in FIG.

1 to 4, the semiconductor device pickup apparatus 100 according to an embodiment of the present invention may be used in a semiconductor inspection facility such as a test handler. In particular, it may be used to transfer the semiconductor devices between trays (not shown) for storing the semiconductor devices (not shown). For example, the semiconductor device pick-up apparatus 100 may have a plurality of sockets for accommodating the semiconductor devices, such as a test tray, a customer tray, a buffer tray, etc., but because the pitches of the sockets are different from each other, There is a need to adjust the spacing between the pickers 102 for picking up the semiconductor devices before or after picking up the devices to correspond to the pitch of the respective trays.

The semiconductor device pick-up apparatus 100 according to the exemplary embodiment of the present invention may include a fixed frame 110 and a movable frame 120, and each of the fixed frame 110 and the movable frame 120 includes a plurality of pickers. Field 102 may be mounted. The movable frame 120 may be coupled to the fixed frame 110 to be movable in a first horizontal direction (hereinafter referred to as a Y-axis direction; FIG. 2).

The fixing frame 110 may include a first base plate 112 disposed in a vertical direction and extending in a second horizontal direction (hereinafter referred to as an X-axis direction; see FIG. 2) perpendicular to the first horizontal direction. Can be. In addition, the fixing frame 110 includes a central plate 114 disposed in parallel with the first base plate 112 and a pair of side plates 116 coupled to both sides of the central plate 114. The first base plate 112 may be coupled to the side plates 116.

The movable frame 120 is spaced apart from the first base plate 112 in the Y-axis direction so as to face the first base plate 112 with the center plate 114 interposed therebetween. It may include a second base plate 122 extending in parallel with (112). In particular, the movable frame 120 may be coupled to the fixed frame 110 so as to be movable in the Y-axis direction. Although not shown in detail, guide brackets (not shown) may be mounted below the second base plate 122, and the guide brackets and the side plates 116 may be disposed in the Y-axis direction. Guide rails (not shown) and guide blocks 124 for moving the movable frame 120 may be disposed.

A plurality of first pickers 102A arranged in the X-axis direction may be mounted on the first base plate 112, and a plurality of agents arranged in the X-axis direction may be mounted on the second base plate 122. Two pickers 102B may be mounted. Each of the first and second pickers 102A and 102B may extend in the vertical direction and may be used to pick up the semiconductor devices, respectively.

According to an embodiment of the present invention, the semiconductor device pick-up apparatus 100 may be configured to adjust a first gap between the first pickers 102A and the second pickers 102B in the Y-axis direction. 1 may include a cam block 130, the first roller 132 and the first driving unit 134. Specifically, the first cam block 130 is mounted on any one of the fixed and movable frames 110 and 120, for example, the fixed frame 110 and has a first inclined surface 130A having a predetermined first inclination angle. ) May be provided.

The first roller 132 may be disposed on the first inclined surface 130A to be movable along the first inclined surface 130A. The first driver 134 may be mounted on the other one of the fixed and movable frames 110 and 120, for example, the movable frame 120, and the first pickers 102A and the second pickers The first roller 132 may be moved in the vertical direction to adjust the first gap between the 102Bs.

For example, as illustrated in FIGS. 3 and 4, the first driving unit 134 may move the first roller 132 downward, whereby the first roller 132 may move the first roller 132. 1 may move along the first inclined surface 130A of the cam block 130. As a result, the first gap between the first pickers 102A and the second pickers 102B may be increased by the Y-axis phase difference of the first cam block 130.

Meanwhile, the first cam block 130 may be mounted on the first base plate 112 of the fixed frame 110, and the first driver 134 may be the second base plate of the movable frame 120. It may be mounted to the 122 through the first mounting bracket 136.

The first driving part 134 may be a pneumatic or hydraulic cylinder, and the first roller 132 may be connected to the first driving part 134 through the first driving bracket 138 and the roller bracket 140. Can be. For example, as shown in FIGS. 3 and 4, the first driving bracket 138 may have an L shape, and the roller bracket 140 may have the first driving bracket 138. It can be mounted on one side of the. In particular, the first driving bracket 138 may be mounted to be movable in a vertical direction to the cylinder tube of the first driving unit 134. For example, although not shown in detail, the cylinder tube of the first drive bracket 138 and the first drive unit 134 may be coupled to each other through a linear motion guide.

The first gap between the first pickers 102A and the second pickers 102B may be reduced by the elastic member 142. For example, as shown in FIGS. 3 and 4, the elastic member 142 may be connected between the fixed frame 110 and the movable frame 120, and in the direction of decreasing the first gap. An elastic restoring force may be applied to the movable frame 120. As an example, the elastic member 142 may include a coil spring. As a result, when the first roller 132 is lifted by the first driving unit 134, the first roller 132 may raise the first inclined surface 130A by the elastic restoring force of the elastic member 142. Can be moved upward, and the first spacing between the first pickers 102A and the second pickers 102B can be reduced.

FIG. 5 is a schematic front view for describing the semiconductor device pickup device illustrated in FIG. 1.

1 to 5, a semiconductor device pick-up apparatus 100 according to an embodiment of the present invention includes a second between the first pickers 102A and the second pickers 102B in the X-axis direction. The first cam plate 150 and the second cam plate 152 may be provided to adjust the gap.

The first cam plate 150 may be disposed to be adjacent to the first base plate 112, and may be arranged in different directions to adjust a second gap between the first pickers 102A in the X-axis direction. It may be provided with a plurality of cam slots 154 each extending to the teeth. The second cam plate 152 may be disposed to be adjacent to the second base plate 122 and may be arranged in different directions to adjust a second gap between the second pickers 102B in the X-axis direction. It may be provided with a plurality of cam slots 154 each extending to the teeth. The cam slots 154 may extend in the shape of a fan, for example, to adjust the second gap.

In particular, second rollers 156 may be disposed in the cam slots 154, and the second rollers 156 may be formed of the first pickers 102A and the second pickers 102B. May be connected to each other. In this case, the first pickers 102A may be mounted to be movable on the first base plate 112 in the X-axis direction, and the second pickers 102B may be mounted on the second base plate 122. It can be mounted to be movable in the X-axis direction on the. For example, guide rails 158 extending in the X-axis direction may be mounted on the first and second base plates 112 and 122, and the first and second pickers 102A and 102B may be mounted. Each may be coupled to the guide rails 158 through the guide block 160.

In addition, the semiconductor device pick-up apparatus 100 may include second drivers 162 for moving the first and second cam plates 150 and 152 in a vertical direction. The second driving units 162 may be mounted to the fixed and movable frames 110 and 120 by second and third mounting brackets 164 and 166 connected to the first and second base plates 112 and 122, respectively. . For example, a pneumatic or hydraulic cylinder may be used as each of the second driving units 162, and the first and second cam plates 150 and 152 are mounted on the cylinder rod of the second driving units 162. Can be.

In particular, the first and second cam plates 150 and 152 may be mounted to the second driving units 162 through the second driving bracket 168 and the third driving bracket 170. As an example, the second and third driving brackets 168 and 170 may have a shape similar to the first driving bracket 138 shown in FIGS. 3 and 4, and the second and third driving brackets ( The 168 and 170 may be movably mounted in a vertical direction on the cylinder tube of the second driving units 162 in a similar manner to the first driving bracket 138.

According to an embodiment of the present invention, as described above, the first and second cam plates 150 and 152 may be connected to the second driving units 162 through the second and third driving brackets 168 and 170. Although it may be configured to be mounted directly, alternatively, as shown in FIGS. 1 and 5, it may be mounted to the second driving units 162 using the moving plates 172. That is, the moving plates 172 may be mounted to the second driving units 162 through the second and third driving brackets 168 and 170, and the first and second moving plates 172 may be mounted on the moving plates 172. The second cam plates 150 and 152 may be mounted, respectively. This is to facilitate the replacement of the first and second cam plates 150 and 152 in response to the second gap change of the trays.

The first and second cam plates 150 and 152 configured as described above may be moved in the vertical direction by the second driving units 162, so that the second rollers 156 may be moved to the cam slots. May be moved along an inner side of 154. As a result, the second distance in the X-axis direction of the first and second pickers 102A and 102B connected to the second rollers 156 may be adjusted as shown in FIGS. 1 and 5.

Meanwhile, referring to FIGS. 3 and 4, the semiconductor device pick-up apparatus 100 according to an embodiment of the present invention may include the Y-axis direction agent between the first pickers 102A and the second pickers 102B. It may include a second cam block 180 for adjusting one interval. The second cam block 180 may be mounted on the first or second cam plates 150 and 152, for example, the first cam plate 150 to be adjacent to the first cam block 130. A second inclined surface 180A may be provided to have a smaller inclination angle than the first cam block 130.

6 and 7 are schematic side views for explaining a method of adjusting the distance between the first and second pickers using the second cam block shown in FIGS. 3 and 4.

6 and 7, the second cam block 180 may be moved in the vertical direction by the second driving unit 162 together with the first cam plate 150, and the first cam block may be moved. When positioned adjacent to 130, the first roller 132 may be configured to move along the second inclined surface 180A of the second cam block 180. As shown in FIG. 2, the second roller 132 may be formed of two rollers to contact each of the first and second inclined surfaces 130A and 180A. However, alternatively, the second roller 132 may be composed of one roller.

As a result, when the first cam plate 150 is moved downward by the second driving unit 162, the first roller 132 is the first cam block as shown in Figs. The first cam plate 150 may be moved along the first inclined surface 130A. Alternatively, when the first cam plate 150 is moved upward by the second driving unit 162, the second cam block ( 180 may be positioned adjacent to the first cam block 130, and the first roller 132 may have a second inclined surface () of the second cam block 180 as shown in FIGS. 6 and 7. May be moved along 180A). As a result, between the first pickers 102A and the second pickers 102B when the first roller 132 moves downward along the second inclined surface 180A of the second cam block 180. The first interval in the Y-axis direction may be adjusted wider than when moving along the first inclined surface 130A as shown in FIGS. 6 and 7.

Meanwhile, the second cam block 180 may be configured to be movable in the vertical direction on the first cam block 130. For example, as illustrated, a linear motion guide may be disposed between the first cam block 130 and the second cam block 180. In addition, the second cam block 180 may be mounted to the first cam plate 150 through a fourth mounting bracket 182, and may be configured to be replaced as necessary. This is to facilitate replacement of the second cam block 180 when the first interval of the trays is changed.

According to the embodiments of the present invention as described above, the first interval in the Y-axis direction and the second interval in the X-axis direction between the first pickers and the second pickers arranged in parallel with each other the first and second cam plate And the first and second camblocks. In particular, the first and second cam plates and the second cam blocks may be easily replaced so that the socket gaps of the trays for accommodating the semiconductor devices may be easily coped with.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as set forth in the following claims And changes may be made without departing from the spirit and scope of the invention.

100 semiconductor device pickup device 102 picker
110: fixing frame 112: first base plate
120: movable frame 122: second base plate
130: first cam block 130A: first inclined surface
132: first roller 134: first drive unit
142: elastic member 150: first cam plate
152: second cam plate 154: cam slot
156: second roller 162: second drive portion
172: moving plate 180: second cam block
180A: second slope

Claims (8)

A fixed frame;
A movable frame coupled to the fixed frame to be movable in a horizontal direction;
Pickers mounted on the fixed frame and the movable frame, respectively, for picking up semiconductor elements;
A cam block mounted to one of the fixed and movable frames and having an inclined surface;
A roller disposed on the inclined surface;
A drive unit mounted to the other one of the fixed and movable frames and connected to the roller and moving the roller in a vertical direction to adjust a gap between the pickers; And
And an elastic member connected between the fixed frame and the movable frame and applying an elastic restoring force in a direction of reducing the distance between the pickers. delete 2. The apparatus of claim 1 wherein the drive comprises a pneumatic or hydraulic cylinder and the roller is mounted to the cylinder rod of the drive via a bracket. A fixed frame including a first base plate disposed in a vertical direction;
A movable frame including a second base plate spaced apart from the first base plate in a first horizontal direction so as to face the first base plate, and coupled to the fixed frame to be movable in the first horizontal direction;
First and second pickers mounted on the first and second base plates, respectively, for picking up semiconductor elements so as to be arranged in a second horizontal direction perpendicular to the first horizontal direction;
A cam block mounted to one of the fixed and movable frames and having an inclined surface;
A roller disposed on the inclined surface; And
A driving unit mounted to the other one of the fixed and movable frames and connected to the roller and moving the roller along the inclined surface to adjust a distance between the first and second pickers in the first horizontal direction; Apparatus for picking up the semiconductor elements comprising a. 5. The apparatus of claim 4, wherein the first and second base plates are disposed adjacent to each other and extend in different directions to adjust the distance between the first and second pickers in the second horizontal direction. First and second cam plates each having cam slots;
Second rollers disposed in the cam slots and connected to the first pickers and the second pickers, respectively; And
And second drivers for moving the first and second camplates in a vertical direction. 6. The apparatus of claim 5, further comprising moving plates connected to the second drives, wherein the first and second camplates are mounted to the moving plates, respectively. The method of claim 5, further comprising a second cam block having a second inclined surface mounted to the first or second cam plate to be adjacent to the cam block and having a smaller inclination angle than the cam block,
Wherein the roller is configured to be moved along the second inclined plane by the driving unit when the second cam block is positioned to be adjacent to the cam block by any one of the second driving units. Device for. 8. The apparatus of claim 7, wherein the second camblock is mounted to the first or second camplate via a mounting bracket.

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